2002 Microchip Technology Inc.
DS21663B-page 1
Features
Very Low Supply Current (55A Typ.) for Longer
Battery Life
Very Low Dropout Voltage: 140mV (Typ.) @
150mA
High Output Voltage Accuracy: 0.4% (Typ)
Standard or Custom Output Voltages
Power-Saving Shutdown Mode
ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
Fast Shutdown Reponse Time: 60
sec (Typ)
Over-Current Protection
Space-Saving 5-Pin SOT-23A Package
Pin Compatible Upgrades for Bipolar Regulators
Applications
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular / GSMS / PHS Phones
Pagers
Device Selection Table
Package Type
General Description
The TC2054, TC2055 and TC2186 are high accuracy
(typically 0.4%) CMOS upgrades for older (bipolar)
low dropout regulators. Designed specifically for bat-
tery-operated systems, the devices' total supply current
is typically 55
A at full load (20 to 60 times lower than
in bipolar regulators).
The devices' key features include ultra low noise oper-
ation,
very low dropout voltage - typically 45mV
(TC2054); 90mV (TC2055); and 140mV (TC2186) at
full load - and fast response to step changes in load. An
error output (ERROR) is asserted when the devices are
out-of-regulation (due to a low input voltage or exces-
sive output current). Supply current is reduced to 0.5
A
(max) and both V
OUT
and ERROR are disabled when
the shutdown input is low. The devices also incorporate
over-current protection.
The TC2054, TC2055 and TC2186 are stable with a
low esr ceramic output capacitor of 1
F and have a
maximum output current of 50mA, 100mA and 150mA,
respectively. This LDO Family also features a fast
response time (60
sec typically) when released from
shutdown.
Typical Application
Part Number
Package
Junction Temp.
Range
TC2054-xxVCT
5-Pin SOT-23A*
-40C to +125C
TC2055-xxVCT
5-Pin SOT-23A*
-40C to +125C
TC2186-xxVCT
5-Pin SOT-23A*
-40C to +125C
Note:
*5-Pin SOT-23A is equivalent to EIAJ (SC-74A).
TC2054
TC2055
TC2186
5-Pin SOT-23A*
TOP VIEW
2
SHDN
ERROR
GND
V
OUT
V
IN
4
5
3
1
1F
Shutdown Control
(from Power Control Logic)
TC2054
TC2055
TC2186
V
IN
1
2
3
4
5
V
IN
V
OUT
ERROR
SHDN
GND
1M
V
OUT
ERROR
1F
TC2054/2055/2186
50mA, 100mA, and 150mA CMOS LDOs
with Shutdown and Error Output
TC2054/2055/2186
DS21663B-page 2
2002 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .........................................................6.5V
Output Voltage................................(-0.3) to (V
IN
+ 0.3)
Operating Temperature .................. -40C < T
J
< 125C
Storage Temperature.......................... -65C to +150C
Maximum Voltage on Any Pin ........ V
IN
+0.3V to -0.3V
*Stresses above those listed under "Absolute Maxi-
mum Ratings" may cause permanent damage to the
device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods my
affect device reliability.
TC2054/2055/2186 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V
IN
= V
R
+ 1V, I
L
= 100
A, C
L
= 3.3
F, SHDN > V
IH
, T
A
= 25C, unless otherwise noted. BOLDFACE
type specifications apply for junction temperature of -40C to +125C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
IN
Input Operating Voltage
2.7
--
6.0
V
Note 1
I
OUTMAX
Maximum Output Current
50
100
150
--
--
--
--
--
--
mA
TC2054
TC2055
TC2186
V
OUT
Output Voltage
V
R
- 2.0%
V
R
0.4%
V
R
+ 2.0%
V
Note 2
TCV
OUT
V
OUT
Temperature
Coefficient
--
--
20
40
--
--
ppm/C Note 3
V
OUT
/
V
IN
Line Regulation
--
0.05
0.5
%
(V
R
+ 1V) < V
IN
< 6V
V
OUT
/
V
OUT
Load Regulation
-1.5
-2.5
0.5
0.5
0.5
0.5
%
TC2054;TC2055 I
L
= 0.1mA to I
OUTMAX
TC2186
I
L
= 0.1mA to I
OUTMAX
Note 4
V
IN
V
OUT
Dropout Voltage, Note 5
--
--
--
--
2
45
90
140
--
70
140
210
mV
I
L
= 100
A
I
L
= 50mA
TC2015; TC2185
I
L
= 100mA
TC2185
I
L
= 150mA
Note 5
I
IN
Supply Current
--
55
80
A
SHDN = V
IH
, I
L
=0
I
INSD
Shutdown Supply Current
--
0.05
0.5
A
SHDN = 0V
PSRR
Power Supply Rejection Ratio
--
50
--
dB
F
RE
120kHz
I
OUTSC
Output Short Circuit Current
160
300
--
mA
V
OUT
= 0V
V
OUT
P
D
Thermal Regulation
--
0.04
--
V/W
Note 6
eN
Output Noise
--
600
--
nV /
Hz
I
L
= I
OUTMAX
, F = 10kHz
t
R
Response Time
(from Shutdown Mode)
--
60
--
sec
V
IN
= 4V
C
IN
= 1
F, C
OUT
= 10
F
I
L
= 0.1mA, Note 9
Note
1:
The minimum V
IN
has to meet two conditions: V
IN
= 2.7V and V
IN
= V
R
+ V
DROPOUT
.
2:
V
R
is the regulator output voltage setting. For example: V
R
= 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3:
TCV
OUT
=
4:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a
load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered
by the thermal regulation specification.
5:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
6:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, exclud-
ing load or line regulation effects. Specifications are for a current pulse equal to I
MAX
at V
IN
= 6V for T = 10msec.
7:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature
and the thermal resistance from junction-to-air (i.e. T
A
, T
J
,
JA
).
8:
Hysteresis voltage is referenced by V
R
.
9:
Time required for V
OUT
to reach 95% of V
R
(output voltage setting), after V
SHDN
is switched from 0 to V
IN
.
V
OU TMAX
V
OUTM IN
(
)
10
6
V
OUT
T
-----------------------------------------------------------------------------------------
2002 Microchip Technology Inc.
DS21663B-page 3
TC2054/2055/2186
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
SHDN Input
V
IH
SHDN Input High Threshold
60
--
--
%V
IN
V
IN
= 2.5V to 6.0V
V
IL
SHDN Input Low Threshold
--
--
15
%V
IN
V
IN
= 2.5V to 6.0V
ERROR OUTPUT
V
INMIN
Minimum V
IN
Operating Volt-
age
1.0
--
--
V
V
OUT
2.7V
V
OL
Output Logic Low Voltage
--
--
400
mV
1 mA Flows to ERROR
V
TH
ERROR Threshold Voltage
--
0.95 x V
R
--
V
See Figure 4-2
V
HYS
ERROR Positive Hysteresis
--
50
--
mV
Note 8
t
DELAY
V
OUT
to ERROR Delay
--
2
--
msec
V
OUT
from V
R
= 3V to 2.8V
R
ERROR
Resistance from ERROR to
GND
--
126
--
V
DD
= 2.5V, V
OUT
= 2.5V
Note
1:
The minimum V
IN
has to meet two conditions: V
IN
= 2.7V and V
IN
= V
R
+ V
DROPOUT
.
2:
V
R
is the regulator output voltage setting. For example: V
R
= 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3:
TCV
OUT
=
4:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a
load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered
by the thermal regulation specification.
5:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
6:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, exclud-
ing load or line regulation effects. Specifications are for a current pulse equal to I
MAX
at V
IN
= 6V for T = 10msec.
7:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature
and the thermal resistance from junction-to-air (i.e. T
A
, T
J
,
JA
).
8:
Hysteresis voltage is referenced by V
R
.
9:
Time required for V
OUT
to reach 95% of V
R
(output voltage setting), after V
SHDN
is switched from 0 to V
IN
.
Electrical Characteristics: V
IN
= V
R
+ 1V, I
L
= 100
A, C
L
= 3.3
F, SHDN > V
IH
, T
A
= 25C, unless otherwise noted. BOLDFACE
type specifications apply for junction temperature of -40C to +125C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
OU TMAX
V
OUTM IN
(
)
10
6
V
OUT
T
-----------------------------------------------------------------------------------------
Pin Number
Symbol
Description
1
V
IN
Unregulated supply input.
2
GND
Ground terminal.
3
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is
applied to this input. The regulator enters shutdown when a logic low is
applied to this input. During shutdown, output voltage falls to zero, ERROR
is open circuited and supply current is reduced to 0.5A (max).
4
ERROR
Out-of-Regulation Flag. (Open drain output). This output goes low when
V
OUT
is out-of-tolerance by approximately -5%.
5
V
OUT
Regulated voltage output.
TC2054/2055/2186
DS21663B-page 4
2002 Microchip Technology Inc.
3.0
DETAILED DESCRIPTION
The TC2054, TC2055 and TC2186 are precision fixed
output voltage regulators. (If an adjustable version is
desired, please see the TC1070, TC1071 or TC1187
data sheets.) Unlike bipolar regulators, the TC2054,
TC2055 and TC2186 supply current does not increase
with load current. In addition, V
OUT
remains stable and
within regulation over the entire 0mA to maximum out-
put current operating load range.
Figure 3-1 shows a typical application circuit. The reg-
ulator is enabled any time the shutdown input (SHDN)
is at or above V
IH
, and shutdown (disabled) when
SHDN is at or below V
IL
. SHDN may be controlled by a
CMOS logic gate, or I/O port of a microcontroller. If the
SHDN input is not required, it should be connected
directly to the input supply. While in shutdown, supply
current decreases to 0.05
A (typical), V
OUT
falls to
zero volts, and ERROR is open-circuited.
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
3.1
ERROR Open Drain Output
ERROR is driven low whenever V
OUT
falls out of regu-
lation by more than -5% (typical). This condition may be
caused by low input voltage, output current limiting or
thermal limiting. The ERROR threshold is 5% below
rated V
OUT
regardless of the programmed output volt-
age value (e.g. ERROR = V
OL
at 4.75V (typ.) for a 5.0V
regulator and 2.85V (typ.) for a 3.0V regulator).
ERROR output operation is shown in Figure 4-2.
Note that ERROR is active when V
OUT
falls to V
TH
, and
inactive when V
OUT
rises above V
TH
by V
HYS
.
As shown in Figure 3-1, ERROR can be used as a bat-
tery low flag or as a processor RESET signal (with the
addition of timing capacitor C2). R1 x C2 should be
chosen to maintain ERROR below V
IH
of the processor
RESET input for at least 200msec to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
V
OUT
, V
IN
or any other voltage less than (V
IN
+ 0.3V).
The ERROR pin sink current is self-limiting to approxi-
mately 18mA.
FIGURE 3-2:
ERROR OUTPUT OPERATION
3.2
Output Capacitor
A 1
F (min) capacitor from V
OUT
to ground is required.
The output capacitor should have an effective series
resistance of 0.01
. to 5
for V
OUT
= 2.5V, and 0.05
.
to 5
for V
OUT
< 2.5V. A 1
F capacitor should be con-
nected from V
IN
to GND if there is more than 10 inches
of wire between the regulator and the AC filter capaci-
tor, or if a battery is used as the power source. Ceramic,
tantalum and aluminum electrolytic capacitors can be
used. (Since many aluminum electrolytic capacitors
freeze at approximately -30C, solid tantalums are rec-
ommended for applications operating below -25C).
When operating from sources other than batteries, sup-
ply-noise rejection and transient response can be
improved by increasing the value of the input and out-
put capacitors and employing passive filtering tech-
niques.
1F
C1
0.2F
C2
R1
1M
V
+
C2 Required Only
if ERROR is used as a
Processor RESET Signal
(See Text)
Shutdown Control
(to CMOS Logic or Tie
to V
IN
if unused)
BATTLOW
or RESET
TC2054
TC2055
TC2186
V
IN
BATTERY
V
OUT
ERROR
SHDN
GND
V
OUT
1F
V
IH
V
OL
ERROR
V
TH
V
OUT
HYSTERESIS (V
HYS
)
2002 Microchip Technology Inc.
DS21663B-page 5
TC2054/2055/2186
4.0
THERMAL CONSIDERATIONS
4.1
Power Dissipation
The amount of power the regulator dissipates is prima-
rily a function of input and output voltage, and output
current.
The following equation is used to calculate worst case
power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
AMAX
), the maximum allowable die temperature (125
C) and the thermal resistance from junction-to-air
(
JA
). The 5-Pin SOT-23A package has a
JA
of
approximately 220C/Watt when mounted on a typical
two layer FR4 dielectric copper clad PC board.
EQUATION 4-2:
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within lim-
its. For example:
Maximum allowable power dissipation:
= 318mW
In this example, the TC2054 dissipates a maximum of
only 20.7mW; far below the allowable limit of 318mW.
In a similar manner, Equation 4-1 and Equation 4-2 can
be used to calculate maximum current and/or input
voltage limits.
4.2
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower
JA
and, therefore,
increase the maximum allowable power dissipation
limit.
P
D
(V
IN
V
OUTMIN
)I
LOADMAX
Where:
P
D
=
Worst case actual power dissipation
V
INMAX
=
Maximum voltage on V
IN
V
OUTMIN
=
Minimum regulator output voltage
I
LOADMAX
=
Maximum output (load) current
Where all terms are previously defined
P
D
M A X
T
J
M AX
T
A
M A X
JA
-----------------------------------
=
Given:
V
INMAX
= 3.0V 5%
V
OUTMIN
= 2.7V 2.5%
I
LOADMAX
= 40mA
T
AMAX
= 55C
Find
:
1. Actual power dissapation
2. Maximum allowable dissapation
Actual power dissipation:
P
D
(V
INMAX
V
OUTMIN
)I
LOADMAX
= [(3.0 x 1.05) (2.7 x .975)]40 x 10
3
= 20.7mW
P
D
M A X
T
J
M AX
T
A
M A X
(
)
JA
--------------------------------------
=
125
55
(
)
220
---------------------------
TC2054/2055/2186
DS21663B-page 6
2002 Microchip Technology Inc.
5.0
TYPICAL CHARACTERISTICS
FIGURE 5-1:
POWER SUPPLY REJECTION
RATIO
FIGURE 5-2:
POWER SUPPLY REJECTION
RATIO
FIGURE 5-3:
OUTPUT NOISE
FIGURE 5-4:
POWER SUPPLY REJECTION
RATIO
FIGURE 5-5:
POWER SUPPLY REJECTION
RATIO
FIGURE 5-6:
DROPOUT VOLTAGE VS. I
LOAD
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
f (Hz)
-100
-80
-60
-40
-20
0
10
100
1k
10k
100k 1M
PSRR (dB)
C
OUT
= 1mF Ceramic
I
OUT
= 100A
V
INAC
= 100mV
p-p
V
INDC
= 4V
V
OUTDC
= 3V
f (Hz)
-100
-80
-60
-40
-20
0
10
100
1k
10k
100k 1M
PSRR (dB)
V
INAC
= 100mV
p-p
V
INDC
= 4V
V
OUTDC
= 3V
C
OUT
= 1F Ceramic
I
OUT
= 150mA
0.01
0.1
1
10
100 1000
0.001
0.01
0.1
1
10
C
OUT
= 1
F
Frequency (KHz)
Noise (mV/
Hz
)
f (Hz)
-100
-80
-60
-40
-20
0
10
100
1k
10k
100k 1M
PSRR (dB)
C
OUT
= 10F Ceramic
I
OUT
= 150mA
V
INAC
= 100mV
p-p
V
INDC
= 4V
V
OUTDC
= 3V
f (Hz)
-100
-80
-60
-40
-20
0
10
100
1k
10k
100k 1M
PSRR (dB)
V
INAC
= 100mV
p-p
V
INDC
= 4V
V
OUTDC
= 3V
C
OUT
= 10F Tantalum
I
OUT
= 150mA
0.000
0.020
0.040
0.060
0.080
0.100
0.120
0.140
0.160
0
50
100
150
T = 130C
T = -45C
T = 25C
I
LOAD
(mA)
DOV (V)
V
OUT
= 1.8V
2002 Microchip Technology Inc.
DS21663B-page 7
TC2054/2055/2186
TYPICAL CHARACTERISTICS (CONT)
FIGURE 5-7:
I
DD
VS. TEMPERATURE
FIGURE 5-8:
OUTPUT VOLTAGE VS.
TEMPERATURE
FIGURE 5-9:
OUTPUT VOLTAGE VS.
TEMPERATURE
FIGURE 5-10: OUTPUT VOLTAGE VS. OUTPUT
CURRENT
FIGURE 5-11: OUTPUT VOLTAGE VS. SUPPLY
VOLTAGE
FIGURE 5-12: OUTPUT VOLTAGE VS. SUPPLY
VOLTAGE
V
IN
= 2.8V
65.00
63.00
61.00
59.00
57.00
55.00
53.00
-45
5
55
105
155
Temp (C)
I
DD
(mA)
V
OUT
= 1.8V
2.5
2.55
2.6
2.65
2.7
2.75
2.8
2.85
2.9
-50 -35 -20 -5 10
25
40
55
70
85
100
115
130
145
I
OUT
= 0.1mA
V
OUT
= 2.8V
V
IN
= 6.5V
V
IN
= 3.8V
V
IN
= 6.0V
Temperature (C)
V
OUT
(V)
-50 -35 -20 -5 10
25
40
55
70
85
100
115
130
145
Temperature (C)
V
OUT
(V)
V
IN
= 6.5V
V
IN
= 6.0V
V
IN
= 2.8V
I
OUT
= 0.1mA
V
OUT
= 1.8V
1.9
1.86
1.84
1.82
1.8
1.78
1.76
1.74
1.72
1.88
1.7
1.7
1.72
1.74
1.76
1.78
1.8
1.82
1.84
1.86
1.88
1.9
0
15
30
45 60 75
90
105
120
135
150
V
IN
= 2.8V
I
LOAD
(mA)
V
OUT
(V)
3.5
4
4.5
5
5.5
6
6.5
7
Temp = +130C
Temp = -45C
Temp = +25C
2.5
2.55
2.6
2.7
2.75
2.8
2.85
2.9
2.65
I
OUT
= 0.1mA
V
OUT
= 2.8V
V
OUT
(V)
V
IN
(V)
2.7 3.2
3.7
4.2
4.7
5.2
5.7
6.2 6.7
V
OUT
(V)
V
IN
(V)
1.7
1.72
1.74
1.76
1.78
1.8
1.82
1.84
1.86
1.88
1.9
Temp = +130C
Temp = -45C
Temp = +25C
I
OUT
= 0.1mA
V
OUT
= 1.8V
TC2054/2055/2186
DS21663B-page 8
2002 Microchip Technology Inc.
TYPICAL CHARACTERISTICS (CONT)
FIGURE 5-13: LOAD TRANSIENT RESPONSE
FIGURE 5-14: LOAD TRANSIENT RESPONSE IN
DROPOUT MODE
FIGURE 5-15: LINE TRANSIENT RESPONSE
FIGURE 5-16: LOAD TRANSIENT RESPONSE
FIGURE 5-17: SHUTDOWN DELAY
FIGURE 5-18: SHUTDOWN WAKE-UP TIME
V = 3.8V
IN
C = 1
F Ceramic
OUT
OUT
V = 2.8V
C = 1
F Ceramic
IN
Frequency = 1 KHz
OUT
V
150mA
Load
100A
Load Current
100mV/DIV
V
IN
= 3.105V
C
OUT
= 1F Ceramic
V
OUT
= 3.006V
C
IN
= 1F Ceramic
R
LOAD
= 20
100A
150mA
V
OUT
Load Transient Response in Dropout Mode
100mV/DIV
6V
4V
C = 470pF
BYP
OUT
V = 2.8V
C = 1
F Ceramic
OUT
I = 100
A
OUT
OUT
V
Input Voltage
50mV / DIV
2V / DIV
V = 3.0V
IN
C = 10F Ceramic
OUT
OUT
V = 2.8V
C = 1F Ceramic
IN
Frequency = 10KHz
OUT
V
150mA
Load
100A
Load Current
100mV / DIV
V = 4.0V
IN
C = 0.01
F
BYP
OUT
V = 3.0V
C = 10
F
OUT
I = 100A
OUT
OUT
V
SHDN
V
V = 4.0V
IN
C = 0.01
F
BYP
OUT
V = 3.0V
C = 10
F
OUT
I = 100A
OUT
OUT
V
SHDN
V
2002 Microchip Technology Inc.
DS21663B-page 9
TC2054/2055/2186
TYPICAL CHARACTERISTICS (CONT)
FIGURE 5-19: V
OUT
TO ERROR DELAY
V
IN
1V/Div
1V/Div
2V/Div
V
OUT
V
ERROR
0V
2.8V
3.42V
3.0V
2.8V
R
PULLUP
= 100k
I
OUT
=
0.3mA
TC2054/2055/2186
DS21663B-page 10
2002 Microchip Technology Inc.
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
1 & 2 = part number code + temperature range and volt-
age
3 represents year and 2-month period code
4 represents lot ID number
6.2
Taping Information
5-Pin SOT-23A
(V)
TC2054
Code
TC2055
Code
TC2186
Code
1.8
SA
TA
VA
2.5
SB
TB
VB
2.7
SC
TC
VC
2.8
SD
TD
VD
2.85
SE
TE
VE
3.0
SF
TF
VF
3.3
SG
TG
VG
User Direction of Feed
Device
Marking
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
PIN 1
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
Reverse Reel Component Orientation
RT Suffix Device
(Mark Upside Down)
W
P
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
5-Pin SOT-23A
8 mm
4 mm
3000
7 in
Carrier Tape, Number of Components Per Reel and Reel Size
2002 Microchip Technology Inc.
DS21663B-page 11
TC2054/2055/2186
6.3
Package Dimensions
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.075 (1.90)
REF.
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
10
MAX.
.010 (0.25)
.004 (0.09)
SOT-23A-5
Dimensions: inches (mm)
TC2054/2055/2186
DS21663B-page 12
2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc.
DS21663B-page 13
TC2054/2055/2186
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC2054/2055/2186
DS21663B-page 14
2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc.
DS21347B - page 15
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
K
EE
L
OQ
, microID,
MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company's quality system processes and
procedures are QS-9000 compliant for its
PICmicro
8-bit MCUs, K
EE
L
OQ
code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip's quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21663B-page 16
2002 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Rocky Mountain
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
China - Beijing
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-6766200 Fax: 86-28-6766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
Hong Kong
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d'Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
*DS21663B*
W
ORLDWIDE
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ALES
AND
S
ERVICE
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