2003 Microchip Technology Inc.

DS21713D-page 1

24AA32A/24LC32A

Device Selection Table

Features

· Single supply with operation down to 1.8V

· Low-power CMOS technology

- 1 mA active current typical

- 1

A standby current (max.) (I-temp)

· Organized as 4 blocks of 8K bits (32K bit)

· 2-wire serial interface bus, I

CTM compatible

· Cascadable for up to eight devices

· Schmitt Trigger inputs for noise suppression

· Output slope control to eliminate ground bounce

· 100 kHz (<2.5V) and 400 kHz (

2.5V)

compatibility

· Self-timed write cycle (including auto-erase)

· Page write buffer for up to 32 bytes

· 2 ms typical write cycle time for page write

· Hardware write-protect for entire memory

· Can be operated as a serial ROM

· Factory programming (QTP) available

· ESD protection > 4,000V

· 1,000,000 erase/write cycles

· Data retention > 200 years

· 8-lead PDIP, SOIC, TSSOP and MSOP packages

· Standard and Pb-free finishes available

· Available temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Description

The Microchip Technology Inc. 24AA32A/24LC32A
(24XX32A*) is a 32 Kbit Electrically Erasable PROM.
The device is organized as four blocks of 8K x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.8V, with standby
and active currents of only 1

A and 1 mA,

respectively. It has been developed for advanced, low-
power applications such as personal communications
or data acquisition. The 24XX32A also has a page write
capability for up to 32 bytes of data. Functional address
lines allow up to eight devices on the same bus, for up
to 256 Kbits address space. The 24XX32A is available
in the standard 8-pin PDIP, surface mount SOIC,
TSSOP and MSOP packages.

Package Types

Block Diagram

Part

Number

Range

Max Clock

Frequency

Temp

Ranges

24AA32A

1.8-5.5

400 kHz

(1)

24LC32A

2.5-5.5

400 kHz

I, E

Note 1:

100 kHz for V

<2.5V

24
X

Vss

Vcc

SCL

SDA

PDIP/SOIC/TSSOP/MSOP

XX3

Vcc

A0
A1

SCL
SDA
Vss
A2

1
2
3
4

8
7
6
5

ROTATED TSSOP

(24AA32AX/24LC32AX)

HV Generator

EEPROM

Array

Page Latches

YDEC

XDEC

Sense Amp.

R/W Control

I/O

Control

Logic

I/O

Memory

Control

Logic

SCL

SDA

Vcc

32K I

Serial EEPROM

*24XX32A is used in this document as a generic part number for the 24AA32A/24LC32A devices.

24AA32A/24LC32A

DS21713D-page 2

2003 Microchip Technology Inc.

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

()

.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. V

......................................................................................................... -0.3V to V

+1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied ................................................................................................-65°C to +125°C

ESD protection on all pins

......................................................................................................................................................

4 kV

TABLE 1-1:

DC CHARACTERISTICS

NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.

DC CHARACTERISTICS

= +1.8V to +5.5V

Industrial (I):

= -40°C to +85°C

Automotive (E): T

= -40°C to +125°C

Param.

No.

Symbol

Characteristic

Min

Typ

Max

Units

Conditions

WP, SCL and SDA pins

High-level input voltage

0.7 V

Low-level input voltage

0.3 V

HYS

Hysteresis of Schmitt
Trigger inputs

0.05 V

(Note 1)

Low-level output voltage

0.40

= 3.0 mA, V

= 2.5V

Input leakage current

±1

=.1V to V

Output leakage current

±1

OUT

=.1V to V

OUT

Pin capacitance
(all inputs/outputs)

= 5.0V (Note 1)

= 25°C, F

CLK

= 1 MHz

write

Operating current

0.1

= 5.5V, SCL = 400 kHz

D10

read

0.05

D11

CCS

Standby current

--
--

0.01

1
5

Industrial
Automotive
SDA = SCL = V

WP = V

Note 1:

This parameter is periodically sampled and not 100% tested.

Typical measurements taken at room temperature.

2003 Microchip Technology Inc.

DS21713D-page 3

24AA32A/24LC32A

TABLE 1-2:

AC CHARACTERISTICS

= +1.8V to +5.5V

Industrial (I):

= -40°C to +85°C

Automotive (E):

= -40°C to +125°C

Param.

No.

Symbol

Characteristic

Min

Max

Units

Conditions

CLK

Clock frequency

--
--

400
100

kHz

2.5V

5.5V

1.8V

2.5V (24AA32A)

HIGH

Clock high time

600

4000

--
--

2.5V

5.5V

1.8V

2.5V (24AA32A)

LOW

Clock low time

1300
4700

--
--

2.5V

5.5V

1.8V

2.5V (24AA32A)

SDA and SCL rise time
(Note 1)

--
--

300

1000

2.5V

5.5V

1.8V

2.5V (24AA32A)

SDA and SCL fall time

300

(Note 1)

STA

Start condition hold time

600

4000

--
--

2.5V

5.5V

1.8V

2.5V (24AA32A)

STA

Start condition setup time

600

4700

--
--

2.5V

5.5V

1.8V

2.5V (24AA32A)

DAT

Data input hold time

(Note 2)

DAT

Data input setup time

100
250

--
--

2.5V

5.5V

1.8V

2.5V (24AA32A)

STO

Stop condition setup time

600

4000

--
--

2.5V

5.5V

1.8V

2.5V (24AA32A)

Output valid from clock
(Note 2)

--
--

900

3500

2.5V

5.5V

1.8V

2.5V (24AA32A)

BUF

Bus free time: Time the bus
must be free before a new
transmission can start

1300
4700

--
--

2.5V

5.5V

1.8V

2.5V (24AA32A)

Output fall time from V

minimum to V

maximum

20+0.1C

250
250

2.5V

5.5V

1.8V

2.5V (24AA32A)

Input filter spike suppression
(SDA and SCL pins)

(Notes 1 and 3)

Write cycle time (byte or
page)

Endurance

cycles

25°C, (Note 4)

Note 1:

Not 100% tested. C

= total capacitance of one bus line in pF.

As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

The combined T

and V

HYS

specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a

specification for standard operation.

This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total EnduranceTM Model which can be obtained on Microchip's web site:
www.microchip.com.

2003 Microchip Technology Inc.

DS21713D-page 5

24AA32A/24LC32A

2.0

FUNCTIONAL DESCRIPTION

The 24XX32A supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
serial clock (SCL), controls the bus access and gener-
ates the Start and Stop conditions, while the 24XX32A
works as slave. Both master and slave can operate as
transmitter or receiver, but the master device deter-
mines which mode is activated.

3.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

· Data transfer may be initiated only when the bus

is not busy.

· During data transfer, the data line must remain

stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have been
defined (Figure 3-1).

3.1

Bus not Busy (A)

Both data and clock lines remain high.

3.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All com-
mands must be preceded by a Start condition.

3.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All opera-
tions must be ended with a Stop condition.

3.4

Data Valid (D)

The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.

The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.

Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically
unlimited, (although only the last thirty two bytes will be
stored when doing a write operation). When an over-
write does occur it will replace data in a first-in first-out
(FIFO) fashion.

3.5

Acknowledge

Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.

The device that acknowledges, has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX32A) will leave the data
line high to enable the master to generate the Stop
condition.

FIGURE 3-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

Note:

The 24XX32A does not generate any
Acknowledge bits if an internal
programming cycle is in progress.

SCL

SDA

(A)

(B)

(D)

(A)

(C)

START

CONDITION

ADDRESS OR

ACKNOWLEDGE

VALID

DATA

ALLOWED

TO CHANGE

STOP

CONDITION

24AA32A/24LC32A

DS21713D-page 6

2003 Microchip Technology Inc.

3.6

Device Addressing

A control byte is the first byte received following the
Start condition from the master device (Figure 3-2).
The control byte consists of a four-bit control code. For
the 24XX32A, this is set as `

1010

' binary for read and

write operations. The next three bits of the control byte
are the Chip Select bits (A2, A1, A0). The Chip Select
bits allow the use of up to eight 24XX32A devices on
the same bus and are used to select which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1, and A0 pins for the device to respond. These bits
are in effect the three Most Significant bits of the word
address.

The last bit of the control byte defines the operation to
be performed. When set to a `

', a read operation is

selected. When set to a zero, a write operation is
selected. The next two bytes received define the
address of the first data byte (Figure 3-3). Because
only A11 to A0 are used, the upper four address bits are
don't care bits. The upper address bits are transferred
first, followed by the less significant bits.

Following the Start condition, the 24XX32A monitors
the SDA bus checking the device type identifier being
transmitted and, upon receiving a `

1010

' code and

appropriate device select bits, the slave device outputs
an Acknowledge signal on the SDA line. Depending on
the state of the R/W bit, the 24XX32A will select a read
or write operation.

FIGURE 3-2:

CONTROL BYTE FORMAT

3.7

Contiguous Addressing Across
Multiple Devices

The Chip Select bits A2, A1, A0 can be used to expand
the contiguous address space for up to 256K bits by
adding up to eight 24XX32A's on the same bus. In this
case, software can use A0 of the control byte as
address bit A12, A1 as address bit A13, and A2 as
address bit A14. It is not possible to sequentially read
across device boundaries.

FIGURE 3-3:

ADDRESS SEQUENCE BIT ASSIGNMENTS

ACK

R/W

Control Code

Chip Select

Bits

Slave Address

Acknowledge Bit

Start Bit

Read/Write Bit

0 R/W

CONTROL BYTE

ADDRESS HIGH BYTE

ADDRESS LOW BYTE

CONTROL

CODE

CHIP

SELECT

BITS

X = Don't Care Bit

2003 Microchip Technology Inc.

DS21713D-page 7

24AA32A/24LC32A

4.0

WRITE OPERATIONS

4.1

Byte Write

Following the Start condition from the master, the
control code (4 bits), the Chip Select (3 bits), and the
R/W bit (which is a logic low) are clocked onto the bus
by the master transmitter. This indicates to the
addressed slave receiver that the address high byte
will follow once it has generated an Acknowledge bit
during the ninth clock cycle. Therefore, the next byte
transmitted by the master is the high-order byte of the
word address and will be written into the address
pointer of the 24XX32A. The next byte is the Least
Significant Address Byte. After receiving another
Acknowledge signal from the 24XX32A, the master
device will transmit the data word to be written into the
addressed memory location. The 24XX32A acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle and,
during this time, the 24XX32A will not generate
Acknowledge signals (Figure 4-1). If an attempt is
made to write to the array with the WP pin held high,
the device will acknowledge the command but no
write cycle will occur. No data will be written and the
device will immediately accept a new command. After
a byte Write command, the internal address counter
will point to the address location following the one that
was just written.

4.2

Page Write

The write control byte, word address and the first data
byte are transmitted to the 24XX32A in the same way
as in a byte write. However, instead of generating a
Stop condition, the master transmits up to 31 additional
bytes which are temporarily stored in the on-chip page
buffer and will be written into memory once the master
has transmitted a Stop condition. Upon receipt of each
word, the five lower-address pointer bits are internally
incremented by `

'. If the master should transmit more

than 32 bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 4-2). If an attempt
is made to write to the array with the WP pin held high,
the device will acknowledge the command but no write
cycle will occur, no data will be written and the device
will immediately accept a new command.

4.3

Write-Protection

The WP pin allows the user to write-protect the entire
array (0000-0FFFF) when the pin is tied to V

. If tied

to V

or left floating, the write protection is disabled.

The WP pin is sampled at the Stop bit for every write
command (Figure 3-1) Toggling the WP pin after the
Stop bit will have no effect on the execution of the write
cycle.

Note:

Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
`page size') and, end at addresses that are
integer multiples of [page size - 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.

2003 Microchip Technology Inc.

DS21713D-page 9

24AA32A/24LC32A

5.0

ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a write
command has been issued from the master, the device
initiates the internally-timed write cycle. ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W =

). If the device is still

busy with the write cycle, then no ACK will be returned.
If no ACK is returned, the Start bit and control byte must
be re-sent. If the cycle is complete, the device will
return the ACK and the master can then proceed with
the next Read or Write command. See Figure 5-1 for
flow diagram of this operation.

FIGURE 5-1:

ACKNOWLEDGE POLLING
FLOW

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W =

Did Device

Acknowledge

(ACK = 0)?

Operation

YES

24AA32A/24LC32A

DS21713D-page 10

2003 Microchip Technology Inc.

6.0

READ OPERATION

Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
control byte is set to `

'. There are three basic types of

read operations: current address read, random read,
and sequential read.

6.1

Current Address Read

The 24XX32A contains an address counter that main-
tains the address of the last word accessed, internally
incremented by `

'. Therefore, if the previous read

access was to address n (n is any legal address), the
next current address read operation would access data
from address

n + 1

Upon receipt of the control byte with R/W bit set to `

the 24XX32A issues an acknowledge and transmits the
8- bit data word. The master will not acknowledge the
transfer but does generate a Stop condition and the
24XX32A discontinues transmission (Figure 6-1).

6.2

Random Read

Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must
first be first. This is accomplished by sending the word
address to the 24XX32A as part of a write operation
(R/W bit set to `

'). Once the word address is sent, the

master generates a Start condition following the
acknowledge. This terminates the write operation, but
not before the internal address pointer is set. The
master issues the control byte again, but with the R/W
bit set to a `

'. The 24XX32A will then issue an

acknowledge and transmit the 8-bit data word. The
master will not acknowledge the transfer but does
generate a Stop condition which causes the 24XX32A
to discontinue transmission (Figure 6-2). After a ran-
dom Read command, the internal address counter will
point to the address location following the one that
was just read.

6.3

Sequential Read

Sequential reads are initiated in the same way as a
random read, except that once the 24XX32A transmits
the first data byte, the master issues an acknowledge
as opposed to the Stop condition used in a random
read. This acknowledge directs the 24XX32A to
transmit the next sequentially addressed 8-bit word
(Figure 6-3). Following the final byte transmitted to the
master, the master will NOT generate an acknowledge
but will generate a Stop condition. To provide sequen-
tial reads, the 24XX32A contains an internal address
pointer which is incremented by `

' upon completion of

each operation. This address pointer allows the entire
memory contents to be serially read during one
operation. The internal address pointer will automati-
cally roll over from address FFF to address 0000 if the
master acknowledges the byte received from the array
address 0FFF.

FIGURE 6-1:

CURRENT ADDRESS READ

BUS ACTIVITY
MASTER

SDA LINE

BUS ACTIVITY

CONTROL

BYTE

DATA (n)

R
T

24AA32A/24LC32A

DS21713D-page 12

2003 Microchip Technology Inc.

7.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 7-1.

TABLE 7-1:

PIN FUNCTION TABLE

7.1

A0, A1, A2 Chip Address Inputs

The A0, A1, A2 inputs are used by the 24XX32A for
multiple device operation. The levels on these inputs
are compared with the corresponding bits in the slave
address. The chip is selected if the compare is true.

Up to eight devices may be connected to the same bus
by using different Chip Select bit combinations. These
inputs must be connected to either V

or V

7.2

Serial Data (SDA)

SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal, therefore, the SDA bus requires a pull-up
resistor to V

(typical 10 k

for 100 kHz, 2 k

for

400 kHz)

For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.

7.3

Serial Clock (SCL)

The SCL input is used to synchronize the data transfer
to and from the device.

7.4

Write-Protect (WP)

The WP pin can be connected to either V

, V

or left

floating. An internal pull-down resistor on this pin will
keep the device in the unprotected state if left floating.
If tied to V

, or left floating, normal memory operation

is enabled (read/write the entire memory 000-FFF).

If tied to V

, write operations are inhibited. Read

operations are not affected.

Name

PDIP

SOIC

TSSOP

MSOP

ROTATED

TSSOP

Description

Chip Address Input

Ground

SDA

Serial Address/Data I/O

SCL

Serial Clock

Write-Protect Input

+1.8V to 5.5V Power Supply

2003 Microchip Technology Inc.

DS21713D-page 13

24AA32A/24LC32A

8.0

PACKAGING INFORMATION

8.1

Package Marking Information

XXXXXXXX
T/XXXNNN

YYWW

8-Lead PDIP (300 mil)

Example:

8-Lead SOIC (150 mil)

Example:

XXXXXXXX

T/XXYYWW

NNN

8-Lead TSSOP

Example:

24LC32A
I/P13F

0327

24LC32A
I/SN0327

13F

4LA

I327

13F

8-Lead MSOP

Example:

XXXXXT

YWWNNN

4L32AI

32713F

8-Lead SOIC (208 mil)

Example:

XXXXXXXX

T/XXXXXX

YYWWNNN

24LC32A

I/SM

032713F

Legend: XX...X

Customer specific information*

Temperature grade (I, E)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week `01')

NNN

Alphanumeric traceability code

Note:

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.

*Standard QTP marking consists of Microchip part number, year code, week code, and traceability code.

Device

TSSOP

Marking Codes

STD

Rot

Pb-free

Rot

24AA32A

4AA

4AAX

G4AA

G4AAX

24LC32A

4LA

4LAX

G4LA

G4LAX

Device

MSOP

Marking Codes

STD

Pb-free

24AA32A

4A32

G4AA

24LC32A

4L32A

G4LA

Note:

Pb-free part number using "G" suffix
is marked on carton

XXXX

TYWW

NNN

24AA32A/24LC32A

DS21713D-page 14

2003 Microchip Technology Inc.

8-Lead Plastic Dual In-line (P) 300 mil (PDIP)

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.360

.373

.385

9.14

9.46

9.78

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001
Drawing No. C04-018

.010" (0.254mm) per side.

§ Significant Characteristic

2003 Microchip Technology Inc.

DS21713D-page 15

24AA32A/24LC32A

8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.42

0.33

.020

.017

.013

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

0.76

0.62

0.48

.030

.025

.019

Foot Length

0.51

0.38

0.25

.020

.015

.010

Chamfer Distance

5.00

4.90

4.80

.197

.193

.189

Overall Length

3.99

3.91

3.71

.157

.154

.146

Molded Package Width

6.20

6.02

5.79

.244

.237

.228

Overall Width

0.25

0.18

0.10

.010

.007

.004

Standoff

1.55

1.42

1.32

.061

.056

.052

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

§ Significant Characteristic

24AA32A/24LC32A

DS21713D-page 16

2003 Microchip Technology Inc.

8-Lead Plastic Small Outline (SM) Medium, 208 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.43

0.36

.020

.017

.014

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

0.76

0.64

0.51

.030

.025

.020

Foot Length

5.33

5.21

5.13

.210

.205

.202

Overall Length

5.38

5.28

5.11

.212

.208

.201

Molded Package Width

8.26

7.95

7.62

.325

.313

.300

Overall Width

0.25

0.13

0.05

.010

.005

.002

Standoff

1.98

.078

Molded Package Thickness

2.03

.080

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

.070

.075

.069

.074

1.78

1.75

1.97

1.88

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
Drawing No. C04-056

§ Significant Characteristic

2003 Microchip Technology Inc.

DS21713D-page 17

24AA32A/24LC32A

8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

Foot Length

3.10

3.00

2.90

.122

.118

.114

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

Overall Width

0.15

0.10

0.05

.006

.004

.002

Standoff

0.95

0.90

0.85

.037

.035

.033

Molded Package Thickness

1.10

.043

Overall Height

0.65

.026

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Foot Angle

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086

§ Significant Characteristic

24AA32A/24LC32A

DS21713D-page 18

2003 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

(F)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037 REF

Footprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

.016

.024

.118 BSC

.000

.030

.193 TYP.

.033

MIN

Units

.026 BSC

NOM

INCHES

0.95 REF

.009

.016

0.08

0.22

0°

0.23

0.40

8°

MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

15°

5°

15°

5°

JEDEC Equivalent: MO-187

0°

8°

5°

15°

2003 Microchip Technology Inc.

DS21713D-page 21

24AA32A/24LC32A

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip
World Wide Web site.

The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape

or Microsoft

Internet Explorer. Files are also available for FTP
download from our FTP site.

Connecting to the Microchip Internet
Web Site

The Microchip web site is available at the following
URL:

www.microchip.com

The file transfer site is available by using an FTP
service to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:

· Latest Microchip Press Releases

· Technical Support Section with Frequently Asked

Questions

· Design Tips

· Device Errata

· Job Postings

· Microchip Consultant Program Member Listing

· Links to other useful web sites related to

Microchip Products

· Conferences for products, Development Systems,

technical information and more

· Listing of seminars and events

SYSTEMS INFORMATION AND
UPGRADE HOT LINE

The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

042003

24AA32A/24LC32A

DS21713D-page 22

2003 Microchip Technology Inc.

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

RE:

Reader Response

Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature

Number:

Questions:

FAX: (______) _________ - _________

DS21713D

24AA32A/24LC32A

What are the best features of this document?

How does this document meet your hardware and software development needs?

Do you find the organization of this document easy to follow? If not, why?

What additions to the document do you think would enhance the structure and subject?

What deletions from the document could be made without affecting the overall usefulness?

Is there any incorrect or misleading information (what and where)?

How would you improve this document?

2003 Microchip Technology Inc.

DS21713D-page 23

24AA32A/24LC32A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

PART NO.

/XX

Package

Temperature

Range

Device

Device:

24AA32A:

1.8V, 32 Kbit I

C Serial EEPROM

24AA32AT: 1.8V, 32 Kbit I

C Serial EEPROM

(Tape and Reel)

24AA32AX 1.8V, 32 Kbit I

C Serial EEPROM in

alternate pinout (ST only)

24AA32AXT 1.8V, 32 Kbit I

C Serial EEPROM in

alternate pinout (ST only)

24LC32A:

2.5V, 32 Kbit I

C Serial EEPROM

24LC32AT: 2.5V, 32 Kbit I

C Serial EEPROM

(Tape and Reel)

24LC32AX 2.5V, 32 Kbit I

C Serial EEPROM in

alternate pinout (ST only)

24LC32AXT 2.5V, 32 Kbit I

C Serial EEPROM in

alternate pinout (ST only)

Tempera-
ture
Range:

-40°C to +85°C

-40°C to +125°C

Package:

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

SM =

Plastic SOIC (208 mil body), 8-lead

Plastic TSSOP (4.4 mm), 8-lead

MS =

Plastic Micro Small Outline (MSOP), 8-lead

Lead Finish

Blank =

Standard 63% / 37% SnPb

Pb-free (Matte Tin - Pure Sn)

Lead Finish

Examples:

24AA32A-I/P: Industrial Temperature,1.8V,
PDIP package

24AA32A-I/SN: Industrial Temperature,1.8V,
SOIC package

24AA32A-I/SM: Industrial Temperature.,1.8V,
SOIC (208 mil) package

24AA32AX-I/ST: Industrial Temp.,1.8V,
Rotated TSSOP package

24AA32A-I/ST: Industrial Temperature.,1.8V,
TSSOP package

24AA32A-I/PG: Industrial Temperature.,1.8V,
PDIP package. Pb-free

24LC32A-I/P: Industrial Temperature, 2.5V,
PDIP package

24LC32A-E/SN: Automotive Temperature,
2.5V SOIC package

24LC32A-E/SM: Automotive Temperature,
2.5V SOIC (208 mil) package

24LC32AX-E/ST: Automotive Temperature,
2.5V, Rotated TSSOP package

24LC32AT-I/ST: Industrial Temperature, 2.5V,
TSSOP package, Tape and Reel

24LC32AT-I/SNG: Industrial Temperature,
2.5V, SOIC package, Tape and Reel, Pb-free

2003 Microchip Technology Inc.

DS21713D-page 25

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

AmpLab, FilterLab, micro

, MXDEV, MXLAB, PICMASTER,

SEEVAL and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company's quality system processes and
procedures are QS-9000 compliant for its
PICmicro

8-bit MCUs, K

code hopping

devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip's quality system for the
design and manufacture of development
systems is ISO 9001 certified.

DS21713D-page 26

2003 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com

Atlanta

3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307

Boston

2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821

Chicago

333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075

Dallas

4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924

Detroit

Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Fax: 248-538-2260

Kokomo

2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387

Los Angeles

18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338

Phoenix

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966
Fax: 480-792-4338

San Jose

2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950
Fax: 408-436-7955

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509

ASIA/PACIFIC

Australia

Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755

China - Beijing

Unit 915
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Tel: 86-10-85282100
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China - Chengdu

Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
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Tel: 86-28-86766200
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China - Fuzhou

Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza
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Tel: 852-2401-1200
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China - Shanghai

Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
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Tel: 86-21-6275-5700
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China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
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China - Shunde

Room 401, Hongjian Building
No. 2 Fengxiangnan Road, Ronggui Town
Shunde City, Guangdong 528303, China
Tel: 86-765-8395507 Fax: 86-765-8395571

China - Qingdao

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No. 12 Hong Kong Central Rd.
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India

Divyasree Chambers
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Japan

Benex S-1 6F
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Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea

168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934

Singapore

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#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803

Taiwan

Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Austria

Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393

Denmark

Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910

France

Parc d'Activite du Moulin de Massy
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Batiment A - ler Etage
91300 Massy, France
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Fax: 33-1-69-30-90-79

Germany

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Italy

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Milan, Italy
Tel: 39-0331-742611
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Netherlands

P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
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United Kingdom

505 Eskdale Road
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Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820

07/28/03

ORLDWIDE

ALES

AND

ERVICE

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 24AA32AXT

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 24AA32AXT