2002 Microchip Technology Inc.
DS21353B-page 1
TC1070/TC1071/TC1187
Features
Zero Ground Current for Longer Battery Life
Adjustable Output Voltage
Very Low Dropout Voltage
Choice of 50mA (TC1070), 100mA (TC1071) and
150mA (TC1187) Output
Power-Saving Shutdown Mode
Over Current and Over Temperature Protection
Space-Saving 5-Pin SOT-23A Package
Pin Compatible with Bipolar Regulators
Applications
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Device Selection Table
Package Type
General Description
The TC1070, TC1071 and TC1187 are adjustable
LDOs designed to supersede a variety of older (bipolar)
voltage regulators. Total supply current is typically
50
A at full load (20 to 60 times lower than in bipolar
regulators).
The devices' key features include ultra low noise
operation, very low dropout voltage typically 85mV
(TC1070); 180mV (TC1071); and 270mV (TC1187) at
full load, and fast response to step changes in load.
Supply current is reduced to 0.5
A (max) when the
shutdown input is low. The devices incorporate both
over-temperature and over-current protection. Output
voltage is programmed with a simple resistor divider
from V
OUT
to ADJ to GND.
The TC1070, TC1071 and TC1187 are stable with an
output capacitor of only 1
F and have a maximum
output
current
of
50mA,
100mA
and
150mA,
respectively. For higher output versions, please see the
TC1174 (I
OUT
= 300mA) data sheet.
Typical Application
Part Number
Output
Voltage
(V)
Package
Junction
Temp. Range
TC1070VCT
Adjustable 5-Pin SOT-23A -40C to +125C
TC1071VCT
Adjustable 5-Pin SOT-23A -40C to +125C
TC1187VCT
Adjustable 5-Pin SOT-23A -40C to +125C
SHDN
5
5-Pin SOT-23A
TC1070
TC1071
TC1187
1
3
4
2
V
IN
V
OUT
GND
ADJ
NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A)
TC1070
TC1071
TC1187
V
OUT
GND
C1
1
F
+
V
IN
V
IN
V
OUT
1
5
2
4
3
SHDN
Shutdown Control
(from Power Control Logic)
ADJ
R1
R2
[ ]
V
OUT
= V
REF
x +1
R1
R2
50mA, 100mA and 150mA Adjustable CMOS LDOs with Shutdown
TC1070/TC1071/TC1187
DS21353B-page 2
2002 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage........................... (-0.3V) to (V
IN
+ 0.3V)
Power Dissipation................Internally Limited (Note 5)
Maximum Voltage on Any Pin ........ V
IN
+0.3V to -0.3V
Operating Temperature Range...... -40C < T
J
< 125C
Storage Temperature.......................... -65C to +150C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V
IN
= V
OUT
+ 1V, I
L
= 0.1mA, C
L
= 3.3
F, SHDN > V
IH
, T
A
= 25C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40C to +125C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
IN
Input Operating Voltage
2.7
--
6.0
V
Note 6
I
OUT
MAX
Maximum Output Current
50
100
150
--
--
--
--
--
--
mA
TC1070
TC1071
TC1187
V
OUT
Adjustable Output
Voltage Range
V
REF
--
5.5
V
V
REF
Reference Voltage
1.165
1.20
1.235
V
V
REF
/
T
V
REF
Temperature Coefficient
--
40
--
ppm/C
Note 1
V
OUT
/
V
IN
Line Regulation
--
0.05
0.35
%
(V
R
+ 1V)
V
IN
6V
V
OUT
/V
OUT
Load Regulation
TC1070; TC1071
TC1187
--
--
0.5
0.5
2
3
%
I
L
= 0.1mA to I
OUT
MAX
I
L
= 0.1mA to I
OUT
MAX
(Note 2)
V
IN
-V
OUT
Dropout Voltage
TC1071; TC1187
TC1187
--
--
--
--
--
2
65
85
180
270
--
--
120
250
400
mV
I
L
= 0.1mA
I
L
= 20mA
I
L
= 50mA
I
L
= 100mA
I
L
= 150mA (Note 3)
I
IN
Supply Current
--
50
80
A
SHDN = V
IH
, I
L
= 0
I
INSD
Shutdown Supply Current
--
0.05
0.5
A
SHDN = 0V
PSRR
Power Supply Rejection Ratio
--
64
--
dB
F
RE
1kHz
I
OUT
SC
Output Short Circuit Current
--
300
450
mA
V
OUT
= 0V
V
OUT
/
P
D
Thermal Regulation
--
0.04
--
V/W
Note 4
T
SD
Thermal Shutdown Die Temperature
--
160
--
C
T
SD
Thermal Shutdown Hysteresis
--
10
--
C
eN
Output Noise
--
260
--
nV/
Hz
I
L
= I
OUT
MAX
Note
1:
2:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
3:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
4:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I
L
MAX
at V
IN
= 6V for T = 10 msec.
5:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details..
6:
The minimum V
IN
has to justify the conditions: V
IN
V
R
+ V
DROPOUT
and V
IN
2.7V for I
L
= 0.1mA to I
OUT
MAX
.
TC V
OUT
= (V
OUT
MAX
V
OUT
MIN
) x 10
6
V
OUT
x
T
2002 Microchip Technology Inc.
DS21353B-page 3
TC1070/TC1071/TC1187
TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATION
S (CONTINUED
)
Electrical Characteristics: V
IN
= V
OUT
+ 1V, I
L
= 0.1mA, C
L
= 3.3
F, SHDN > V
IH
, T
A
= 25C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40C to +125C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
SHDN Input
V
IH
SHDN Input High Threshold
45
--
--
%V
IN
V
IN
= 2.5V to 6.5V
V
IL
SHDN Input Low Threshold
--
--
15
%V
IN
V
IN
= 2.5V to 6.5V
ADJ Input
I
ADJ
Adjust Input Leakage Current
--
50
--
pA
Note
1:
2:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
3:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
4:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I
L
MAX
at V
IN
= 6V for T = 10 msec.
5:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
6:
The minimum V
IN
has to justify the conditions: V
IN
V
R
+ V
DROPOUT
and V
IN
2.7V for I
L
= 0.1mA to I
OUT
MAX
.
TC V
OUT
= (V
OUT
MAX
V
OUT
MIN
) x 10
6
V
OUT
x
T
TC1070/TC1071/TC1187
DS21353B-page 4
2002 Microchip Technology Inc.
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(5-Pin SOT-23A)
Symbol
Description
1
V
IN
Unregulated supply input.
2
GND
Ground terminal.
3
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this
input. The regulator enters shutdown when a logic low is applied to this input. During shut-
down, output voltage falls to zero and supply current is reduced to 0.5
A (max).
4
ADJ
Output voltage adjust terminal. Output voltage setting is programmed with a resistor divider
from V
OUT
to this input. A capacitor may also be added to this input to reduce output noise
(See Section 3.2, Output Capacitor).
5
V
OUT
Regulated voltage output.
2002 Microchip Technology Inc.
DS21353B-page 5
TC1070/TC1071/TC1187
3.0
DETAILED DESCRIPTION
The TC1070, TC1071 and TC1187 are adjustable fixed
output voltage regulators. (If a fixed version is desired,
please see the TC1014/TC1015/TC1185 data sheet.)
Unlike bipolar regulators, the TC1070, TC1071 and
TC1187 supply current does not increase with load
current. In addition, V
OUT
remains stable and within
regulation over the entire 0mA to I
OUT
MAX
operating
load current range, (an important consideration in RTC
and CMOS RAM battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above V
IH
, and shutdown (disabled)
when SHDN is at or below V
IL
. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05
A
(typical), V
OUT
falls to zero volts.
FIGURE 3-1:
BATTERY-OPERATED
SUPPLY
3.1
Adjust Input
The output voltage setting is determined by the values
of R1 and R2 (Figure 3-1). The ohmic values of these
resistors should be between 470K and 3M to minimize
bleeder current.
The output voltage setting is calculated using the
following equation.
EQUATION 3-1:
The voltage adjustment range of the TC1070, TC1071
and TC1187 is from V
REF
to (V
IN
0.05V). If so desired,
a small capacitor (100pF to 0.01
F) may be added to
the ADJ input to further reduce output noise.
3.2
Output Capacitor
A 1
F (min) capacitor from V
OUT
to ground is
recommended. The output capacitor should have an
effective series resistance greater than 0.1
and less
than 5.0
, and a resonant frequency above 1MHz. A
1
F capacitor should be connected from V
IN
to GND if
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30C, solid tantalums are recommended for
applications operating below -25C.) When operating
from sources
other
than
batteries,
supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
TC1070
TC1071
TC1187
V
OUT
SHDN
GND
C2
1
F
+
V
IN
+2.45V
Shutdown Control
(from Power
Control Logic)
C1
1
F
+
3.0V
Battery
+
C3
100pF
to 0.01
F
(Optional)
R1
470K
1
5
2
4
3
ADJ
R2
470K
V
OUT
= V
REF
x
[
+ 1
]
R1
R2
TC1070/TC1071/TC1187
DS21353B-page 6
2002 Microchip Technology Inc.
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated
thermal
protection
circuitry
shuts
the
regulator off when die temperature exceeds 160C.
The regulator remains off until the die temperature
drops to approximately 150C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
A
MAX
), the maximum allowable die temperature
(T
J
MAX
) and the thermal resistance from junction-to-air
(
JA
). The 5-Pin SOT-23A package has a
JA
of
approximately 220C/Watt.
EQUATION 4-2:
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
V
IN
MAX
= 3.0V 10%
V
OUT
MIN
= 2.7V 2%
I
LOAD
MAX
= 40mA
T
J
MAX
= 125C
T
A
MAX
= 55C
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
D
(V
IN
MAX
V
OUT
MIN
)I
LOAD
MAX
= [(3.0 x 1.10) (2.7 x .0.98)]40 x 10
3
= 26.2mW
Maximum allowable power dissipation:
In this example, the TC1070 dissipates a maximum of
26.2mW; below the allowable limit of 318mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower
JA
and therefore
increase the maximum allowable power dissipation
limit.
Where:
P
D
(V
IN
MAX
V
OUT
MIN
)I
LOAD
MAX
P
D
V
IN
MAX
V
OUT
MIN
I
LOAD
MAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on V
IN
P
D
MAX
= (T
J
MAX
T
A
MAX
)
JA
Where all terms are previously defined.
P
D
MAX
= (T
J
MAX
T
A
MAX
)
JA
= (125 55)
220
= 318mW
2002 Microchip Technology Inc.
DS21353B-page 7
TC1070/TC1071/TC1187
5.0
TYPICAL CHARACTERISTICS
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25C)
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.000
0.002
0.004
0.006
0.008
0.010
0.012
0.014
0.016
0.018
0.020
-40
-20
0
20
50
70
125
DROPOUT VOLTAGE (V)
I
LOAD
= 10mA
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
Dropout Voltage vs. Temperature (V
OUT
= 3.3V)
0.000
0.020
0.040
0.060
0.080
0.100
0.120
0.140
0.160
0.180
0.200
-40
-20
0
20
50
70
125
DROPOUT VOLTAGE (V)
I
LOAD
= 100mA
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
Dropout Voltage vs. Temperature (V
OUT
= 3.3V)
0
10
20
30
40
50
60
70
80
90
GND CURRENT (
A)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
I
LOAD
= 10mA
C
IN
= 1
F
C
OUT
= 1
F
Ground Current vs. V
IN
(V
OUT
= 3.3V)
V
IN
(V)
0.000
0.010
0.020
0.030
0.040
0.050
0.060
0.070
0.080
0.090
0.100
-40
-20
0
20
50
70
125
DROPOUT VOLTAGE (V)
I
LOAD
= 50mA
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
Dropout Voltage vs. Temperature (V
OUT
= 3.3V)
0.000
0.050
0.100
0.150
0.200
0.250
0.300
-40
-20
0
20
50
70
125
DROPOUT VOLTAGE (V)
I
LOAD
= 150mA
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
Dropout Voltage vs. Temperature (V
OUT
= 3.3V)
0
10
20
30
40
50
60
70
80
90
GND CURRENT (
A)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
I
LOAD
= 100mA
C
IN
= 1
F
C
OUT
= 1
F
Ground Current vs. V
IN
(V
OUT
= 3.3V)
V
IN
(V)
TC1070/TC1071/TC1187
DS21353B-page 8
2002 Microchip Technology Inc.
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25C)
0
10
20
30
40
50
60
70
80
GND CURRENT (
A)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
I
LOAD
= 150mA
C
IN
= 1
F
C
OUT
= 1
F
V
IN
(V)
Ground Current vs. V
IN
(V
OUT
= 3.3V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
I
LOAD
= 100mA
C
IN
= 1
F
C
OUT
= 1
F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
V
IN
(V)
V
OUT
(V)
V
OUT
vs.
V
IN
(V
OUT
= 3.3V)
3.274
3.276
3.278
3.280
3.282
3.284
3.286
3.288
3.290
-40
-20
-10
0
20
40
85
125
I
LOAD
= 150mA
C
IN
= 1
F
C
OUT
= 1
F
V
IN
= 4.3V
TEMPERATURE (
C)
V
OUT
(V)
Output Voltage vs. Temperature (V
OUT
= 3.3V)
0
0.5
1
1.5
2
2.5
3
3.5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
I
LOAD
= 0
C
IN
= 1
F
C
OUT
= 1
F
V
IN
(V)
V
OUT
(V)
V
OUT
vs.
V
IN
(V
OUT
= 3.3V)
3.275
3.280
3.285
3.290
3.295
3.300
3.305
3.310
3.315
3.320
-40
-20
-10
0
20
40
85
125
I
LOAD
= 10mA
C
IN
= 1
F
C
OUT
= 1
F
V
IN
= 4.3V
TEMPERATURE (
C)
V
OUT
(V)
Output Voltage vs. Temperature (V
OUT
= 3.3V)
2002 Microchip Technology Inc.
DS21353B-page 9
TC1070/TC1071/TC1187
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25C)
4.985
4.990
4.995
5.000
5.005
5.010
5.015
5.020
5.025
-40
-20
-10
0
20
40
85
125
I
LOAD
= 10mA
V
IN
= 6V
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
Output Voltage vs. Temperature (V
OUT
= 5V)
V
OUT
(V)
0
10
20
30
40
50
60
70
-40
-20
-10
0
20
40
85
125
GND CURRENT (
A)
I
LOAD
= 10mA
V
IN
= 6V
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
Temperature
vs. Quiescent Current (V
OUT
= 5V)
4.974
4.976
4.978
4.980
4.982
4.984
4.986
4.988
4.990
4.992
4.994
-40
-20
-10
0
20
40
85
125
I
LOAD
= 150mA
V
IN
= 6V
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
Output Voltage vs. Temperature (V
OUT
= 5V)
V
OUT
(V)
Temperature vs. Quiescent Current (V
OUT
= 5V)
0
10
20
30
40
50
60
70
80
-40
-20
-10
0
20
40
85
125
GND CURRENT (
A)
I
LOAD
= 150mA
V
IN
= 6V
C
IN
= 1
F
C
OUT
= 1
F
TEMPERATURE (
C)
10.0
1.0
0.1
0.0
0.01K 0.1K
1K
10K
100K
1000K
FREQUENCY (Hz)
Output Noise vs. Frequency
NOISE (
V/
Hz)
R
LOAD
= 50
C
OUT
= 1
F
C
IN
= 1
F
1000
100
10
1
0.1
0.01
0
10 20 30 40 50 60 70 80 90 100
LOAD CURRENT (mA)
Stability Region vs. Load Current
C
OUT
ESR
(
)
C
OUT
= 1
F
to 10
F
Stable Region
Stable Region
-30
-35
-40
-45
-50
-60
-55
-65
-70
-75
-80
0.01K 0.1K
1K
10K
100K 1000K
FREQUENCY (Hz)
Power Supply Rejection Ratio
PSRR (dB)
I
OUT
=
10mA
V
INDC
=
4V
V
INAC
=
100mVp-p
V
OUT
=
3V
C
IN
=
0
C
OUT
=
1
F
TC1070/TC1071/TC1187
DS21353B-page 10
2002 Microchip Technology Inc.
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
V
OUT
V
SHDN
Measure Rise Time of 3.3V LDO
Conditions: C
IN
= 1
F, C
OUT
= 1
F, I
LOAD
= 100mA, V
IN
= 4.3V,
Temp = 25
C, Fall Time = 184S
V
SHDN
Measure Rise Time of 5.0V LDO
Conditions: C
IN
= 1
F, C
OUT
= 1
F, I
LOAD
= 100mA, V
IN
= 6V,
Temp = 25
C, Fall Time = 192S
V
OUT
Thermal Shutdown Response of 5.0V LDO
Conditions: V
IN
= 6V, C
IN
= 0
F, C
OUT
= 1
F
I
LOAD
was increased until temperature of die reached about 160
C, at
which time integrated thermal protection circuitry shuts the regulator
off when die temperature exceeds approximately 160
C. The regulator
remains off until die temperature drops to approximately 150
C.
V
OUT
Measure Fall Time of 3.3V LDO
Conditions: C
IN
= 1
F, C
OUT
= 1
F, I
LOAD
= 100mA, V
IN
= 4.3V,
Temp = 25
C, Fall Time = 52S
V
OUT
V
SHDN
Measure Fall Time of 5.0V LDO
Conditions: C
IN
= 1
F, C
OUT
= 1
F, I
LOAD
= 100mA, V
IN
= 6V,
Temp = 25
C, Fall Time = 88S
V
OUT
V
SHDN
2002 Microchip Technology Inc.
DS21353B-page 11
TC1070/TC1071/TC1187
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
"1" & "2" = part number code + temperature range and
voltage
"3" represents year and quarter code
"4" represents lot ID number
6.2
Taping Form
(V)
TC1070
Code
TC1071
Code
TC1187
Code
Adjustable
BA
BB
R9
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
5-Pin SOT-23A
8 mm
4 mm
3000
7 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
W
P
TC1070/TC1071/TC1187
DS21353B-page 12
2002 Microchip Technology Inc.
6.3
Package Dimensions
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.075 (1.90)
REF.
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
10
MAX.
.010 (0.25)
.004 (0.09)
SOT-23A-5
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21353B-page 13
TC1070/TC1071/TC1187
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1070/TC1071/TC1187
DS21353B-page 14
2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc.
DS21353B-page 15
TC1070/TC1071/TC1187
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
K
EE
L
OQ
, microID,
MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company's quality system processes and
procedures are QS-9000 compliant for its
PICmicro
8-bit MCUs, K
EE
L
OQ
code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip's quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21353B-page 16
2002 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Rocky Mountain
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Atlanta
500 Sugar Mill Road, Suite 200B
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Tel: 770-640-0034 Fax: 770-640-0307
Boston
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Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
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Tel: 630-285-0071 Fax: 630-285-0075
Dallas
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Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
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Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
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Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
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Tel: 949-263-1888 Fax: 949-263-1338
New York
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Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
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San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
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Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
China - Beijing
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
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Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
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Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
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Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
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Benex S-1 6F
3-18-20, Shinyokohama
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Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
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Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
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Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d'Activite du Moulin de Massy
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Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
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20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
*DS21353B*
W
ORLDWIDE
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ALES
AND
S
ERVICE
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