2003 Microchip Technology Inc.

DS21796B-page 1

93AA76A/B/C, 93LC76A/B/C,

93C76A/B/C

Device Selection Table

Features

· Low-power CMOS technology
· ORG pin to select word size for `76C' version
· 1024 x 8-bit organization `A' devices (no ORG)
· 512 x 16-bit organization `B' devices (no ORG)
· Program Enable pin to write-protect the entire

array

· Self-timed ERASE/WRITE cycles (including

auto-erase)

· Automatic ERAL before WRAL
· Power on/off data protection circuitry
· Industry standard 3-wire serial I/O
· Device STATUS signal (READY/BUSY)
· Sequential READ function
· 1,000,000 E/W cycles
· Data retention > 200 years
· Temperature ranges supported:

Pin Function Table

Description

The Microchip Technology Inc. 93XX76A/B/C devices
are 8K bit low-voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX76C are dependent upon external logic
levels driving the ORG pin to set word size. For
dedicated 8-bit communication, the 93XX76A devices
are available, while the 93XX76B devices provide
dedicated 16-bit communication. A Program Enable
(PE) pin allows the user to write-protect the entire
memory array. Advanced CMOS technology makes
these devices ideal for low-power, nonvolatile memory
applications. The 93XX Series is available in standard
packages including 8-lead PDIP and SOIC, and
advanced packaging including 8-lead MSOP, 6-lead
SOT-23, and 8-lead TSSOP. Pb-free (Pure Matte Sn)
finish is also available.

Package Types (not to scale)

Part Number

Range

ORG Pin

Word Size

Temp Ranges

Packages

93AA76A

1.8-5.5

8-bit

93AA76B

1.8-5-5

16-bit

93LC76A

2.5-5.5

8-bit

I, E

93LC76B

2.5-5.5

16-bit

I, E

93C76A

4.5-5.5

8-bit

I, E

93C76B

4.5-5.5

16-bit

I, E

93AA76C

1.8-5.5

Yes

8 or 16-bit

P, SN, ST, MS

93LC76C

2.5-5.5

Yes

8 or 16-bit

I, E

P, SN, ST, MS

93C76C

4.5-5.5

Yes

8 or 16-bit

I, E

P, SN, ST, MS

- Industrial (I)

-40°C to +85°C

- Automotive (E)

-40°C to +125°C

Name

Function

Chip Select

CLK

Serial Data Clock

Serial Data Input

Serial Data Output

Ground

Program Enable

ORG

Memory Configuration

Power Supply

CLK

1
2
3
4

8
7
6
5

PE
ORG
V

PDIP/SOIC

(P, SN)

TSSOP/MSOP

CLK

ORG

(ST, MS)

SOT-23

1
2
3

6
5

CLK

(OT)

8K Microwire

Compatible Serial EEPROM

Microwire is a registered trademark of National Semiconductor.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 2

2003 Microchip Technology Inc.

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

()

.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. V

......................................................................................................... -0.6V to V

+1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied ................................................................................................-40°C to +125°C

ESD protection on all pins

...................................................................................................................................................... 4 kV

DC CHARACTERISTICS

NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

All parameters apply over the specified
ranges unless otherwise noted.

= range by device (see Table on Page 1)

Industrial (I):

AMB

= -40°C to +85°C

Automotive (E): T

AMB

= -40°C to +125°C

Param.

No.

Symbol

Parameter

Min

Typ

Max

Units

Conditions

High-level input voltage

2.0

0.7 V

--
--

V
V

2.7V

< 2.7V

Low-level input voltage

-0.3
-0.3

--
--

0.8

0.2 V

V
V

2.7V

< 2.7V

Vol1
Vol2

Low-level output voltage

--
--

0.4
0.2

V
V

= 2.1 mA, V

= 4.5V

= 100

µA, V

= 2.5V

High-level output voltage

2.4

- 0.2

--
--

V
V

= -400

µA, V

= 4.5V

= -100

µA, V

= 2.5V

Input leakage current

±10

µA

= V

to V

Output leakage current

±10

µA

OUT

= V

to V

OUT

Pin capacitance (all inputs/
outputs)

OUT

= 0V (Note 1)

AMB

= 25°C, F

CLK

= 1 MHz

write Write current

--
--

500

µA

CLK

= 3 MHz, V

= 5.5V

CLK

= 2 MHz, V

= 2.5V

read Read current

--
--
--

--
--

100

500

µA

CLK

= 3 MHz, V

= 5.5V

CLK

= 2 MHz, V

= 3.0V

CLK

= 2 MHz, V

= 2.5V

D10

CCS

Standby current

--
--

1
5

µA

I Temp
E Temp
CLK = Cs = 0V
ORG = DI = V

or V

(Note 2) (Note 3)

D11

POR

voltage detect

93AA76A/B/C, 93LC76A/B/C
93C76A/B/C

--
--

1.5V
3.8V

--
--

V
V

(Note 1)

Note 1:

This parameter is periodically sampled and not 100% tested.

ORG pin not available on `A' or `B' versions.

READY/BUSY status must be cleared from DO, see Section 3.4 "Data Out (DO)".

2003 Microchip Technology Inc.

DS21796B-page 3

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

AC CHARACTERISTICS

All parameters apply over the specified
ranges unless otherwise noted.

= range by device (see Table on Page 1)

Industrial (I):

AMB

= -40°C to +85°C

Automotive (E): T

AMB

= -40°C to +125°C

Param.

No.

Symbol

Parameter

Min

Max

Units

Conditions

CLK

Clock frequency

3
2
1

MHz
MHz
MHz

4.5V

< 5.5V

2.5V

< 4.5V

1.8V

< 2.5V

CKH

Clock high time

200
250
450

ns
ns
ns

4.5V

< 5.5V

2.5V

< 4.5V

1.8V

< 2.5V

CKL

Clock low time

100
200
450

ns
ns
ns

4.5V

< 5.5V

2.5V

< 4.5V

1.8V

< 2.5V

CSS

Chip select setup time

100
250

ns
ns
ns

4.5V

< 5.5V

2.5V

< 4.5V

1.8V

< 2.5V

CSH

Chip select hold time

1.8V

< 5.5V

CSL

Chip select low time

250

1.8V

< 5.5V

DIS

Data input setup time

100
250

ns
ns
ns

4.5V

< 5.5V

2.5V

< 4.5V

1.8V

< 2.5V

DIH

Data input hold time

100
250

ns
ns
ns

4.5V

< 5.5V

2.5V

< 4.5V

1.8V

< 2.5V

Data output delay time

100
250
400

ns
ns
ns

4.5V

< 5.5V, CL = 100 pF

2.5V

< 4.5V, CL = 100 pF

1.8V

< 2.5V, CL = 100 pF

A10

Data output disable time

100
200

ns
ns

4.5V

< 5.5V, (Note 1)

1.8V

< 4.5V, (Note 1)

A11

Status valid time

200
300
500

ns
ns
ns

4.5V

< 5.5V, CL = 100 pF

2.5V

< 4.5V, CL = 100 pF

1.8V

< 2.5V, CL = 100 pF

A12

Program cycle time

ERASE/WRITE mode (AA and LC
versions)

A13

ERASE/WRITE mode
(93C versions)

A14

ERAL mode, 4.5V

5.5V

A15

WRAL mode, 4.5V

5.5V

A16

Endurance

cycles 25°C, V

= 5.0V, (Note 2)

Note 1:

This parameter is periodically sampled and not 100% tested.

This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total EnduranceTM Model which may be obtained on www.microchip.com.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 4

2003 Microchip Technology Inc.

FIGURE 1-1:

SYNCHRONOUS DATA TIMING

TABLE 1-1:

INSTRUCTION SET FOR X 16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1)

TABLE 1-2:

INSTRUCTION SET FOR X 8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0)

Instruction

Opcode

Address

Data In

Data Out

Req. CLK

Cycles

READ

A8 A7 A6 A5 A4 A3 A2 A1 A0

D15 D0

EWEN

HIGH-Z

ERASE

A8 A7 A6 A5 A4 A3 A2 A1 A0

(RDY/BSY)

ERAL

(RDY/BSY)

WRITE

A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 D0

(RDY/BSY)

WRAL

D15 D0

(RDY/BSY)

EWDS

HIGH-Z

Instruction

Opcode

Address

Data In

Data Out

Req. CLK

Cycles

READ

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

D7 D0

EWEN

HIGH-Z

ERASE

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

(RDY/BSY)

ERAL

(RDY/BSY)

WRITE

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

D7 D0

(RDY/BSY)

WRAL

D7 D0

(RDY/BSY)

EWDS

HIGH-Z

CLK

(READ)

(PROGRAM)

CSS

DIS

CKH

CKL

DIH

CSH

STATUS VALID

Note:

is relative to CS.

2003 Microchip Technology Inc.

DS21796B-page 5

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

2.0

FUNCTIONAL DESCRIPTION

When the ORG* pin is connected to V

, the (x16)

organization is selected. When it is connected to
ground, the (x8) organization is selected. Instructions,
addresses and write data are clocked into the DI pin on
the rising edge of the clock (CLK). The DO pin is
normally held in a HIGH-Z state except when reading
data from the device, or when checking the READY/
BUSY status during a programming operation. The
READY/BUSY status can be verified during an Erase/
Write operation by polling the DO pin; DO low indicates
that programming is still in progress, while DO high
indicates the device is ready. DO will enter the HIGH-Z
state on the falling edge of CS.

2.1

START Condition

The START bit is detected by the device if CS and DI
are both high with respect to the positive edge of CLK
for the first time.

Before a START condition is detected, CS, CLK and DI
may change in any combination (except to that of a
START condition), without resulting in any device
operation (READ, WRITE, ERASE, EWEN, EWDS,
ERAL, or WRAL). As soon as CS is high, the device is
no longer in Standby mode.

An instruction following a START condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.

2.2

Data In/Data Out (DI/DO)

It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a "bus conflict" to occur during the "dummy zero"
that precedes the read operation, if A0 is a logic high-
level. Under such a condition the voltage level seen at
Data Out is undefined and will depend upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of A0,
the higher the voltage at the Data Out pin. In order to
limit this current, a resistor should be connected
between DI and DO.

2.3

Data Protection

All modes of operation are inhibited when V

is below

a typical voltage of 1.5V for `93AA' and `93LC' devices
or 3.8V for `93C' devices.

The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.

Note:

For added protection, an EWDS command
should be performed after every write
operation.

After power-up, the device is automatically in the
EWDS mode. Therefore, an

EWEN

instruction must be

performed before the initial

ERASE

WRITE

instruction

can be executed.

Block Diagram

Memory

Array

Data Register

Mode

Decode

Logic

Clock

Address
Decoder

Address

Counter

Output

Buffer

ORG*

CLK

*ORG and PE inputs are not available on

A/B devices.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 6

2003 Microchip Technology Inc.

2.4

ERASE

The

ERASE

instruction forces all data bits of the speci-

fied address to the logical "1" state. CS is brought low
following the loading of the last address bit. This falling
edge of the CS pin initiates the self-timed program-
ming cycle, except on `93C' devices where the rising
edge of CLK before the last address bit initiates the
write cycle.

The DO pin indicates the READY/BUSY status of the
device if CS is brought high after a minimum of 250 ns
low (T

CSL

). DO at logical "0" indicates that program-

ming is still in progress. DO at logical "1" indicates that
the register at the specified address has been erased
and the device is ready for another instruction.

Note:

Issuing a START bit and then taking CS low
will clear the READY/BUSY status from
DO.

FIGURE 2-1:

ERASE TIMING

CLK

CSL

CHECK STATUS

-1

-2

···

BUSY

READY

HIGH-Z

2003 Microchip Technology Inc.

DS21796B-page 7

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

2.5

ERASE ALL (ERAL)

The Erase All (

ERAL

) instruction will erase the entire

memory array to the logical "1" state. The ERAL cycle
is identical to the ERASE cycle, except for the different
opcode. The ERAL cycle is completely self-timed and
commences at the falling edge of the CS, except on
`93C' devices where the rising edge of CLK before the
last data bit initiates the write cycle. Clocking of the
CLK pin is not necessary after the device has entered
the ERAL cycle.

The DO pin indicates the READY/BUSY status of the
device, if CS is brought high after a minimum of 250 ns
low (T

CSL

Note:

Issuing a START bit and then taking CS low
will clear the READY/BUSY status from
DO.

must be

4.5V for proper operation of ERAL.

FIGURE 2-2:

ERAL TIMING

CLK

CSL

CHECK STATUS

···

BUSY

READY

HIGH-Z

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 8

2003 Microchip Technology Inc.

2.6

ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)

The 93XX76A/B/C powers up in the ERASE/WRITE
Disable (

EWDS

) state. All programming modes must be

preceded by an ERASE/WRITE Enable (

EWEN

) instruc-

tion. Once the

EWEN

instruction is executed, program-

ming remains enabled until an

EWDS

instruction is

executed or V

is removed from the device. To protect

against accidental data disturbance, the

EWDS

instruc-

tion can be used to disable all ERASE/WRITE
functions and should follow all programming opera-
tions. Execution of a

READ

instruction is independent of

both the

EWEN

and

EWDS

instructions.

FIGURE 2-3:

EWDS TIMING

FIGURE 2-4:

EWEN TIMING

2.7

READ

The

READ

instruction outputs the serial data of the

addressed memory location on the DO pin. A dummy
zero bit precedes the 8-bit (If ORG pin is low or A-Version
devices) or 16-bit (If ORG pin is high or B-version

devices) output string. The output data bits will toggle on
the rising edge of the CLK and are stable after the spec-
ified time delay (T

). Sequential read is possible when

CS is held high. The memory data will automatically cycle
to the next register and output sequentially.

FIGURE 2-5:

READ TIMING

CLK

···

CSL

CLK

CSL

···

CLK

···

HIGH-Z

···

2003 Microchip Technology Inc.

DS21796B-page 9

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

2.8

WRITE

The

WRITE

instruction is followed by 8 bits (If ORG is

low or A-version devices) or 16 bits (If ORG pin is high
or B-version devices) of data which are written into the
specified address. For 93AA76A/B/C and 93LC76A/B/C
devices, after the last data bit is clocked into DI, the
falling edge of CS initiates the self-timed auto-erase and
programming cycle. For 93C76A/B/C devices, the self-
timed auto-erase and programming cycle is initiated by
the rising edge of CLK on the last data bit.

The DO pin indicates the READY/BUSY status of the
device, if CS is brought high after a minimum of 250 ns
low (T

CSL

). DO at logical "0" indicates that program-

ming is still in progress. DO at logical "1" indicates that
the register at the specified address has been written
with the data specified and the device is ready for
another instruction.

Note:

Issuing a START bit and then taking CS low
will clear the READY/BUSY status from
DO.

FIGURE 2-6:

WRITE TIMINGS

CLK

···

BUSY

READY

HIGH-Z

Twc

CSL

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 10

2003 Microchip Technology Inc.

2.9

WRITE ALL (WRAL)

The Write All (

WRAL

) instruction will write the entire

memory array with the data specified in the command.
For 93AA76A/B/C and 93LC76A/B/C devices, after the
last data bit is clocked into DI, the falling edge of CS
initiates the self-timed auto-erase and programming
cycle. For 93C76A/B/C devices, the self-timed auto-
erase and programming cycle is initiated by the rising
edge of CLK on the last data bit. Clocking of the CLK
pin is not necessary after the device has entered the
WRAL cycle. The WRAL command does include an

automatic ERAL cycle for the device. Therefore, the

WRAL

instruction does not require an

ERAL

instruction

but the chip must be in the EWEN status.

The DO pin indicates the READY/BUSY status of the
device if CS is brought high after a minimum of 250 ns
low (T

CSL

Note:

Issuing a START bit and then taking CS low
will clear the READY/BUSY status from
DO.

must be

4.5V for proper operation of WRAL.

FIGURE 2-7:

WRAL TIMING

CLK

HIGH-Z

···

HIGH-Z

BUSY

READY

CSL

2003 Microchip Technology Inc.

DS21796B-page 11

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

3.0

PIN DESCRIPTIONS

TABLE 3-1:

PIN DESCRIPTIONS

3.1

Chip Select (CS)

A high-level selects the device; a low-level deselects
the device and forces it into Standby mode. However, a
programming cycle which is already in progress will be
completed, regardless of the Chip Select (CS) input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.

CS must be low for 250 ns minimum (T

CSL

) between

consecutive instructions. If CS is low, the internal
control logic is held in a RESET status.

3.2

Serial Clock (CLK)

The Serial Clock is used to synchronize the communi-
cation between a master device and the 93XX series
device. Opcodes, address and data bits are clocked in
on the positive edge of CLK. Data bits are also clocked
out on the positive edge of CLK.

CLK can be stopped anywhere in the transmission
sequence (at high or low-level) and can be continued
anytime with respect to clock high time (T

CKH

) and

clock low time (T

CKL

). This gives the controlling master

freedom in preparing opcode, address and data.

CLK is a "Don't Care" if CS is low (device deselected).
If CS is high, but the START condition has not been
detected (DI = 0), any number of clock cycles can be
received by the device without changing its status (i.e.,
waiting for a START condition).

CLK cycles are not required during the self-timed
WRITE (i.e., auto ERASE/WRITE) cycle.

After detection of a START condition the specified
number of clock cycles (respectively low to high transi-
tions of CLK) must be provided. These clock cycles are
required to clock in all required opcode, address and
data bits before an instruction is executed. CLK and DI
then become don't care inputs waiting for a new START
condition to be detected.

3.3

Data In (DI)

Data In (DI) is used to clock in a START bit, opcode,
address and data synchronously with the CLK input.

3.4

Data Out (DO)

Data Out (DO) is used in the Read mode to output data
synchronously with the CLK input (T

after the posi-

tive edge of CLK).

This pin also provides READY/BUSY status informa-
tion during ERASE and WRITE cycles. READY/BUSY
status information is available on the DO pin if CS is
brought high after being low for minimum chip select
low time (T

CSL

) and an erase or write operation has

been initiated.

The status signal is not available on DO, if CS is held
low during the entire ERASE or WRITE cycle. In this
case, DO is in the HIGH-Z mode. If status is checked
after the ERASE/WRITE cycle, the data line will be high
to indicate the device is ready.

Note:

Issuing a START bit and then taking CS low
will clear the READY/BUSY status from
DO.

3.5

Organization (ORG)

When the ORG pin is connected to V

or Logic HI, the

(x16) memory organization is selected. When the ORG
pin is tied to V

or Logic LO, the (x8) memory

organization is selected. For proper operation, ORG
must be tied to a valid logic level.

93XX76A devices are always x8 organization and
93XX76B devices are always x16 organization.

Name

SOIC/PDIP/MSOP/

TSSOP

SOT-23

Function

Chip Select

CLK

Serial Clock

Data In

Data Out

Ground

ORG

N/A

Organization / 93XX76C

N/A

Program Enable

Power Supply

2003 Microchip Technology Inc.

DS21796B-page 13

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

4.0

PACKAGING INFORMATION

4.1

Package Marking Information

Legend: XX...X Part number

Temperature

Blank Commercial
I

Industrial

E Extended
YY

Year code (last 2 digits of calendar year) except TSSOP
and MSOP which use only the last 1 digit

Week code (week of January 1 is week `01')

NNN

Alphanumeric traceability code

Note:

Custom marking available.

Example:

6-Lead SOT-23

8-Lead MSOP (150 mil)

Example:

XXXXXXT

YWWNNN

3L76I

2281L7

XXNN

4EL7

XXXXXNNN

XXXXXXXX

YYWW

8-Lead PDIP

8-Lead SOIC

XXXXYYWW

XXXXXXXX

NNN

XXXX
TYWW

8-Lead TSSOP

NNN

I/P 1L7

93LC76

0228

Example:

I/SN 0228

93LC76

1L7

L76
I228

Example:

MSOP 1st Line Marking Codes

Device

93AA76C

93LC76C

93C76C

std mark

3A76CT

3L76CT

3C76CT

Pb-free

mark

GA76CT

GL76CT

GC76CT

T = blank for commercial, "I" for Industrial,

"E" for Extended.

TSSOP 1st Line Marking Codes

Device

93AA76C

93LC76C

93C76C

std mark

A76C

L76C

C76C

Pb-free

mark

GADC

GLDC

GCDC

Temperature grade is marked on line 2.

SOT23 Marking Codes

Device

93AA76A
93AA76B
93LC76A
93LC76B

93C76A
93C76B

I-temp
4BNN
4LNN
4ENN
4PNN
4HNN
4TNN

E-temp

4FNN
4RNN
4JNN
4UNN

Pb-free topside mark is same; Pb-free
noted only on carton label.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 14

2003 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

(F)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037 REF

Footprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

.016

.024

.118 BSC

.000

.030

.193 TYP.

.033

MIN

Units

.026 BSC

NOM

INCHES

0.95 REF

.009

.016

0.08

0.22

0°

0.23

0.40

8°

MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

15°

5°

15°

5°

JEDEC Equivalent: MO-187

0°

8°

5°

15°

2003 Microchip Technology Inc.

DS21796B-page 15

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

6-Lead Plastic Small Outline Transistor (CH) (SOT-23)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.50

0.43

0.35

.020

.017

.014

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

Foot Angle

0.55

0.45

0.35

.022

.018

.014

Foot Length

3.10

2.95

2.80

.122

.116

.110

Overall Length

1.75

1.63

1.50

.069

.064

.059

Molded Package Width

3.00

2.80

2.60

.118

.110

.102

Overall Width

0.15

0.08

0.00

.006

.003

.000

Standoff

1.30

1.10

0.90

.051

.043

.035

Molded Package Thickness

1.45

1.18

0.90

.057

.046

.035

Overall Height

1.90

.075

Outside lead pitch (basic)

0.95

.038

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

exceed .005" (0.127mm) per side.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

Notes:

JEITA (formerly EIAJ) equivalent: SC-74A

Drawing No. C04-120

*Controlling Parameter

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 16

2003 Microchip Technology Inc.

8-Lead Plastic Dual In-line (P) 300 mil (PDIP)

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.360

.373

.385

9.14

9.46

9.78

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001
Drawing No. C04-018

.010" (0.254mm) per side.

§ Significant Characteristic

2003 Microchip Technology Inc.

DS21796B-page 17

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.42

0.33

.020

.017

.013

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

0.76

0.62

0.48

.030

.025

.019

Foot Length

0.51

0.38

0.25

.020

.015

.010

Chamfer Distance

5.00

4.90

4.80

.197

.193

.189

Overall Length

3.99

3.91

3.71

.157

.154

.146

Molded Package Width

6.20

6.02

5.79

.244

.237

.228

Overall Width

0.25

0.18

0.10

.010

.007

.004

Standoff

1.55

1.42

1.32

.061

.056

.052

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

§ Significant Characteristic

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 18

2003 Microchip Technology Inc.

8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

Foot Length

3.10

3.00

2.90

.122

.118

.114

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

Overall Width

0.15

0.10

0.05

.006

.004

.002

Standoff

0.95

0.90

0.85

.037

.035

.033

Molded Package Thickness

1.10

.043

Overall Height

0.65

.026

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Foot Angle

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086

§ Significant Characteristic

2003 Microchip Technology Inc.

DS21796B-page 19

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip
World Wide Web site.

The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape

or Microsoft

Internet Explorer. Files are also available for FTP
download from our FTP site.

Connecting to the Microchip Internet
Web Site

The Microchip web site is available at the following
URL:

www.microchip.com

The file transfer site is available by using an FTP ser-
vice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:

· Latest Microchip Press Releases
· Technical Support Section with Frequently Asked

Questions

· Design Tips
· Device Errata
· Job Postings
· Microchip Consultant Program Member Listing
· Links to other useful web sites related to

Microchip Products

· Conferences for products, Development Systems,

technical information and more

· Listing of seminars and events

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

042003

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796B-page 20

2003 Microchip Technology Inc.

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

RE:

Reader Response

Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature

Number:

Questions:

FAX: (______) _________ - _________

DS21796B

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

2003 Microchip Technology Inc.

DS21796B-page 21

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Sales and Support

Device

93AA76A: 8K 1.8V Microwire Serial EEPROM (x8)
93AA76B: 8K 1.8V Microwire Serial EEPROM (x16)
93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG

93LC76A: 8K 2.5V Microwire Serial EEPROM (x8)
93LC76B: 8K 2.5V Microwire Serial EEPROM (x16)
93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG

93C76A: 8K 5.0V Microwire Serial EEPROM (x8)
93C76B: 8K 5.0V Microwire Serial EEPROM (x16)
93C76C: 8K 5.0V Microwire Serial EEPROM w/ORG

Tape & Reel:

Blank =

Standard pinout

Tape & Reel

Temperature Range

-40°C to +85°C

-40°C to +125°C

Package

Plastic MSOP (Micro Small outline, 8-lead)

SOT-23, 6-lead (Tape & Reel only)

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

TSSOP, 8-lead

Lead Finish:

Blank =

Standard 63% / 37% SnPb

Pb-free (Matte Tin - Pure Sn)

Examples:
a)

93AA76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 1.8V

93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 1.8V

93AA76CT-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, tape and reel, 1.8V

93LC76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 2.5V

93LC76BT-I/OT: 8K, 512x16 Serial EEPROM,
SOT-23 package, tape and reel, 2.5V

93LC76CXT-I/SNG: 8K, 1024x8 or 512x16

Serial EEPROM, SOIC package, Industrial
temperature, tape and reel, Pb-free finish, 2.5V

93C76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 5.0V

93C76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 5.0V

PART NO.

/XX

Package

Temperature

Range

Device

Lead Finish

Tape & Reel

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences
and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of
the following:

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

2003 Microchip Technology Inc.

DS21796B-page 23

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
K

, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and

PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

FilterLab, micro

ID, MXDEV, MXLAB, PICMASTER, SEEVAL

and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.

Accuron, Application Maestro, dsPICDEM, dsPICDEM.net,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-
Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company's quality system processes and
procedures are QS-9000 compliant for its
PICmicro

8-bit MCUs, K

code hopping

devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip's quality system for the
design and manufacture of development
systems is ISO 9001 certified.

DS21796B-page 24

2003 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com

Atlanta

3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307

Boston

2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821

Chicago

333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075

Dallas

4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924

Detroit

Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Fax: 248-538-2260

Kokomo

2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387

Los Angeles

18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338

Phoenix

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966
Fax: 480-792-4338

San Jose

2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950
Fax: 408-436-7955

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509

ASIA/PACIFIC

Australia

Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755

China - Beijing

Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100
Fax: 86-10-85282104

China - Chengdu

Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Fax: 86-28-86766599

China - Fuzhou

Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431

China - Shanghai

Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393

China - Shunde

Room 401, Hongjian Building
No. 2 Fengxiangnan Road, Ronggui Town
Shunde City, Guangdong 528303, China
Tel: 86-765-8395507 Fax: 86-765-8395571

China - Qingdao

Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205

India

Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea

168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934

Singapore

200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803

Taiwan

Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Austria

Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393

Denmark

Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910

France

Parc d'Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

Germany

Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Italy

Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611
Fax: 39-0331-466781

Netherlands

P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
Fax: 31-416-690340

United Kingdom

505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820

07/28/03

ORLDWIDE

ALES

AND

ERVICE

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 93C76A

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 93C76A

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 93C76A