2002 Microchip Technology Inc.
DS21373B-page 1
TC1262
Features
Very Low Dropout Voltage
500mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Over Current and Over Temperature Protection
Applications
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Device Selection Table
NOTE: xx indicates output voltages.
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
General Description
The TC1262 is a fixed output, high accuracy (typically
0.5%) CMOS low dropout regulator. Designed specif-
ically for battery-operated systems, the TC1262's
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80
A at full load (20 to 60 times lower than
in bipolar regulators).
TC1262 key features include ultra low noise operation,
very low dropout voltage (typically 350mV at full load),
and fast response to step changes in load.
The TC1262 incorporates both over temperature and
over current protection. The TC1262 is stable with an
output capacitor of only 1
F and has a maximum
output current of 500mA. It is available in 3-Pin
SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.
Typical Application
Part Number
Package
Junction
Temp. Range
TC1262-xxVDB
3-Pin SOT-223
-40C to +125C
TC1262-xxVAB
3-Pin TO-220
-40C to +125C
TC1262-xxVEB
3-Pin DDPAK
-40C to +125C
V
IN
V
IN
V
OUT
GND
G
ND
V
OU
T
Tab is GND
Front View
Front View
1
1
2
3
3
2
Tab is GND
TC1262
TC1262
V
IN
V
OU
T
TC1262
3-Pin TO-220
Tab is GND
3-Pin SOT-223
3-Pin DDPAK
1
2
3
G
ND
TC1262
V
IN
V
OUT
C1
1
F
GND
V
OUT
V
IN
+
500mA Fixed Output CMOS LDO
TC1262
DS21373B-page 2
2002 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (V
SS
0.3V) to (V
IN
+ 0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........ V
IN
+0.3V to -0.3V
Operating Temperature Range...... -40C < T
J
< 125C
Storage Temperature.......................... -65C to +150C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1262 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V
IN
= V
OUT
+ 1V, I
L
= 100
A, C
L
= 3.3
F, T
A
= 25C, unless otherwise noted. Boldface type
specifications apply for junction temperatures of -40C to +125C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
IN
Input Operating Voltage
2.7
--
6.0
V
Note 7
I
OUT
MAX
Maximum Output Current
500
--
--
mA
V
OUT
Output Voltage
--
V
R
2.5%
V
R
0.5%
--
--
V
R
+ 2.5%
V
Note 1
V
OUT
/
T
V
OUT
Temperature Coefficient
--
40
--
ppm/C
Note 2
V
OUT
/
V
IN
Line Regulation
--
.003
0.35
%/V
(V
R
+ 1V)
V
IN
6V
V
OUT
/V
OUT
Load Regulation
--
0.002
0.01
%/mA
I
L
= 0.1mA to I
OUT
MAX
(Note 3)
V
IN
-V
OUT
Dropout Voltage
--
--
--
20
60
200
350
30
130
390
650
mV
I
L
= 100
A
I
L
= 100mA
I
L
= 300mA
I
L
= 500mA (Note 4)
I
DD
Supply Current
--
80
130
A
I
L
= 0
PSRR
Power Supply Rejection Ratio
--
64
--
dB
F
RE
1kHz
I
OUT
SC
Output Short Circuit Current
--
1200
--
mA
V
OUT
= 0V
V
OUT
/
P
D
Thermal Regulation
--
0.04
--
V/W
Note 5
eN
Output Noise
--
260
--
nV/
Hz
I
L
= I
OUT
MAX
, F
RE
= 10kHz
Note
1:
V
R
is the regulator output voltage setting.
2:
3:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I
L
MAX
at V
IN
= 6V for T = 10 msec.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7:
The minimum V
IN
has to justify the conditions: V
IN
V
R
+ V
DROPOUT
and V
IN
2.7V for I
L
= 0.1mA to I
OUT
MAX
.
TC V
OUT
= (V
OUT
MAX
V
OUT
MIN
) x 10
6
V
OUT
x
T
2002 Microchip Technology Inc.
DS21373B-page 3
TC1262
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
3.0
DETAILED DESCRIPTION
The TC1262 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1262's supply current does
not increase with load current. In addition, V
OUT
remains stable and within regulation over the entire
0mA to I
LOAD
MAX
load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 3-1 shows a typical application circuit.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
3.1
Output Capacitor
A 1
F (min) capacitor from V
OUT
to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1
and less than 5
, and a
resonant frequency above 1MHz. A 1
F capacitor
should be connected from V
IN
to GND if there is more
than 10 inches of wire between the regulator and the
AC filter capacitor, or if a battery is used as the power
source. Aluminum electrolytic or tantalum capacitor
types can be used. (Since many aluminum electrolytic
capacitors
freeze
at
approximately
-30C,
solid
tantalums are recommended for applications operating
below -25C.) When operating from sources other than
batteries,
supply-noise
rejection
and
transient
response can be improved by increasing the value of
the input and output capacitors and employing passive
filtering techniques.
Pin No.
(3-Pin SOT-223)
(3-Pin TO-220)
(3-Pin DDPAK)
Symbol
Description
1
V
IN
Unregulated supply input.
2
GND
Ground terminal.
3
V
OUT
Regulated voltage output.
C1
1
F
Battery
TC1262
V
IN
V
OUT
C2
1
F
GND
V
OUT
+
+
+
TC1262
DS21373B-page 4
2002 Microchip Technology Inc.
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated
thermal
protection
circuitry
shuts
the
regulator off when die temperature exceeds 160C.
The regulator remains off until the die temperature
drops to approximately 150C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
A
MAX
), the maximum allowable die temperature
(T
J
MAX
) and the thermal resistance from junction-to-air
(
JA
).
EQUATION 4-2:
Table 4-1 and Table 4-2 show various values of
JA
for
the TC1262 packages.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
SOT-223 PACKAGE
*Tab of device attached to topside copper
TABLE 4-2:
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
3-PIN DDPAK/TO-220
PACKAGE
*Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
V
IN
MAX
= 3.3V 10%
V
OUT
MIN
= 2.7V 0.5%
I
LOAD
MAX
= 275mA
T
J
MAX
= 125C
T
A
MAX
= 95C
JA
= 59C/W (SOT-223)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
D
(V
IN
MAX
V
OUT
MIN
)I
LOAD
MAX
= [(3.3 x 1.1) (2.7 x .995)]275 x 10
3
= 260mW
Maximum allowable power dissipation:
In this example, the TC1262 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
IN
, is found by sustituting the maximum allowable
power dissipation of 508mW into Equation 4-1, from
which V
IN
MAX
= 4.6V.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(
JA
)
2500 sq mm 2500 sq mm
2500 sq mm
45C/W
1000 sq mm 2500 sq mm
2500 sq mm
45C/W
225 sq mm
2500 sq mm
2500 sq mm
53C/W
100 sq mm
2500 sq mm
2500 sq mm
59C/W
1000 sq mm 1000 sq mm
1000 sq mm
52C/W
1000 sq mm
0 sq mm
1000 sq mm
55C/W
Where:
P
D
(V
IN
MAX
V
OUT
MIN
)I
LOAD
MAX
P
D
V
IN
MAX
V
OUT
MIN
I
LOAD
MAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on V
IN
P
D
MAX
= (T
J
MAX
T
A
MAX
)
JA
Where all terms are previously defined.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(
JA
)
2500 sq mm 2500 sq mm
2500 sq mm
25C/W
1000 sq mm 2500 sq mm
2500 sq mm
27C/W
125 sq mm
2500 sq mm
2500 sq mm
35C/W
P
D
MAX
= (T
J
MAX
T
A
MAX
)
JA
= (125 95)
59
= 508mW
2002 Microchip Technology Inc.
DS21373B-page 5
TC1262
5.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Noise vs. Frequency
FREQUENCY (kHz)
NOISE (
V/
Hz)
10.0
1.0
0.01
0.01
1
10
100
1000
0.1
0.0
R
LOAD
= 50
C
OUT
= 1
F
0.020
0.018
0.016
0.012
0.010
0.008
0.006
0.004
0.002
0.000
0.014
TEMPERATURE (
C)
Line Regulation vs. Temperature
LINE REGULATION (%)
-40
C 0C
25
C 70C
85
C 125C
-40
C
0
C
25
C
70
C
85
C 125C
0.0100
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
0.0020
0.0010
0.0100
TEMPERATURE (
C)
Load Regulation vs. Temperature
LOAD REGULATION (%/mA)
1mA to 500mA
1mA to 500mA
5V
2.5V
TEMPERATURE (
C)
I
DD
(
A)
150
135
120
105
90
75
60
45
30
15
0
I
DD
vs. Temperature
5V
-40
C 0C
25
C 70C
85
C 125C
0
100
300
400
500
ILOAD (mA)
0
100
200
300
400
500
ILOAD (mA)
2.5V Dropout Voltage vs. I
LOAD
DROPOUT VOLTAGE (V)
2.5V
0.50
0.40
0.30
0.20
0.10
0.00
0.50
0.40
0.30
0.20
0.10
0.00
LOAD
D
ROPOUT VOLTAGE
(
V
)
25
C
-40
C
-40
C
0
C
0
C
70
C
70
C
85
C
1
125
C
85
C
25
C
125
C
2.70
2.50
2.30
2.10
1.90
1.70
1.50
-40
C
0
C
25
C
70
C 85C 125C
TEMPERATURE (
C)
2.5V V
OUT
vs. Temperature
I
L
= 0.1mA
I
L
A
= 300mA
I
I
I
L
A
A
= 500mA
5.20
5.10
5.00
4.90
4.80
4.70
4.60
4.50
4.40
4.30
4.20
4.10
4.00
-40
C
0
C
25
C
70
C 85C 125C
TEMPERATURE (
C)
5.0V V
OUT
vs. Temperature
V
OUT
(V)
V
OUT
(V)
I
L
= 0.1mA
I
I
I
L
I
I
I
L
TC1262
DS21373B-page 6
2002 Microchip Technology Inc.
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 3-Pin SOT-223 Devices
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
3-Pin SOT-223
12 mm
8 mm
4000
13 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
W
P
Component Taping Orientation for 3-Pin DDPAK Devices
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
3-Pin DDPAK
24 mm
16 mm
750
13 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
W
P
2002 Microchip Technology Inc.
DS21373B-page 7
TC1262
6.3
Package Dimensions
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30)
.264 (6.70)
.146 (3.70)
.130 (3.30)
.091 (2.30) TYP.
.071
(1.80)
MAX.
.181 (4.60) TYP.
.036 (0.91) MIN.
.041 (1.04)
.033 (0.84)
PIN 1
.013 (0.33)
.009 (0.24)
.031 (0.80)
.024 (0.60)
.004 (0.10)
.001 (0.02)
10
MAX.
3-Pin SOT-223
Dimensions: inches (mm)
3-Pin TO-220
.205 (5.21)
.195 (4.95)
PIN 1
.113 (2.87)
.103 (2.62)
.410 (10.41)
.357 (9.06)
.156 (3.96)
.146 (3.71)
DIA.
.258 (6.55)
.230 (5.84)
.560 (14.22)
.518 (13.16)
.105 (2.67)
.095 (2.41)
.037 (0.94)
.027 (0.69)
.055 (1.40)
.045 (1.14)
.244 (6.20)
.234 (5.94)
.185 (4.70)
.165 (4.19)
.055 (1.40)
.045 (1.14)
.594 (15.09)
.569 (14.45)
.115 (2.92)
.095 (2.41)
.020 (0.51)
.012 (0.30)
3
- 7.5
5 PLCS.
Dimensions: inches (mm)
TC1262
DS21373B-page 8
2002 Microchip Technology Inc.
6.3
Package Dimensions (Continued)
.100 (2.54) TYP.
3-Pin DDPAK
.037 (0.94)
.026 (0.66)
.370 (9.40)
.330 (8.38)
.067 (1.70)
.045 (1.14)
.605 (15.37)
.549 (13.95)
.410 (10.41)
.385 (9.78)
.183 (4.65)
.170 (4.32)
.055 (1.40)
.045 (1.14)
.010 (0.25)
.000 (0.00)
.110 (2.79)
.068 (1.72)
.026 (0.66)
.014 (0.36)
.051 (1.30)
.049 (1.24)
8
MAX.
3
- 7
(5x)
PIN 1
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21373B-page 9
TC1262
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1262
DS21373B-page 10
2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc.
DS21373B-page 11
TC1262
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
K
EE
L
OQ
, microID,
MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
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Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company's quality system processes and
procedures are QS-9000 compliant for its
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8-bit MCUs, K
EE
L
OQ
code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip's quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21373B-page 12
2002 Microchip Technology Inc.
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China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d'Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
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