LESHAN RADIO COMPANY, LTD.
S51/3
High Speed Switching Diode
CASE 477 02, STYLE 1
SOD 323
1
2
MMDL914T1
2
ANODE
1
CATHODE
MAXIMUM RATINGS
Rating
Symbol
Va l u e
Unit
Reverse Voltage
V
R
100
Vdc
Forward Current
I
F
200
mAdc
Peak Forward Surge Current
I
FM(surge)
500
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR-5 Board,*
P
D
200
mW
T
A
= 25C
Derate above 25C
1.57
mW/C
Thermal Resistance Junction to Ambient
R
JA
635
C/W
Junction and Storage Temperature
T
J
, T
stg
150
C
**FR-4 Minimum Pad
DEVICE MARKING
MMDL914T1 = 5D
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I
R
= 100
Adc)
V
(BR)
100
--
Vdc
Reverse Voltage Leakage Current
I
R
(V
R
= 20Vdc)
--
25
nAdc
(V
R
= 75Vdc)
--
5.0
Adc
Diode Voltage
C
T
--
4.0
pF
(V
R
=0, f =1.0MHz )
Forward Voltage
V
F
--
1.0
Vdc
(I
F
= 10 mAdc)
Reverse Recovery Time
t
rr
--
4.0
ns
(I
F
= I
R
= 10 mAdc ) (Figure 1)
LESHAN RADIO COMPANY, LTD.
S52/3
Notes: 1. A 2.0 k
variable resistor adjusted for a Forward Current (I
F
) of 10mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10mA.
Notes:
3. t
p
t
rr
Figure 1. Recovery Time Equivalent Test Circuit
+10 V
2.0 k
820
100
H
0.1
F
D U T
0.1
F
50
OUTPUT
PULSE
GENERATOR
t
r
50
INPUT
SAMPLING
OSCILLOSCOPE
t
p
t
10%
90%
I
F
I
R
t
rr
t
i
R(REC)
= 1.0 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; MEASURED
at i
R(REC)
= 1.0 mA)
INPUT SIGNAL
I
F
V
R
MMDL914T1
T
A
= 85C
V
F
, FORWARD VOLTAGE (VOLTS)
Figure 2. Forward Voltage
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Leakage Current
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
T
A
= 40C
T
A
= 25C
T
A
= 25C
T
A
= 55C
T
A
= 85C
T
A
= 150C
T
A
= 125C
100
10
1.0
0.1
0.2
0.4
0.6
0.8
1.0
1.2
10
1.0
0.1
0.01
0.001
0
10
20
30
40
50
I
F
, FORWARD CURRENT (mA)
I
R
, REVERSE CURRENT (
A)
0.68
0.64
0.60
0.56
0.52
0
0.2
0.4
0.6
0.8
C
D
, DIODE CAP
ACIT
ANCE (pF)
LESHAN RADIO COMPANY, LTD.
S53/3
MMDL914T1
PACKAGE DIMENSIONS
S O D 3 2 3
PLASTIC PACKAGE
CASE 47702
ISSUE A
K
A
D
B
1
2
J
NOTE 3
H
E
C
0.63 mm
0.025''
1.60 mm
0.063''
2.85 mm
0.112''
0.83 mm
0.033''
(
)
m m
inches
SOD323
Soldering Footprint
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH
SOLDER PLATING.
DIM
MILLIMETERS
INCHES
M I N
M A X
M I N
M A X
A
1.60
1.80
0.063
0.071
B
1.15
1.35
0.045
0.053
C
0.80
1.00
0.031
0.039
D
0.25
0.40
0.010
0.016
E
0.15 REF
0.006 REF
H
0.00
0.10
0.000
0.004
J
0.089
0.177
0.0035
0.0070
K
2.30
2.70
0.091
0.106
STYLE 1:
PIN 1.
CATHODE
2. ANODE
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