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Электронный компонент: 1032E-125LT

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1
ispLSI
and pLSI
1032E
High-Density Programmable Logic
Functional Block Diagram
Features
HIGH DENSITY PROGRAMMABLE LOGIC
-- 6000 PLD Gates
-- 64 I/O Pins, Eight Dedicated Inputs
-- 192 Registers
-- High Speed Global Interconnect
-- Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
-- Small Logic Block Size for Random Logic
HIGH PERFORMANCE E
2
CMOS
TECHNOLOGY
--
f
max = 125 MHz Maximum Operating Frequency
--
t
pd = 7.5 ns Propagation Delay
-- TTL Compatible Inputs and Outputs
-- Electrically Erasable and Reprogrammable
-- Non-Volatile
-- 100% Tested at Time of Manufacture
-- Unused Product Term Shutdown Saves Power
ispLSI OFFERS THE FOLLOWING ADDED FEATURES
-- In-System Programmable (ISPTM) 5-Volt Only
-- Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
-- Reprogram Soldered Devices for Faster Prototyping
OFFERS THE EASE OF USE AND FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
-- Complete Programmable Device Can Combine Glue
Logic and Structured Designs
-- Enhanced Pin Locking Capability
-- Four Dedicated Clock Input Pins
-- Synchronous and Asynchronous Clocks
-- Programmable Output Slew Rate Control to
Minimize Switching Noise
-- Flexible Pin Placement
-- Optimized Global Routing Pool Provides Global
Interconnectivity
ispEXPERTTM LOGIC COMPILER AND COMPLETE
ISP DEVICE DESIGN SYSTEMS FROM HDL SYNTHESIS
THROUGH IN-SYSTEM PROGRAMMING
-- Superior Quality of Results
-- Tightly Integrated with Leading CAE Vendor Tools
-- Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZERTM
-- PC and UNIX Platforms
Output Routing Pool
Output Routing Pool
D7 D6 D5 D4 D3 D2 D1 D0
B0 B1 B2 B3 B4 B5 B6 B7
A0
A1
A2
A3
A4
A5
A6
A7
C7
C6
C5
C4
C3
C2
C1
C0
Output Routing Pool
Output Routing Pool
CLK
Global Routing Pool (GRP)
0139A(A1)-isp
Logic
Array
D Q
D Q
D Q
D Q
GLB
Description
The ispLSI and pLSI 1032E are High Density Program-
mable Logic Devices containing 192 Registers, 64
Universal I/O pins, eight Dedicated Input pins, four Dedi-
cated Clock Input pins and a Global Routing Pool (GRP).
The GRP provides complete interconnectivity between
all of these elements. The ispLSI 1032E features 5-Volt
in-system programmability and in-system diagnostic ca-
pabilities. The ispLSI 1032E device offers non-volatile
reprogrammability of the logic, as well as the intercon-
nects to provide truly reconfigurable systems. It is
architecturally and parametrically compatible to the pLSI
1032E device, but multiplexes four input pins to control
in-system programming. A functional superset of the
ispLSI and pLSI 1032 architecture, the ispLSI and pLSI
1032E devices add two new global output enable pins.
The basic unit of logic on the ispLSI and pLSI 1032E
devices is the Generic Logic Block (GLB). The GLBs are
labeled A0, A1...D7 (see Figure 1). There are a total of 32
GLBs in the ispLSI and pLSI 1032E devices. Each GLB
has 18 inputs, a programmable AND/OR/Exclusive OR
array, and four outputs which can be configured to be
either combinatorial or registered. Inputs to the GLB
come from the GRP and dedicated inputs. All of the GLB
outputs are brought back into the GRP so that they can
be connected to the inputs of any GLB on the device.
1032E_06
Copyright 1998 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
October 1998
Tel. (503) 681-0118; 1-800-LATTICE; FAX (503) 681-3037; http://www.latticesemi.com
2
Specifications
ispLSI and pLSI 1032E
Functional Block Diagram
Figure 1. ispLSI and pLSI 1032E Functional Block Diagram
The devices also have 64 I/O cells, each of which is
directly connected to an I/O pin. Each I/O cell can be
individually programmed to be a combinatorial input,
registered input, latched input, output or bi-directional
I/O pin with 3-state control. The signal levels are TTL
compatible voltages and the output drivers can source 4
mA or sink 8 mA. Each output can be programmed
independently for fast or slow output slew rate to mini-
mize overall output switching noise.
Eight GLBs, 16 I/O cells, two dedicated inputs and one
ORP are connected together to make a Megablock (see
figure 1). The outputs of the eight GLBs are connected to
a set of 16 universal I/O cells by the ORP. Each ispLSI
and pLSI 1032E device contains four Megablocks.
The GRP has, as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI and pLSI 1032E devices are se-
lected using the Clock Distribution Network. Four
dedicated clock pins (Y0, Y1, Y2 and Y3) are brought into
the distribution network, and five clock outputs (CLK 0,
CLK 1, CLK 2, IOCLK 0 and IOCLK 1) are provided to
route clocks to the GLBs and I/O cells. The Clock Distri-
bution Network can also be driven from a special clock
GLB (C0 on the ispLSI and pLSI 1032E devices). The
logic of this GLB allows the user to create an internal
clock from a combination of internal signals within the
device.
I/O 63
I/O 62
I/O 61
I/O 60
RESET
Global
Routing
Pool
(GRP)
CLK 0
CLK 1
CLK 2
IOCLK 0
IOCLK 1
Clock
Distribution
Network
C7
C6
C5
C4
C3
C2
C1
C0
A0
A1
A2
A3
A4
A5
A6
A7
Generic
Logic Blocks
(GLBs)
Megablock
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Input Bus
Input Bus
*ispEN/NC
lnput Bus
lnput Bus
*ISP Control Functions for ispLSI 1032E Only
I/O 59
I/O 58
I/O 57
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
IN 7
IN 6
D7
D6
D5
D4
D3
D2
D1
D0
I/O 16
I/O 17
I/O 18
I/O 19
*SDO/IN 2
*SCLK/IN 3
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
I/O 35
I/O 34
I/O 33
I/O 32
I/O 0
I/O 1
I/O 2
I/O 3
I/O 12
I/O 13
I/O 14
I/O 15
*SDI/IN 0
*MODE/IN 1
I/O 8
I/O 9
I/O 10
I/O 11
I/O 4
I/O 5
I/O 6
I/O 7
I/O 47
I/O 46
I/O 45
I/O 44
GOE 1/IN 5
GOE 0/IN 4
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 38
I/O 37
I/O 36
Y0
Y1
Y2
Y3
B0
B1
B2
B3
B4
B5
B6
B7
3
Specifications
ispLSI and pLSI 1032E
Absolute Maximum Ratings
1
Supply Voltage V
cc
.................................. -0.5 to +7.0V
Input Voltage Applied ........................ -2.5 to V
CC
+1.0V
Off-State Output Voltage Applied ..... -2.5 to V
CC
+1.0V
Storage Temperature ................................ -65 to 150
C
Case Temp. with Power Applied .............. -55 to 125
C
Max. Junction Temp. (T
J
) with Power Applied ... 150
C
1. Stresses above those listed under the "Absolute Maximum Ratings" may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specifica tion
is not implied (while programming, follow the programming specifications).
DC Recommended Operating Conditions
T
A
= 0
C to + 70
C
T
A
= -40
C to + 85
C
SYMBOL
Table 2-0005/1032E
V
CC
V
IH
V
IL
PARAMETER
Supply Voltage
Input High Voltage
Input Low Voltage
MIN.
MAX.
UNITS
4.75
4.5
2.0
0
5.25
5.5
V
cc
+1
0.8
V
V
V
V
Commercial
Industrial
Capacitance (T
A
=25
o
C, f=1.0 MHz)
Data Retention Specifications
Table 2-0008/1032E
PARAMETER
pLSI Erase/Reprogram Cycles
100
Data Retention
MINIMUM
MAXIMUM
UNITS
ispLSI Erase/Reprogram Cycles
20
10000
Cycles
Years
Cycles
C
SYMBOL
Table 2-0006/1032E
C
PARAMETER
Y0 Clock Capacitance
15
UNITS
TYPICAL
TEST CONDITIONS
1
2
8
Dedicated Input, I/O, Y1, Y2, Y3, Clock Capacitance
(Commercial/Industrial)
pf
pf
V = 5.0V, V = 2.0V
V = 5.0V, V = 2.0V
CC
CC
PIN
PIN
4
Specifications
ispLSI and pLSI 1032E
Output Load Conditions (see Figure 2)
Switching Test Conditions
TEST CONDITION
R1
R2
CL
A
470
390
35pF
B
390
35pF
470
390
35pF
Active High
Active Low
C
470
390
5pF
390
5pF
Active Low to Z
at V +0.5V
OL
Active High to Z
at V -0.5V
OH
Table 2-0004/1032E
Figure 2. Test Load
+ 5V
R1
R2
CL
*
Device
Output
Test
Point
*
CL includes Test Fixture and Probe Capacitance.
0213a
DC Electrical Characteristics
Over Recommended Operating Conditions
V
OL
SYMBOL
1. One output at a time for a maximum duration of one second. V = 0.5V was selected to avoid test problems
by tester ground degradation. Characterized but not 100% tested.
2. Measured using eight 16-bit counters.
3. Typical values are at V = 5V and T = 25
C.
4. Maximum I varies widely with specific device configuration and operating frequency. Refer to the Power Consumption
section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to
estimate maximum I .
Table 2-0007/1032E
1
V
OH
I
IH
I
IL
I
IL-isp
PARAMETER
I
IL-PU
I
OS
2, 4
I
CC
Output Low Voltage
Output High Voltage
Input or I/O High Leakage Current
Input or I/O Low Leakage Current
ispEN Input Low Leakage Current
I/O Active Pull-Up Current
Output Short Circuit Current
Operating Power Supply Current
I = 8 mA
I = -4 mA
3.5V
V
V
0V
V
V (Max.)
0V
V
V
0V
V
V
V = 5V, V = 0.5V
V = 0.5V, V = 3.0V
f = 1 MHz
OL
OH
IN IL
IN CC
IN
IL
IN IL
CC OUT
CLOCK
IL
IH
CONDITION
MIN.
TYP.
MAX.
UNITS
3
2.4
190
190
0.4
10
-10
-150
-150
-200
V
V
A
A
A
A
mA
mA
mA
CC
A
OUT
CC
CC
Commercial
Industrial
Input Pulse Levels
Table 2-0003/1032E
Input Rise and Fall Time
10% to 90%
Input Timing Reference Levels
Output Timing Reference Levels
Output Load
GND to 3.0V
1.5V
1.5V
See Figure 2
3-state levels are measured 0.5V from
steady-state active level.
-125
Others
2 ns
3 ns
5
Specifications
ispLSI and pLSI 1032E
t
pd1
UNITS
TEST
COND.
1. Unless noted otherwise, all parameters use the GRP, 20 PTXOR path, ORP and Y0 clock.
2. Refer to Timing Model
in this data sheet for further details.
3. Standard 16-bit counter using GRP feedback.
4. Reference Switching Test Conditions section.
Table 2-0030A/1032E
1
4
3
1
tsu2 + tco1
( )
-100
MIN. MAX.
DESCRIPTION
#
2
PARAMETER
A
1
Data Propagation Delay, 4PT Bypass, ORP Bypass
10.0
ns
t
pd2
A
2
Data Propagation Delay, Worst Case Path
ns
f
max (Int.)
A
3
Clock Frequency with Internal Feedback
100
MHz
f
max (Ext.)
4
Clock Frequency with External Feedback
MHz
f
max (Tog.)
5
Clock Frequency, Max. Toggle
MHz
t
su1
6
GLB Reg. Setup Time before Clock,4 PT Bypass
ns
t
co1
A
7
GLB Reg. Clock to Output Delay, ORP Bypass
ns
t
h1
8
GLB Reg. Hold Time after Clock, 4 PT Bypass
ns
t
su2
9
GLB Reg. Setup Time before Clock
ns
t
co2
10
GLB Reg. Clock to Output Delay
ns
t
h2
11
GLB Reg. Hold Time after Clock
ns
t
r1
A
12
Ext. Reset Pin to Output Delay
ns
t
rw1
13
Ext. Reset Pulse Duration
ns
t
ptoeen
B
14
Input to Output Enable
ns
t
ptoedis
C
15
Input to Output Disable
ns
t
wh
18
External Synchronous Clock Pulse Duration, High
4.0
ns
t
wl
19
External Synchronous Clock Pulse Duration, Low
4.0
ns
t
su3
20
I/O Reg. Setup Time before Ext. Sync Clock (Y2, Y3)
ns
t
h3
21
I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3)
ns
71.0
125
7.0
0.0
8.0
0.0
6.5
3.5
0.0
12.5
6.0
7.0
13.5
15.0
15.0
( )
1
twh + tw1
t
goeen
B
16
Global OE Output Enable
ns
9.0
t
goedis
C
17
Global OE Output Disable
ns
9.0
-125
MIN. MAX.
7.5
125
3.0
3.0
91.0
167
5.0
0.0
6.0
0.0
5.0
3.0
0.0
10.0
5.0
6.0
10.0
12.0
12.0
7.0
7.0
External Timing Parameters
Over Recommended Operating Conditions