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P/N:PM0824
REV. 1.7, JUL. 30, 2004
FEATURES
Bit organization
- 4M x 8 (byte mode)
- 2M x 16 (word mode)
Fast access time
- Random access:90ns(max.)
Current
- Operating:16mA
- Standby:5uA
Supply voltage
- 2.7V ~ 3.6V
Package
- 48 ball mini BGA (7.0mm x 7.0mm, ball pitch
0.8mm, ball size 0.4mm)
Note: die form: 3.0~3.6V : 70ns/2.7~3.6V : 90ns
PIN DESCRIPTION
Symbol
Pin Function
A0~A20
Address Inputs
D0~D14
Data Outputs
D15/A-1
D15 (Word Mode)/ LSB Address
(Byte Mode)
CE#
Chip Enable Input
OE#
Output Enable Input
Byte#
Word/ Byte Mode Selection
VCC
Power Supply Pin
VSS
Ground Pin
NC
No Connection
PIN CONFIGURATION
MX23L3212
32M-BIT MASK ROM
48 mini BGA (Top View, Ball Down)
A1
A3
A2
A7
A3
NC
A4
NC
A5
A9
A6
A13
B1
A4
B2
A17
B3
NC
B4
NC
B5
A8
B6
A12
C1
A2
C2
A6
C3
A18
C4
NC
C5
A10
C6
A14
D1
A1
D2
A5
D3
A20
D4
A19
D5
A11
D6
A15
E1
A0
E2
D0
E3
D2
E4
D5
E5
D7
E6
A16
F1
CE#
F2
D8
F3
D10
F4
D12
F5
D14
F6
BYTE#
G1
OE#
G2
D9
G3
D11
G4
Vcc
G5
D13
G6
D15/A-1
H1
Vss
H2
D1
H3
D3
H4
D4
H5
D6
H6
Vss
7.0 mm
7.0 mm
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P/N:PM0824
REV. 1.7, JUL. 30, 2004
MX23L3212
ABSOLUTE MAXIMUM RATINGS
Item
Symbol
Ratings
Voltage on any Pin Relative to VSS
VIN
-0.3V to 3.9V
Ambient Operating Temperature
Topr
-40
C to 85
C
Storage Temperature
Tstg
-65
C to 125
C
DC CHARACTERISTICS (Ta = -40
C ~ 85
C, VCC = 2.7V~3.6V)
Item
Symbol
MIN.
MAX.
Conditions
Output High Voltage
VOH
2.4V
-
IOH = -400uA
Output Low Voltage
VOL
-
0.4V
IOL = 1.6mA
Input High Voltage
VIH
2.2V
VCC+0.3V
Input Low Voltage
VIL
-0.3V
0.8V
Input Leakage Current
ILI
-
5uA
0V, VCC
Output Leakage Current
ILO
-
5uA
0V, VCC
Operating Current
ICC
-
16mA
f=5MHz, CE#=VIL, OE#=VIH
all output open
Standby Current (CMOS)
ISTB
-
5uA
CE#>VCC-0.2V
Input Capacitance
CIN
-
10pF
Ta = 25
C, f = 1MHZ
Output Capacitance
COUT
-
10pF
Ta = 25
C, f = 1MHZ
MODE SELECTION
CE#
OE#
Byte#
D15/A-1
D0~D7
D8~D15
Mode
Power
H
X
X
X
High Z
High Z
-
Stand-by
L
H
X
X
High Z
High Z
-
Active
L
L
H
Output
D0~D7
D8~D15
Word
Active
L
L
L
Input
D0~D7
High Z
Byte
Active
ORDER INFORMATION
Part No.
Speed
Package
Grade
MX23L3212XI-90G
90ns
48 ball mini BGA (Pb free)
Industrial
MX23L3212XI-12G
120ns
48 ball mini BGA (Pb free)
Industrial
Note: Industrial grade temperature: -40 ~ 85
C
Commercial grade temperature: 0 ~ 70
C
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P/N:PM0824
REV. 1.7, JUL. 30, 2004
MX23L3212
AC Test Conditions
Input Pulse Levels
0V~ 3.0V
Input Rise and Fall Times
5ns
Input Timing Level
1.5V
Output Timing Level
1.5V
Output Load
See Figure
Note:No output loading is present in tester load board.
Active loading is used and under software programming control.
Output loading capacitance includes load board's and all stray capacitance.
DOUT
C<100pF
IOL (load)=1.6mA
IOH (load)=-0.4mA
TIMING DIAGRAM
RANDOM READ
Note:
30pF output load capacitance for 90ns speed
grade
100pF output load capacitance for 120ns speed
grade
tACE
tAA
tOH
tHZ
ADD
ADD
ADD
ADD
CE#
OE#
DATA
VALID
VALID
VALID
tRC
tOE
AC CHARACTERISTICS (Ta = -40
C ~ 85
C, VCC = 2.7V~3.6V)
Item
Symbol
23L3212-90
23L3212-12
MIN.
MAX.
MIN.
MAX.
Read Cycle Time
tRC
90ns
-
120ns
-
Address Access Time
tAA
-
90ns
-
120ns
Chip Enable Access Time
tACE
-
90ns
-
120ns
Output Enable Time
tOE
-
40ns
-
50ns
Output Hold After Address tOH
0ns
-
0ns
-
Output High Z Delay
tHZ
-
20ns
-
20ns
Note:Output high-impedance delay (tHZ) is measured from OE# or CE# going high, and this parameter guaranteed by
design over the full voltage and temperature operating range - not tested.
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P/N:PM0824
REV. 1.7, JUL. 30, 2004
MX23L3212
PACKAGE INFORMATION
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P/N:PM0824
REV. 1.7, JUL. 30, 2004
MX23L3212
REVISION HISTORY
Revision No. Description
Page
Date
1.1
Added Order Information
P2
JUL/11/2001
1.2
Add CE#=VIL, OE#=VIH in DC Characteristics's ICC
P2
OCT/03/2001
1.3
Modify package size from 8x10mm to 7x7mm
P1,4
MAR/27/2002
1.4
Modify Package Information
P4
JUN/20/2003
1.5
Add Note: die form: 3.0~3.6V : 70ns/2.7~3.6V : 90ns
P1
MAY/19/2004
1.6
Delete 70ns speed grade
P1,2,3
JUL/07/2004
1.7
Correct typo errors
P5
JUL/30/2004
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