Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
GaAs MULTI-CHIP MODULE
MC-7894
1 GHz CATV 2
5 dB POWER DOUBLER AMPLIFIER
NEC Compound Semiconductor Devices 2005
Document No. *************** (1st edition)
Date Published March 2005 CP(K)
Printed in Japan
DESCRIPTION
The MC-7894 is a GaAs Multi-chip Module designed for use in CATV applications up to 1 GHz. This unit has low
distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
Low
distortion
High linear gain
G
L
= 24.5 dB MIN. @ f = 1 GHz
Low return loss
ORDERING INFORMATION
Part Number
Package
Supplying Form
MC-7894-AZ
7-pin special with heatsink
50 pcs MAX./Tray
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7894
ABSOLUTE MAXIMUM RATINGS (T
A
= +25
C, unless otherwise specified)
Parameter Symbol
Ratings
Unit
Supply Voltage
V
DD
30 V
Input Voltage
Note
V
i
70.0
dBmV
Operating Case Temperature
T
C
-
30 to +100
C
Storage Temperature
T
stg
-
40 to +100
C
Note In case of single tone
PRELIMINARY PRODUCT INFORMATION
Preliminary Product Information
2
MC-7894
RECOMMENDED OPERATING CONDITIONS (Z
S
= Z
L
= 75
, unless otherwise specified)
Parameter Symbol
Test
Conditions MIN.
TYP.
MAX.
Unit
Supply Voltage
V
DD
23.5 24.0 24.5 V
Input Voltage
V
i
77 channel,
7 dB tilted across the band
-
28.0 34.0 dBmV
Operating Case Temperature
T
C
-
30 +25 +85
C
ELECTRICAL CHARACTERISTICS (T
C
= 30
5
C, V
DD
= 24 V, Z
S
= Z
L
= 75
, unless otherwise
specified)
Parameter Symbol
Test
Conditions MIN.
TYP.
MAX.
Unit
Linear Gain 1
G
L1
f = 40 MHz
22.5
-
24.0 dB
Linear Gain 2
G
L2
f = 1 GHz
24.5
-
25.5 dB
Gain Slope
G
Slope
f = 40 MHz to 1 GHz
1.0
-
2.4 dB
Gain Flatness
G
Flatness
f = 40 MHz to 1 GHz, Peak to valley
-
-
0.6 dB
Noise Figure 1
NF
1
f = 50 MHz
-
-
6.0 dB
Noise Figure 2
NF
2
f = 1 GHz
-
-
6.5 dB
Operating Current
I
DD
RF
OFF
-
-
385 mA
Composite Triple Beat
CTB
77 channel,
-
-
-
63 dBc
Cross Modulation
XM
V
O
= 52 dBmV at 547.25 MHz,
-
-
-
60 dBc
Composite 2nd Order Beat
CSO
7 dB tilted across the band
-
-
-
65 dBc
Input Return Loss 1
RLi
1
f = 40 MHz
20
-
-
dB
Input Return Loss 2
RLi
2
f = 1 GHz
14
-
-
dB
Output Return Loss 1
RLo
1
f = 40 MHz
23
-
-
dB
Output Return Loss 2
RLo
2
f = 1 GHz
17
-
-
dB
Preliminary Product Information
3
MC-7894
PACKAGE DIMENSIONS
7-PIN SPECIAL WITH HEATSINK (UNIT: mm)
27.5 MAX.
38.10.25
45.08 MAX.
4.00.25
8.1 MAX.
3.2 MAX.
14.85 MAX.
0.510.05
12.9 MAX.
21.5 MAX.
4.190.13
6-32UNC2B
1 2 3
7 8 9
5
19.050.38
2.540.38
0.510.05
2.620.35
10.750.25
4.25
+0.25
0.35
0.05
0.38.. A
2.5
6.3
2.540.25
25.40.25
A
PIN CONNECTION
1
2
3
7
8
IN
9
OUT
GND
V
DD
5
Preliminary Product Information
4
MC-7894
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress
to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Partial Heating
Peak temperature (pin temperature) : 350
C or below
Note
Soldering time (per pin of device)
: 3 seconds or less
-
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
Preliminary Product Information
5
MC-7894
M8E 00. 4 - 0110
The information in this document is current as of June, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
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and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
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