3236 Scott Boulevard
Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
2.0 to 24.0 GHz
GaAs MMIC
Power Amplifier
Advanced Product Information
April 2003
(1 of 2)
Features
Small Size: 43 x 92 mils
High Gain
Directly Cascadable
Medium Power: +24 dBm
Ion-Implanted Active Layers
Silicon Nitride Passivation
Specifications (TA = 25C, VDD = 8V)
Parameters
Units
Min
Typ
Max
Frequency Range
GHz
2.0
24.0
Small Signal Gain
dB
11.0
12.0
Gain Flatness
dB
0.5
0.85
Input/Output VSWR
--
1.8:1
2.0:1
Power Output (@1 dB Gain Compression)
dBm
22.0
24.0
Second Order Intercept Point
dBm
40.0
Third Order Intercept Point
dBm
30.0
Current
mA
300
330
Absolute Maximum Ratings
Parameter
Rating
Drain Voltage
12V
Drain Current
360 mA
Continuous Power Dissipation
3.0 W
Channel Temperature
+175C
Storage Temperature
-65C to +175C
Mounting Temperature
+320C
Input Power
+23 dBm
Die Attach and Bonding Procedures
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290C, 5C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250C; Bond Tip Temperature: 150C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
CMM0224-BD
Chip Diagram
3236 Scott Boulevard, Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
CMM0224-BD
Advanced Product Information - April 2003
(2 of 2)
Celeritek reserves the right to make changes without further notice to any products herein. Celeritek makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Celeritek assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating
parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Celeritek does not convey any license under its patent
rights nor the rights of others. Celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Celeritek product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Celeritek products for any such unintended or unauthorized application, Buyer shall indemnify and hold Celeritek and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Celeritek was negligent
regarding the design or manufacture of the part. Celeritek is a registered trademark of Celeritek, Inc. Celeritek, Inc. is an Equal Opportunity/Affirmative Action Employer.
Ordering Information
The CMM-0224-BD is available in bare die and is shipped in Gel Pak.
Part Number for Ordering
Package
CMM0224-BD
Bare Die
Optional Current Setting Resistor
532-001525-002
Typical Scattering Parameters, TA = 25C
(S-Parameters Include Bonding Wire Parasitics)
Freq
S11
S21
S12
S22
(GHz)
(dB)
(Mag)
(Ang)
(dB)
(Mag)
(Ang)
(dB)
(Mag)
(Ang)
(dB)
(Mag)
(Ang)
2.0
-16.5
0.149623566 -121
12.2
4.073802778
139
-51.3
0.002722701
-6
-14.6
0.186208714 141
4.0
-16.4
0.151356125 -179
12.5
4.216965034
71
-42.6
0.007413102
1
-18.8
0.114815362
89
6.0
-19.7
0.103514217
108
12.2
4.073802778
9
-38.5
0.011885022
-59
-24.3
0.06095369
61
8.0
-25.8
0.051286138
-67
11.9
3.935500755
-50
-36.1
0.015667511
-114
-28.4
0.03801894
-112
10.0
-16.9
0.142889396 -152
12.2
4.073802778
-111
-33.0
0.022387211 -167
-21.5
0.084139514 -165
12.0
-15.8
0.16218101
151
12.2
4.073802778
-171
-32.3
0.024266101
145
-21.9
0.080352612 132
14.0
-22.6
0.074131024
106
11.9
3.935500755
129
-31.3
0.027227013
108
-21.9
0.080352612
-72
16.0
-19.7
0.103514217 -157
11.7
3.84591782
66
-32.3
0.024266101
49
-14.2
0.19498446
-130
18.0
-14.9
0.179887092
162
12.3
4.120975191
4
-32.1
0.024831331
-23
-12.1
0.248313311 -163
20.0
-19.2
0.10964782
162
12.2
4.073802778
-62
-30.0
0.031622777
-91
-11.2
0.27542287
-174
22.0
-15.1
0.175792361
175
12.0
3.981071706
-72
-28.8
0.036307805 -117
-10.6
0.295120923 179
24.0
-13.7
0.206538016
173
11.8
3.89045145
-71
-28.6
0.037153523 -126
-10.2
0.309029543 158
Schematic Diagram
Assembly Example
Typical Performance (TA=25C, VDD = 8V)
27
26
25
24
23
22
21
2
4
6
8
10
12
14
16
18
20
FREQUENCY, GHz
OUTPUT
POWER, +dBm
OUTPUT POWER VS FREQUENCY
2
4
6
8
10 12
14
16
18 20 22 42
FREQUENCY, GHz
14
13
12
11
10
GAIN, dB
GAIN VS FREQUENCY
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