SYMBOL

PIN NAME

A0~A16

Address Input

Q0~Q7

Data Input/Output

Chip Enable Input

Output Enable Input

PGM

Programmable Enable Input

VPP

Program Supply Voltage

No Internal Connection

VCC

Power Supply Pin

GND

Ground Pin

may be used. The MX27L1000 supports a intelligent fast
programming algorithm which can result in programming
time of less than thirty seconds.

This EPROM is packaged in industry standard 32 pin
dual-in-line packages,32 lead SOP , 32 lead PLCC, and
32 lead TSOP packages.

FEATURES

128K x 8 organization

Wide power supply range, 2.7V DC to 3.6VDC

+12.5V programming voltage

Fast access time:90/120/150/200/250 ns

Totally static operation

Completely TTL compatible

PIN CONFIGURATIONS

32 PDIP/SOP

Operating current: 20mA @3.6V, 5MHz

Standby current: 10uA

Package type:

- 32 pin plastic DIP
- 32 pin SOP
- 32 pin TSOP
- 32 pin PLCC

P/N: PM0238

REV. 3.8, AUG. 26, 2003

GENERAL DESCRIPTION

The MX27L1000 is a 1M-bit, One Time Programmable
Read Only Memory. It isorganized as 128K words by 8
bits per word, opeates from a single 2.7 to 3.6 volt supply,
has a static standby mode, and features fast single
address location programming. All programming signals
are TTL levels, requirin a single pulse. For programming
outside from the system, existing EPROM programmers

32 PLCC

32 TSOP

BLOCK DIAGRAM

PIN DESCRIPTION

MX27L1000

1M-BIT [128Kx8] LOW VOLTAGE OPERATION

CMOS EPROM

MX27L1000

VPP

A16

A15

A12

GND

VCC

PGM

A14

A13

A11

A10

A14

A13

A11

A10

GND

A12

A15

A16

VPP

VCC

PGM

MX27L1000

A11

A9
A8

A13
A14

PGM

VCC

VPP

A16
A15
A12

A7
A6
A5
A4

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

MX27L1000

CONTROL

LOGIC

OUTPUT

BUFFERS

Q0~Q17

PGM

A0~A16

ADDRESS

INPUTS

Y-DECODER

X-DECODER

Y-SELECT

1M BIT

CELL

MAXTRIX

VCC

GND

VPP

MX27L1000

P/N: PM0238

REV. 3.8 , AUG. 26, 2003

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25

C ambient temperature range

that is required when programming the MX27L1000.

To activate this mode, the programming equipment must
force 12.0

0.5 V on address line A9 of the device.

Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.

Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For
the MX27L1000, these two identifier bytes are given
in the Mode Select Table. All identifiers for manufacturer
and device codes will possess odd parity, with the MSB
(Q7) defined as the parity bit.

READ MODE

The MX27L1000 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data
to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tQE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.

STANDBY MODE

The MX27L1000 has a CMOS standby mode which
reduces the maximum VCC current to 10 uA. It is placed
in CMOS standby when CE is at VCC

0.3 V. The

MX27L1000 also has a TTL-standby mode which
reduces the maximum VCC current to 0.25mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.

FUNCTIONAL DESCRIPTION

THE PROGRAMMING OF THE MX27L1000

When the MX27L1000 is delivered, or it is erased,
the chip has all 1M bits in the "ONE" or HIGH state.
"ZERO" are loaded into the MX27L1000 through the
procedure of programming.

For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.

VCC must be applied simultaneously or before VPP, and
removed simultaneously or after VPP. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across VPP and ground to suppress spurious
voltage transients which may damage the device.

FAST PROGRAMMING

The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm
is shown in Figure 1). The programming is achieved
by applying a single TTL low level 100us pulse to the
PGM input after addresses and data line are stable. If
the data is not verified, an additional pulse is applied
for a maximum of 25 pulses. This process is repeated
while sequencing through each address of the device.
When the programming mode is completed, the data in
all address is verified at VCC = VPP = 5V

10%.

PROGRAM INHIBIT MODE

Programming of multiple MX27L1000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L1000 may be common. A
TTL low-level program pulse applied to an MX27L1000
CE input with VPP = 12.5

0.5 V and PGM LOW will

program that MX27L1000. A high-level CE input inhibits
the other MX27L1000s from being programmed.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE at VIL,
PGM at VIH, and VPP at its programming voltage.

MX27L1000

P/N: PM0238

REV. 3.8 , AUG. 26, 2003

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a two-
line control function is provided to allow for:

1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.

It is recommended that CE be decoded and used as
the primary device-selecting function, while OE be made
a common connection to all devices in the array and
connected to the READ line from the system control
bus. This assures that all deselected memory devices
are in their low-power standby mode and that the output
pins are only active when data is desired from a particular
memory device.

NOTES:
1. VH = 12.0 V

0.5 V

2. X = Either VIH or VIL
3. A1 - A8 = A10 - A16 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.

SYSTEM CONSIDERATIONS

During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
Vcc and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between Vcc and GND for each eight devices. The
location of the capacitor should be close to where the
power supply is connected to the array.

MODE SELECT TABLE

PINS

MODE

PGM

VPP

OUTPUTS

Read

VIL

VCC

DOUT

Output Disable

VIL

VIH

VCC

High Z

Standby (TTL)

VIH

VCC

High Z

Standby (CMOS)

VCC

0.3V

VCC

High Z

Program

VIL

VIH

VIL

VPP

DIN

Program Verify

VIL

VIH

VPP

DOUT

Program Inhibit

VIH

VPP

High Z

Manufacturer Code(3)

VIL

VCC

C2H

Device Code(3)

VIL

VIH

VCC

0EH

MX27L1000

P/N: PM0238

REV. 3.8 , AUG. 26, 2003

DC CHARACTERISTICS

SYMBOL PARAMETER

MIN.

MAX.

UNIT

CONDITIONS

VOH

Output High Voltage

VCC - 0.3

IOH = -100uA VCC=3.0V

VOL

Output Low Voltage

0.3

IOL = 2.1mA, VCC = 3.0V

VIH

Input High Voltage

2.0

Vcc + 0.5

VIL

Input Low Voltage

-0.3

0.6

2.7V < VCC < 3.6V

ILI

Input Leakage Current

-10

VIN = 0 to 3.6V

ILO

Output Leakage Current

-10

VOUT = 0 to 3.6V

ICC3

VCC Power-Down Current

CE = VCC

0.3V

ICC2

VCC Standby Current

0.25

CE = VIH

ICC1

VCC Active Current

CE = VIH, f=5MHz, lout = OmA,

Vcc=3.6V

IPP

Supply Current Read

CE = OE = VIL, VPP = VCC

NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating
conditions for extended period may affect reliability.

NOTICE:
Specifications contained within the following tables are
subject to change.

DC/AC Operating Conditions for Read Operation

ABSOLUTE MAXIMUM RATINGS

RATING

VALUE

Ambient Operating Temperature -40

C to 85

Storage Temperature

-65

C to 125

Applied Input Voltage

-0.5V to 7.0V

Applied Output Voltage

-0.5V to VCC+0.5V

VCC to Ground Potential

-0.5V to 7.0V

V9 & VPP

-0.5V to 13.5V

MX27L1000

-90

-12

-15

-20

-25

Operating Temperature

Commercial

C to 70

Industrial

-40

C to 85

C -40

C to 85

C -40

C to 85

C -40

C to 85

C -40

C to 85

Vcc Power Supply

2.7V to 3.6V

CAPACITANCE

TA = 25

C, f = 1.0 MHz (Sampled only)

SYMBOL PARAMETER

TYP.

MAX.

UNIT

CONDITIONS

CIN

Input Capacitance

VIN = 0V

COUT

Output Capacitance

VOUT = 0V

CVPP

VPP Capacitance

VPP = 0V

MX27L1000

P/N: PM0238

REV. 3.8 , AUG. 26, 2003

AC CHARACTERISTICS

27L1000-90 27L1000-12 27L1000-15 27L1000-20 27L1000-25

Symbol PARAMETER

MIN.

MAX. MIN.

MAX. UNIT CONDITIONS

tACC

Address to Output Delay

120

150

200

250

CE = OE = VIL

tCE

Chip Enable to Output Delay

120

150

200

250

OE = VIL

tOE

Output Enable to Output Delay

100

120

CE = VIL

tDF

OE High to Output Float,

or CE High to Output Float

tOH

Output Hold from Address,

CE or OE which ever occurred first

AC PROGRAMMING CHARACTERISTICS

TA = 25

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

tAS

Address Setup Time

2.0

tOES

OE Setup Time

2.0

tDS

Data Setup Time

2.0

tAH

Address Hold Time

tDH

Data Hold Time

2.0

tDFP

Out put Enable to Output Float Delay

130

tVPS

VPP Setup Time

2.0

tPW

PGM Program Pulse Width

105

tVCS

VCC Setup Time

2.0

tCES

CE Setup Time

2.0

tOE

Data valid from OE

150

DC PROGRAMMING CHARACTERISTICS

TA = 25

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

CONDITIONS

VOH

Output High Voltage

2.4

IOH = -0.10mA

VOL

Output Low Voltage

0.4

IOL = 2.1mA

VIH

Input High Voltage

2.0

VCC + 0.5

VIL

Input Low Voltage

-0.3

0.8

ILI

Input Leakage Current

-10

VIN = 0 to 3.6V

A9 Auto Select Voltage

11.5

12.5

ICC3

VCC Supply Current (Program & Verify)

IPP2

VPP Supply Current(Program)

CE = VIL, OE = VIH

VCC1

Fast Programming Supply Voltage

6.00

6.50

VPP1

Fast Programming Voltage

12.5

13.0

MX27L1000

P/N: PM0238

REV. 3.8 , AUG. 26, 2003

ORDER INFORMATION

PART NO.

ACCESS TIME(ns)

OPERATING

STANDBY

OPERATING

PACKAGE

CURRENT MAX.(mA) CURRENT MAX.(uA)

TEMPERATURE

MX27L1000PC-25

250

C to 70

32 Pin DIP

MX27L1000QC-25

250

C to 70

32 Pin PLCC

MX27L1000MC-25

250

C to 70

32 Pin SOP

MX27L1000TC-25

250

C to 70

32 Pin TSOP

MX27L1000PC-20

200

C to 70

32 Pin DIP

MX27L1000QC-20

200

C to 70

32 Pin PLCC

MX27L1000MC-20

200

C to 70

32 Pin SOP

MX27L1000TC-20

200

C to 70

32 Pin TSOP

MX27L1000PC-15

150

C to 70

32 Pin DIP

MX27L1000QC-15

150

C to 70

32 Pin PLCC

MX27L1000MC-15

150

C to 70

32 Pin SOP

MX27L1000TC-15

150

C to 70

32 Pin TSOP

MX27L1000PC-12

120

C to 70

32 Pin DIP

MX27L1000QC-12

120

C to 70

32 Pin PLCC

MX27L1000MC-12

120

C to 70

32 Pin SOP

MX27L1000TC-12

120

C to 70

32 Pin TSOP

MX27L1000PC-90

C to 70

32 Pin DIP

MX27L1000QC-90

C to 70

32 Pin PLCC

MX27L1000MC-90

C to 70

32 Pin SOP

MX27L1000TC-90

C to 70

32 Pin TSOP

MX27L1000PI-25

250

-40

C to 85

32 Pin DIP

MX27L1000QI-25

250

-40

C to 85

32 Pin PLCC

MX27L1000MI-25

250

-40

C to 85

32 Pin SOP

MX27L1000TI-25

250

-40

C to 85

32 Pin TSOP

MX27L1000PI-20

200

-40

C to 85

32 Pin DIP

MX27L1000QI-20

200

-40

C to 85

32 Pin PLCC

MX27L1000MI-20

200

-40

C to 85

32 Pin SOP

MX27L1000TI-20

200

-40

C to 85

32 Pin TSOP

MX27L1000PI-15

150

-40

C to 85

32 Pin DIP

MX27L1000QI-15

150

-40

C to 85

32 Pin PLCC

MX27L1000MI-15

150

-40

C to 85

32 Pin SOP

MX27L1000TI-15

150

-40

C to 85

32 Pin TSOP

MX27L1000PI-12

120

-40

C to 85

32 Pin DIP

MX27L1000QI-12

120

-40

C to 85

32 Pin PLCC

MX27L1000MI-12

120

-40

C to 85

32 Pin SOP

MX27L1000TI-12

120

-40

C to 85

32 Pin TSOP

MX27L1000PI-90

-40

C to 85

32 Pin DIP

MX27L1000QI-90

-40

C to 85

32 Pin PLCC

MX27L1000MI-90

-40

C to 85

32 Pin SOP

MX27L1000TI-90

-40

C to 85

32 Pin TSOP

MX27L1000

P/N: PM0238

REV. 3.8 , AUG. 26, 2003

REVISION HISTORY

Revision No. Description

Page

Date

2.4

Page 3:Mode Select Table : VPP pin-"VCC" instead of " X".

9/24/1996

Revise SWITCHING TEST WAVEFORM, VOL=0.6V to VOL=0.8V.

3.0

Eliminate Interactive Programming Mode.

6/18/1997

3.1

IPP 100uA --> 10uA

8/07/1997

3.2

Change TSOP Orientation

4/09/1998

3.3

Add speed 90/120ns

P1,9,10

OCT/13/1999

Change VIH/VIL, VOH/VOL for 90/120ns

Change CL to 30pF for 90/120ns

3.4

Cancel 32pin ceramic DIP Package

P1,2,9,11 FEB/25/2000

3.5

To modify Package Information

P10~13

JUL/19/2001

3.6

Cancel "Ultraviolet Erasable" wording in General Description

AUG/20/2001

3.7

To modify Package Information

P10~13

NOV/19/2002

3.8

To modify 32-PLCC package information

P12

AUG/26/2003

A1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom.

from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom.

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