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Электронный компонент: MT28C3214P2

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1
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
2002, Micron Technology, Inc.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.
FLASH AND SRAM
COMBO MEMORY
MT28C3214P2FL
MT28C3214P2NFL
Low Voltage, Extended Temperature
FEATURES
Flexible dual-bank architecture
Support for true concurrent operations with no
latency:
Read bank b during program bank a and vice versa
Read bank b during erase bank a and vice versa
Organization: 2,048K x 16 (Flash)
256K x 16 (SRAM)
Basic configuration:
Flash
Bank a (4Mb Flash for data storage)
Eight 4K-word parameter blocks
Seven 32K-word blocks
Bank b (28Mb Flash for program storage)
Fifty-six 32K-word main blocks
SRAM
4Mb SRAM for data storage
256K-words
F_V
CC
, V
CC
Q, F_V
PP
, S_V
CC
voltages
1
1.65V (MIN)/1.95V (MAX) F_V
CC
read voltage or
1.80V (MIN)/2.20V (MAX) F_V
CC
read voltage
1.65V (MIN)/1.95V (MAX) S_V
CC
read voltage or
1.80V (MIN)/2.20V (MAX) S_V
CC
read voltage
1.65V (MIN)/1.95V (MAX) V
CC
Q or
1.80V (MIN)/2.20V (MAX) V
CC
Q
1.80V (TYP) F_V
PP
(in-system PROGRAM/ERASE)
0.0V (MIN)/2.20V (MAX) F_V
PP
(in-system
PROGRAM/ERASE)
2
12V 5% (HV) F_V
PP
(production programming
compatibility)
Asynchronous access time
1
Flash access time: 100ns or 110ns @ 1.65V F_V
CC
SRAM access time: 100ns @ 1.65V S_V
CC
Page Mode read access
1
Interpage read access: 100ns/110ns @ 1.65V F_V
CC
Intrapage read access: 35ns/45ns @ 1.65V F_V
CC
Low power consumption
Enhanced suspend options
ERASE-SUSPEND-to-READ within same bank
PROGRAM-SUSPEND-to-READ within same bank
ERASE-SUSPEND-to-PROGRAM within same bank
Read/Write SRAM during program/erase of Flash
Dual 64-bit chip protection registers for security
purposes
PROGRAM/ERASE cycles
100,000 WRITE/ERASE cycles per block
Cross-compatible command set support
Extended command set
Common flash interface (CFI) compliant
NOTE: 1. These specifications are guaranteed for operation
within either one of two voltage ranges, 1.65V1.95V
or 1.80V2.20V. Use only one of the two voltage
ranges for PROGRAM and ERASE operations.
2. MT28C3214P2NFL only.
OPTIONS
MARKING
Timing
100ns
-10
110ns
-11
Boot Block
Top
T
Bottom
B
V
PP
1
Range
0.9V2.2V
None
0.0V2.2V
N
Operating Temperature Range
Commercial Temperature (0
o
C to +70
o
C) None
Extended Temperature (-40
o
C to +85
o
C)
ET
Package
66-ball FBGA (8 x 8 grid)
FL
Part Number Example:
MT28C3214P2FL-10 TET
BALL ASSIGNMENT
66-Ball FBGA (Top View)
A
B
C
D
E
F
G
H
1 2 3 4 5 6 7 8 9 10 11
12
Top View
(Ball Down)
NC
NC
A14
A9
DQ11
A6
A0
A15
A10
A19
S_OE#
A7
A4
A20
A16
F_WE#
S_V
SS
F_WP#
S_LB#
A18
F_V
CC
A12
S_WE#
DQ6
S_CE2
DQ10
DQ8
A2
F_V
SS
F_V
SS
DQ14
DQ4
S_V
CC
DQ2
DQ0
A1
F_OE#
V
cc
Q
DQ7
DQ5
F_V
CC
DQ3
DQ1
S_CE1#
NC
NC
NC
NC
NC
A13
DQ15
DQ13
DQ12
DQ9
A3
F_CE#
NC
NC
A11
A8
NC
F_RP#
F_V
PP
S_UB#
A17
A5
2
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
Table 2
Cross Reference for Abbreviated Device Marks
PRODUCT
SAMPLE
MECHANICAL
PART NUMBER
MARKING
MARKING
SAMPLE MARKING
MT28C3214P2FL-10 BET
FW420
FX420
FY420
MT28C3214P2FL-10 TET
FW421
FX421
FY421
MT28C3214P2FL-11 BET
FW437
FX437
FY437
MT28C3214P2FL-11 TET
FW431
FX431
FY431
MT28C3214P2NFL-11 TET
FW439
FX439
FY439
GENERAL DESCRIPTION
The MT28C3214P2FL and MT28C3214P2NFL com-
bination Flash and SRAM memory devices provide a
compact, low-power solution for systems where PCB
real estate is at a premium. The dual-bank Flash is a
high-performance, high-density, nonvolatile memory
device with a revolutionary architecture that can sig-
nificantly improve system performance.
This new architecture features:
A two-memory-bank configuration supporting
dual-bank burst operation;
A high-performance bus interface providing a fast
page data transfer; and
A conventional asynchronous bus interface.
The device also provides soft protection for blocks
by configuring soft protection registers with dedicated
command sequences. For security purposes, dual 64-
bit chip protection registers are provided.
The embedded WORD WRITE and BLOCK ERASE
functions are fully automated by an on-chip write state
machine (WSM). The WSM simplifies these operations
and relieves the system processor of secondary tasks.
An on-chip status register, one for each bank, can be
used to monitor the WSM status to determine the
progress of a PROGRAM/ERASE command.
The erase/program suspend functionality allows
compatibility with existing EEPROM emulation soft-
ware packages.
The device takes advantage of a dedicated power
source for the Flash device (F_V
CC
) and a dedicated
power source for the SRAM device (S_V
CC
), both at
1.65V1.95V or 1.80V2.20V for optimized power con-
sumption and improved noise immunity. The
MT28C3214P2FL and MT28C3214P2NFL devices sup-
port two V
PP
voltage ranges, V
PP
1
and V
PP
2
. V
PP
1
is an
in-circuit voltage of 0.9V2.2V (MT28C3214P2FL) or
0.0V2.2V (MT28C3214P2NFL). V
PP
2
is the production
compatibility voltage of 12V 5%. The 12V 5% V
PP
2
is
supported for a maximum of 100 cycles and 10 cumula-
tive hours. See Table 1.
The MT28C3214P2FL and MT28C3214P2NFL de-
vices contain an asynchronous 4Mb SRAM organized
as 256K-words by 16 bits. These devices are fabricated
using an advanced CMOS process and high-speed/
ultra-low-power circuit technology.
The MT28C3214P2FL and MT28C3214P2NFL de-
vices are packaged in a 66-ball FBGA package with
0.80mm pitch.
DEVICE MARKING
Due to the size of the package, Micron's standard
part number is not printed on the top of each device.
Instead, an abbreviated device mark comprised of a
five-digit alphanumeric code is used. The abbreviated
device marks are cross referenced to Micron part num-
bers in Table 2.
ARCHITECTURE AND MEMORY
ORGANIZATION
The Flash memory device contains two separate
memory banks (bank a and bank b) for simultaneous
READ and WRITE operations. Bank a is 4Mb deep and
contains 8 x 4K-word parameter blocks and seven 32K-
word blocks. Bank b is 28Mb deep, is equally sectored,
and contains fifty-six 32K-word blocks.
Figures 2 and 3 show the top and bottom memory
organizations.
Table 1
V
PP
Voltage Ranges
VOLTAGE RANGE
DEVICE
V
PP
1
V
PP
2
MT28C3214P2FL
0.9V2.2V
11.4V12.6V
MT28C3214P2NFL
0.0V2.2V
11.4V12.6V
3
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
PART NUMBERING INFORMATION
Micron's low-power devices are available with sev-
eral different combinations of features (see Figure 1).
Table 3
Valid Part Number Combinations
BOOT BLOCK
OPERATING
V
PP
1
ACCESS
STARTING
TEMPERATURE
PART NUMBER
RANGE
TIME (ns)
ADDRESS
RANGE
MT28C3214P2FL-10 BET
0.9V2.2V
100
Bottom
-40
o
C to +85
o
C
MT28C3214P2FL-10 TET
0.9V2.2V
100
Top
-40
o
C to +85
o
C
MT28C3214P2FL-11 BET
0.9V2.2V
110
Bottom
-40
o
C to +85
o
C
MT28C3214P2FL-11 TET
0.9V2.2V
110
Top
-40
o
C to +85
o
C
MT28C3214P2NFL-11 TET
0.0V2.2V
110
Top
-40
o
C to +85
o
C
MT 28C 321 4 P 2 N FL-11 T ET
Micron Technology
Flash Family
28C = Dual-Supply Flash/SRAM Combo
Density/Organization/Banks
321 = 32Mb (2,048K x 16)
bank a = 1/8; bank b = 7/8
SRAM Density
4 = 4Mb SRAM (256K x 16)
Access Time
-10 = 100ns
-11 = 110ns
Read Mode Operation
P = Asynchronous/Page Read
Package Code
FL = 66-ball FBGA (8 x 8 grid)
Operating Temperature Range
None = Commercial (0C to +70C)
ET = Extended (-40C to +85C)
V
PP1
Range
None = 0.9V2.2V
N = 0.0V2.2V
Boot Block Starting Address
B = Bottom boot
T = Top boot
Operating Voltage Range
2 = 1.65V1.95V or 1.80V2.20V
Figure 1
Part Number Chart
Valid combinations of features and their correspond-
ing part numbers are listed in Table 3.
4
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
BLOCK DIAGRAM
F_V
PP
S_OE#
S_CE2
S_CE1#
S_WE#
DQ0
DQ15
A18
A20
A0
A17
F_RP#
F_CE#
F_OE#
F_WE#
F_V
CC
F_WP#
F_V
SS
FLASH
SRAM
S_V
SS
S_UB#
S_LB#
2,048K x 16
256K x 16
Bank a
Bank b
S_V
CC
V
CC
Q
FLASH FUNCTIONAL BLOCK DIAGRAM
Address
Input
Buffer
X DEC
Y/Z DEC
Data Input
Buffer
Output
Multiplexer
Address
CNT/WSM
Output
Buffer
Status
Reg.
WSM
Program/
Erase
Pump Voltage
Generators
Address Latch
DQ0-DQ15
DQ0DQ15
CSM
F_RST#
F_CE#
X DEC
Y/Z DEC
F_WE#
F_OE#
I/O Logic
A0A20
Address
Multiplexer
Bank 2 Blocks
Y/Z Gating/Sensing
Data
Register
Bank 1 Blocks
Y/Z Gating/Sensing
ID Reg.
RCR
Block Lock
Device ID
Manufacturer's ID
OTP
Query
PR Lock
Query/OTP
PR Lock
5
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
BALL DESCRIPTIONS
66-BALL FBGA
NUMBERS
SYMBOL
TYPE
DESCRIPTION
A3, A4, A5, A6,
A0A20
Input
Address Inputs: Inputs for the addresses during READ and WRITE
A7, A8, B3, B4,
operations. Addresses are internally latched during READ and WRITE
B5, B6, E5, G3,
cycles. Flash: A0A20; SRAM: A0A17.
G4, G5, G6, G7,
G8, G9, H4, H5,
H6
H7
F_CE#
Input
Flash Chip Enable: Activates the device when LOW. When CE# is HIGH,
the device is disabled and goes into standby power mode.
H9
F_OE#
Input
Flash Output Enable: Enables Flash output buffers when LOW. When
F_OE# is HIGH, the output buffers are disabled.
C3
F_WE#
Input
Flash Write Enable: Determines if a given cycle is a Flash WRITE cycle.
F_WE# is active LOW.
D4
F_RP#
Input
Reset. When F_RP# is a logic LOW, the device is in reset, which drives
the outputs to High-Z and resets the WSM. When F_RP# is a logic HIGH,
the device is in standard operation. When F_RP# transitions from logic
LOW to logic HIGH, the device resets all blocks to locked and defaults to
the read array mode.
E3
F_WP#
Input
Flash Write Protect. Controls the lock down function of the flexible
locking feature.
G10
S_CE1#
Input
SRAM Chip Enable1: Activates the SRAM when it is LOW. HIGH level
deselects the SRAM and reduces the power consumption to standby
levels.
D8
S_CE2
Input
SRAM Chip Enable2: Activates the SRAM when it is HIGH. LOW level
deselects the SRAM and reduces the power consumption to standby
levels.
F5
S_OE#
Input
SRAM Output Enable: Enables SRAM output buffers when LOW. When
S_OE# is HIGH, the output buffers are disabled.
B8
S_WE#
Input
SRAM Write Enable: Determines if a given cycle is an SRAM WRITE cycle.
S_WE# is active LOW.
F3
S_LB#
Input
SRAM Lower Byte: When LOW, it selects the SRAM address lower byte
(DQ0DQ7).
F4
S_UB#
Input
SRAM Upper Byte: When LOW, it selects the SRAM address upper byte
(DQ8DQ15).
B7, B9, B10,
DQ0DQ15
Input/
Data Inputs/Outputs: Input array data on the second CE# and WE#
C7, C8, C9,
Output
cycle during PROGRAM command. Input commands to the command
C10, D7, E6,
user interface when CE# and WE# are active. Output data when CE#
E8, E9, E10,
and OE# are active.
F7, F8, F9, F10
(continued on next page)
6
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
BALL DESCRIPTIONS (continued)
66-BALL FBGA
NUMBERS
SYMBOL
TYPE
DESCRIPTION
E4
F_V
PP
Input/
Flash Program/Erase Power Supply: [0.9V2.2V or 11.4V12.6V].
Supply
Operates as input at logic levels to control complete device protection.
Provides backward compatibility for factory programming when driven
to 11.4V12.6V. A lower F_V
PP
voltage range (0.0V2.2V) is available on
the MT28C3214P2NFL device.
D10, H3
F_V
CC
Supply
Flash Power Supply: [1.65V1.95V or 1.80V2.20V]. Supplies power for
device operation.
A9, H8
F_V
SS
Supply
Flash Specific Ground: Do not float any ground pin.
D9
S_V
CC
Supply
SRAM Power Supply: [1.65V1.95V or 1.80V2.20V]. Supplies power for
device operation.
D3
S_V
SS
Supply
SRAM Specific Ground: Do not float any ground pin.
A10
V
CC
Q
Supply
I/O Power Supply: [1.651.95V or 1.80V2.20V]. This input should be tied
directly to V
CC
.
A1, A2, A11,
NC
No Connect: Lead is not internally connected; it may be driven or
A12, C4, H1,
floated.
H2, H10, H11,
H12
7
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
NOTE: 1. Two devices may not drive the memory bus at the same time.
2. Allowable flash read modes include read array, read query, read configuration, and read status.
3. Outputs are dependent on a separate device controlling bus outputs.
4. Modes of the Flash and SRAM can be interleaved so that while one is disabled, the other controls outputs.
5. SRAM is enabled and/or disabled with the logical function: S_CE1# or S_CE2.
6. Simultaneous operations can exist, as long as the operations are interleaved such that only one device attempts to
control the bus outputs at a time.
7. Data output on lower byte only; upper byte High-Z.
8. Data output on upper byte only; lower byte High-Z.
9. Data input on lower byte only.
10. Data input on upper byte only.
TRUTH TABLE FLASH
FLASH SIGNALS
SRAM SIGNALS
MEMORY OUPUT
MODES
F_RP# F_CE# F_OE# F_WE# S_CE1# S_CE2 S_OE# S_WE# S_UB# S_LB#
MEMORY
DQ0DQ15
NOTES
BUS CONTROL
Read
H
L
L
H
SRAM must be High-Z
Flash
D
OUT
1, 2, 3
Write
H
L
H
L
Flash
D
IN
1
Standby
H
H
X
X
Other
High-Z
4
Output Disable
H
L
H
H
SRAM any mode allowable
Other
High-Z
4, 5
Reset
L
X
X
X
Other
High-Z
4, 6
TRUTH TABLE SRAM
FLASH SIGNALS
SRAM SIGNALS
MEMORY OUPUT
MODES
F_RP# F_CE# F_OE# F_WE# S_CE1# S_CE2 S_OE# S_WE# S_UB# S_LB#
MEMORY
DQ0DQ15
NOTES
BUS CONTROL
Read
DQ0DQ15
L
H
L
H
L
L
SRAM
D
OUT
1, 3
DQ0DQ7
L
H
L
H
H
L
SRAM
D
OUT
LB
7
DQ8DQ15
Flash must be High-Z
L
H
L
H
L
H
SRAM
D
OUT
UB
8
Write
DQ0DQ15
L
H
H
L
L
L
SRAM
D
IN
1, 3
DQ0DQ7
L
H
H
L
H
L
SRAM
D
IN
LB
9
DQ8DQ15
L
H
H
L
L
H
SRAM
D
IN
UB
10
Standby
H
X
X
X
X
X
Other
High-Z
4
Flash any mode allowable
X
L
X
X
X
X
Other
High-Z
4
Output Disable
L
H
X
X
X
X
Other
High-Z
4
FLASH
8
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
Figure 2
Bottom Boot Block Device
Bank b = 28Mb
Block
Block Size
Address Range
(K-bytes/K-words)
(x16)
70
64/32
1F8000h-1FFFFFh
69
64/32
1F0000h-1F7FFFh
68
64/32
1E8000h-1EFFFFh
67
64/32
1E0000h-1E7FFFh
66
64/32
1D8000h-1DFFFFh
65
64/32
1D0000h-1D7FFFh
64
64/32
1C8000h-1CFFFFh
63
64/32
1C0000h-1C7FFFh
62
64/32
1B8000h-1BFFFFh
61
64/32
1B0000h-1B7FFFh
60
64/32
1A8000h-1AFFFFh
59
64/32
1A0000h-1A7FFFh
58
64/32
198000h-19FFFFh
57
64/32
190000h-197FFFh
56
64/32
188000h-18FFFFh
55
64/32
180000h-187FFFh
54
64/32
178000h-17FFFFh
53
64/32
170000h-177FFFh
52
64/32
168000h-16FFFFh
51
64/32
160000h-167FFFh
50
64/32
158000h-15FFFFh
49
64/32
150000h-157FFFh
48
64/32
148000h-14FFFFh
47
64/32
140000h-147FFFh
46
64/32
138000h-13FFFFh
45
64/32
130000h-137FFFh
44
64/32
128000h-12FFFFh
43
64/32
120000h-127FFFh
42
64/32
118000h-11FFFFh
41
64/32
110000h-117FFFh
40
64/32
108000h-10FFFFh
39
64/32
100000h-107FFFh
38
64/32
0F8000h-0FFFFFh
37
64/32
0F0000h-0F7FFFh
36
64/32
0E8000h-0EFFFFh
35
64/32
0E0000h-0E7FFFh
34
64/32
0D800h-0DFFFFh
33
64/32
0D0000h-0D7FFFh
32
64/32
0C8000h-0CFFFFh
31
64/32
0C0000h-0C7FFFh
30
64/32
0B8000h-0BFFFFh
29
64/32
0B0000h-0B7FFFh
28
64/32
0A8000h-0AFFFFh
27
64/32
0A0000h-0A7FFFh
26
64/32
098000h-097FFFh
25
64/32
090000h-097FFFh
24
64/32
088000h-087FFFh
23
64/32
080000h-087FFFh
22
64/32
078000h-07FFFFh
21
64/32
070000h-077FFFh
20
64/32
068000h-067FFFh
19
64/32
060000h-067FFFh
18
64/32
058000h-05FFFFh
17
64/32
050000h-057FFFh
16
64/32
048000h-04FFFFh
15
64/32
040000h-047FFFh
Bank a = 4Mb
Block
Block Size
Address Range
(K-bytes/K-words)
(x16)
14
64/32
038000h-03FFFFh
13
64/32
030000h-037FFFh
12
64/32
028000h-02FFFFh
11
64/32
020000h-027FFFh
10
64/32
018000h-01FFFFh
9
64/32
010000h-017FFFh
8
64/32
008000h-00FFFFh
7
8/4
007000h-007FFFh
6
8/4
006000h-006FFFh
5
8/4
005000h-005FFFh
4
8/4
004000h-004FFFh
3
8/4
003000h-003FFFh
2
8/4
002000h-002FFFh
1
8/4
001000h-001FFFh
0
8/4
000000h-000FFFh
FLASH
9
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
Figure 3
Top Boot Block Device
Bank b = 28Mb
Block
Block Size
Address Range
(K-bytes/K-words)
(x16)
55
64/32
1B8000h-1BFFFFh
54
64/32
1B0000h-1B7FFFh
53
64/32
1A8000h-1AFFFFh
52
64/32
1A0000h-1A7FFFh
51
64/32
198000h-19FFFFh
50
64/32
190000h-197FFFh
49
64/32
188000h-18FFFFh
48
64/32
180000h-187FFFh
47
64/32
178000h-17FFFFh
46
64/32
170000h-177FFFh
45
64/32
168000h-16FFFFh
44
64/32
160000h-167FFFh
43
64/32
158000h-15FFFFh
42
64/32
150000h-157FFFh
41
64/32
148000h-14FFFFh
40
64/32
140000h-147FFFh
39
64/32
138000h-13FFFFh
38
64/32
130000h-137FFFh
37
64/32
128000h-12FFFFh
36
64/32
120000h-127FFFh
35
64/32
118000h-11FFFFh
34
64/32
110000h-117FFFh
33
64/32
108000h-10FFFFh
32
64/32
100000h-107FFFh
31
64/32
0F8000h-0FFFFFh
30
64/32
0F0000h-0F7FFFh
29
64/32
0E8000h-0EFFFFh
28
64/32
0E0000h-0E7FFFh
27
64/32
0D8000h-0DFFFFh
26
64/32
0D0000h-0D7FFFh
25
64/32
0C8000h-0CFFFFh
24
64/32
0C0000h-0C7FFFh
23
64/32
0B8000h-0BFFFFh
22
64/32
0B0000h-0B7FFFh
21
64/32
0A8000h-0AFFFFh
20
64/32
0A0000h-0A7FFFh
19
64/32
098000h-09FFFFh
18
64/32
090000h-097FFFh
17
64/32
088000h-08FFFFh
16
64/32
080000h-087FFFh
15
64/32
078000h-07FFFFh
14
64/32
070000h-077FFFh
13
64/32
068000h-06FFFFh
12
64/32
060000h-067FFFh
11
64/32
058000h-05FFFFh
10
64/32
050000h-057FFFh
9
64/32
048000h-04FFFFh
8
64/32
040000h-047FFFh
7
64/32
038000h-03FFFFh
6
64/32
030000h-037FFFh
5
64/32
028000h-02FFFFh
4
64/32
020000h-027FFFh
3
64/32
018000h-01FFFFh
2
64/32
010000h-017FFFh
1
64/32
008000h-00FFFFh
0
64/32
000000h-007FFFh
Bank a = 4Mb
Block
Block Size
Address Range
(K-bytes/K-words)
(x16)
70
8/4
1FF000h-1FFFFFh
69
8/4
1FE000h-1FEFFFh
68
8/4
1FD000h-1FDFFFh
67
8/4
1FC000h-1FCFFFh
66
8/4
1FB000h-1FBFFFh
65
8/4
1FA000h-1FAFFFh
64
8/4
1F9000h-1F9FFFh
63
8/4
1F8000h-1F8FFFh
62
64/32
1F0000h-1F7FFFh
61
64/32
1E8000h-1EFFFFh
60
64/32
1E0000h-1E7FFFh
59
64/32
1D8000h-1DFFFFh
58
64/32
1D0000h-1D7FFFh
57
64/32
1C8000h-1CFFFFh
56
64/32
1C0000h-1C7FFFh
FLASH
10
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
FLASH MEMORY OPERATING MODES
COMMAND STATE MACHINE
Commands are issued to the command state ma-
chine (CSM) using standard microprocessor write tim-
ings. The CSM acts as an interface between external
microprocessors and the internal write state machine
(WSM). The available commands are listed in Table 4,
their definitions are given in Table 5 and their descrip-
tions in Table 6. Program and erase algorithms are au-
tomated by the on-chip WSM. For more specific infor-
mation about the CSM transition states, see Micron
technical note TN-28-33, "Command State Machine
Description and Command Definition."
Once a valid PROGRAM/ERASE command is en-
tered, the WSM executes the appropriate algorithm,
which generates the necessary timing signals to con-
trol the device internally. A command is valid only if the
exact sequence of WRITEs is completed. After the WSM
completes its task, the write state machine status
(WSMS) bit (SR7) (see Table 8) is set to a logic HIGH
level (V
IH
), allowing the CSM to respond to the full com-
mand set again.
OPERATIONS
Device operations are selected by entering a stan-
dard JEDEC 8-bit command code with conventional
microprocessor timings into an on-chip CSM through
I/Os DQ0DQ7. The number of bus cycles required to
activate a command is typically one or two. The first
operation is always a WRITE. Control signals F_CE#
and F_WE# must be at a logic LOW level (V
IL
), and F_OE#
and F_RP# must be at logic HIGH (V
IH
). The second
operation, when needed, can be a WRITE or a READ
depending upon the command. During a READ opera-
tion, control signals F_CE# and F_OE# must be at a
logic LOW level (V
IL
), and F_WE# and F_RP# must be at
logic HIGH (V
IH
).
Table 7 illustrates the bus operations for all the
modes: write, read, reset, standby, and output disable.
When the device is powered up, internal reset cir-
cuitry initializes the chip to a read array mode of opera-
tion. Changing the mode of operation requires that a
command code be entered into the CSM. For each one
of the two Flash memory partitions, an on-chip status
register is available. These two registers allow the moni-
toring of the progress of various operations that can
take place on a memory bank. One of the two status
registers is interrogated by entering a READ STATUS
REGISTER command onto the CSM (cycle 1), specify-
ing an address within the memory partition boundary,
and reading the register data on I/O pins DQ0DQ7
(cycle 2). Status register bits SR0-SR7 correspond to
DQ0DQ7 (see Table 8).
COMMAND DEFINITION
Once a specific command code has been entered,
the WSM executes an internal algorithm, generating
the necessary timing signals to program, erase, and
verify data. See Table 5 for the CSM command defini-
tions and data for each of the bus cycles.
STATUS REGISTER
The status register allows the user to determine
whether the state of a PROGRAM/ERASE operation is
pending or complete. The status register is monitored
by toggling F_OE# and F_CE# and reading the result-
ing status code on I/Os DQ0DQ7. The high-order I/Os
(DQ8DQ15) are set to 00h internally, so only the low-
Table 4
Command State Machine Codes For Device Mode Selection
COMMAND DQ0DQ7
CODE ON DEVICE MODE
40h/10h
Program setup/alternate program setup
20h
Block erase setup
50h
Clear status register
60h
Protection configuration setup
70h
Read status register
90h
Read protection configuration register
98h
Read query
B0h
Program/erase suspend
C0h
Protection register program/lock
D0h
Program/erase resume erase confirm
FFh
Read array
FLASH
11
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256K x 16 SRAM COMBO MEMORY
order I/O signals (DQ0DQ7) need to be interpreted.
Address lines select the status register pertinent to the
selected memory partition.
Register data is updated and latched on the rising
edge of F_OE# or F_CE#, whichever occurs first. The
latest falling edge of either of these two signals up-
dates the latch within a given READ cycle. Latching the
data prevents errors from occurring if the register input
changes during a status register read.
The status register provides the internal state of the
WSM to the external microprocessor. During periods
when the WSM is active, the status register can be polled
to determine the WSM status. Table 8 defines the sta-
tus register bits.
After monitoring the status register during a
PROGRAM/ERASE operation, the data appearing on
DQ0DQ7 remains as status register data until a new
command is issued to the CSM. To return the device to
other modes of operation, a new command must be
issued to the CSM.
COMMAND STATE MACHINE OPERATIONS
The CSM decodes instructions for the commands
listed in Table 4. The 8-bit command code is input to
the device on DQ0DQ7 (see Table 5 for command
definitions). During a PROGRAM or ERASE cycle, the
CSM informs the WSM that a PROGRAM or ERASE cycle
has been requested.
During a PROGRAM cycle, the WSM controls the
program sequences and the CSM responds to a PRO-
GRAM SUSPEND command only.
During an ERASE cycle, the CSM responds to an
ERASE SUSPEND command only. When the WSM has
completed its task, the WSMS bit (SR7) is set to a logic
HIGH level and the CSM responds to the full command
set. The CSM stays in the current command state until
the microprocessor issues another command.
The WSM successfully initiates an ERASE or PRO-
GRAM operation only when V
PP
is within its correct volt-
age range.
Table 5
Command Definitions
FIRST BUS CYCLE
SECOND BUS CYCLE
COMMAND
OPERATION
ADDRESS
DATA
OPERATION
ADDRESS
DATA
READ ARRAY
WRITE
WA
FFh
READ PROTECTION CONFIGURATION REGISTER
WRITE
IA
90h
READ
IA
ID
READ STATUS REGISTER
WRITE
BA
70h
READ
BA
SRD
CLEAR STATUS REGISTER
WRITE
BA
50h
READ QUERY
WRITE
QA
98h
READ
QA
QD
BLOCK ERASE SETUP
WRITE
BA
20h
WRITE
BA
D0h
PROGRAM SETUP/ALTERNATE PROGRAM SETUP
WRITE
WA
40h/10h
WRITE
WA
WD
PROGRAM/ERASE SUSPEND
WRITE
BA
B0h
PROGRAM/ERASE RESUME ERASE CONFIRM
WRITE
BA
D0h
LOCK BLOCK
WRITE
BA
60h
WRITE
BA
01h
UNLOCK BLOCK
WRITE
BA
60h
WRITE
BA
D0h
LOCK DOWN BLOCK
WRITE
BA
60h
WRITE
BA
2Fh
PROTECTION REGISTER PROGRAM
WRITE
PA
C0h
WRITE
PA
PD
PROTECTION REGISTER LOCK
WRITE
LPA
C0h
WRITE
LPA
FFFDh
NOTE: 1. WA: Word address of memory location to be written, or read
2. IA:
Identification code address
3. BA: Address within the block
4. ID:
Identification code data
5. SRD: Data read from the status register
6. QA: Query code address
7. QD: Query code data
8. WD: Data to be written at the location WA
9. PA: Protection register address
10. LPA: Lock protection register address
11. PD: Protection register data
FLASH
12
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256K x 16 SRAM COMBO MEMORY
Table 6
Command Descriptions
CODE DEVICE MODE
BUS CYCLE
DESCRIPTION
10h
Alt. Program Setup
First
Operates the same as a PROGRAM SETUP command.
20h
Erase Setup
First
Prepares the CSM for an ERASE CONFIRM command. If the next
command is not ERASE CONFIRM, the CSM sets both SR4 and SR5 of
the status register to a "1," places the device into read status register
mode, and waits for another command.
40h
Program Setup
First
A two-cycle command: The first cycle prepares for a PROGRAM
operation, the second cycle latches addresses and data and initiates
the WSM to execute the program algorithm. The Flash outputs status
register data on the falling edge of F_OE# or F_CE#, whichever
occurs first.
50h
Clear Status
First
The WSM can set the program status (SR4), and erase status (SR5) bits
Register
in the status register to "1," but it cannot clear them to "0." Issuing
this command clears those bits to "0."
60h
Protection
First
Prepares the CSM for changes to the block locking status. If the next
Configuration
command is not BLOCK UNLOCK, BLOCK LOCK or BLOCK LOCK
Setup
DOWN, then the CSM sets both the program and erase status register
bits to indicate a command sequence error.
70h
Read Status
First
Places the device into read status register mode. Reading the device
Register
outputs the contents of the status register, regardless of the address
presented to the device. The device automatically enters this mode
after a PROGRAM or ERASE operation has been initiated.
90h
Read Protection
First
Puts the device into the read protection configuration mode so that
Configuration
reading the device outputs the manufacturer/device codes or block
lock status.
98h
Read Query
First
Puts the device into the read query mode so that reading the device
outputs common Flash interface information.
B0h
Program Suspend
First
Suspends the currently executing PROGRAM/ERASE operation. The
status register indicates when the operation has been successfully
Erase Suspend
First
suspended by setting either the program suspend (SR2) or erase
suspend (SR6) and the WSMS bit (SR7) to a "1" (ready). The WSM
continues to idle in the suspend state, regardless of the state of all
input control pins except F_RP#, which immediately shuts down the
WSM and the remainder of the chip if F_RP# is driven to V
IL
.
C0h
Program Device
First
Writes a specific code into the device protection register.
Protection Register
Lock Device
First
Locks the device protection register; data can no longer be changed.
Protection register
(continued on the next page)
FLASH
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Table 6
Command Descriptions (continued)
CODE DEVICE MODE
BUS CYCLE
DESCRIPTION
D0h
Erase Confirm
First
If the previous command was an ERASE SETUP command, then the
CSM closes the address and data latches, and it begins erasing the
block indicated on the address pins. During programming/erase, the
device responds only to the READ STATUS REGISTER, PROGRAM
SUSPEND, or ERASE SUSPEND commands and outputs status register
data on the falling edge of F_OE# or F_CE#, whichever occurs last.
Program/Erase
First
If a PROGRAM or ERASE operation was previously suspended, this
Resume
command resumes the operation.
FFh
Read Array
First
During the array mode, array data is output on the data bus.
01h
Lock Block
Second
If the previous command was PROTECTION CONFIGURATION SETUP,
the CSM latches the address and locks the block indicated on the
address bus.
2Fh
Lock Down
Second
If the previous command was PROTECTION CONFIGURATION SETUP,
the CSM latches the address and locks down the block indicated on
the address bus.
D0h
Unlock Block
Second
If the previous command was PROTECTION CONFIGURATION SETUP,
the CSM latches the address and unlocks the block indicated on the
address bus. If the block had been previously set to lock down, this
operation has no effect.
00h
Invalid/Reserved
Unassigned command that should not be used.
FLASH
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CLEAR STATUS REGISTER
The internal circuitry can set, but not clear, the block
lock status bit (SR1), the V
PP
status bit (SR3), the pro-
gram status bit (SR4), and the erase status bit (SR5) of
the status register. The CLEAR STATUS REGISTER com-
mand (50h) allows the external microprocessor to clear
these status bits and synchronize to the internal op-
erations. When the status bits are cleared, the device
returns to the read array mode.
READ OPERATIONS
The following READ operations are available: READ
ARRAY, READ PROTECTION CONFIGURATION REG-
ISTER, READ QUERY and READ STATUS REGISTER.
READ ARRAY
The array is read by entering the command code
FFh on DQ0DQ7. Control signals F_CE# and F_OE#
must be at a logic LOW level (V
IL
), and F_WE# and F_RP#
must be at a logic HIGH level (V
IH
) to read data from the
array. Data is available on DQ0DQ15. Any valid ad-
dress within any of the blocks selects that address and
allows data to be read from that address. Upon initial
power-up, the device defaults to the read array mode.
READ CHIP PROTECTION IDENTIFICATION DATA
The chip identification mode outputs three types
of information: the manufacturer/device identifier, the
block locking status, and the protection register. Two
bus cycles are required for this operation: the chip iden-
tification data is read by entering the command code
90h on DQ0DQ7 to the bank containing address 00h
and the identification code address on the address
lines. Control signals F_CE# and F_OE# must be at a
logic LOW level (V
IL
), and F_WE# and F_RP# must be at
a logic HIGH level (V
IH
) to read data from the protection
configuration register. Data is available on DQ0DQ15.
After data is read from the protection configuration
register, the READ ARRAY command, FFh, must be is-
sued to the bank containing address 00h prior to issu-
ing other commands. See Table 10 for further details.
READ QUERY
The read query mode outputs common flash inter-
face (CFI) data when the device is read (see Table 12).
Two bus cycles are required for this operation. It is
possible to access the query by writing the read query
command code 98h on DQ0DQ7. Control signals
F_CE# and F_OE# must be at a logic LOW level (V
IL
),
and F_WE# and F_RP# must be at a logic HIGH level
(V
IH
) to read data from the query. The CFI data struc-
ture contains information such as block size, density,
command set, and electrical specifications. To return
to read array mode, write the read array command code
FFh on DQ0DQ7.
READ STATUS REGISTER
The status register is read by entering the command
code 70h on DQ0DQ7. Two bus cycles are required for
this operation: one to enter the command code and a
second to read the status register. In a READ cycle, the
address is latched and register data is updated on the
falling edge of F_OE# or F_CE#, whichever occurs last.
FLASH
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plished only by blocks; data at single address locations
within the array cannot be erased individually. The
block to be erased is selected by using any valid ad-
dress within that block. Block erasure is initiated by a
command sequence to the CSM: BLOCK ERASE setup
(20h) followed by BLOCK ERASE CONFIRM (D0h) (see
Table 5). A two-command erase sequence protects
against accidental erasure of memory contents.
When the BLOCK ERASE CONFIRM command is
complete, the WSM automatically executes a sequence
of events to complete the block erasure. During this
sequence, the block is programmed with logic 0s, data
is verified, all bits in the block are erased, and finally
verification is performed to ensure that all bits are cor-
rectly erased. Monitoring of the ERASE operation is
possible through the status register (see the Status
Register section).
During the execution of an ERASE operation, the
ERASE SUSPEND command (B0h) can be entered to
direct the WSM to suspend the ERASE operation. Once
the WSM has reached the suspend state, it allows the
CSM to respond only to the READ ARRAY, READ STA-
TUS REGISTER, READ QUERY, READ CHIP PROTEC-
TION CONFIGURATION, PROGRAM SETUP, PRO-
GRAM RESUME, ERASE RESUME and LOCK SETUP
(see the Block Locking section). During the ERASE SUS-
PEND operation, array data must be read from a block
other than the one being erased. To resume the ERASE
operation, an ERASE RESUME command (D0h) must
be issued to cause the CSM to clear the suspend state
previously set (see Figure 7). It is also possible that an
ERASE in any bank can be suspended and a WRITE to
another block in the same bank can be initiated. After
the completion of a WRITE, an ERASE can be resumed
by writing an ERASE RESUME command.
PROGRAMMING OPERATIONS
There are two CSM commands for programming:
PROGRAM SETUP and ALTERNATE PROGRAM SETUP
(see Table 4).
After the desired command code is entered (10h or
40h command code on DQ0DQ7), the WSM takes over
and correctly sequences the device to complete the
PROGRAM operation. The WRITE operation may be
monitored through the status register (see the Status
Register section). During this time, the CSM only re-
sponds to a PROGRAM SUSPEND command until the
PROGRAM operation has been completed, after which
time all commands to the CSM become valid again.
The PROGRAM operation can be suspended by issuing
a PROGRAM SUSPEND command (B0h). Once the WSM
reaches the suspend state, it allows the CSM to re-
spond only to READ ARRAY, READ STATUS REGISTER,
READ PROTECTION CONFIGURATION, READ QUERY,
PROGRAM SETUP, or PROGRAM RESUME. During the
PROGRAM SUSPEND operation, array data should be
read from an address other than the one being pro-
grammed. To resume the PROGRAM operation, a PRO-
GRAM RESUME command (D0h) must be issued to
cause the CSM to clear the suspend state previously
set (see Figure 4 for programming operation and Figure
5 for program suspend and program resume).
Taking F_RP# to V
IL
during programming aborts the
PROGRAM operation.
ERASE OPERATIONS
An ERASE operation must be used to initialize all
bits in an array block to "1s." After BLOCK ERASE con-
firm is issued, the CSM responds only to an ERASE
SUSPEND command until the WSM completes its task.
Block erasure inside the memory array sets all bits
within the address block to logic 1s. Erase is accom-
Table 7
Bus Operations
MODE
F_RP#
F_CE#
F_OE#
F_WE#
ADDRESS DQ0DQ15
Read (array, status registers,
V
IH
V
IL
V
IL
V
IH
X
D
OUT
device identification register, or
query)
Standby
V
IH
V
IH
X
X
X
High-Z
Output Disable
V
IH
V
IH
X
X
X
High-Z
Reset
V
IL
X
X
X
X
High-Z
Write
V
IH
V
IL
V
IH
V
IL
X
D
IN
FLASH
16
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STATUS
BIT #
STATUS REGISTER BIT
DESCRIPTION
SR7
WRITE STATE MACHINE STATUS (WSMS) Check write state machine bit first to determine word
1 = Ready
program or block erase completion, before checking
0 = Busy
program or erase status bits.
SR6
ERASE SUSPEND STATUS (ESS)
When ERASE SUSPEND is issued, WSM halts execution and
1 = BLOCK ERASE Suspended
sets both WSMS and ESS bits to "1." ESS bit remains set to
0 = BLOCK ERASE in
"1" until an ERASE RESUME command is issued.
Progress/Completed
SR5
ERASE STATUS (ES)
When this bit is set to "1," WSM has applied the maximum
1 = Error in Block Erasure
number of erase pulses to the block and is still unable to
0 = Successful BLOCK ERASE
verify successful block erasure.
SR4
PROGRAM STATUS (PS)
When this bit is set to "1," WSM has attempted but failed to
1 = Error in PROGRAM
program a word.
0 = Successful PROGRAM
SR3
V
PP
STATUS (V
PP
S)
The V
PP
status bit does not provide continuous indication
1 = V
PP
Low Detect, Operation Abort
of the V
PP
level. The WSM interrogates the V
PP
level only
0 = V
PP
= OK
after the program or erase command sequences have been
entered and informs the system if V
PP
< 0.9V. The V
PP
level is
also checked before the PROGRAM/ERASE operation is
verified by the WSM. The MT28C3214P2NFL device allows
PROGRAM or ERASE at 0V, in which case SR3 is held at "0."
SR2
PROGRAM SUSPEND STATUS (PSS)
When PROGRAM SUSPEND is issued, WSM halts execution
1 = PROGRAM Suspended
and sets both WSM and PSS bits to "1." PSS bit remains set to
0 = PROGRAM in Progress/Completed
"1" until a PROGRAM RESUME command is issued.
SR1
BLOCK LOCK STATUS (BLS)
If a PROGRAM or ERASE operation is attempted to one of
1 = PROGRAM/ERASE Attempted on a
the locked blocks, this is set by the WSM. The operation
Locked Block; Operation Aborted
specified is aborted, and the device is returned to read status
0 = No Operation to Locked Blocks
mode.
SR0
RESERVED FOR FUTURE
This bit is reserved for future.
ENHANCEMENT
Table 8
Status Register Bit Definition
WSMS
ESS
ES
PS
V
PP
S
PSS
BLS
R
7
6
5
4
3
2
1
0
FLASH
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Figure 4
Automated Word Programming
Flowchart
NOTE: 1. Full status register check can be done after each word or after a sequence of words.
2. SR3 must be cleared before attempting additional PROGRAM/ERASE operations.
3. SR4 is cleared only by the CLEAR STATUS REGISTER command, but it does not prevent additional program operation
attempts.
BUS
OPERATION COMMAND COMMENTS
WRITE
WRITE
Data =
40h or 10h
PROGRAM
Addr =
Address of word to be
SETUP
programmed
WRITE
WRITE
Data =
Word to be
DATA
programmed
Addr =
Address of word to be
programmed
READ
Status register data;
toggle OE# or CE# to update
status register.
Standby
Check SR7
1 = Ready, 0 = Busy
Repeat for subsequent words.
Write FFh after the last word programming operation
to reset the device to read array mode.
BUS
OPERATION COMMAND COMMENTS
Standby
Check SR1
1 = Detect locked block
Standby
Check SR3
2
1 = Detect V
PP
low
Standby
Check SR4
3
1 = Word program error
YES
NO
Full Status Register
Check (optional)
NO
YES
PROGRAM
SUSPEND?
SR7 = 1?
Issue PROGRAM SETUP
Command and
Word Address
Start
Word Program Passed
V
PP
Range Error
Word Program Failed
FULL STATUS REGISTER CHECK FLOW
Read Status Register
Bits
Issue Word Address
and Word Data
PROGRAM
SUSPEND Loop
1
YES
NO
SR1 = 0?
YES
NO
SR3 = 0?
YES
NO
SR4 = 0?
Word Program
Completed
Read Status Register
Bits
PROGRAM Attempted
on a Locked Block
FLASH
18
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
Issue READ ARRAY
Command
PROGRAM
Complete
Finished
Reading
?
Issue PROGRAM
RESUME Command
YES
YES
NO
NO
SR2 = 1?
Start
PROGRAM Resumed
Read Status Register
Bits
Issue PROGRAM
SUSPEND Command
YES
NO
SR7 = 1?
Figure 5
PROGRAM SUSPEND/
PROGRAM RESUME Flowchart
BUS
OPERATION COMMAND COMMENTS
WRITE
PROGRAM
Data = B0h
SUSPEND
READ
Status register data;
toggle OE# or CE# to update
status register.
Standby
Check SR7
1 = Ready
Standby
Check SR2
1 = Suspended
WRITE
READ
Data = FFh
MEMORY
READ
Read data from block other
than that being programmed.
WRITE
PROGRAM
Data = D0h
RESUME
FLASH
19
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
YES
NO
Full Status Register
Check (optional)
NO
YES
ERASE
SUSPEND?
SR 7 = 1?
Start
BLOCK ERASE Passed
V
PP
Range Error
BLOCK ERASE Failed
FULL STATUS REGISTER CHECK FLOW
Read Status Register
Bits
ERASE
SUSPEND Loop
1
YES
NO
SR1 = 0?
YES
NO
YES
NO
BLOCK ERASE
Completed
Read Status Register
Bits
ERASE Attempted
on a Locked Block
SR3 = 0?
SR5 = 0?
Issue ERASE SETUP
Command and
Block Address
Issue BLOCK ERASE
CONFIRM Command
and Block Address
Figure 6
BLOCK ERASE Flowchart
NOTE: 1. Full status register check can be done after each block or after a sequence of blocks.
2. SR3 must be cleared before attempting additional PROGRAM/ERASE operations.
3. SR5 is cleared only by the CLEAR STATUS REGISTER command in cases where multiple blocks are erased before full
status is checked.
BUS
OPERATION COMMAND COMMENTS
WRITE
WRITE
Data = 20h
ERASE
Block Addr = Address
SETUP
within block to be erased
WRITE
ERASE
Data = D0h
Block Addr = Address
within block to be erased
READ
Status register data;
toggle OE# or CE# to
update status register.
Standby
Check SR7
1 = Ready, 0 = Busy
Repeat for subsequent blocks.
Write FFh after the last BLOCK ERASE operation to
reset the device to read array mode.
BUS
OPERATION COMMAND COMMENTS
Standby
Check SR1
1 = Detect locked block
Standby
Check SR3
2
1 = Detect V
PP
block
Standby
Check SR4 and SR5
1 = BLOCK ERASE
command error
Standby
Check SR5
3
1 = BLOCK ERASE error
FLASH
20
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
READ
PROGRAM
Issue READ ARRAY
Command
PROGRAM
Loop
ERASE
Complete
READ or
PROGRAM?
YES
NO
Issue ERASE
RESUME Command
READ or
PROGRAM
Complete?
YES
NO
SR6 = 1?
Start
ERASE Continued
Read Status Register
Bits
Issue ERASE
SUSPEND Command
2
(Note 1)
YES
NO
SR7 = 1?
Figure 7
ERASE SUSPEND/ERASE RESUME
Flowchart
NOTE: 1. See BLOCK ERASE Flowchart for complete erasure procedure.
2. See Word Programming Flowchart for complete programming procedure.
BUS
OPERATION COMMAND COMMENTS
WRITE
ERASE
Data = B0h
SUSPEND
READ
Status register data;
toggle OE# or CE# to
update status register.
Standby
Check SR7
1 = Ready
Standby
Check SR6
1 = Suspended
WRITE
READ
Data = FFh
MEMORY
READ
Read data from block
other than that being
erased.
WRITE
ERASE
Data = D0h
RESUME
FLASH
21
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
READ-WHILE-WRITE/ERASE
CONCURRENCY
It is possible for the device to read from one bank
while erasing/writing to another bank. Once a bank
enters the WRITE/ERASE operation, the other bank
automatically enters read array mode. For example,
during a READ CONCURRENCY operation, if a PRO-
GRAM/ERASE command is issued in bank a, then bank
a changes to the read status mode and bank b defaults
to the read array mode. The device reads from bank b if
the latched address resides in bank b (see Figure 8).
Similarly, if a PROGRAM/ERASE command is issued in
bank b, then bank b changes to read status mode and
bank a defaults to read array mode. When returning to
bank a, the device reads program/erase status if the
latched address resides in bank a. A correct bank ad-
dress must be specified to read status register after
returning from concurrent read in the other bank.
When reading the CFI area, or the chip protection
register, the possible concurrent operations are re-
ported in Figures 9a and 9b.
Figure 8
READ-While-WRITE Concurrency
Bank a
1 - Erasing/writing to bank a
2 - Erasing in bank a can be
suspended, and a WRITE to
another block in bank a
can be initiated.
3 - After the WRITE in that block
is complete, an ERASE can
be resumed by writing an
ERASE RESUME command.
1 - Reading bank a
Bank b
1 - Reading from bank b
1 - Erasing/writing to bank b
2 - Erasing in bank b can be
suspended, and a WRITE to
another block in bank b
can be initiated.
3 - After the WRITE in that block
is complete, an ERASE can
be resumed by writing an
ERASE RESUME command.
Figure 9a
Top Boot Block Device
Figure 9b
Bottom Boot Block Device
BANK a
BANK b
Reading the
READ
Not
Not
CFI or Chip
Supported
Supported
Protection
WRITE
Not
Not
Register
ERASE
Supported
Supported
BANK a
BANK b
Reading the
READ
Not
Supported
CFI or Chip
Supported
Protection
WRITE
Not
Supported
Register
ERASE
Supported
BLOCK LOCKING
The Flash memory of the MT28C3214P2FL or
MT28C3214P2NFL device provides a flexible locking
scheme which allows each block to be individually
locked or unlocked with no latency.
The device offers two-level protection for the blocks.
The first level allows software-only control of block lock-
ing (for data which needs to be changed frequently),
while the second level requires hardware interaction
before locking can be changed (code which does not
require frequent updates).
Control signals F_WP#, DQ0, and DQ1 define
the state of a block; for example, state [001] means
F_WP# = 0, DQ0 = 0 and DQ1 = 1.
Table 9 defines all of the possible locking states.
NOTE: All blocks are software-locked upon comple-
tion of the power-up sequence.
LOCKED STATE
After a power-up sequence completion, or after a
reset sequence, all blocks are locked (states [001] or
[101]). This means full protection from alteration. Any
PROGRAM or ERASE operations attempted on a locked
block will return an error on bit SR1 of the status regis-
ter. The status of a locked block can be changed to
unlocked or lock down using the appropriate software
commands. Writing the lock command sequence, 60h
followed by 01h, can lock an unlocked block.
UNLOCKED STATE
Unlocked blocks (states [000], [100], [110]) can be
programmed or erased. All unlocked blocks return to
the locked state when the device is reset or powered
down. An unlocked block can be locked or locked down
using the appropriate software command sequence,
60h followed by D0h. (See Table 5.)
LOCKED DOWN STATE
Blocks locked down (state [011]) are protected from
PROGRAM and ERASE operations, but their protection
status cannot be changed using software commands
FLASH
22
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2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
alone. A locked or unlocked block can be locked down
by writing the lock down command sequence, 60h fol-
lowed by 2Fh. Locked down blocks revert to the locked
state when the device is reset or powered down.
The LOCK DOWN function is dependent on the
F_WP# input. When F_WP# = 0, blocks in lock down
[011] are protected from program, erase, and lock sta-
tus changes. When F_WP# = 1, the LOCK DOWN func-
tion is disabled ([111]) and locked down blocks can be
individually unlocked by a software command to the
[110] state, where they can be erased and programmed.
These blocks can then be relocked [111] and unlocked
[110], as desired, as long as F_WP# remains HIGH.
When F_WP# goes LOW, blocks that were previously
locked down return to the lock down state [011] regard-
less of any changes made while F_WP# was HIGH. De-
vice reset or power-down resets all locks, including
those in lock down, to the locked state (see Table 9).
READING A BLOCK'S LOCK STATUS
The lock status of every block can be read in the
read device identification mode. To enter this mode,
write 90h to the bank containing address 00h. Subse-
quent READs at block address +00002 will output the
lock status of that block. The lowest two outputs, DQ0
and DQ1, represent the lock status. DQ0 indicates the
block lock/unlock status and is set by the LOCK com-
mand and cleared by the UNLOCK command. It is also
automatically set when entering lock down. DQ1 indi-
cates lock down status and is set by the LOCK DOWN
Table 9
Block Locking State Transition
ERASE/PROGRAM
LOCK
F_WP#
DQ1
DQ0
NAME
ALLOWED
LOCK
UNLOCK
DOWN
0
0
0
Unlocked
Yes
To [001]
To [011]
0
0
1
Locked (Default)
No
To [000]
To [011]
0
1
1
Lock Down
No
1
0
0
Unlocked
Yes
To [101]
To [111]
1
0
1
Locked
No
To [100]
To [111]
1
1
0
Lock Down
Yes
To [111]
To [111]
Disabled
1
1
1
Lock Down
No
To [110]
Disabled
ITEM
ADDRESS
2
DATA
Manufacturer Code (x16)
00000h
002Ch
Device Code
00001h
Top boot configuration
44A2h
Bottom boot configuration
44A3h
Block Lock Configuration
XX002h
Lock
Block is unlocked
DQ0 = 0
Block is locked
DQ0 = 1
Block is locked down
DQ1 = 1
Chip Protection Register Lock
80h
PR Lock
Chip Protection Register 1
81h84h
Factory Data
Chip Protection Register 2
85h88h
User Data
NOTE: 1. Other locations within the configuration address space are reserved by
Micron for future use.
2. "XX" specifies the block address of lock configuration.
Table 10
Chip Protection Configuration Addressing
1
FLASH
23
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2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
command. It can only be cleared by reset or power-
down, not by software. Table 9 shows the block locking
state transition scheme. The READ ARRAY command,
FFh, must be issued to the bank containing address
00h prior to issuing other commands.
LOCKING OPERATIONS DURING ERASE
SUSPEND
Changes to block lock status can be performed dur-
ing an ERASE SUSPEND by using the standard locking
command sequences to unlock, lock, or lock down. This
is useful in the case when another block needs to be
updated while an ERASE operation is in progress.
To change block locking during an ERASE opera-
tion, first write the ERASE SUSPEND command (B0h),
then check the status register until it indicates that the
ERASE operation has been suspended. Next, write the
desired lock command sequence to block lock, and the
lock status will be changed. After completing any de-
sired LOCK, READ, or PROGRAM operations, resume
the ERASE operation with the ERASE RESUME com-
mand (D0h).
If a block is locked or locked down during an ERASE
SUSPEND on the same block, the locking status bits
are changed immediately. When the ERASE is resumed,
the ERASE operation completes.
A locking operation cannot be performed during a
PROGRAM SUSPEND.
STATUS REGISTER ERROR CHECKING
Using nested locking or program command se-
quences during ERASE SUSPEND can introduce ambi-
guity into status register results.
Following protection configuration setup (60h), an
invalid command produces a lock command error (SR4
and SR5 are set to "1") in the status register. If a lock
command error occurs during an ERASE SUSPEND,
SR4 and SR5 are set to "1" and remain at "1" after the
ERASE SUSPEND command is issued. When the ERASE
is complete, any possible error during the ERASE can-
not be detected via the status register because of the
previous locking command error.
A similar situation happens if an error occurs during
a program operation error nested within an ERASE
SUSPEND.
CHIP PROTECTION REGISTER
A 128-bit protection register can be used to fullfill
the security considerations in the system (preventing
device substitution).
The 128-bit security area is divided into two 64-bit
segments. The first 64 bits are programmed at the
manufacturing site with a unique 64-bit number. The
other segment is left blank for customers to program as
desired. (See Figure 10).
READING THE CHIP PROTECTION REGISTER
The chip protection register is read in the device
identification mode. To enter this mode, load the 90h
command to the bank containing address 00h. Once in
this mode, READ cycles from addresses shown in Table
10 retrieve the specified information. To return to the
read array mode, write the READ ARRAY command
(FFh). The READ ARRAY command, FFh, must be is-
sued to the bank containing address 00h prior to issu-
ing other commands.
PAGE READ MODE
The initial portion of the page mode cycle is the
same as the asynchronous access cycle. Holding CE#
LOW and toggling addresses A0A1 allows random ac-
cess of other words in the page.
The page size can be customized at the factory to
four or eight words as required; but if no specification is
made, the normal size is four words.
ASYNCHRONOUS READ CYCLE
When accessing addresses in a random order or
when switching between pages, the access time is given
by
t
AA.
When F_CE# and F_OE# are LOW, the data is placed
on the data bus and the processor can read the data.
Figure 10
Protection Register Memory Map
4 Words
Factory-Programmed
4 Words
User-Programmed
PR Lock
0
88h
85h
84h
81h
80h
FLASH
24
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
STANDBY MODE
Icc supply current is reduced by applying a logic
HIGH level on F_CE# and F_RP# to enter the standby
mode. In the standby mode, the outputs are placed in
High-Z. Applying a CMOS logic HIGH level on F_CE#
and F_RP# reduces the current to I
CC
2
(MAX). If the
device is deselected during an ERASE operation or dur-
ing programming, the device continues to draw cur-
rent until the operation is complete.
AUTOMATIC POWER SAVE (APS) MODE
Substantial power savings are realized during peri-
ods when the Flash array is not being read and the
device is in the active mode. During this time the de-
vice switches to the automatic power save (APS) mode.
When the device switches to this mode, I
CC
is reduced
to I
CC
2
. The low level of power is maintained until
another operation is initiated. In this mode, the I/Os
retain the data from the last memory address read un-
til a new address is read. This mode is entered auto-
matically if no addresses or control signals toggle.
V
PP
/V
CC
PROGRAM AND ERASE
VOLTAGES
The MT28C3214P2FL Flash memory provides in-
system programming and erase with V
PP
in the 0.9V
2.2V range (V
PP
1
). In addition to the flexible block lock-
ing, the V
PP
programming voltage can be held LOW for
absolute hardware write protection of all blocks in the
Flash device. When V
PP
is below V
PPLK
, any PROGRAM or
ERASE operation results in an error, prompting the cor-
responding status register bit (SR3) to be set.
The MT28C3214P2NFL Flash memory provides in-
system programming and erase with V
PP
in the 0.0V
2.2V range (V
PP
1
).
V
PP
at 12V 5% (V
PP
2
) is supported for a maximum
of 100 cycles and 10 cumulative hours. The device
can withstand 100,000 WRITE/ERASE operations when
V
PP
= V
CC
.
During WRITE and ERASE operations, the WSM
monitors the V
PP
voltage level. WRITE/ERASE opera-
tions are allowed only when V
PP
is within the ranges
specified in Table 11.
When V
CC
is below V
LKO
or V
PP
is below V
PPLK
, any
WRITE/ERASE operation is prevented.
DEVICE RESET
To correctly reset the device, the RST# signal must
be asserted (RST# = V
IL
) for a minimum of
t
RP. After
reset, the device can be accessed for a READ operation
with a delayed access time of
t
RWH from the rising edge
of RST#. The circuitry used for generating the RST#
signal needs to be common with the rest of the system
reset to ensure that correct system initialization occurs.
Please refer to the timing diagram for further details.
POWER-UP SEQUENCE
The following power-up sequence must be observed
to properly initialize the device:
RST# must be at V
IL
.
Power on V
CC
/V
CC
Q (V
CC
V
CC
Q at all times).
Wait 2S after V
CC
reaches V
CC
(MIN).
Take RST# from V
IL
to V
IH
.
The RST# transition from V
IL
to V
IH
must be less
than 10S.
Table 11
V
PP
Ranges (V)
IN-SYSTEM
IN-FACTORY
DEVICE
MIN
MAX
MIN
MAX
MT28C3214P2FL
0.9
2.2
11.4
12.6
MT28C3214P2NFL
0.0
2.2
11.4
12.6
FLASH
25
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
ABSOLUTE MAXIMUM RATINGS*
Voltage to Any Pin Except V
CC
and V
PP
with Respect to V
SS
............................ -0.5V to +2.45V
V
PP
Voltage (for BLOCK ERASE and PROGRAM
with Respect to V
SS
) ....................... -0.5V to +13.5V**
V
CC
and V
CC
Q Supply Voltage
with Respect to V
SS
............................ -0.3V to +2.45V
Output Short Circuit Current ............................... 100mA
Operating Temperature Range .............. -40
o
C to +85
o
C
Storage Temperature Range ................. -55
o
C to +125
o
C
Soldering Cycle ........................................... 260
o
C for 10s
*Stresses greater than those listed under "Absolute
Maximum Ratings" may cause permanent damage to
the device. This is a stress rating only and functional
operation of the device at these or any other conditions
above those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect reliability.
**Maximum DC voltage on V
PP
may overshoot to +13.5V
for periods <20ns.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
SYMBOL
MIN
MAX
UNITS
NOTES
Operating temperature
t
A
-40
+85
o
C
V
CC
supply voltage
F_V
CC
, S_V
CC
1.65
2.2
V
I/O supply voltage (V
CC
= 1.65V1.95V)
V
CC
Q
1.65
1.95
V
1
I/O supply voltage (V
CC
= 1.80V2.20V)
V
CC
Q
1.80
2.20
V
1
V
PP
voltage
V
PP
1
0.9
2.2
V
(MT28C3214P2FL only)
V
PP
voltage
V
PP
1
0.0
2.2
V
(MT28C3214P2NFL only)
V
PP
in-factory programming voltage
V
PP
2
11.4
12.6
V
2
Data retention supply voltage
S_V
DR
1.0
V
Block erase cycling
100,000
Cycles
Figure 11
Output Load Circuit
I/O
14.5K
30pF
V
CC
V
SS
14.5K
FLASH ELECTRICAL SPECIFICATIONS
NOTE: 1. Use only one of the two I/O supply voltage ranges, 1.65V1.95V or 1.80V2.20V.
2. 12V V
PP
is supported for a maximum of 100 cycles and may be connected for up to 10 cumulative hours.
FLASH
26
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
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MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
COMBINED DC CHARACTERISTICS
1
V
CC
= 1.65V1.95V or
1.80V2.20V
V
CC
Q = 1.65V1.95V or
1.80V2.20V
DESCRIPTION
CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS NOTES
Input low voltage
V
IL
-0.4
0.4
V
Input high voltage
V
IH
V
CC
Q -
V
CC
Q +
V
0.4V
0.3V
Output low voltage
V
OL
0.10
V
I
OL
= 100A (Flash)
Output low voltage
V
OL
0.3
0.3
V
I
OL
= 100A (SRAM)
Output high voltage
V
OH
V
CC
Q -
V
I
OH
= 100A (Flash)
0.1V
Output high voltage
V
OH
V
CC
Q -
V
I
OH
= 100A (SRAM)
0.3V
V
PP
lock out voltage
V
PPLK
0.4
V
V
PP
during PROGRAM/ERASE
V
PP
1
0.9
2.2
V
operations (MT28C3214P2FL only)
V
PP
2
11.4
12.6
V
2
V
PP
during PROGRAM/ERASE
V
PP
1
0.0
2.2
V
operations (MT28C3214P2NFL only)
V
PP
2
11.4
12.6
V
2
V
CC
PROGRAM/ERASE lock voltage
V
LKO
1.0
V
Input leakage current
I
L
1
mA
Output leakage current
I
OZ
1
mA
F_V
CC
asynchronous
I
CC
1
15
mA
read current at 95ns
F_V
CC
page mode
I
CC
2
5
mA
read current at 35ns
F_V
CC
plus S_V
CC
standby current
I
CC
3
25
60
mA
F_V
CC
program current
I
CC
4+
I
PP
3
55
mA
F_V
CC
erase current
I
CC
5+
I
PP
4
65
mA
F_V
CC
/S_V
CC
erase suspend current
I
CC
6
60
mA
F_V
CC
/S_V
CC
program suspend
I
CC
7
60
mA
current
Read-while-write current
I
CC
8
80
mA
NOTE: 1. All currents are in RMS unless otherwise noted.
2. 12V V
PP
is supported for a maximum of 100 cycles and may be connected for up to 10 cumulative hours.
3. Operating current is a linear function of operating frequency and voltage. Operating current can be calculated using
the formula shown with operating frequency (f) expressed in MHz and operating voltage (V) in volts.
Example: When operating at 2 MHz at 2V, the device will draw a typical active current of 0.8*2* 2 = 3.2mA in the page
access mode. This parameter is specified with the outputs disabled to avoid external loading effects. The user must
add current required to drive output capacitance expected in the actual system.
(continued on the next page)
FLASH
27
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
COMBINED DC CHARACTERISTICS
1
(continued)
V
CC
= 1.65V1.95V or
1.80V2.20V
V
CC
Q = 1.65V1.95V or
1.80V2.20V
DESCRIPTION
CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS NOTES
S_V
CC
read/write operating
V
IN
= V
IH
or V
IL
I
CC
9
12
25
mA
3
supply current page access
chip enabled, I
OL
= 0
mode
S_V
CC
read/write operating
V
IN
= V
IH
or V
IL
I
CC
10
3
8
mA
3
supply current word access
chip enabled, I
OL
= 0
mode
V
PP
read current
V
PP
V
CC
I
PP
1
1
mA
V
PP
V
CC
200
mA
V
PP
standby current
V
PP
V
CC
I
PP
2
1
mA
V
PP
V
CC
200
mA
V
PP
erase suspend current
V
PP
= V
PP
1
I
PP
5
1
mA
V
PP
= V
PP
2
200
mA
V
PP
program suspend current
V
PP
= V
PP
1
I
PP
6
1
mA
V
PP
= V
PP
2
200
mA
NOTE: 1. All currents are in RMS unless otherwise noted.
2. 12V V
PP
is supported for a maximum of 100 cycles and may be connected for up to 10 cumulative hours.
3. Operating current is a linear function of operating frequency and voltage. Operating current can be calculated using
the formula shown with operating frequency (f) expressed in MHz and operating voltage (V) in volts.
Example: When operating at 2 MHz at 2V, the device will draw a typical active current of 0.8*2* 2 = 3.2mA in the page
access mode. This parameter is specified with the outputs disabled to avoid external loading effects. The user must
add current required to drive output capacitance expected in the actual system.
FLASH
28
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
FLASH READ CYCLE TIMING REQUIREMENT
V
CC
= 1.65V1.95V
-10
-11
V
CC
= 1.65V
1.95V
V
CC
= 1.65V
1.95V
PARAMETER
SYMBOL
MIN
MAX
MIN
MAX
UNITS
Address to output delay
t
AA
100
110
ns
CE# LOW to output delay
t
ACE
100
110
ns
Page address access
t
APA
35
45
ns
OE# LOW to output delay
t
AOE
30
30
ns
F_RP# HIGH to output delay
t
RWH
200
200
ns
F_RP# LOW pulse width
t
RP
125
125
ns
CE# or OE# HIGH to output High-Z
t
OD
25
25
ns
Output hold from address, CE# or OE# change
t
OH
0
0
ns
READ cycle time
t
RC
100
110
ns
FLASH READ CYCLE TIMING REQUIREMENT
V
CC
= 1.80V2.20V
-10
-11
V
CC
= 1.80V
2.20V
V
CC
= 1.80V
2.20V
PARAMETER
SYMBOL
MIN
MAX
MIN
MAX
UNITS
Address to output delay
t
AA
95
100
ns
CE# LOW to output delay
t
ACE
95
100
ns
Page address access
t
APA
35
45
ns
OE# LOW to output delay
t
AOE
30
30
ns
F_RP# HIGH to output delay
t
RWH
150
150
ns
F_RP# LOW pulse width
t
RP
100
100
ns
CE# or OE# HIGH to output High-Z
t
OD
25
25
ns
Output hold from address, CE# or OE# change
t
OH
0
0
ns
READ cycle time
t
RC
95
100
ns
FLASH
29
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
FLASH WRITE CYCLE TIMING REQUIREMENTS
-10/-11
V
CC
= 1.65V
1.95V or
1.80V2.20V
PARAMETER
SYMBOL
MIN
MAX
UNITS
Reset HIGH recovery to WE# going LOW
t
RS
150
ns
CE# setup to WE# going LOW
t
CS
0
ns
Write pulse width
t
WP
50
ns
Data setup to WE# going HIGH
t
DS
50
ns
Address setup to WE# going HIGH
t
AS
50
ns
CE# hold from WE# HIGH
t
CH
0
ns
Data hold from WE# HIGH
t
DH
0
ns
Address hold from WE# HIGH
t
AH
9
ns
Write pulse width HIGH
t
WPH
30
ns
WP# setup to WE# going HIGH
t
RHS
200
ns
V
PP
setup to WE# going HIGH
t
VPS
200
ns
Write recovery before READ
t
WOS
50
ns
WP# hold from valid SRD
t
RHH
0
ns
V
PP
hold from valid SRD
t
VPH
0
ns
WE# HIGH to data valid
t
WB
t
AA+50
ns
FLASH ERASE AND PROGRAM CYCLE TIMING REQUIREMENTS
-10/-11
V
CC
= 1.65V
1.95V or
1.80V2.20V
PARAMETER
TYP
MAX
UNITS
4KW parameter block program time
0.1
0.3
s
32KW parameter block program time
0.8
2.4
s
Word program time
8
185
s
4KW parameter block erase time
1
4
s
32KW parameter block erase time
1.5
5
s
Program suspend latency
5
10
s
Erase suspend latency
5
20
s
FLASH
30
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
TWO-CYCLE PROGRAMMING/ERASE OPERATION
VALID ADDRESS
VALID ADDRESS
VALID ADDRESS
UNDEFINED
t
CH
t
DH
t
RHS
t
DS
A0A20
OE#
CE#
WE#
V
PP
RP#
WP#
V
IH
V
IH
V
IL
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IPPLK
V
IL
V
IPPH
t
AS
t
AH
t
WPH
t
RS
t
WP
t
WOS
t
CS
t
WB
CMD
CMD/
DATA
DQ0DQ15
V
OH
V
OL
t
RHH
t
VPS
t
VPPH
STATUS
High-Z
NOTE: 1. The WRITE cycles for the WORD PROGRAMMING command are followed by a READ ARRAY DATA cycle.
-10/-11
V
CC
= 1.65V1.95V or
1.80V2.20V
SYMBOL
MIN
MAX
UNITS
WRITE TIMING PARAMETERS
-10/-11
V
CC
= 1.65V1.95V or
1.80V2.20V
SYMBOL
MIN
MAX
UNITS
t
RS
150
ns
t
CS
0
ns
t
WP
50
ns
t
DS
50
ns
t
AS
50
ns
t
CH
0
ns
t
DH
0
ns
t
AH
9
ns
t
RHS
200
ns
t
VPS
200
ns
t
WOS
50
ns
t
RHH
0
ns
t
VPH
0
ns
t
WB
t
AA+50
ns
FLASH
31
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
SINGLE ASYNCHRONOUS READ OPERATION
READ TIMING PARAMETERS
(V
CC
= 1.65V1.95V)
-10
-11
V
CC
= 1.65V1.95V V
CC
= 1.65V1.95V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
100
110
ns
t
ACE
100
110
ns
t
AOE
30
30
ns
t
RWH
200
200
ns
t
OD
25
25
ns
t
OH
0
0
ns
t
RC
100
110
ns
VALID ADDRESS
UNDEFINED
t
OD
t
AA
t
ACE
t
OH
A0A20
OE#
CE#
WE#
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
t
RC
t
RWH
DQ0DQ15
RP#
V
OH
V
OL
VALID OUTPUT
High-Z
t
AOE
READ TIMING PARAMETERS
(V
CC
= 1.80V2.20V)
-10
-11
V
CC
= 1.80V2.20V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
95
100
ns
t
ACE
95
100
ns
t
AOE
30
30
ns
t
RWH
150
150
ns
t
OD
25
25
ns
t
OH
0
0
ns
t
RC
95
100
ns
FLASH
32
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
ASYNCHRONOUS PAGE MODE READ OPERATION
VALID ADDRESS
VALID
ADDRESS
VALID
ADDRESS
VALID
ADDRESS
VALID
OUTPUT
VALID
OUTPUT
VALID
OUTPUT
VALID
OUTPUT
UNDEFINED
t
OD
t
AA
t
ACE
t
OH
t
A
PA
t
AOE
t
RMH
A0A1
F_OE#
F_CE#
F_WE#
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
VALID ADDRESS
A2A20
V
IH
V
IL
F_RP#
V
IH
V
IL
DQ0DQ15
V
OH
V
OL
High-Z
READ TIMING PARAMETERS
(V
CC
= 1.65V1.95V)
-10
-11
V
CC
= 1.65V1.95V V
CC
= 1.65V1.95V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
100
110
ns
t
ACE
100
110
ns
t
APA
35
45
ns
t
AOE
30
30
ns
t
RWH
200
200
ns
t
OD
25
25
ns
t
OH
0
0
ns
READ TIMING PARAMETERS
(V
CC
= 1.80V2.20V)
-10
-11
V
CC
= 1.80V2.20V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
95
100
ns
t
ACE
95
100
ns
t
APA
35
45
ns
t
AOE
30
30
ns
t
RWH
150
150
ns
t
OD
25
25
ns
t
OH
0
0
ns
FLASH
33
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
RESET OPERATION
F_OE#
DQ0DQ15
V
IH
V
IL
F_RST#
V
IH
V
IL
F_CE#
V
IH
V
IL
V
OH
V
OL
t
RWH
t
RP
READ TIMING PARAMETERS
(V
CC
= 1.65V1.95V)
-10
-11
V
CC
= 1.65V1.95V V
CC
= 1.65V1.95V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
RWH
200
200
ns
t
RP
125
125
ns
READ TIMING PARAMETERS
(V
CC
= 1.80V2.20V)
-10
-11
V
CC
= 1.80V2.20V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
RWH
150
150
ns
t
RP
100
100
ns
FLASH
34
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
Table 12
CFI
OFFSET
DATA
DESCRIPTION
00
2Ch
Manufacturer Code
01
A2h
Top Boot Block Device Code
A3h
Bottom Boot Block Device Code
020F
reserved
Reserved
10, 11
0051,0052
"QR"
12
0059
"Y"
13, 14
0003, 0000
Primary OEM Command Set
15, 16
0039, 0000
Address for Primary Extended Table
17, 18
0000, 0000
Alternate OEM Command Set
19, 1A
0000, 0000
Address for OEM Extended Table
1B
0017
V
CC
MIN for Erase/Write; Bit7Bit4 Volts in BCD; Bit3Bit0 100mV in BCD
1C
0022
V
CC
MAX for Erase/Write; Bit7Bit4 Volts in BCD; Bit3Bit0 100mV in BCD
1D
00B4
V
PP
MIN for Erase/Write; Bit7Bit4 Volts in Hex; Bit3Bit0 100mV in BCD
1E
00C6
V
PP
MAX for Erase/Write; Bit7Bit4 Volts in Hex; Bit3Bit0 100mV in BCD
1F
0003
Typical timeout for single byte/word program, 2
n
s, 0000 = not supported
20
0000
Typical timeout for maximum size multiple byte/word program, 2
n
s, 0000 = not
supported
21
0009
Typical timeout for individual block erase, 2
n
ms, 0000 = not supported
22
0000
Typical timeout for full chip erase, 2
n
ms, 0000 = not supported
23
000C
Maximum timeout for single byte/word program, 2
n
s, 0000 = not supported
24
0000
Maximum timeout for maximum size multiple byte/word program, 2
n
s, 0000 = not
supported
25
0003
Maximum timeout for individual block erase, 2
n
ms, 0000 = not supported
26
0000
Maximum timeout for full chip erase, 2
n
ms, 0000 = not supported
27
0016
Device size, 2
n
bytes
28
0001
Bus Interface x8 = 0, x16 = 1, x8/x16 = 2
29
0000
Flash device interface description 0000 = async
2A, 2B
0000, 0000
Maximum number of bytes in multi-byte program or page, 2
n
2C
0003
Number of erase block regions within device (4K words and 32K words)
2D, 2E
0037, 0000
Top boot block device erase block region information 1, 8 blocks ...
0007, 0000
Bottom boot block device erase block region information 1, 8 blocks ...
2F, 30
0000, 0001
Top boot block device ...of 8KB
0020, 0000
Bottom boot block device ...of 8KB
31, 32
0006, 0000
7 blocks of ....
33, 34
0000, 0001
......64KB
35, 36
0007, 0000
Top boot block device 56 blocks of
0037, 0000
Bottom boot block device 56 blocks of
(continued on the next page)
FLASH
35
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
Table 12
CFI (continued)
OFFSET
DATA
DESCRIPTION
37, 38
0020, 0000
Top boot block device......64KB
0000, 0001
Bottom boot block device......64KB
39, 3A
0050, 0052
"PR"
3B
0049
"I"
3C
0030
Major version number, ASCII
3D
0031
Minor Version Number, ASCII
3E
00E6
Optional Feature and Command Support
3F
0002
Bit 0 Chip erase supported no = 0
40
0000
Bit 1 Suspend erase supported = yes = 1
41
0000
Bit 2 Suspend program supported = yes = 1
Bit 3 Chip lock/unlock supported = no = 0
Bit 4 Queued erase supported = no = 0
Bit 5 Instant individual block locking supported = yes = 1
Bit 6 Protection bits supported = yes = 1
Bit 7 Page mode read supported = yes = 1
Bit 8 Synchronous read supported = yes = 1
Bit 9 Simultaneous operation supported = yes = 1
42
0001
Program supported after erase suspend = yes
43, 44
0003,0000
Bit 0 Block Lock Status active = yes; Bit 1 Block Lock Down active = yes
45
0018
V
CC
supply optimum; Bit7Bit4 Volts in BCD; Bit3Bit0 100mV in BCD
46
00C0
V
PP
supply optimum; Bit7Bit4 Volts in Hex; Bit3Bit0 100mV in BCD
47
0001
Number of protection register fields in JEDEC ID space
48, 49
0080, 0000
Lock bytes LOW address, lock bytes HIGH address
4A, 4B
0003, 0003
2
n
factory programmed bytes, 2
n
user programmable bytes
4C
0002
Background Operation
0000 = Not used
0001 = 4% block split
0002 = 12% block split
0003 = 25% block split
0004 = 50% block split
4D
0000
Burst Mode Type
0000 = No burst mode
00x1 = 4 words max
00x2 = 8 words max
00x3 = 16 words max
001x = Linear burst, and/or
002x = Interleaved burst, and/or
004x = Continuous burst
4E
0002
Page Mode Type
0000 = No page mode
0001 = 4-word page
0002 = 8-word page
0003 = 16-word page
0004 = 32-word page
4F
0004
SRAM density, 4Mb (256K x 16)
SRAM
36
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
SRAM OPERATING MODES
SRAM READ ARRAY
The operational state of the SRAM is determined by
S_CE1#, S_CE2, S_WE#, S_OE#, S_UB#, and S_LB#, as
indicated in the Truth Table. To perform an SRAM
READ operation, S_CE1#, and S_OE#, must be at V
IL
,
and S_CE2 and S_WE# must be at V
IH
. When in this
state, S_UB# and S_LB# control whether the lower byte
is read (S_UB# V
IH
, S_LB# V
IL
), the upper byte is read
(S_UB# V
IL
, S_LB# V
IH
), both upper and lower bytes are
read (S_UB# V
IL
, S_LB# V
IL
), or neither are read (S_UB#
V
IH
, S_LB# V
IH
) and the device is in a standby state.
While performing an SRAM READ operation, cur-
rent consumption may be reduced by reading within a
16-word page. This is done by holding S_CE1# and
SRAM FUNCTIONAL BLOCK DIAGRAM
DQ0DQ7
WORD
ADDRESS
DECODE
LOGIC
PAGE
ADDRESS
DECODE
LOGIC
CONTROL
LOGIC
16K-PAGE
x16 WORD
x16 BIT
RAM ARRAY
WORD
MUX
DQ8DQ15
INPUT/
OUTPUT
MUX
AND
BUFFERS
S_CE1#
A4A17
A0A3
S_OE#
S_UB#
S_LB#
S_CE2
S_WE#
S_OE# at V
IL
, S_WE# and S_CE2 at V
IH
, and toggling
addresses A0-A3. S_UB# and S_LB# control the data
width as described above.
SRAM WRITE ARRAY
In order to perform an SRAM WRITE operation,
S_CE1# and S_WE# must be at V
IL
, and S_CE2 and
S_OE# must be at V
IH
. When in this state, S_UB# and
S_LB# control whether the lower byte is written (S_UB#
V
IH
, S_LB# V
IL
), the upper byte is written (S_UB# V
IL
,
S_LB# V
IH
), both upper and lower bytes are written
(S_UB# V
IL
, S_LB# V
IL
), or neither are written (S_UB#
V
IH
, S_LB# V
IH
) and the device is in a standby state.
SRAM
37
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
TIMING TEST CONDITIONS
Input pulse levels .................... 0.1V V
CC
to 0.9V V
CC
Input rise and fall times .................................... 5ns
Input timing reference levels ......................... 0.5V
Output timing reference levels ..................... 0.5V
Operating Temperature ............... -40
o
C to +85
o
C
SRAM READ CYCLE TIMING
-10/-11
V
CC
= 1.65V1.95V
V
CC
= 1.80V2.20V
DESCRIPTION
SYMBOL
MIN
MAX
MIN
MAX
UNITS
Read cycle time
t
RC
100
85
ns
Address access time
t
AA
100
85
ns
Chip enable to valid output
t
C O
100
85
ns
Output enable to valid output
t
OE
35
35
ns
Byte select to valid output
t
LB,
t
UB
100
85
ns
Chip enable to Low-Z output
t
LZ
0
0
ns
Output enable to Low-Z output
t
OLZ
0
0
ns
Byte select to Low-Z output
t
LBZ,
t
UBZ
0
0
ns
Chip enable to High-Z output
t
HZ
0
15
0
15
ns
Output disable to High-Z output
t
OHZ
0
15
0
15
ns
Byte select disable to High-Z output
t
LBHZ,
t
UBHZ
0
15
0
15
ns
Output hold from address change
t
OH
5
5
ns
SRAM WRITE CYCLE TIMING
-10/-11
V
CC
= 1.65V1.95V
V
CC
= 1.80V2.20V
DESCRIPTION
SYMBOL
MIN
MAX
MIN
MAX
UNITS
Write cycle time
t
WC
100
85
ns
Chip enable to end of write
t
CW
100
85
ns
Address valid to end of write
t
AW
100
85
ns
Byte select to end of write
t
LBW,
t
UBW
100
85
ns
Address setup time
t
AS
0
0
ns
Write pulse width
t
WP
50
50
ns
Write recovery time
t
WR
0
0
ns
Write to High-Z output
t
WHZ
0
15
0
15
ns
Data to write time overlap
t
DW
50
50
ns
Data hold from write time
t
DH
0
0
ns
End write to Low-Z output
t
O W
0
0
ns
SRAM
38
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
DON'T CARE
ADDRESS
S_CE1#
S_CE2
S_OE#
S_LB#, S_UB#
DATA-OUT
tRC
tAA
tHZ (1, 2)
tCO
tLBLZ, tUBLZ
tLBHZ, tUBHZ
DATA VALID
High-Z
tOE
tLZ(2)
tOLZ
tOHZ (1)
tLB, tUB
READ CYCLE
1
(S_CE1# = S_OE# = V
IL
; S_CE2, S_WE# = V
IH
)
ADDRESS
DATA-OUT
tRC
tAA
tOH
PREVIOUS
DATA VALID
DATA VALID
READ CYCLE
2
(S_WE# = V
IH
)
READ TIMING PARAMETERS
-10/-11
V
CC
= 1.65V1.95V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
RC
100
85
ns
t
AA
100
85
ns
t
CO
100
85
ns
t
OE
35
35
ns
t
LB,
t
UB
100
85
ns
t
LZ
0
0
ns
-10/-11
V
CC
= 1.65V1.95V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
OLZ
0
0
ns
t
HZ
0
15
0
15
ns
t
OHZ
0
15
0
15
ns
t
LBHZ,
t
UBHZ
0
15
0
15
ns
t
OH
5
5
ns
SRAM
39
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
WRITE CYCLE
(S_WE# CONTROL)
DON'T CARE
ADDRESS
S_CE1#
S_CE2
DATA-OUT
tWC
tAW
tWR
tCW
tWHZ
tOW
High-Z
S_LB#, S_UB#
tLBW, tUBW
S_WE#
DATA-IN
tAS
tWP
tDH
tDW
DATA VALID
High-Z
WRITE TIMING PARAMETERS
-10/-11
V
CC
= 1.65V1.95V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
WC
100
85
ns
t
CW
100
85
ns
t
AW
100
85
ns
t
LBW,
t
UBW
100
85
ns
t
AS
0
0
ns
t
WP
50
50
ns
-10/-11
V
CC
= 1.65V1.95V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
WR
0
0
ns
t
WHZ
0
15
0
15
ns
t
DW
50
50
ns
t
DH
0
0
ns
t
OW
0
0
ns
SRAM
40
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
WRITE CYCLE
2
(S_CE1# CONTROL)
DON'T CARE
ADDRESS
S_CE1#
DATA-OUT
tWC
tAW
tWR
tCW
tWHZ
tLZ
High-Z
S_LB#, S_UB#
S_WE#
DATA-IN
tAS
tWP
tLBW, tUBW
tDH
tDW
DATA VALID
WRITE TIMING PARAMETERS
-10/-11
V
CC
= 1.65V1.95V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
WC
100
85
ns
t
CW
100
85
ns
t
AW
100
85
ns
t
LBW,
t
UBW
100
85
ns
t
AS
0
0
ns
t
WP
50
50
ns
-10/-11
V
CC
= 1.65V1.95V V
CC
= 1.80V2.20V
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
WR
0
0
ns
t
WHZ
0
15
0
15
ns
t
DW
50
50
ns
t
DH
0
0
ns
t
OW
0
0
ns
41
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
66-BALL FBGA
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: .27mm
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
1.40 MAX
0.80
(TYP)
8.80
0.80
(TYP)
8.00 0.10
12.00 0.10
4.40
0.05
6.00
0.05
66X
0.35
BALL A12
BALL A1
BALL A1
BALL #1 ID
5.60
2.80 0.05
4.00 0.05
0.10
1.05 0.075
C
C
SEATING PLANE
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS 0.33
C
L
C
L
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
MIN
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.27mm per side.
DATA SHEET DESIGNATION
This data sheet contains minimum and maximum limits specified over the complete power supply and
temperature range for production devices. Although considered final, these specifications are subject to change,
as further product development and data characterization sometimes occur.
42
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT28C3214P2FL_4.p65 Rev. 4, Pub. 4/02
2002, Micron Technology, Inc.
2 MEG x 16 PAGE FLASH
256K x 16 SRAM COMBO MEMORY
REVISION HISTORY
Rev. 4, Pub. 4/02 ................................................................................................................................................................ 4/02
Removed the
t
CBPH parameter.
Updated the chip protection mode and register information.
Updated the block locking information.
Rev. 4, Pub. 9/01 ................................................................................................................................................................ 9/01
Added minimum spec for SRAM output high voltage (V
OH
)
Removed CSM Table
Rev. 3, Pub. 6/01 ................................................................................................................................................................ 6/01
Data sheet designation change (removed "Advance")
Rev. 2, Pub. 5/01, Advance .............................................................................................................................................. 5/01
Added V
PP
1
range
Added second V
CC
range
Initial published release, Rev. 1, Advance ................................................................................................................ 11/00