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Электронный компонент: 653SEA-2/3Mxx

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TZ7-01-239B(1/7)
June 13, 2002
Specification of 10Gb/s EML module
Module type:
FU-653SEA-2M series
(Dispersion 800ps/nm)
FU-653SEA-3M series
##
(Dispersion 1600ps/nm)
# #
Under development
APPROVED
APPROVED
APPROVED
T.Onodera
A
B
C
D
x
DATE
Approved
14.June `02
T.Nambara
TZ7-01-239B(2/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55
m EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
DESCRIPTION
Module type FU-653SEA-1Mx is a 1.55
m EA
modulator integrated DFB-LD module with single-
mode optical fiber.
This module is suitable to a light source for use in
10Gb/s digital optical communication systems.
FEATURES
l
Input impedance is 50
l
Integrated Electro-absorption Modulator
l
Distributed feed-back(DFB) Laser Diode
l
Emission wavelength is 1.55
m band
l
Single mode optical fiber pigtail
l
Built-in optical isolator
l
Built-in thermoelectric cooler
l
7-pin Butterfly package with GPO connector
l
For DWDM application
APPLICATION
STM-64, OC192 application
ABSOLUTE MAXIMUM RATINGS
Item
Symbol
Condition
Rating
Unit
Optical output power
Pf
CW
10
mW
Forward current
If
CW
200
mA
Laser diode
Reverse voltage
Vrl
CW
2
V
Reverse voltage
Vrm
-
5
V
Modulator
Forward voltage
Vfm
-
1
V
Reverse voltage
Vrd
-
20
V
Photodiode for
monitoring
Forward current
Ifd
-
2
mA
Current
Ipe
-
1.5
A
Thermoelectric
cooler(Note1)
Voltage
Vpe
-
3
V
Operating case temperature
Tc
-
-20
70
C
Storage temperature
Tstg
-
-40
85
C
Note1
Even if the thermoelectric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or
operation without heat sink may easily damage the module by exceeding the storage temperature range.
Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the
catastrophic damage.
TZ7-01-239B(3/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55
m EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
1.
ELECTRICAL/OPTICAL CHARACTERISTICS (Tc=25
C,chip temperature=Tld, unless otherwise noted)
Item
Symbol
Condition(Note2)
Min.
Typ.
Max.
Unit
Threshold current
Ith
CW,Vm=0V
5
-
30
mA
Operating current
Iop
CW,Vm=0V
50
70
100
mA
Operating voltage
Vop
CW, If=Iop, Vm=0V
-
-
1.7
V
Input impedance
Zin
If=Iop
-
50
-
Optical output power
from fiber end
Pf
(Note 3,4)
-2
-
-
dBm
Side mode
suppression ratio
Sr
(Note 3,4)
35
40
-
dB
Relative intensity
noise
RIN
CW, If=Iop, Vm=0V,10GHz
-
-
-135
dB/Hz
(Note 3,4,), 800ps/nm
-
-
2.0
dB
Power penalty
Pp
(Note 3,4,6), 1600ps/nm
-
-
2.0
dB
Extinction ratio
Ex
(Note 3,4)
10
-
-
dB
Rise/fall time
tr/tf
(Note 3,4),20-80%
-
-
45
ps
Cutoff frequency
fc
If=Iop,Vm=-1V
11
-
-
GHz
If=Iop,Vm=-1V, f
5GHz
10
15
-
dB
RF return loss
S11
If=Iop,Vm=-1V, f
10GHz
5
7
-
dB
Tracking error
Er
If=Iop,Tc=-20
70
C, Note 5
-
0.3
0.5
dB
Monitor current
Imon
If=Iop,Vrd=-5V
0.1
-
1.5
mA
Dark current(PD)
Id
Vrd=-5V
-
-
0.1
A
Capacitance(PD)
Ct
Vrd=-5V
-
10
-
pF
Tc=25
C
35
-
-
dB
Optical isolation
Iso
Tc=-20
70
C
23
-
-
dB
Laser diode
temperature
Tld
-
15
-
35
C
Note 2 : Vm is EAM bias voltage at CW condition, Vpp and Voff are EAM amplitude and EAM high level
offset voltage respectively at modulation condition.
Note 3 : 9.95328Gbps, NRZ, PRBS2^23-1, If=Iop,Vpp=2.5V,Voff=0V to 1V
Note 4 : Optical return loss of the connectors should be greater than 40dB in order to get specified performance.
Note 5 : Er=10
log[Pf(Tc)/Pf(25
C)]
Note 6 :
Under development
TZ7-01-239B(4/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55
m EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
THERMAL CHARACTERISTICS
Limits
Parameter
Symbol
Conditions (Note2)
Min.
Typ.
Max.
Unit
Thermistor resistance
Rth
Tc=Tld=25
C,
9.5
10
10.5
B constant of Rth
B
-
-
3950
-
K
Cooling capacity
T
Tld=25
C
45
-
-
C
Cooler current
Ipe
If=Iop, Tc=70
C,Tld=25
C
-
0.6
1.2
A
Cooler voltage
Vpe
If=Iop, Tc=70
C,Tld=25
C
-
1.2
2.5
V
FIBER PIGTAIL SPECIFICATIONS
Parameter
Specification
Unit
Type
SM
-
Mode field diameter
9.5
1
m
Cladding diameter
125
2
m
Secondary coating outer diameter
0.9
0.1
mm
Connector
See OUTLINE DIAGRAM
Optical return loss of connector
40(min)
dB
DOCUMENTATION
Threshold current (Ith)
Laser forward current (Iop)
Monitor current (Imon)
Central wavelength (
c)
Laser set temperature(Tld)
Extinction ratio
Offset voltage
TZ7-01-239B(5/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55
m EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
Wavelength table
Extension
Extension
Dispersion
800ps/nm
Dispersion
1600ps/nm
Wavelength(nm)
Dispersion
800ps/nm
Dispersion
1600ps/nm
Wavelength(nm)
-2M11
-3M11
1530.33
-2M53
-3M53
1546.92
-2M12
-3M12
1530.72
-2M54
-3M54
1547.32
-2M13
-3M13
1531.12
-2M55
-3M55
1547.72
-2M14
-3M14
1531.51
-2M56
-3M56
1548.11
-2M15
-3M15
1531.90
-2M57
-3M57
1548.51
-2M16
-3M16
1532.29
-2M58
-3M58
1548.91
-2M17
-3M17
1532.68
-2M59
-3M59
1549.32
-2M18
-3M18
1533.07
-2M60
-3M60
1549.72
-2M19
-3M19
1533.47
-2M61
-3M61
1550.12
-2M20
-3M20
1533.86
-2M62
-3M62
1550.52
-2M21
-3M21
1534.25
-2M63
-3M63
1550.92
-2M22
-3M22
1534.64
-2M64
-3M64
1551.32
-2M23
-3M23
1535.04
-2M65
-3M65
1551.72
-2M24
-3M24
1535.43
-2M66
-3M66
1552.12
-2M25
-3M25
1535.82
-2M67
-3M67
1552.52
-2M26
-3M26
1536.22
-2M68
-3M68
1552.93
-2M27
-3M27
1536.61
-2M69
-3M69
1553.33
-2M28
-3M28
1537.00
-2M70
-3M70
1553.73
-2M29
-3M29
1537.40
-2M71
-3M71
1554.13
-2M30
-3M30
1537.79
-2M72
-3M72
1554.54
-2M31
-3M31
1538.19
-2M73
-3M73
1554.94
-2M32
-3M32
1538.58
-2M74
-3M74
1555.34
-2M33
-3M33
1538.98
-2M75
-3M75
1555.75
-2M34
-3M34
1539.37
-2M76
-3M76
1556.15
-2M35
-3M35
1539.77
-2M77
-3M77
1556.55
-2M36
-3M36
1540.16
-2M78
-3M78
1556.96
-2M37
-3M37
1540.56
-2M79
-3M79
1557.36
-2M38
-3M38
1540.95
-2M80
-3M80
1557.77
-2M39
-3M39
1541.35
-2M81
-3M81
1558.17
-2M40
-3M40
1541.75
-2M82
-3M82
1558.58
-2M41
-3M41
1542.14
-2M83
-3M83
1558.98
-2M42
-3M42
1542.54
-2M84
-3M84
1559.39
-2M43
-3M43
1542.94
-2M85
-3M85
1559.79
-2M44
-3M44
1543.33
-2M86
-3M86
1560.20
-2M45
-3M45
1543.73
-2M87
-3M87
1560.61
-2M46
-3M46
1544.13
-2M88
-3M88
1561.01
-2M47
-3M47
1544.53
-2M89
-3M89
1561.42
-2M48
-3M48
1544.92
-2M90
-3M90
1561.83
-2M49
-3M49
1545.32
-2M91
-3M91
1562.23
-2M50
-3M50
1545.72
-2M92
-3M92
1562.64
-2M51
-3M51
1546.12
-2M93
-3M93
1563.05
-2M52
-3M52
1546.52
-
-
-
All wavelengths are referred to vacuum.
Extension -3Mseries(dispersion =1600ps/nm) is under development.
TZ7-01-239B(6/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55
m EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
.
OUTLINE DIAGRAM
FU-653SEA-2Mxx/3Mxx
Connector type
Identical type number Dispersion
FU-653SEA-2Mxx
800ps/nm
No connector
FU-653SEA-3Mxx
1600ps/nm
FU-653SEA-W2Mxx
800ps/nm
SC/PC
FU-653SEA-W3Mxx
1600ps/nm
FU-653SEA-V2Mxx
800ps/nm
FC/PC
FU-653SEA-V3Mxx
1600ps/nm
Pin No. Pin No.
1 Thermistor
2 Thermistor
3 LD bias (Anode)
4 Monitor PD (Anode)
5 Monitor PD (Cathode)
6 Cooler (Anode)
7 Cooler (Cathode)
GPO connector
EAM/LD
Thermo
cooler
PD
Thermistor
Pin1
Pin7
Unit : mm
TZ7-01-239B(7/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55
m EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
For additionally informations please contact:
Internet:
www.mitsubishichips.com
Japan:
Overseas Marketing Division, Semicondoctor Group, Mitsubishi Electric Corporation, 2-2-3, Marunouchi,
Chiyoda-Ku, Tokyo 100-8310, Japan,
Americas: Tel:+81 (03) 3218-3472, FAX: +81(03) 3218-2724
Europe: Tel:+81 (03) 3218-2863, FAX: +81(03) 3218-2894
Asia, Pacific: Tel:+81 (03) 3218-3199, FAX: +81(03) 3218-2723
China: Tel:+81 (03) 3218-2796, FAX: +81(03) 3218-2722
Europe:
Mitsubishi Electric Europe B.V., German Branch, Gothaer Str.8, D-40880 Ratingen, Germany,
Tel:+49 2102-486-0, FAX:+049 2102-486-367
U.S.A.:
Mitsubishi Electric and Electronics USA, Inc, Electronic Device Group, 1050 East Arques Avenue, Sunnyvale,
CA 94086 , Tel:+41 (408) 730-5900, FAX:+41 (408) 732-9382
China:
Ke Ling Electric (Shanghai) Co.,Ltd, Room 1601/1602, OOCL Plaza No.841 Yan An Road(M), Jin An
District,
Shanghai 2000 40, China, Tel: +86 21-6289-4430, FAX:+86-21-6289-4440
HongKong: Mitsubishi Electric (H.K.) Co. Ltd Semiconductor Division, 41
st
Floor, Manulife Tower, 169 Electric
Road,
North Point, Hong Kong, Tel: +852-2510-0555, FAX:+852-2510-9822
Taiwan: Mitsubishi Electric Taiwan Co., Ltd. Semiconductor Department, 9
th
Floor, 88 Sec.6,
Chung shan North Road, Taipei, Taiwan, Tel:+ 886-2-2836-5288, FAX:+ 886-2-2833-9793
Singapore:
Mitsubishi Electric Asia Pte. Ltd. Semiconductor Division, 307 Alexandra Road #05-01/02,
Mitsubishi Electric Building, Singapore 159943, Tel:+65 4732308, FAX: +65 4738944
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without
notice. No liability is assumed as a result of their use or application.