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Электронный компонент: MC2009

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02009-DSH-001-C 6/03
M02009
Pin Pre-amplifier with AGC for 3.3V Fiber Optic Applications
to 622 Mbps
Data Sheet
Information provided in this Data Sheet is subject to change without notice.
Mindspeed TechnologiesTM, Inc, Proprietary and Confidential
02009-DSH-001-C 6/03
Page 2 of 10
M02009
Pin Pre-amplifier with AGC for 3.3V Fiber Optic Applications to 622 Mbps
Information provided in this Data Sheet is subject to change without notice.
Mindspeed TechnologiesTM, Proprietary and Confidential
T
ABLE
OF
C
ONTENTS
Features ...........................................................................................................................................................3
Applications ......................................................................................................................................................3
Connections ......................................................................................................................................................3
Description ........................................................................................................................................................3
Table 1 Ordering Information ............................................................................................................................3
Top Level Diagram ...........................................................................................................................................3
Table 2 Pad Description ...................................................................................................................................4
Table 3 Absolute Maximum Ratings..................................................................................................................4
Table 4 Recommended Operating Conditions .................................................................................................4
Table 5 DC Characteristics ...............................................................................................................................4
Table 6 AC Characteristics ...............................................................................................................................5
Functional Diagram ..........................................................................................................................................6
Functional Description ......................................................................................................................................6
TIA ....................................................................................................................................................................6
AGC ..................................................................................................................................................................6
Output Stage ....................................................................................................................................................7
Monitor Output...................................................................................................................................................7
Typical Performance..........................................................................................................................................7
Bare Die Information .........................................................................................................................................10
Bare Die Layout ................................................................................................................................................10
X Y Coordinates ...............................................................................................................................................10
Disclaimer .........................................................................................................................................................11
Contact Information ..........................................................................................................................................12
02009-DSH-001-C 6/03
Page 3 of 12
M02009
Pin Pre-amplifier with AGC for 3.3V Fiber Optic Applications to 622 Mbps
Information provided in this Data Sheet is subject to change without notice.
Mindspeed TechnologiesTM, Proprietary and Confidential
F
EATURES
Low cost IC fabricated in CMOS.
Receiver sensitivity better than -32 dBm @ 622
Mbps.
Minimum 340 MHz bandwidth and multi-pole roll off
allows a wide range of operation up to 622 Mbps.
Typical differential transimpedance at low signal
levels of 40 K
.
AGC gives continuous operation to +3 dBm
> 33 dB power-supply noise rejection.
Typical 130 mW power comsumption at 3.3V supply.
Monitor output gives linear indication of received
optical power.
Differential output.
A
PPLICATIONS
ATM/SDH/SONET
T
OP
L
EVEL
D
IAGRAM
D
ESCRIPTION
The MC2009 is a low-noise, transimpedance amplifier
with AGC, manufactured in low-cost CMOS. Its wide
dynamic range, differential output and high PIN bias make
it well suited for telecommunications, especially OC-12/
STM-4. However, the MC2009 is intended to meet the
needs of both Telecom and Datacom users.
The MC2009 is available in die form. For optimum system
performance die should be mounted in close proximity
with the photodetector.
The MC2009 is designed to be used with the Mindspeed
MC2044C Postamplifier IC. When combined with a
photodiode, the chip set forms a high performance, low
cost 3.3V receiver.
T
ABLE
1
O
RDERING
I
NFORMATION
Part
Pin Package
M2009DIE
Waffle Pack
M2009DIEW
Expanded whole wafer on a ring
Fig. 1
V
CC
V
CC
PIN
K
PIN
A
D
OUT
D
OUT
Gnd
Gnd
Gnd
Gnd
MON
AGC
02009-DSH-001-C 6/03
Page 4 of 12
M02009
Pin Pre-amplifier with AGC for 3.3V Fiber Optic Applications to 622 Mbps
Information provided in this Data Sheet is subject to change without notice.
Mindspeed TechnologiesTM, Proprietary and Confidential
T
ABLE
2
P
AD
D
ESCRIPTION
T
ABLE
3
A
BSOLUTE
M
AXIMUM
R
ATINGS
T
ABLE
4
R
ECOMMENDED
O
PERATING
C
ONDITIONS
T
ABLE
5
DC C
HARACTERISTICS
Name
Function
GND
Ground. Connect to the most negative supply. All pads should be connected
D
OUT
Non-Inverted Data Output. Differential output with D
OUT
V
CC
Power. Connect to most positive supply. Either or both pads may be used.
PINK
Photodiode Cathode connection. Connect photodiode between PINK and PINA. Connect de-coupling cap
between PINK and GND (470pF typ).
PINA
Photodiode Anode connection. Connect photodiode between PINA and PINK.
D
OUT
Inverted Data Output. Differential output with D
OUT
MON
Optical input power monitor. Current sink output, current flow into pin.
AGC
AGC disable/monitor (test mode enable)
Symbol
Parameter
Rating
Units
V
CC
Power supply (V
CC
-GND)
4.5
V
T
A
Operating ambient
-40 to +85
C
T
J
Junction temperature (die)
+150
C
T
STG
Storage temperature
-65 to +150
C
Symbol
Parameter
Rating
Units
V
CC
Power supply (V
CC
-GND)
3.3 10%
V
T
J
Junction temperature (die)
-40 to +100
C
T
A
Operating ambient temperature
-40 to +85
1
C
Symbol
Parameter
Min.
Typ.
Max.
Units
V
B
PIN Photodiode bias voltage (PINK - PINA)
1.5
1.6
1.8
V
V
CM
Common mode output voltage
(V
CC
/ 2) - 0.1V
V
CC
/ 2
(V
CC
/ 2) + 0.1V
V
I
CC
Supply current (no loads)
--
30
45
mA
Notes:
1) Die are tested and guaranteed at 25 C, and are designed and characterized to operate over the whole temperature range.
02009-DSH-001-C 6/03
Page 5 of 12
M02009
Pin Pre-amplifier with AGC for 3.3V Fiber Optic Applications to 622 Mbps
Information provided in this Data Sheet is subject to change without notice.
Mindspeed TechnologiesTM, Proprietary and Confidential
T
ABLE
6
AC C
HARACTERISTICS
Symbol
Parameter
Min.
Typ.
Max.
Units
R
OUT
Output impedance (single ended)
3
-
50
-
I
NOISE
Input referred Noise Current
1,2,8
< 4 pA
70
100
nA
RMS
PIN(mean), min
Optical Sensitivity
1,2,8
-31
-32
-33
dBm
I
max
Input Overload Current
3
mA
pp
PIN(mean), max
Optical Saturation
2,8
0
+3
dBm
G
Small signal Transimpedance
3, 4
Single ended
Diffferential
-
-
20
40
-
-
V
D
Differential output voltage
3
-
600
-
mV
BW
Bandwidth to -3dB point (optical)
5, 7,8
340
415
-
MHz
T
PWD
Pulse width distortion
8
-
-
6
%
OS
PULSE
Pulse overshoot
8
-
-
20
%
T
AGC
AGC Time constant
6
-
32
-
us
O
SAGC
AGC Overshoot
8
-
-
12
%
PSSR
Power Supply Rejection Ratio (<4 MHz)
8
33
-
-
dB
Jitter
Jitter
8
200
ps, p-p
LF cutoff
Lower frequency cutoff (-3 dB corner)
8
30
50
KHz
Notes:
1. Measured with input capacitance, C
IN
= 0.7 pF
2. Assuming photodiode responsivity of 0.9 A/W, extinction ratio of 10 dB and BER of 10
-10
BW=415 MHz
3. The 2009 is designed to drive a load >500
. Measurements are taken into >500
4. Measured at 1 MHz, 10 uA
5. Multi-pole roll off, measured at -30 dBm
6. AGC time constant can be increased by adding a capacitor from AGC pad to ground
7. Over Vcc = Vcc 5%, temperature -40 - +85 C
8. Guaranteed by design and characterization.
Hz