2002 Microchip Technology Inc.

DS21743A-page 1

TC72

Features

· Temperature-to-Digital Converter
· SPITM Compatible Interface
· 10-Bit Resolution (0.25°C/Bit)
· ±2°C (max.) Accuracy from -40°C to +85°C
· ±3°C (max.) Accuracy from -55°C to +125°C
· 2.65V to 5.5V Operating Range
· Low Power Consumption:

- 250 µA (typ.) Continuous Temperature

Conversion Mode

- 1 µA (max.) Shutdown Mode

· Power Saving One-Shot Temperature

Measurement

· Industry Standard 8-Pin MSOP Package
· Space Saving 8-Pin DFN (3x3 mm) Package

Typical Applications

· Personal Computers and Servers
· Hard Disk Drives and Other PC Peripherals
· Entertainment Systems
· Office Equipment
· Datacom Equipment
· Mobile Phones
· General Purpose Temperature Monitoring

Package Types

General Description

The TC72 is a digital temperature sensor capable of
reading temperatures from -55°C to +125°C. This sen-
sor features a serial interface that allows communica-
tion with a host controller or other peripherals. The
TC72 interface is compatible with the SPI protocol. The
TC72 does not require any additional external compo-
nents. However, it is recommended that a decoupling
capacitor of 0.01 µF to 0.1 µF be provided between the
V

and GND pins.

The TC72 can be used either in a Continuous Temper-
ature Conversion mode or a One-Shot Conversion
mode. The Continuous Conversion mode measures
the temperature approximately every 150 ms and
stores the data in the temperature registers. In con-
trast, the One-Shot mode performs a single tempera-
ture measurement and returns to the power saving
shutdown mode.

The TC72 features high temperature accuracy, ease-
of-use and is the ideal solution for implementing ther-
mal management in a variety of systems. The device is
available in both 8-pin MSOP and 8-pin DFN space-
saving packages. The TC72 also features a shutdown
mode for low power operation.

Block Diagram

SCK

GND

SDI

5 SDO

MSOP

TC72

SCK

GND

SDO

5 SDI

DFN

TC72

Diode

Temperature

Sensor

SCK

Serial

Port

Interface

10-Bit

Sigma Delta

A/D Converter

Temperature

Internal

Control

Manufacturer
ID Register

GND

SDO

SDI

Digital Temperature Sensor with SPI

Interfa

2002 Microchip Technology Inc.

DS21743A-page 3

TC72

1.0

ELECTRICAL
CHARACTERISTICS

1.1

Maximum Ratings

........................................................................ 6.0V

All inputs and outputs w.r.t. GND ...-0.3V to V

+0.3V

Storage temperature .......................... -65°C to +150°C
Ambient temp. with power applied ..... -55°C to +125°C
Junction Temperature ........................................ 150°C
ESD protection on all pins:

Human Body Model (HBM)............................. > 4 kV
Man Machine Model (MM)............................. > 400V

Latch-Up Current at each pin ........................ ±200 mA
Maximum Power Dissipation........................... 250 mW

Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.

PIN FUNCTION TABLE

Name

Function

No Internal Connection

Chip Enable Input, the device is selected
when this input is high

SCK

Serial Clock Input

GND

Ground

SDO

Serial Data Output

SDI

Serial Data Input

No Internal Connection

Power Supply

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply at V

= 2.65V to 5.5V, T

= -55°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Power Supply
Operating Voltage Range

2.65

5.5

Note 1

Operating Current:

Normal Mode, ADC Active

DD-CON

250

400

µA

Continuous temp. conversion mode
(Shutdown Bit = `

Shut-Down Supply Current

SHD

0.1

1.0

µA

Shutdown Mode (Shutdown Bit = `

Temperature Sensor and Analog-to-Digital Converter
Temperature Accuracy
(Note 1)

ACY

-2.0

+2.0

°C

-40°C < T

< +85°C

-3.0

+3.0

-55°C < T

< +125°C

Resolution

Bits

Note 4

ADC Conversion Time

CONV

150

200

Digital Input / Output
High Level Input Voltage

0.7 V

Low Level Input Voltage

0.2 V

High Level Output Voltage

0.7 V

= 1 mA

Low Level Output Voltage

0.2 V

= 4 mA

Input Resistance

1.0

Pin Capacitance

OUT

Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the

TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,
3.3V and 5.0V respectively. As V

varies from the nominal operating value, the accuracy may be degraded. Refer to

Figure 2-5 and Figure 2-6.

2: Measured with a load of C

= 50 pF on the SDO output pin of the TC72.

3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.

The rise and fall times are defined as the 10% to 90% transition time.

4: Resolution = Temperature Range/No. of Bits = (+127°C -128°C) / (2

) = 256/1024 = 0.25°C/Bit

TC72

DS21743A-page 4

2002 Microchip Technology Inc.

Serial Port AC Timing (Note 2, 3)
Clock Frequency

CLK

7.5

MHz

SCK Low Time

SCK High Time

CE to SCK Setup

400

SCK to Data Out Valid

CDD

CE to Output Tri-state

CDZ

SCK to Data Hold Time

CDH

Data to SCK Set-up Time

SCK to CE Hold Time

CCH

100

SCK Rise Time

200

SCK Fall Time

200

CE Inactive Time

CWH

400

Thermal Package Resistance
Thermal Resistance, MSOP-8

206

°C/W

Thermal Resistance, DFN-8

60.5

°C/W

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, all parameters apply at V

= 2.65V to 5.5V, T

= -55°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the

TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,
3.3V and 5.0V respectively. As V

varies from the nominal operating value, the accuracy may be degraded. Refer to

Figure 2-5 and Figure 2-6.

2: Measured with a load of C

= 50 pF on the SDO output pin of the TC72.

3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.

The rise and fall times are defined as the 10% to 90% transition time.

4: Resolution = Temperature Range/No. of Bits = (+127°C -128°C) / (2

) = 256/1024 = 0.25°C/Bit

TC72

DS21743A-page 6

2002 Microchip Technology Inc.

2.0

TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, all parameters apply at V

= 2.65V to 5.5V, T

= -55°C to +125°C.

FIGURE 2-1:

Accuracy vs. Temperature

(TC72-X.XMXX).

FIGURE 2-2:

Supply Current vs. Supply

Voltage.

FIGURE 2-3:

Supply Current vs.

Temperature.

FIGURE 2-4:

Shutdown Current vs.

Temperature.

FIGURE 2-5:

Temperature Accuracy vs.

Supply Voltage (TC72-2.8MXX).

FIGURE 2-6:

Temperature Accuracy vs.

Supply Voltage (TC72-5.0MXX).

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

-3.5

-3

-2.5

-2

-1.5

-1

-0.5

0.5

1.5

2.5

3.5

-55

-25

125

Reference Temperature (°C)

Temperature Error (°C)

Lower Specification Limit

Upper Specification Limit

Mean + 3

Mean - 3

Mean

200

210

220

230

240

250

260

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Supply Voltage (V)

Supply Current (µA)

= +25°C

= +125°C

= -55°C

TC72-X.XMXX

100

150

200

250

300

350

400

-55

-25

125

Temperature (°C)

Supply Current (uA)

TC72-5.0MXX
V

= 5.0V

TC72-3.3MXX
V

= 3.3V

TC72-2.8MXX
V

= 2.8V

0.00

0.05

0.10

0.15

0.20

-55

-25

125

Temperature (°C)

Shutdown Current (µA)

TC72-5.0MXX
V

= 5.0V

TC72-5.0MXX
V

= 2.8V

TC72-3.3MXX
V

= 3.3V

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

2.6

2.7

2.8

2.9

3.0

Supply Voltage (V)

Temperature Change (°C)

= +25°C

= -25°C

= +85°C

TC72-2.8MXX

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5

Supply Voltage (V)

Temperature Change (°C)

= +25°C

= -25°C

= +85°C

TC72-5.0MXX

2002 Microchip Technology Inc.

DS21743A-page 7

TC72

Note: Unless otherwise indicated, all parameters apply at V

= 2.65V to 5.5V, T

= -55°C to +125°C.

FIGURE 2-7:

Histogram of Temperature

Accuracy at -55 Degrees C.

FIGURE 2-8:

Histogram of Temperature

Accuracy at -40 Degrees C.

FIGURE 2-9:

Histogram of Temperature

Accuracy at +25 Degrees C.

FIGURE 2-10:

Histogram of Temperature

Accuracy at +65 Degrees C.

FIGURE 2-11:

Histogram of Temperature

Accuracy at +85 Degrees C.

FIGURE 2-12:

Histogram of Temperature

Accuracy at +125 Degrees C.

-3

-2.5

-2

-1.5

-1

-0.5

0.5

1.5

2.5

Temperature Error (°C)

Percentage of Occurances (%)

TC72-X.XMXX
Sample Size = 166
T

= -55°C

-2

-1.5

-1

-0.5

0.5

1.5

Temperature Error (°C)

Percentage of Occurances (%)

TC72-X.XMXX
Sample Size = 166
T

= -40°C

-1.50

-1.25

-1.00

-0.75

-0.50

-0.25

0.00

0.25

0.50

0.75

1.00

1.25

1.50

Temperature Error (°C)

Percentage of Occurances (%)

TC72-X.XMXX
Sample Size = 166
T

= +25°C

-1.50

-1.25

-1.00

-0.75

-0.50

-0.25

0.00

0.25

0.50

0.75

1.00

1.25

1.50

Temperature Error (°C)

Percentage of Occurances (%)

TC72-X.XMXX
Sample Size = 166
T

= +65°C

-2

-1.5

-1

-0.5

0.5

1.5

Temperature Error (°C)

Percentage of Occurances (%)

TC72-X.XMXX
Sample Size = 166
T

= +85°C

-3

-2.5

-2

-1.5

-1

-0.5

0.5

1.5

2.5

Temperature Error (°C)

Percentage of Occurances (%)

TC72-X.XMXX
Sample Size = 166
T

= +125°C

TC72

DS21743A-page 8

2002 Microchip Technology Inc.

3.0

FUNCTIONAL DESCRIPTION

The TC72 consists of a band-gap type temperature
sensor, a 10-bit Sigma Delta Analog-to-Digital Con-
verter (ADC), an internal conversion oscillator and a
double buffer digital output port. The 10-bit ADC is
scaled from -128°C to +127°C; therefore, the resolution
is 0.25°C per bit. The ambient temperature operating
range of the TC72 is specified from -55°C to +125°C.

This device features a four-wire serial interface that is
fully compatible with the SPI specification and, there-
fore, allows simple communications with common
microcontrollers and processors. The TC72 can be
used either in a Continuous Temperature Conversion
mode or a One-Shot Conversion mode. The TC72 tem-
perature measurements are performed in the back-
ground and, therefore, reading the temperature via the
serial I/O lines does not affect the measurement in
progress.

The Continuous Conversion mode measures the tem-
perature approximately every 150 ms and stores the
data in the temperature registers. The TC72 has an
internal clock generator that controls the automatic
temperature conversion sequence. The automatic tem-
perature sampling operation is repeated indefinitely
until the TC72 is placed in a shutdown mode by a write
operation to the Control register. The TC72 will remain
in the shutdown mode until the shutdown bit in the
Control register is reset.

In contrast, the One-Shot mode performs a single tem-
perature measurement and returns to the power-sav-
ing shut down mode. This mode is especially useful for
low power applications.

FIGURE 3-1:

Temperature-To-Digital Transfer Function (Non-linear Scale).

Temp

Output

Code

+125°C

-55°C

+25°C

-25°C

+0.25°C

-0.125°C

0111 1101 / 0000 0000

MSB

LSB

Note:

The ADC converter is scaled from -128°C to -127°C, but the operating range of the
TC72 is specified from -55°C to +125°C.

0001 1001 / 0000 0000

MSB

LSB

0000 0000 / 0100 0000

MSB

LSB

0000 0000 / 0000 0000

MSB

LSB

1111 1111 / 1100 0000

MSB

LSB

1110 0111 / 0000 0000

MSB

LSB

1100 1001 / 0000 0000

MSB

LSB

0°C

2002 Microchip Technology Inc.

DS21743A-page 9

TC72

3.1

Temperature Data Format

Temperature data is represented by a 10-bit two's com-
plement word with a resolution of 0.25°C per bit. The
temperature data is stored in the Temperature registers
in a two's complement format. The ADC converter is
scaled from -128°C to +127°C, but the operating range
of the TC72 is specified from -55°C to +125°C.

Example:

Temperature

= 41.5°C

MSB Temperature Register=

00101001b

= 2

+ 2

= 32 + 8 + 1 = 41

LSB Temperature Register =

10000000b

= 2

-1

= 0.5

TABLE 3-1:

TC72 TEMPERATURE
OUTPUT DATA

TABLE 3-2:

TEMPERATURE REGISTER

3.2

Power-Up And Power-Down

The TC72 is in the low power consumption shutdown
mode at power-up. The Continuous Temperature Con-
version mode is selected by performing a Write opera-
tion to the Control register, as described in Section 4.0,
"Internal Register Structure".

A supply voltage lower than 1.6V (typical) is considered
a power-down state for the TC72. If the supply voltage
drops below the 1.6V threshold, the internal registers
are reset to the power-up default state.

3.3

Serial Bus Interface

The serial interface consists of the Chip Enable (CE),
Serial Clock (SCK), Serial Data Input (SDI) and Serial
Data Output (SDO) signals. The TC72 operates as a
slave and is compatible with the SPI bus specifications.
The serial interface is designed to be compatible with
the Microchip PICmicro

family of microcontrollers.

The CE input is used to select the TC72 when multiple
devices are connected to the serial clock and data
lines. The CE is active-high, and data is written to or
read from the device, when CE is equal to a logic high
voltage. The SCK input is disabled when CE is low. The
rising edge of the CE line initiates a read or write oper-
ation, while the falling edge of CE completes a read or
write operation.

The SCK input is provided by the external microcontrol-
ler and is used to synchronize the data on the SDI and
SDO lines. The SDI input writes data into the TC72's
Control register, while the SDO outputs the tempera-
ture data from the Temperature register and the status
of Shutdown bit of the Control register.

The TC72 has the capability to function with either an
active-high or low SCK input. The SCK inactive state is
detected when the CE signal goes high, while the
polarity of the clock input (CP) determines whether the
data is clocked and shifted on either the rising or falling
edge of the system clock, as shown in Figure 3-2.
Table 3-3 gives the appropriate clock edge used to
transfer data into and out of the registers. Each data bit
is transferred at each clock pulse, and the data bits are
clocked in groups of eight bits, as shown in Figure 3-3.

The address byte is transferred first, followed by the
data. A7, the MSb of the address, determines whether
a read or write operation will occur. If A7 = `

', one or

more read cycles will occur; otherwise, if A7 = `

', one

or more write cycles will occur.

Data can be transferred either in a single byte or a
multi-byte packet, as shown in Figure 3-3. In the 3-byte
packet, the data sequence consists of the MSb temper-
ature data, LSb temperature data, followed by the Con-
trol register data. The multi-byte read feature is initiated
by writing the highest address of the desired packet to
registers. The TC72 will automatically send the register
addressed and all of the lower address registers, as
long as the Chip Enable pin is held active.

Temperature

Binary

MSB / LSB

Hex

+125°C

0111 1101/0000 0000

7D00

+25°C

0001 1001/0000 0000

1900

+0.5°C

0000 0000/1000 0000

0080

+0.25°C

0000 0000/0100 0000

0040

0°C

0000 0000/0000 0000

0000

-0.25°C

1111 1111/1100 0000

FFC0

-25°C

1110 0111/0000 0000

E700

-55°C

1100 1001/0000 0000

C900

Address/

Register

Sign

02H

Temp. MSB

-1

-2

01H

Temp. LSB

TC72

DS21743A-page 10

2002 Microchip Technology Inc.

TABLE 3-3:

OPERATIONAL MODES

3.4

Read Operation

The temperature and control register data is outputted
from the TC72 using the CE, SCK and SDO lines.
Figure 3-3 shows a timing diagram of the read opera-
tion. Communication is initiated by the chip enable (CE)
going high. The SDO line remains at the voltage level
of the LSb bit that is outputted and goes to the tri-state
level when the CE line goes to a logic low level.

3.5

Write Operation

Data is clocked into the Control register in order to
enable the TC72's power saving shutdown mode. The
write operation is shown in Figure 3-3 and is
accomplished using the CE, SCK and SDI line.

FIGURE 3-2:

Serial Clock Polarity (CP)

Operation.

Mode

SCK (Note 1)

SDI

SDO

Disable

Input Disabled

High Z

Write (A7 =

)

CP=

, Data Shifted on Falling Edge,

Data Clocked on Rising Edge

Data Bit Latch

High Z

CP=

, Data Shifted on Rising Edge,

Data Clocked on Falling Edge

Read (A7 =

)

CP=

, Data Shifted on Falling Edge,

Data Clocked on Rising Edge

Next data bit shift,

Note 2

CP=

, Data Shifted on Rising Edge,

Data Clocked on Falling Edge

Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high,

CP is equal to `

'; otherwise, if the inactive state of SCK is low, CP is equal to `

2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin

to be shifted out of the Temperature register.

SHIFT
EDGE

CLOCK

EDGE

SHIFT
EDGE

CLOCK

EDGE

SCK

CP = 0

CP = 1

2002 Microchip Technology Inc.

DS21743A-page 11

TC72

FIGURE 3-3:

Serial Interface Timing Diagrams (CP=0).

SCK

SDI

SDO

High Z

A7=1

Single Byte Write Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)

MSb

LSb

Single Byte Read Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)

SCK

SDI

A7=0

SDO

High Z

MSb

LSb

SPI Multiple Byte Transfer

SCK

Write Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)

SDI

Address Byte = 80hex

High Z

SDO

Control Byte

Read Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)

SDI

SDO

High Z

MSB Temp. Byte

LSB Temp. Byte

Address Byte = 02hex

Control Byte

TC72

DS21743A-page 12

2002 Microchip Technology Inc.

4.0

INTERNAL REGISTER
STRUCTURE

The TC72 registers are listed below.

TABLE 4-1:

REGISTERS FOR TC72

4.1

Control Register

The Control register is both a read and a write register
that is used to select either the Shutdown, Continuous
or One-Shot Conversion operating mode. The Temper-
ature Conversion mode selection logic is shown in
Table 4-2. The Shutdown (SHDN) bit is stored in bit 0
of the Control register. If SHDN is equal to `

', the TC72

will go into the power-saving shutdown mode. If SHDN
is equal to `

', the TC72 will perform a temperature

conversion approximately every 150 ms.

At power-up, the SHDN bit is set to `

'. Thus, the TC72

is in the shutdown operating mode at startup. The Con-
tinuous Temperature Conversion mode is selected by
writing a `

' to the SHDN bit of the Control register.

The Shutdown mode can be used to minimize the
power consumption of the TC72 when active tempera-
ture monitoring is not required. The shutdown mode
disables the temperature conversion circuitry; how-
ever, the serial I/O communication port remains active.
A temperature conversion will be initialized by a Write
operation to the Control register to select either the
Continuous Temperature Conversion or the One-Shot
operating mode. The temperature data will be available
in the MSB and LSB Temperature registers approxi-
mately 150 ms after the Control register Write
operation.

The One-Shot mode is selected by writing a `

' into bit

4 of the Control register. The One-Shot mode performs
a single temperature measurement and returns to the
power-saving shutdown mode. After completion of the
temperature conversion, the One-Shot bit (OS) is reset
to `

' (i.e. "OFF"). The user must set the One-Shot bit

to `

' to initiate another temperature conversion.

Bits 1, 3, 5, 6 and 7 of the Control register are not used
by the TC72. Bit 2 is set to a logic `

'. Any write opera-

tion to these bit locations will have no affect on the
operation of the TC72.

4.2

Temperature Register

The Temperature register is a read-only register and
contains a 10-bit two's complement representation of
the temperature measurement. Bit 0 through Bit 5 of
the LSB Temperature register are always set to a logic
`

At Power-On Reset (POR) or a Brown-Out Reset
(BOR) low voltage occurrence, the temperature regis-
ter is reset to all zeroes, which corresponds to a tem-
perature value of 0°C. A V

power supply less than

1.6V is considered a reset event and will reset the
Temperature register to the power-up state.

4.3

Manufacturer ID Register

The Manufacturer Identification (ID) register is a read-
only register used to identify the temperature sensor as
a Microchip component.

TABLE 4-2:

CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION

Register

Read

Address

Write

Address

Bit

Value on

POR/BOR

Control

00hex

80hex

One-Shot

(OS)

Shutdown

(SHDN)

05hex

LSB Temperature

01hex

N/A

00hex

MSB Temperature

02hex

N/A

T5 T4 T3

00hex

Manufacturer ID

03hex

N/A

54hex

Operational Mode

One-Shot (OS) Bit 4

Shutdown (SHDN) Bit 0

Continuous Temperature Conversion

Shutdown

Continuous Temperature Conversion
(One-Shot Command is ignored if SHDN = `

One-Shot

2002 Microchip Technology Inc.

DS21743A-page 13

TC72

5.0

APPLICATIONS INFORMATION

The TC72 does not require any additional components
in order to measure temperature; however, it is recom-
mended that a decoupling capacitor of 0.1mF to 1mF
be provided between the V

and GND pins. Although

the current consumption of the TC72 is modest
(250 mA, typical), the TC72 contains an on chip data
acquisition with internal digital switching circuitry. Thus,
it is considered good design practice to use an external
decoupling capacitor with the sensor. A high frequency
ceramic capacitor should be used and be located as
close as possible to the IC power pins in order to
provide effective noise protection to the TC72.

The TC72 measures temperature by monitoring the
voltage of a diode located on the IC die. The IC pins of
the TC72 provide a low impedance thermal path
between the die and the PCB, allowing the TC72 to
effectively monitor the temperature of the PCB board.
The thermal path between the ambient air is not as effi-
cient because the plastic IC housing package functions
as a thermal insulator. Thus the ambient air tempera-
ture (assuming that a large temperature gradient exists
between the air and PCB) has only a small effect on the
temperature measured by the TC72.

Note that the exposed metal center pad on the bottom
of the DFN package is connected to the silicon sub-
strate. The center pad should be connected to either
the PCB ground plane or treated as a "No Connect" pin.
The mechanical dimensions of the center pad are given
in Section 6.0, "Packaging Information", of this
datasheet.

A potential for self-heating errors can exist if the TC72
SPI communication lines are heavily loaded. Typically,
the self-heating error is negligible because of the rela-
tively small current consumption of the TC72. A tem-
perature accuracy error of approximately 0.5°C will
result from self-heating if the SPI communication pins
sink/source the maximum current specified for the
TC72. Thus to maximize the temperature accuracy, the
output loading of the SPI signals should be minimized.

TC72

DS21743A-page 16

2002 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037

.035

Footprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top
Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

7
7

.004
.010

.006
.012

(F)

Dimension Limits

Overall Height
Molded Package Thickness

Molded Package Width
Overall Length
Foot Length

Standoff §
Overall Width

Number of Pins
Pitch

.016

.114
.114

.022

.118
.118

.002

.030

.193

.034

MIN

Units

.026

NOM

INCHES

1.00

0.95

0.90

.039

0.15
0.30

.008
.016

0.10
0.25

7
7

0.20
0.40

MILLIMETERS*

0.65

0.86

3.00
3.00
0.55

4.90

.044

.122

.028

.122

.038
.006

0.40

2.90
2.90

0.05

0.76

MIN

MAX

NOM

1.18

0.70

3.10
3.10

0.15

0.97

MAX

§ Significant Characteristic

.184

.200

4.67

.5.08

2002 Microchip Technology Inc.

DS21743A-page 17

TC72

8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)

Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not

Exposed Pad Width

Exposed Pad Length

Lead Length

*Controlling Parameter

Lead Width

Drawing No. C04-062

Notes:

Exposed pad dimensions vary with paddle size.

exceed .010" (0.254mm) per side.

Overall Width

.019

.012

.007

.047

.055

.010

.118 BSC

Number of Pins

Standoff

Lead Thickness

Overall Length

Overall Height

Pitch

Units

Dimension Limits

.000

.001

.008 REF.

.118 BSC

.031

.026 BSC

MIN

INCHES

NOM

TOP VIEW

EXPOSED

METAL

PAD

0.48

0.26

3.00 BSC

0.30

.022

.069

.015

.096

0.23

1.20

1.39

0.55

0.37

1.75

2.45

0.02

0.80

3.00 BSC

0.20 REF.

0.65 BSC

MILLIMETERS*

.002

.039

0.00

MIN

MAX

NOM

0.05

1.00

MAX

BOTTOM VIEW

ID INDEX

PIN 1

Package may have one or more exposed tie bars at ends.

AREA

Pin 1 visual index feature may vary, but must be located within the hatched area.

(NOTE 2)

TIE BAR

(NOTE 1)

EXPOSED

0.90

.035

(Note 4)

5. JEDEC equivalent: Pending

TC72

DS21743A-page 18

2002 Microchip Technology Inc.

8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)

Exposed Pad Length

Thermal Via Diameter

*Controlling Parameter

Termal Via Pitch

Drawing No. C04-2062

Exposed Pad Width

.012

.130

.047

Terminal Land Pattern I.D.

Terminal Land Width

Terminal Land Length

Terminal Land Pattern O.D.

Terminal Pitch

Units

Dimension Limits

.057

.134

.026 BSC

MIN

INCHES

NOM

0.30

1.20

3.30

3.40

0.65 BSC

MILLIMETERS*

.060

.157

1.45

MIN

MAX

NOM

1.53

4.00

MAX

THERMAL VIAS

ON 4 LAYER

PC BOARD

DFN LAND PATTERN

OPTIONAL TWO LAYER

PCB LAND PATTERN

OPTIONAL FOUR LAYER

0.42

0.35

.014

.017

.033

.035

0.85

0.88

1.50

1.45

.059

.057

Exposed Pad Clearance

.006

0.15

(Note 1)

Exposed pad dimensions vary with paddle size.

Notes:

Interior Lead Clearance

.071

1.80

Optional Exposed Pad Length

.130

3.30

TYPCAL SOLDER MASKS

Minimum Solder Mask Clearance

.002

0.05

M (TYP)

2002 Microchip Technology Inc.

DS21734A-page19

TC72

SYSTEMS INFORMATION AND
UPGRADE HOT LINE

The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip
World Wide Web site.

The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape

or Microsoft

Internet Explorer. Files are also available for FTP
download from our FTP site.

Connecting to the Microchip Internet Web Site

The Microchip web site is available at the following
URL:

www.microchip.com

The file transfer site is available by using an FTP ser-
vice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:

· Latest Microchip Press Releases
· Technical Support Section with Frequently Asked

Questions

· Design Tips
· Device Errata
· Job Postings
· Microchip Consultant Program Member Listing
· Links to other useful web sites related to

Microchip Products

· Conferences for products, Development Systems,

technical information and more

· Listing of seminars and events

092002

TC72

DS21734A-page20

2002 Microchip Technology Inc.

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

To:

Technical Publications Manager

RE:

Reader Response

Total Pages Sent ________

From: Name

Company
Address
City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device:

Literature Number:

Questions:

FAX: (______) _________ - _________

DS21734A

TC72

2002 Microchip Technology Inc.

DS21743A-page21

TC72

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

PART NO.

-X.X

Package

Voltage

Range

Device

Device:

TC72: Digital Temperature Sensor w/SPI Interface

Voltage Range:

2.8

= Accuracy Optimized for 2.8V

3.3

= Accuracy Optimized for 3.3V

5.0

= Accuracy Optimized for 5.0V

Temperature Range:

= -55°C to +125°C

Package:

= Dual, Flat, No Lead (DFN) (3x3mm), 8-lead

MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead

(Tape and Reel)

= Plastic Micro Small Outline (MSOP), 8-lead

UATR = Plastic Micro Small Outline (MSOP), 8-lead

(Tape and Reel)

Examples:

TC72-2.8MUA:

Digital Temperature Sensor,

2.8V, 8LD MSOP package.

TC72-2.8MUATR:

Digital Temperature Sen-

sor, 2.8V, 8LD MSOP (tape and reel) package.

TC72-2.8MMF:

Digital Temperature Sensor,

2.8V, 8LD DFN package.

TC72-3.3MUA:

Digital Temperature Sensor,

3.3V, 8LD MSOP package.

TC72-3.3MMF:

Digital Temperature Sensor,

3.3V, 8LD DFN package.

TC72-5.0MUA:

Digital Temperature Sensor,

5.0V, 8LD MSOP package.

TC72-5.0MMF:

Digital Temperature Sensor,

5.0V, 8LD DFN package.

TC72-5.0MMFTR:

Digital Temperature Sen-

sor, 5.0V, 8LD DFN (tape and reel) package.

Temperature

Range

2002 Microchip Technology Inc.

DS21743A - page 23

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, K

MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.

FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.

dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company's quality system processes and

procedures are QS-9000 compliant for its

PICmicro

8-bit MCUs, K

code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip's quality system for the

design and manufacture of development

systems is ISO 9001 certified.

DS21743A-page 24

2002 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com

Rocky Mountain

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338

Atlanta

500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307

Boston

2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821

Chicago

333 Pierce Road, Suite 180
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Tel: 630-285-0071 Fax: 630-285-0075

Dallas

4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924

Detroit

Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260

Kokomo

2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387

Los Angeles

18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338

New York

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Tel: 631-273-5305 Fax: 631-273-5335

San Jose

Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Australia

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Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beijing

Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
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Tel: 86-10-85282100 Fax: 86-10-85282104

China - Chengdu

Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599

China - Fuzhou

Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521

China - Shanghai

Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
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Tel: 86-21-6275-5700 Fax: 86-21-6275-5060

China - Shenzhen

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Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086

China - Hong Kong SAR

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Unit 901-6, Tower 2, Metroplaza
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Tel: 852-2401-1200 Fax: 852-2401-3431

India

Microchip Technology Inc.
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Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

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Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea

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Singapore

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#07-02 Prime Centre
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Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

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Taiwan Branch
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Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Austria

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Fax: 43-7242-2244-393

Denmark

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France

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Germany

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Tel: 49-89-627-144 0 Fax: 49-89-627-144-44

Italy

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Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883

United Kingdom

Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820

08/01/02

ORLDWIDE

ALES

AND

ERVICE

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TC72-5.0MUATR

Document Outline

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