PIN DESCRIPTION

REV. 4.2, AUG. 26, 2003

P/N: PM0157

32 TSOP

FEATURES

256Kx 8 organization

Single +5V power supply

+12.5V programming voltage

Fast access time:35/45/55/70/90/100/120/150 ns

Totally static operation

Completely TTL compatible

Operating current:30mA

Standby current: 100uA

Package type:

- 32 pin plastic DIP
- 32 pin SOP
- 32 pin PLCC
- 32 pin TSOP(

)

GENERAL DESCRIPTION

The MX27C2000 is a 5V only, 2M-bit, One Time
Programmable Read Only Memory. It is organized as
256K words by 8 bits per word, operates from a single +
5 volt supply, has a static standby mode, and features
fast single address location programming. All program-
ming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM

programmers may be used. The MX27C2000 supports
a intelligent fast programming algorithm which can result
in programming time of less than one minute.

This EPROM is packaged in industry standard 32 pin
dual-in-line packages, 32 lead SOP, 32 lead PLCC and
32 lead TSOP (I) packages.

PIN CONFIGURATIONS

32 PDIP/SOP

BLOCK DIAGRAM

32 PLCC

SYMBOL

PIN NAME

A0~A17

Address Input

Q0~Q7

Data Input/Output

Chip Enable Input

Output Enable Input

PGM

Programmable Enable Input

VPP

Program Supply Voltage

No Internal Connection

VCC

Power Supply Pin (+5V)

GND

Ground Pin

MX27C2000

2M-BIT [256K x 8] CMOS EPROM

A14

A13

A11

A10

GND

A12

A15

A16

VPP

VCC

PGM

A17

MX27C2000

A11

A9
A8

A13
A14
A17

PGM

VCC

VPP

A16
A15
A12

A7
A6
A5
A4

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

MX27C2000

CONTROL

LOGIC

OUTPUT

BUFFERS

Q0~Q7

PGM

A0~A17

ADDRESS

INPUTS

Y-DECODER

X-DECODER

Y-SELECT

2M BIT

CELL

MAXTRIX

VCC

VSS

VPP

MX27C2000

VPP

A16

A15

A12

GND

VCC

PGM

A17

A14

A13

A11

A10

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25

C ambient temperature range

that is required when programming the MX27C2000.

To activate this mode, the programming equipment must
force 12.0

0.5 V on address line A9 of the device. Two

identifier bytes may then be sequenced from the device
outputs by toggling address line A0 from VIL to VIH. All
other address lines must be held at VIL during auto
identify mode.

Byte 0 ( A0 = VIL) represents the manufacturer code, and
byte 1 (A0 = VIH), the device identifier code. For the
MX27C2000, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.

READ MODE

The MX27C2000 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data to
the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.

STANDBY MODE

The MX27C2000 has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC

0.3 V. The

MX27C2000 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.

FUNCTIONAL DESCRIPTION

THE PROGRAMMING OF THE MX27C2000

When the MX27C2000 is delivered, or it is erased, the
chip has all 2M bits in the "ONE", or HIGH state.
"ZEROs" are loaded into the MX27C2000 through the
procedure of programming.

For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.

VCC must be applied simultaneously or before VPP, and
removed simultaneously or after VPP. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across VPP and ground to suppress spurious
voltage transients which may damage the device.

FAST PROGRAMMING

The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the PGM input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V

10%.

PROGRAM INHIBIT MODE

Programming of multiple MX27C2000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C2000 may be common. A
TTL low-level program pulse applied to an MX27C2000
CE input with VPP = 12.5

0.5 V and PGM LOW will

program that MX27C2000. A high-level CE input inhibits
the other MX27C2000s from being programmed.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE at VIL,
PGM at VIH, and VPP at its programming voltage.

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

SYSTEM CONSIDERATIONS

During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between Vcc
and GND to minimize transient effects. In addition, to
overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices. The
location of the capacitor should be close to where the
power supply is connected to the array.

NOTES: 1. VH = 12.0 V

0.5 V

2. X = Either VIH or VIL

3. A1 - A8 = A10 - A17 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during

programming.

MODE SELECT TABLE

PINS

MODE

PGM

VPP

OUTPUTS

Read

VIL

VCC

DOUT

Output Disable

VIL

VIH

VCC

High Z

Standby (TTL)

VIH

VCC

High Z

Standby (CMOS)

VCC

0.3V

VCC

High Z

Program

VIL

VIH

VIL

VPP

DIN

Program Verify

VIL

VIH

VPP

DOUT

Program Inhibit

VIH

VPP

High Z

Manufacturer Code(3)

VIL

VCC

C2H

Device Code(3)

VIL

VIH

VCC

20H

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a two-
line control function is provided to allow for:

1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.

It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins are
only active when data is desired from a particular memory
device.

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

-35

-45

-55

-70

-90

-10

-12

-15

Operating

Commercial 0

C to 55

C 0

C to 70

Temperature Industrial

-40

C to 85

-40

C to 85

C -40

C to 85

C -40

C to 85

C -40

C to 85

C -40

C to 85

Vcc Power Supply

10%

DC CHARACTERISTICS

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

CONDITIONS

VOH

Output High Voltage

2.4

IOH = -0.4mA

VOL

Output Low Voltage

0.4

IOL = 2.1mA

VIH

Input High Voltage

2.0

VCC + 0.5

VIL

Input Low Voltage

-0.3

0.8

ILI

Input Leakage Current

-10

VIN = 0 to 5.5V

ILO

Output Leakage Current

-10

VOUT = 0 to 5.5V

ICC3

VCC Power-Down Current

100

CE = VCC

0.3V

ICC2

VCC Standby Current

1.5

CE = VIH

ICC1

VCC Active Current

CE = VIL, f=5MHz, Iout = 0mA

IPP

VPP Supply Current Read

CE = OE = VIL, VPP = 5.5V

NOTICE:
Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended period may affect reliability.

NOTICE:
Specifications contained within the following tables are subject to
change.

DC/AC Operating Condition for Read Operation

ABSOLUTE MAXIMUM RATINGS

RATING

VALUE

Ambient Operating Temperature

-40

C to 85

Storage Temperature

-65

C to 125

Applied Input Voltage

-0.5V to 7.0V

Applied Output Voltage

-0.5V to VCC + 0.5V

VCC to Ground Potential

-0.5V to 7.0V

V9 & VPP

-0.5V to 13.5V

CAPACITANCE

TA = 25

C, f = 1.0 MHz (Sampled only)

SYMBOL

PARAMETER

TYP.

MAX.

UNIT

CONDITIONS

CIN

Input Capacitance

VIN = 0V

COUT

Output Capacitance

VOUT = 0V

CVPP

VPP Capacitance

VPP = 0V

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

AC CHARACTERISTICS

27C2000-90

27C2000-10

27C2000-12

27C2000-15

Symbol PARAMETER

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

MIN.

MAX. Unit

Conditions

tACC

Address to Output Delay

100

120

150

CE = OE = VIL

tCE

Chip Enable to Output Delay

100

120

150

OE = VIL

tOE

Output Enable to Output Delay

CE = VIL

tDF

OE High to Output Float,

or CE High to Output Float

tOH

Output Hold from Address,CE or 0

OE which ever occurred first

27C2000-35

27C2000-45

27C2000-55

27C2000-70

Symbol PARAMETER

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

MIN. MAX.

Unit

Conditions

tACC

Address to Output Delay

CE = OE = VIL

tCE

Chip Enable to Output Delay

OE = VIL

tOE

Output Enable to Output Delay

CE = VIL

tDF

OE High to Output Float,

or CE High to Output Float

tOH

Output Hold from Address,CE or

OE which ever occurred first

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

AC PROGRAMMING CHARACTERISTICS

TA = 25

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

CONDITIONS

tAS

Address Setup Time

2.0

tOES

OE Setup Time

2.0

tDS

Data Setup Time

2.0

tAH

Address Hold Time

tDH

Data Hold Time

2.0

tDFP

Output Enable to Output Float Delay

130

tVPS

VPP Setup Time

2.0

tPW

PGM Program Pulse Width

105

tVCS

VCC Setup Time

2.0

tCES

CE Setup Time

2.0

tOE

Data valid from OE

150

DC PROGRAMMING CHARACTERISTICS

TA = 25

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

CONDITIONS

VOH

Output High Voltage

2.4

IOH = -0.40mA

VOL

Output Low Voltage

0.4

IOL = 2.1mA

VIH

Input High Voltage

2.0

VCC + 0.5

VIL

Input Low Voltage

-0.3

0.8

ILI

Input Leakage Current

-10

VIN = 0 to 5.5V

A9 Auto Select Voltage

11.5

12.5

ICC3

VCC Supply Current (Program & Verify)

IPP2

VPP Supply Current(Program)

CE=PGM=VIL,OE=VIH

VCC1

Fast Programming Supply Voltage

6.00

6.50

VPP1

Fast Programming Voltage

12.5

13.0

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

PLASTIC PACKAGE

PART NO.

ACCESS TIME

OPERATING

STANDBY

OPERATING

PACKAGE

(ns)

CURRENT MAX.(mA)

CURRENT MAX.(uA)

TEMPERATURE

MX27C2000PC-35

100

C to 55

32 Pin DIP

MX27C2000QC-35 35

100

C to 55

32 Pin PLCC

MX27C2000MC-35 35

100

C to 55

32 Pin SOP

MX27C2000TC-35

100

C to 55

32 Pin TSOP

MX27C2000PC-45

100

C to 55

32 Pin DIP

MX27C2000QC-45 45

100

C to 55

32 Pin PLCC

MX27C2000MC-45 45

100

C to 55

32 Pin SOP

MX27C2000TC-45

100

C to 55

32 Pin TSOP

MX27C2000PC-55

100

C to 70

32 Pin DIP

MX27C2000QC-55 55

100

C to 70

32 Pin PLCC

MX27C2000MC-55 55

100

C to 70

32 Pin SOP

MX27C2000TC-55

100

C to 70

32 Pin TSOP

MX27C2000PI-55

100

-40

C to 85

32 Pin DIP

MX27C2000QI-55

100

-40

C to 85

32 Pin PLCC

MX27C2000MI-55

100

-40

C to 85

32 Pin SOP

MX27C2000TI-55

100

-40

C to 85

32 Pin TSOP

MX27C2000PC-70

100

C to 70

32 Pin DIP

MX27C2000QC-70 70

100

C to 70

32 Pin PLCC

MX27C2000MC-70 70

100

C to 70

32 Pin SOP

MX27C2000TC-70

100

C to 70

32 Pin TSOP

MX27C2000PI-70

100

-40

C to 85

32 Pin DIP

MX27C2000QI-70

100

-40

C to 85

32 Pin PLCC

MX27C2000MI-70

100

-40

C to 85

32 Pin SOP

MX27C2000TI-70

100

-40

C to 85

32 Pin TSOP

MX27C2000PC-90

100

C to 70

32 Pin DIP

MX27C2000QC-90 90

100

C to 70

32 Pin PLCC

MX27C2000MC-90 90

100

C to 70

32 Pin SOP

MX27C2000TC-90

100

C to 70

32 Pin TSOP

MX27C2000PI-90

100

-40

C to 85

32 Pin DIP

MX27C2000QI-90

100

-40

C to 85

32 Pin PLCC

MX27C2000MI-90

100

-40

C to 85

32 Pin SOP

MX27C2000TI-90

100

-40

C to 85

32 Pin TSOP

MX27C2000PC-10

100

C to 70

32 Pin DIP

MX27C2000QC-10 100

100

C to 70

32 Pin PLCC

MX27C2000MC-10 100

100

C to 70

32 Pin SOP

MX27C2000TC-10

100

C to 70

32 Pin TSOP

MX27C2000PI-10

100

-40

C to 85

32 Pin DIP

MX27C2000QI-10

100

-40

C to 85

32 Pin PLCC

ORDERING INFORMATION

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

PART NO.

ACCESS TIME

OPERATING

STANDBY

OPERATING

PACKAGE

(ns)

CURRENT MAX.(mA)

CURRENT MAX.(uA)

TEMPERATURE

MX27C2000MI-10

100

-40

C to 85

32 Pin SOP

MX27C2000TI-10

100

-40

C to 85

32 Pin TSOP

MX27C2000PC-12

120

100

C to 70

32 Pin DIP

MX27C2000QC-12 120

100

C to 70

32 Pin PLCC

MX27C2000MC-12 120

100

C to 70

32 Pin SOP

MX27C2000TC-12

120

100

C to 70

32 Pin TSOP

MX27C2000PI-12

120

100

-40

C to 85

32 Pin DIP

MX27C2000QI-12

120

100

-40

C to 85

32 Pin PLCC

MX27C2000MI-12

120

100

-40

C to 85

32 Pin SOP

MX27C2000TI-12

120

100

-40

C to 85

32 Pin TSOP

MX27C2000PC-15

150

100

C to 70

32 Pin DIP

MX27C2000QC-15 150

100

C to 70

32 Pin PLCC

MX27C2000MC-15 150

100

C to 70

32 Pin SOP

MX27C2000TC-15

150

100

C to 70

32 Pin TSOP

MX27C2000PI-15

150

100

-40

C to 85

32 Pin DIP

MX27C2000QI-15

150

100

-40

C to 85

32 Pin PLCC

MX27C2000MI-15

150

100

-40

C to 85

32 Pin SOP

MX27C2000TI-15

150

100

-40

C to 85

32 Pin TSOP

REV. 4.2, AUG. 26, 2003

P/N: PM0157

MX27C2000

REVISION HISTORY

Revision No. Description

Page

Date

3.0

1) Eliminate Interactive Programming Mode.

06/11/1997

2) Reduce Operating current from 40mA to 30mA.

3.1

IPP 100uA --> 10uA

08/07/1997

3.2

Change TSOP Orientation.

04/09/1998

3.3

Add 45/55ns speed grades

P1,5,6,7,10 11/19/1998

3.4

Modify the operating temperature from 70

C to 55

C for the 45ns parts P6,10

02/02/1999

3.5

Add 100ns speed grades

P1,7,9,10

Mar/16/1999

3.6

Add 55ns/70ns speed grade for industrial grade parts

P10,11

Apr/27/1999

3.7

Add 35ns speed for commerial grade

P1,5-7,9-10 JUL/13/1999

3.8

Remove 27C2000DC-35 part number

P10

AUG/20/1999

3.9

Cancel ceramic DIP package type

P1,2,10,13

FEB/29/2000

4.0

Cancel "Ultraviolet Erasable" wording in General Description

AUG/20/2001

To modify Package Information

P12~15

4.1

To modify Package Information

P12~15

NOV/19/2002

4.2

To modify 32-PLCC package information

P14

AUG/26/2003

A1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom.

from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom.

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 27C2000-90

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 27C2000-90