390109025502
Page 1 of 11
Aug/02
Rev. 004
Features and Benefits
128 x 1 Sensor-Element Organization (1 Not Connected, 1 dummy, 128 real, 1 dummy
and 1 Dark Pixel)
385 Dots-Per-Inch (DPI) Sensor Pitch
High Linearity and Uniformity for 256 Gray-Scale (8-Bit) Applications
High Sensitivity: 1.7V @ 10W/cm
@ 0.7ms integration time
Special Gain Compensation for use with single LED light source
Output Referenced to Ground
Low Image Lag
Single 5V Supply
Replacement for Texas Instruments TSL1301 & TSL1401 and MLX90255AA
Operation to 1MHz
Applications
Position Sensing
Electrical Power Assist Steering (EPAS)
Spectrometer Applications
Ordering Information
Part No.
Temperature Suffix
Package Code
Option code
MLX90255
K (-40C to 125C)
LA (GLP-5)
-BA
MLX90255
K (-40C to 125C))
JA (SMD-8)
-BA
1. Functional Diagram
3
5
Pixel 2
Pixel 1
Pixel 132
2
1
4
Hold
Q1
Q2
Q132
Switching Logic
132-Bit Shift Register
Integrator Reset
Sample
C
L
K
S
I
G
N
D
V
D
D
A
n
a
l
o
g
O
U
T
External
Load
2. Description
The MLX90255BA linear sensor array consists
of a 128 x 1 array of photodiodes, associated
charge amplifier circuitry and a pixel data-hold
function that provides simultaneous-integration
start and stop times for all pixels. The pixels
measure 200m (H) by 66 m (W). Operation is
simplified by internal control logic that requires
only a serial-input (SI) signal and a clock.
The sensor consists of 128 photodiodes
arranged in a linear array. Light energy falling on
a photodiode generates photocurrent, which is
integrated by the active integration circuitry
associated with that pixel. During the integration
period, a sampling capacitor connects to the
output of the integrator through an analog
switch. The amount of charge accumulated at
each pixel is directly proportional to the light
intensity and the integration time. The output
and reset of the integrators is controlled by a
132-bit shift register and reset logic. An output
cycle is initiated by clocking in a logic 1 on SI.
This causes all 132 sampling capacitors to be
disconnected from their respective integrators
and starts an integrator reset period.
(continued on page 5)
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Rev. 004
TABLE OF CONTENTS
FEATURES AND BENEFITS .................................................................................................................. 1
APPLICATIONS ...................................................................................................................................... 1
ORDERING INFORMATION.................................................................................................................... 1
1.
FUNCTIONAL DIAGRAM.............................................................................................................. 1-1
2.
DESCRIPTION .............................................................................................................................. 2-1
3.
MLX90255BA ELECTRICAL SPECIFICATIONS ............................................................................. 3
4.
GENERAL DESCRIPTION ............................................................................................................... 5
5.
ABSOLUTE MAXIMUM RATINGS ................................................................................................... 5
6.
PERFORMANCE GRAPHS .............................................................................................................. 6
7.
RELIABILITY INFORMATION .......................................................................................................... 7
8.
ESD PRECAUTIONS........................................................................................................................ 7
9.
PACKAGE INFORMATION .............................................................................................................. 8
9.1.
MLX90255BA
LA
(SMD8)
PACKAGE DIMENSIONS
.......................................................................... 8
9.2.
LA
(SMD8)
P
IN
D
ESCRIPTION
....................................................................................................... 9
9.3.
MLX90255BA
JA
(GLP5)
PACKAGE DIMENSIONS
........................................................................... 9
9.4.
JA
(GLP5)
P
IN
D
ESCRIPTION
...................................................................................................... 10
10.
DISCLAIMER ................................................................................................................................. 11
390109025502
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Rev. 004
3. MLX90255BA Electrical Specifications
DC Operating Parameters T
A
= -40
o
C to 125
o
C, V
DD
= 4.5V to 5.5V (unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Supply voltage
Vdd
4.5
5
5.5
V
Input voltage
Vi
0
Vdd
V
High-level input voltage
Vih
Vdd*0.7
Vdd
V
Low-level input voltage
Vil
0
Vdd*0.3
V
Hysteresis on SI and CLK
0.2
0.4
0.8
V
Wavelength of light source
400
1000
nm
Clock frequency
Fclock
64
1024
kHz
Sensor integration time below
60C (1)
Tint
0.125
100
ms
Sensor integration time (full
temperature range) (2)
Tint
0.125
2
ms
Pixel charge transfer time (full
temp range)
Tqt
8
s
Setup time, serial input
Tsu(SI)
350
ns
Hold time, serial input (3)
Th(SI)
160
ns
Operating free-air temperature
Ta
-40
125
C
Clock pulse duration (high)
Tw(H)
320
ns
Clock pulse duration (low)
Tw(L)
320
ns
Notes:
(1) Reset until clock pulse 18 (on declining flank).
Minimum integration time = (133-18) * CLK period + 10s (this is the time the S&H cap needs to follow).
At 1MHz clock speed, the minimum integration time becomes 0.125ms.
(2) At 125C, the integration time should be limited to 2ms.
(3) The SI pulse must go low before the rising edge of the next clock pulse.
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Rev. 004
MLX90255BA Electrical specifications
All tests are made with 0.7ms integration time, at 1
0
mW/cm
light = 100% at 25C at 880nm and with a
clock speed of 500kHz in, 250kHz out, and 500kHz, unless otherwise specified in the Test Conditions.
100 % light under Test Conditions means that the light is set in such a way that there is 2.4V at the output
of the chip.
Parameter
Symbol Test Conditions
Min
Typ
Max
Units
Illumination
Illum100 At 25C, 2.4V at output
11.4
14
16
W/cm
Average analog output (1)
VaoLight At 25C, 100% light
1.5
1.7
2.1
V
Average analog output
Initial offset At 25C, 0% light
0
0.15
0.3
V
Average analog output
VaoDark At 125C, 0% light
0
0.40
1.4
V
Highest Dark Pixel
Vaodarkmax At 125C, 0.25ms integration time
0.8
V
Non Linearity
Nlao1
All Temp
0.5%
1.2%
FS
Pixel Response Non Uniformity (2) PRNU All Temp, 100% light
4.0%
8.5%
FS
Pixel Interaction Test (3)
PIT
AT 25C
5%
FS
Noise Level (4)
Vn
All Temp
3
6
mV (RMS)
Hold spec, same as PRNU
PRNUH All Temp, 100% light, 62.5kHz
4.0%
8.5%
FS
Output Settling Time
Ts
All Temp
450
750
ns
Array Lag (5)
Alag
At 25C
0.5%
FS
Dark Signal Non Uniformity (6)
DSNU At 25C
At 125C
80
140
120
440
mV
mV
Analog Output Saturation
All Temp
3.0
V
Change in sensitivity with
Temperature at 880nm (7)
0
0.3
0.8
%/C
Operating Free Temp
-40
125
C
Supply Current (8)
Idd
2
5
8
mA
(0) After power on, the first integration scan is not guaranteed correct. This scan is needed for initializing digital levels on chip. After a SI and 133 proper
CLK signals, the system is fully initialized and all further scans are valid. The next SI will provide a valid scan.
(1) Absolute Light measurements are very test-setup dependent and should be regarded with caution. Relative measurements are possible with
1%
accuracy.
(2) PRNU is defined as the worst case deviation of any PixelValue (pixel 3 till 130) to the average light value. PixelValue = (Vout of a pixel at 100% light
Vout of same pixel at 0% light) The 90255BA has a cosign shaped gain: external pixels have 15% more gain than middle pixels.
(3) PIT = (Vout of pixel 132 @ 10W Vout of pixel 132 @0W) / (Vaverage @10W Vaverage @10W)
(4) Noise: We compare 5 different measurements, normalize them and then take the RMS value.
(5) Array Lag is defined as: (Vaverage 0W 1 Vaverage 0W2) / ((Vaverage 10W Vaverage 0W 2). Where 0W1 is a 0% light level, 1ms after a 100%
light level. (there can still be some light effects). 0W2 is a 0% light level, 10ms after a 100% light level, which should be a true dark reference.
(6) DSNU is defined as: (max Vout of pixel I @ 0% light) - (min Vout of pixel j @ 0% light) for pixels 3 thru 130
(7) Sensitivity always increases with rising temperature.
(8) Idd is measured with Rload disconnected from the output pin.
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Rev. 004
4. General Description
(continued from page 1)
As the SI pulse is clocked through the shift
register, the charge stored on the sampling
capacitors is sequentially connected to a charge-
coupled output amplifier that generates a voltage
on the analog output AO. Two dummy pixel
values are shifted out first, then the 128 actual
pixel bits, followed by two additional dummy
pixel bits, for a total of 132 data bits. Although
there are only 132 pixels, 133 clock pulses are
necessary for a complete shift out. The final
pulse is used to re-initialize the shift register.
The integrator reset period ends 18 clock cycles
after the SI pulse is clocked in. So the light-
integration starts after the 18
th
CLK pulse. The
light-integration ends at the next SI pulse.
Between the end of the 133
th
clock pulse and the
next SI pulse, a minimum time of 10s is
necessary for an effective S&H function. So the
minimum integration time of the MLX90255BA is
(133 -18) * Ts + 10s and thus dependent on
clock speed. (Ts = clock period) After the 132
data bits are clocked out, the output becomes
high impedance. (see figure) The AO is driven
by a source follower that requires an external
pulldown resistor. (typically 33
0
) The output is
nominally 125mV for no light input and 2.4V for a
nominal full-scale output. The pixel gain is 15%
bigger at the edges than in the middle (cosine
correction) in order to get a flat output when
illuminating the device with a single LED light
source.
The MLX90255BA is intended for use in a wide
variety
of
applications,
including:
image
scanning, mark and code reading, optical
character recognition (OCR) and contact
imaging, edge detection and positioning, and
optical linear and rotary encoding.
The
MLX90255BA is a replacement for the Texas
Instruments' TSL1301 and TSL1401 parts.
5. Absolute Maximum Ratings
Supply Voltage, Vdd
+7V
Digital Input Current Range
-20 to 20 mA
Operating Free-Air temperature
range, Ta
-40C to 125C
(automotive compliant
optical package)
Storage temperature range,
Tstg
-40C to 125C
Lead Temperature
1.6mm (1/16 inch) from case for
10 seconds
260C
Stresses beyond those listed under "absolute
maximum ratings" may cause permanent
damage to the device.
These are stress ratings only, and functional
operation of the device at these or any other
conditions
beyond
those indicated
under
"recommended operating conditions" is not
implied.
Exposure
to
absolute-maximum
-rated
conditions for extended periods may affect
device reliability.
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Rev. 004
6. Performance Graphs
Typical Photodiode Spectral Response Curve (%), without Anti
Reflection Coating*
*There is also an option for an Anti Reflection Coating. This will remove the interference
ripples in the figure above. With this special Anti Reflection Coating, the sensitivity curve in
function of wavelength will be somewhat lower (typically 4%) but will no longer display
interference ripples.
MLX90255 Timing Diagram
High impedance
.
390109025502
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Rev. 004
7. Reliability Information
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave
soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:
IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance
of adhesive strength between device and board.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/
8. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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Rev. 004
9. Package Information
9.1. MLX90255BA JA (SMD8) package dimensions
1
2
3
4
5
6
7
8
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Rev. 004
9.2. JA (SMD8) Pin Description
Pin
Symb
ol
Description
1
SI
Serial Input. Si defines the start of
the data-out sequence
2
CLK
Clock. CLK controls the charge
transfer, pixel output and reset
(together with SI)
3
A0
Analog Output
4
Vdd
Supply voltage, for both analog
and digital circuits
5, 6, 7, 8
Vss
Ground (substrate). All Vss Pins
are referenced to the substrate.
Note: All 4 Vss pins are internally connected to form a large
ground plane to get better EMC characteristics.
9.3. MLX90255BA LA (GLP5) package dimensions
1
2
3
4
5
QS9000, VDA6.1 and ISO14001 Certified
390109025502
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Rev. 004
9.4. LA (GLP5) Pin Description
Pin
Symb
ol
Description
1
SI
Serial Input. Si defines the start of
the data-out sequence
2
CLK
Clock. CLK controls the charge
transfer, pixel output and reset
(together with SI)
3
A0
Analog Output
4
Vdd
Supply voltage, for both analog
and digital circuits
5
Vss
Ground (substrate). All Vss Pins
are referenced to the substrate.
390109025502
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Rev. 004
10. Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in
its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not
be liable to recipient or any third party for any damages, including but not limited to personal injury,
property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or
use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow
out of Melexis' rendering of technical or other services.
2002 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at:
www.melexis.com
Or for additional information contact Melexis Direct:
Europe and Japan:
All other locations:
Phone: +32 13 67 04 95
Phone: +1 603 223 2362
E-mail: sales_europe@melexis.com
E-mail: sales_usa@melexis.com
QS9000, VDA6.1 and ISO14001 Certified
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