Product Data Sheet - REV_02
April 2002
Product Data Sheet
MC2007-3
3.3 V PIN Pre-Amplifier with AGC for Applications to 200 Mbps
Data Sheet
Features
Description
Applications
Pin Descriptions
Measurement Tables
Functional Description
Features
Description
Applications
Pin Descriptions
Measurement Tables
Functional Description
Information provided in this Data Sheet is subject to change without notice.
MindspeedTM Technologies, Inc, Proprietary and Confidential
Product Data Sheet - REV_02
Page 2 of 13
MC2007-3
3.3V PIN Pre-Amplifier with AGC for Applications to 200 Mbps
Product Data Sheet
Information provided in this Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
T
ABLE
OF
C
ONTENTS
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Top Level Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 4 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 5 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Typical Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Eye Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
TZA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical Applications Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Applications Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Typical TO-can Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bare Die Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6 Pad Co-ordinates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
World Wide Sales Offices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Product Data Sheet - REV_02
Page 3 of 13
MC2007-3
3.3V PIN Pre-Amplifier with AGC for Applications to 200 Mbps
Product Data Sheet
Information provided in this Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
F
EATURES
Low-cost IC, fabricated in advanced sub-micron pure-
CMOS process
Receiver sensitivity typically -39 dBm at 155 Mbps, when
integrated into a module with suitable photodiode and
post-amplifier
140 MHz bandwidth allows wide range of operation;
suitable for e.g. 100, 125, 155, 200 Mbps
Typical differential gain of 62 k
at low signal levels
AGC gives continuous operation to +3 dBm
65 mW power consumption at +3.3 V supply
> 35 dB Power-supply noise rejection
Available as die
Also available in SOIC8 package for evaluation purposes
only
A
PPLICATIONS
SDH / SONET / ATM
Fast Ethernet
ESCON
C
ONNECTIONS
D
ESCRIPTION
The MC2007-3 is a low-noise, transimpedance amplifier
with AGC, manufactured in an advanced, yet low-cost,
sub-micron CMOS process. Its wide dynamic range,
differential output and high PIN bias make it well suited for
telecommunications, especially OC-3/STM-1. However,
the MC2007-3 is intended to meet the needs of both
Telecom and Datacom users.
The MC2007-3 is available in die form. For optimum
system performance die should be mounted in close
proximity with the photodetector.The MC2007-3 is also
available in SOIC8 package in sample quantities to ease
customer evaluation.
The MC2007-3 is designed to be used with the MC2045
postamplifier IC. When combined with a photodiode, the
chip set forms a high performance, low cost 3.3 V
receiver.
T
ABLE
1
O
RDERING
I
NFORMATION
T
OP
L
EVEL
D
IAGRAM
1
2
3
4
8
7
6
5
MC2007-3
Date Code
D
OUT
V
CC
V
CC
PIN K
PIN A
D
OUT
Gnd
Gnd
SO8 Package
S
am
pl
es
O
nl
y
Fig. 1
Part
Pin-package
MC2007-3DIE
Waffle pack
MC2007-3DIE
Expanded whole wafer on a ring
MC2007-3S8
SOIC8 (evaluation samples only)
MC2045-2P7EVM
Evaluation board with an
MC2045-2YT20 and an MC2007-3S8
V
CC
D
OUT
GND
PINK
PINA
GND
V
CC
D
OUT
Fig. 2
Product Data Sheet - REV_02
Page 4 of 13
MC2007-3
3.3V PIN Pre-Amplifier with AGC for Applications to 200 Mbps
Product Data Sheet
Information provided in this Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
T
ABLE
2
P
IN
D
ESCRIPTION
T
ABLE
3
A
BSOLUTE
M
AXIMUM
R
ATINGS
These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged.
Reliable operation at these extremes for any length of time is not implied.
T
ABLE
4
DC C
HARACTERISTICS
Die Pad No
Pin Number
Name
Function
1, 8
6, 7
GND
Ground pin. Connect to the most negative supply, Both pins should be used
2
8
D
OUT
Non-inverted data output. Differential output with D
OUT
3, 6
1, 4
V
CC
Power pin. Connect to most positive supply. Either or both pins may be used
4
2
PINK
PIN cathode connection. Connect photodiode between this pin and PINA
5
3
PINA
PIN anode connection. Connect photodiode between this pin and PINK
7
5
D
OUT
Inverted data output. Differential output with D
OUT
Symbol
Parameter
Rating
Units
V
CC
Power supply (V
CC
-GND)
4.5
V
T
A
Operating ambient (SOIC8)
-40 to +85
C
T
J
Junction temperature (die)
+150
C
T
STG
Storage temperature
-65 to +150
C
Symbol
Parameter
Min.
Typ.
Max.
Units
V
B
PIN bias voltage (PINK - PINA)
1.5
1.7
2.0
V
V
CM
Common mode output voltage
-
V
CC
/2
-
V
I
CC
Supply current
12
22
32
mA
V
A
PINA bias voltage wrt GND
0.9
1.04
1.1
V
Product Data Sheet - REV_02
Page 5 of 13
MC2007-3
3.3V PIN Pre-Amplifier with AGC for Applications to 200 Mbps
Product Data Sheet
Information provided in this Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
T
ABLE
5
AC C
HARACTERISTICS
NOTE:
(1)
Measured with input capacitance, C
IN
= 0.7 pF
(2)
Assuming photodiode respons of 0.9 A/W, extinction ratio of 10 dB and BER of 10
-10
(3)
The 2007 is designed to drive a load >500
. Measurements are taken into high Z.
(4)
Measured at 10 MHz.
(5)
Data input amplitude dependant Z
IN
is inversely proportional to input photocurrent and measured between 20 kHz
and 100 MHz.
Symbol
Parameter
Min.
Typ.
Max.
Units
R
OUT
Output impedance (single ended)
25
40
100
I
NOISE
Input noise current
(1), (2), (3)
1.0
1.5
2.6
pA/ Hz
-1
Pin(mean), Min.
Optical sensitivity
(1), (2)
-
-39
-
dBm
I
MAX
Input overload current
2.2
4.5
-
mApp
Pin(mean), Max.
Optical saturation
(2)
+1
+3
-
dBm
G
Small signal transimpedance
(3), (4)
Single ended :
Differential :
26
52
31
62
35
70
k
V
D
Differential output voltage
(3)
-
-
800
mV
BW
Bandwidth to -3 dB point (electrical)
110
140
150
MHz
T
r
T
f
Data out rise/fall times (20% - 80% points)
-
-
2
ns
T
PWD
Pulse width distortion
-
-
10
%
OS
PULSE
Pulse overshoot
-
-
10
%
T
AGC
AGC setting time
-
-
100
s
OS
AGC
AGC overshoot
-
-
12
%
PSRR
Power supply rejection ratio (<4 MHz)
35
-
-
dB
Z
IN
Input impedance
(5)
30
-
3k
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