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Электронный компонент: 29F200C-90

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- Superior inadvertent write protection
Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Temporary sector unprotect allows code changes in
previously locked sectors
Sector protect/chip unprotect for 5V only system
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1V to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Low VCC write inhibit is equal to or less than 3.2V
Erase suspend/ Erase Resume
- Suspends an erase operation to read data from, or
program data to a sector that is not being erased, then
resume the erase operation.
Hardware reset pin
- Resets internal state mechine to the read mode
20 years data retention
Package type:
- 44-pin SOP
- 48-pin TSOP
- All Pb-free devices are RoHS Compliant
GENERAL DESCRIPTION
The MX29F200C T/B is a 2-mega bit, single 5 Volt Flash
memory organized as 1M word x16 or 2M bytex8 MXIC's
Flash memories offer the most cost-effective and reli-
able read/write non-volatile random access memory.
The MX29F200C T/B is packaged in 44-pin SOP and 48-
pin TSOP. It is designed to be reprogrammed and
erased in-system or in-standard EPROM programmers.
The standard MX29F200C T/B offers access time as fast
as 55ns, allowing operation of high-speed microproces-
sors without wait states. To eliminate bus contention, the
MX29F200C T/B has separate chip enable (CE#) and
output enable (OE# ) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F200C T/B uses a command register to manage
this functionality. The command register allows for 100%
FEATURES
5.0V10% for read, erase and write operation
131072x16/262144x8 switchable
Fast access time: 55/70/90ns
Compatible with MX29F200T/B device
Low power consumption
- 40mA maximum active current@5MHz
- 1uA typical standby current
Command register architecture
- Byte/Word Programming (9us/11us typical)
- Sector Erase (16K-Bytex1, 8K-Bytex2, 32K-Bytex1,
and 64K-Byte x3)
Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors or
the whole chip with Erase Suspend capability.
- Automatically program and verify data at specified
address
Status Reply
- Data# Polling & Toggle bit for detection of program
and erase cycle completion.
Ready/Busy# pin(RY/BY#)
- Provides a hardware method or detecting program
or erase cycle completion
Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining maxi-
mum EPROM compatibility.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields for
erase and programming operations produces reliable
cycling. The MX29F200C T/B uses a 5.0V
10% VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up
protection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
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REV. 1.0, DEC. 14, 2005
MX29F200C T/B
2M-BIT [256Kx8/128Kx16] CMOS FLASH MEMORY
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REV. 1.0 , DEC. 14, 2005
MX29F200C T/B
PIN CONFIGURATIONS
44 SOP(500mil)
48 TSOP(TYPE I) (12mm x 20mm)
PIN DESCRIPTION
SYMBOL
PIN NAME
A0-A16
Address Input
Q0-Q14
Data Input/Output
Q15/A-1
Q15(Word mode)/LSB addr.(Byte mode)
CE#
Chip Enable Input
OE#
Output Enable Input
RESET#
Hardware Reset Pin, Active low
WE#
Write Enable Input
RY/BY#
Read/Busy Output
BYTE#
Word/Byte Selection Input
VCC
Power Supply Pin (+5V)
GND
Ground Pin
NC
Pin Not Connected Internally
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
RY/BY#
NC
A7
A6
A5
A4
A3
A2
A1
A0
CE#
GND
OE#
Q0
Q8
Q1
Q9
Q2
Q10
Q3
Q11
RESET#
WE#
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
MX29F200C T/B
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RESET#
NC
NC
RY/BY#
NC
NC
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A16
BYTE#
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
Q11
Q3
Q10
Q2
Q9
Q1
Q8
Q0
OE#
GND
CE#
A0
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX29F200C T/B
(NORMAL TYPE)
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RESET#
NC
NC
RY/BY#
NC
NC
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A16
BYTE#
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
Q11
Q3
Q10
Q2
Q9
Q1
Q8
Q0
OE#
GND
CE#
A0
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX29F200C T/B
(REVERSE TYPE)
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REV. 1.0 , DEC. 14, 2005
MX29F200C T/B
MX29F200CT Top Boot Sector Addresses Tables
Sector Size
Address Range (in hexadecimal)
(Kbytes/
A16
A15
A14
A13
A12
Kwords)
(x8)Address Range
(x16) Address Range
SA0
0
0
X
X
X
64/32
00000h-0FFFFh
00000h-07FFFh
SA1
0
1
X
X
X
64/32
10000h-1FFFFh
08000h-0FFFFh
SA2
1
0
X
X
X
64/32
20000h-2FFFFh
10000h-17FFFh
SA3
1
1
0
X
X
32/16
30000h-37FFFh
18000h-1BFFFh
SA4
1
1
1
0
0
8/4
38000h-39FFFh
1C000h-1CFFFh
SA5
1
1
1
0
1
8/4
3A000h-3BFFFh
1D000h-1DFFFh
SA6
1
1
1
1
X
16/8
3C000h-3FFFFh
1E000h-1FFFFh
MX29F200CB Bottom Boot Sector Addresses Tables
Sector Size
Address Range (in hexadecimal)
(Kbytes/
A16
A15
A14
A13
A12
Kwords)
(x8)Address Range
(x16) Address Range
SA0
0
0
0
0
X
16/8
00000h-03FFFh
00000h-01FFFh
SA1
0
0
0
1
0
8/4
04000h-05FFFh
02000h-02FFFh
SA2
0
0
0
1
1
8/4
06000h-07FFFh
03000h-03FFFh
SA3
0
0
1
X
X
32/16
08000h-0FFFFh
04000h-07FFFh
SA4
0
1
X
X
X
64/32
10000h-1FFFFh
08000h-0FFFFh
SA5
1
0
X
X
X
64/32
20000h-2FFFFh
10000h-17FFFh
SA6
1
1
X
X
X
64/32
30000h-3FFFFh
18000h-1FFFFh
SECTOR STRUCTURE
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REV. 1.0 , DEC. 14, 2005
MX29F200C T/B
BLOCK DIAGRAM
CONTROL
INPUT
LOGIC
PROGRAM/ERASE
HIGH VOLTAGE
WRITE
STATE
MACHINE
(WSM)
STATE
REGISTER
FLASH
ARRAY
X-DECODER
ADDRESS
LATCH
AND
BUFFER
Y-PASS GATE
Y
-DECODER
ARRAY
SOURCE
HV
COMMAND
DATA
DECODER
COMMAND
DATA LATCH
I/O BUFFER
PGM
DATA
HV
PROGRAM
DATA LATCH
SENSE
AMPLIFIER
A-1/Q15
Q0-Q14
A0-A16
CE#
OE#
WE#
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REV. 1.0 , DEC. 14, 2005
MX29F200C T/B
AUTOMATIC ERASE ALGORITHM
MXIC's Automatic Erase algorithm requires the user to
write commands to the command register using stand-
ard microprocessor write timings. The device will auto-
matically pre-program and verify the entire array. Then
the device automatically times the erase pulse width,
verifies the erase and counts the number of sequences.
A status bit toggling between consecutive read cycles
provides feedback to the user as to the status of the
programming operation.
Register contents serve as inputs to an internal state-
machine which controls the erase and programming
circuitry. During write cycles, the command register
internally latches addresses and data needed for the
programming and erase operations. During a system
write cycle, addresses are latched on the falling edge,
and data are latched on the rising edge of WE#.
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality,
reliability, and cost effectiveness. The MX29F200C T/B
electrically erases all bits simultaneously using Fowler-
Nordheim tunneling. The bytes are programmed by
using the EPROM programming mechanism of hot
electron injection.
During a program cycle, the state-machine will control
the program sequences and command register will not
respond to any command set. During a Sector Erase
cycle, the command register will only respond to Erase
Suspend command. After Erase Suspend is complete,
the device stays in read mode. After the state machine
has completed its task, it will allow the command register
to respond to its full command set.
AUTOMATIC PROGRAMMING
The MX29F200C T/B is byte programmable using the
Automatic Programming algorithm. The Automatic Pro-
gramming algorithm does not require the system to time
out sequence or verify the data programmed. The
typical chip programming time of the MX29F200C T/B at
room temperature is less than 4.5 seconds.
AUTOMATIC CHIP ERASE
The entire chip is bulk erased using 10 ms erase pulses
according to MXIC's Automatic Chip Erase algorithm.
Typical erasure at room temperature is accomplished in
less than two second. The Automatic Erase algorithm
automatically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
internally controlled by the device.
AUTOMATIC SECTOR ERASE
The MX29F200C T/B is sector(s) erasable using MXIC's
Auto Sector Erase algorithm. Sector erase modes allow
sectors of the array to be erased in one erase cycle. The
Automatic Sector Erase algorithm automatically pro-
grams the specified sector(s) prior to electrical erase.
The timing and verification of electrical erase are inter-
nally controlled by the device.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm requires the
user to only write program set-up commands (include 2
unlock write cycle and A0H) and a program command
(program data and address). The device automatically
times the programming pulse width, verifies the pro-
gram, and counts the number of sequences. A status bit
similar to Data# Polling and a status bit toggling between
consecutive read cycles, provides feedback to the user
as to the status of the programming operation.