MOSEL VITELIC
1
V436616Y24V
3.3 VOLT 16M x 64 HIGH PERFORMANCE
SDRAM UNBUFFERED SODIMM
PRELIMINARY
V436616Y24V Rev. 1.0 January 2002
Features
s
JEDEC-standard 144 pin, Small-Outline, Dual in
line Memory Module (SODIMM)
s
Serial Presence Detect with E
2
PROM
s
Nonbuffered
s
Fully Synchronous, All Signals Registered on
Positive Edge of System Clock
s
Single +3.3V ( 0.3V) Power Supply
s
All Device Pins are LVTTL Compatible
s
8192 Refresh Cycles every 64 ms
s
Self-Refresh Mode
s
Internal Pipelined Operation; Column Address
can be changed every System Clock
s
Auto Precharge and Piecharge all Banks by A10
s
Data Mask Function by DQM
s
Mode Register Set Programming
s
Programmable (CAS Latency:2, 3 Clocks)
Description
The V436616Y24V memory module is organized
16,777,216 x 64 bits in a 144 pin SODIMM. The
16M x 64 memory module uses 4 Mosel-Vitelic 16M
x 16 SDRAM. The x64 modules are ideal for use in
high
performance
computer
systems
where
increased memory density and fast access times
are required.
Part Number
Speed
Grade
Configuration
V436616Y24VXXG-75PC
133MHz CL2,3
16M x 64
V436616Y24VXXG-75
133MHz CL3
16M x 64
V436616Y24VXXG-10PC
100MHz CL2,3
16M x 64
1
Pin 2 on Backside
Pin 144 on Backside
59
61
143
4M x 16
4M x 16
2
V436616Y24V Rev. 1.0 January 2002
MOSEL VITELIC
V436616Y24V
Pin Configurations (Front Side/Back Side)
Note:
1. RAS, CAS, WE CASx, CSx are active low signals.
Pin
Front
Pin
Front
Pin
Front
Pin
Back
Pin
Back
Pin
Back
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
VSS
VSS
DQ0
DQ32
DQ1
DQ33
DQ2
DQ34
DQ3
DQ35
VDD
VDD
DQ4
DQ36
DQ5
DQ37
DQ6
DQ38
DQ7
DQ39
VSS
VSS
DQMB0
DQMB4
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
DQMB1
DQMB5
VDD
VDD
A0
A3
A1
A4
A2
A5
VSS
VSS
DQ8
DQ40
DQ9
DQ41
DQ10
DQ42
DQ11
DQ43
VDD
VDD
DQ12
DQ44
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
DQ13
DQ45
DQ14
DQ46
DQ15
DQ47
VSS
VSS
NC
NC
NC
NC
CLK0
CKE0
VDD
VDD
RAS
CAS
WE
CKE1
CS0
NC
CS1
A12
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
NC
CLK1
VSS
VSS
NC
NC
NC
NC
VDD
VDD
DQ16
DQ48
DQ17
DQ49
DQ18
DQ50
DQ19
DQ51
VSS
VSS
DQ20
DQ52
DQ21
DQ53
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
DQ22
DQ54
DQ23
DQ55
VDD
VDD
A6
A7
A8
BA0
VSS
VSS
A9
BA1
A10
A11
VDD
VDD
DQMB2
DQMB6
DQMB3
DQMB7
VSS
VSS
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
DQ24
DQ56
DQ25
DQ57
DQ26
DQ58
DQ27
DQ59
VDD
VDD
DQ28
DQ60
DQ29
DQ61
DQ30
DQ62
DQ31
DQ63
VSS
VSS
SDA
SCL
VDD
VDD
Pin Names
A0A12, BA0, BA1
Address, Bank Select
DQ0DQ63
Data Inputs/Outputs
RAS
Row Address Strobes
CAS
Column Address Strobes
WE
Write Enable
CS0, CS1
Chip Select
DQMB0DQMB7
Output Enable
CKE0, CKE1
Clock Enable
CLK0, CLK1
Clock
SDA
Serial Input/Output
SCL
Serial Clock
VDD
Power Supply
VSS
Ground
NC
No Connect (Open)
MOSEL VITELIC
V436616Y24V
3
V436616Y24V Rev. 1.0 January 2002
Part Number Information
Block Diagram
V
4
3
66
16
Y
2
4
V
X
T
G - XX
SDRAM
3.3V
WIDTH
DEPTH
168 PIN Unbuffered
DIMM X16 COMPONENT
REFRESH
RATE 8K
4 BANKS
LVTTL
COMPONENT A=0.17u B=0.14u
REV LEVEL
COMPONENT
PACKAGE, T = TSOP
LEAD FINISH
G = GOLD
SPEED
75PC = 133MHz CL3,2
MOSEL VITELIC
MANUFACTURED
75
= 133MHz CL3
10PC = 100MHz CL3,2
WE
CSO
U0U7
A0A12, BA0, BA1
VDD
U0U3
CKE0
U4U7
CKEI
U0-U3
RAS
U0-U3
CAS
U0U7
U0, U1
CLK0
VSS
U2, U3
10
SCL
SDA
10
SPD
A0
A1
A2
DQMB4
DQMB5
DQ3239
DQ4047
UDQM
U2
LDQM
DQMB0
DQMB1
DQ07
DQ815
UDQM
U0
LDQM
DQMB6
DQMB7
DQ4354
DQ5563
UDQM
U3
LDQM
DQMB2
DQMB3
DQ1623
DQ2431
UDQM
U1
LDQM
CS
WE
CS
WE
CS
WE
CS
WE
C1C4
4
V436616Y24V Rev. 1.0 January 2002
MOSEL VITELIC
V436616Y24V
Serial Presence Detect Information
A serial presence detect storage device -
E
2
PROM - is assembled onto the module. Informa-
tion about the module configuration, speed, etc. is
written into the E
2
PROM device during module pro-
duction using a serial presence detect protocol (I
2
C
synchronous 2-wire bus)
SPD-Table for modules:
Byte Num-
ber
Function Described
SPD Entry Value
Hex Value
-75PC
-75
-10PC
0
Number of SPD bytes
128
80
80
80
1
Total bytes in Serial PD
256
08
08
08
2
Memory Type
SDRAM
04
04
04
3
Number of Row Addresses (without BS bits)
13
0D
0D
0D
4
Number of Column Addresses (for x16
SDRAM)
9
09
09
09
5
Number of DIMM Banks
1
01
01
01
6
Module Data Width
64
40
40
40
7
Module Data Width (continued)
0
00
00
00
8
Module Interface Levels
LVTTL
01
01
01
9
SDRAM Cycle Time at CL=3
7.5 ns/10.0 ns
75
75
A0
10
SDRAM Access Time from Clock at CL=3
5.4 ns/6.0 ns
54
54
60
11
Dimm Config (Error Det/Corr.)
none
00
00
00
12
Refresh Rate/Type
Self-Refresh,7.8
s
82
82
82
13
SDRAM width, Primary
x16
10
10
10
14
Error Checking SDRAM Data Width
n/a / x16
00
00
00
15
Minimum Clock Delay from Back to Back Ran-
dom Column Address
t
ccd
= 1 CLK
01
01
01
16
Burst Length Supported
1, 2, 4, 8
0F
0F
0F
17
Number of SDRAM Banks
4
04
04
04
18
Supported CAS Latencies
CL =2, 3
06
06
06
19
CS Latencies
CS Latency = 0
01
01
01
20
WE Latencies
WL = 0
01
01
01
21
SDRAM DIMM Module Attributes
Non Buffered/Non Reg.
00
00
00
22
SDRAM Device Attributes: General
Vcc tol 10%
0E
0E
0E
23
Minimum Clock Cycle Time at CAS Latency =
2
7. 5 ns/10.0 ns
75
A0
A0
24
Maximum Data Access Time from Clock for
CL = 2
5.4 ns/6.0 ns
54
60
60
25
Minimum Clock Cycle Time at CL = 1
Not Supported
00
00
00
26
Maximum Data Access Time from Clock at CL
= 1
Not Supported
00
00
00
27
Minimum Row Precharge Time
15 ns/20 ns
0F
14
14
MOSEL VITELIC
V436616Y24V
5
V436616Y24V Rev. 1.0 January 2002
DC Characteristics
T
A
= 0
C to 70
C; V
SS
= 0 V; V
DD
, V
DDQ
= 3.3V
0.3V
28
Minimum Row Active to Row Active Delay
t
RRD
14 ns/15 ns/16 ns
0E
0F
10
29
Minimum RAS to CAS Delay t
RCD
15 ns/20 ns
0F
14
14
30
Minimum RAS Pulse Width t
RAS
42 ns/45 ns
2A
2D
30
31
Module Bank Density (Per Bank)
128 Mbyte
20
20
20
32
SDRAM Input Setup Time
1.5 ns
15
15
20
33
SDRAM Input Hold Time
0.8 ns
08
08
10
34
SDRAM Data Input Setup Time
1.5 ns
15
15
20
35
SDRAM Data Input Hold Time
0.8 ns
08
08
10
36-61
Superset Information (May be used in Future)
00
00
00
62
SPD Revision
Revision 2
02
02
12
63
Checksum for Bytes 0 - 62
E4
29
9A
64
Manufacturer's JEDEC ID Code
Mosel Vitelic
40
40
40
65-71
Manufacturer's JEDEC ID Code (cont.)
00
00
00
72
Manufacturing Location
1 = US, 2 = Taiwan
73-90
Module Part Number (ASCII)
V436616Y24V
91-92
PCB Identification Code
Current PCB Revision
93
Assembly Manufacturing Date (Year)
Binary Coded year (BCD)
94
Assembly Manufacturing Date (Week)
Binary Coded week (BCD)
95-98
Assembly Serial Number
byte 95 = LSB, byte 98 =
MSB
99-125
Reserved
00
00
00
126
Intel Specification for Frequency
64
64
64
127
Supported frequency
128+
Unused Storage Location
00
00
00
Symbol
Parameter
Limit Values
Unit
Min.
Max.
V
IH
Input High Voltage
2.0
V
CC
+0.3
V
V
IL
Input Low Voltage
0.5
0.8
V
V
OH
Output High Voltage (I
OUT
= 4.0 mA)
2.4
--
V
V
OL
Output Low Voltage (I
OUT
= 4.0 mA)
--
0.4
V
SPD-Table for modules: (Continued)
Byte Num-
ber
Function Described
SPD Entry Value
Hex Value
-75PC
-75
-10PC
6
V436616Y24V Rev. 1.0 January 2002
MOSEL VITELIC
V436616Y24V
Capacitance
T
A
= 0
C to 70
C; V
DD
= 3.3V
0.3V, f = 1 MHz
Absolute Maximum Ratings
Standby and Refresh Currents
1
T
A
= 0
C to 70
C, V
CC
= 3.3V
0.3V
I
I(L)
Input Leakage Current, any input
(0 V < V
IN
< 3.6 V, all other inputs = 0V)
40
40
A
I
O(L)
Output leakage current
(DQ is disabled, 0V < V
OUT
< V
CC
)
40
40
A
Symbol
Parameter
Limit Values (Max.)
Unit
C
I1
Input Capacitance (A0 to A11, RAS, CAS, WE)
65
pF
C
I2
Input Capacitance (CS0, CSI)
32
pF
C
ICL
Input Capacitance (CLK0-CLK1)
38
pF
C
I3
Input Capacitance (CKE0, CKEI)
65
pF
C
I4
Input Capacitance (DQMB0-DQMB7)
13
pF
C
SC
Input Capacitance (SCL, SA0-2)
8
pF
C
IO
Input/Output Capacitance
10
pF
Parameter
Max.
Units
Voltage on VDD Supply Relative to V
SS
-1 to 4.6
V
Voltage on Input Relative to V
SS
-1 to 4.6
V
Operating Temperature
0 to +70
C
Storage Temperature
-55 to 125
C
Power Dissipation
4
W
Symbol Parameter
Test Conditions
-75PC/75
-10PC
Unit
Note
I
CC
1
Operating Current
Burst length = 4, CL = 3
t
RC
> = t
RC
(min),
t
CK
> = t
CK
(min), IO = 0 mA
2 Bank Interleave Operation
920
840
mA
1,2
I
CC
2P
Precharged Standby Current in Power
Down Mode
CKE< = V
IL
(max), t
CK
> = t
CK
(min)
8
8
mA
I
CC
2N
Precharged Standby Current in
Non-Power Down Mode
CKE> = V
IH
(min), t
CK
> = t
CK
(min), Input
changed once in 3 cycles
160
140
mA
CS = High
I
CC
3P
Active Standby Current in Power
Down Mode
CKE< = V
IL
(max), t
CK
> = t
CK
(min)
40
40
mA
Symbol
Parameter
Limit Values
Unit
Min.
Max.
MOSEL VITELIC
V436616Y24V
7
V436616Y24V Rev. 1.0 January 2002
I
CC
3N
Active Standby Current in Non-Power
Down Mode
CKE> = V
IH
(min), t
CK
> = t
CK
(min), Input
changed one time
200
180
mA
CS = High
I
CC
4
Burst Operating Current
t
RC
= Infinite, CL = 3,
t
CK
> = t
CK
(min), IO = 0 mA
2 Banks Activated
600
480
mA
1, 2
I
CC
5
Auto Refresh Current
t
RC
>= t
RC
(min)
960
880
mA
1,2
I
CC
6
Self Refresh Current
CKE = <0.2 V
Standard
12
12
mA
1,2
L-Version
6.8
6.8
AC Characteristics
T
A
= 0 to 70
C; V
SS
= 0V; V
CC
= 3.3V
0.3V, t
T
= 1 ns
#
Symbol
Parameter
Limit Values
Unit
Note
-75PC
-75
-10PC
Min.
Max.
Min.
Max.
Min.
Max.
Clock and Clock Enable
1
t
CK
Clock Cycle Time
CAS Latency = 3
CAS Latency = 2
7.5
7.5
7.5
10
10
10
ns
ns
2
t
CK
Clock Frequency
CAS Latency = 3
CAS Latency = 2
133
133
133
100
100
100
MHz
MHz
3
t
AC
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
_
5.4
5.4
_
5.4
6
_
6
6
ns
ns
2, 4
4
t
CH
Clock High Pulse Width
2.5
2.5
3
ns
5
t
CL
Clock Low Pulse Width
2.5
2.5
3
ns
6
t
T
Transition Tim
1
1
1
ns
Setup and Hold Times
7
t
IS
Input Setup Time
1.5
1.5
2
ns
5
8
t
IH
Input Hold Time
0.8
0.8
1
ns
5
9
t
CKS
Input Setup Time
1.5
1.5
2
ns
5
10
t
CKH
CKE Hold Time
0.8
0.8
1
ns
5
11
t
RSC
Mode Register Set-up Time
15
15
15
ns
12
t
SB
Power Down Mode Entry Time
0
7.5
0
7.5
0
10
ns
Common Parameters
13
t
RCD
Row to Column Delay Time
15
20
20
ns
6
Symbol Parameter
Test Conditions
-75PC/75
-10PC
Unit
Note
8
V436616Y24V Rev. 1.0 January 2002
MOSEL VITELIC
V436616Y24V
Notes:
1.The specified values are valid when addresses are changed no more than once during t
CK
(min.) and when No
Operation commands are registered on every rising clock edge during t
RC
(min). Values are shown per module
bank.
2.
The specified values are valid when data inputs (DQ's) are stable during t
RC
(min.).
3.
All AC characteristics are shown for device level.
An initial pause of 100
s is required after power-up, then a Precharge All Banks command must be given followed
by 8 Auto Refresh (CBR) cycles before the Mode Register Set Operation can begin.
4.
AC timing tests have V
IL
= 0.4V and V
IH
= 2.4V with the timing referenced to the 1.4V crossover point. The transition
time is measured between V
IH
and V
IL
. All AC measurements assume t
T
= 1 ns with the AC output load circuit
shown. Specific tac and toh parameters are measured with a 50 pF only, without any resistive termination and a
14
t
RP
Row Precharge Time
15
20
20
ns
6
15
t
RAS
Row Active Time
42
100K
45
100K
45
100K
ns
6
16
t
RC
Row Cycle Time
60
60
70
ns
6
17
t
RRD
Activate(a) to Activate(b) Command Pe-
riod
14
15
20
ns
6
18
t
CCD
CAS(a) to CAS(b) Command Period
1
1
1
CLK
Refresh Cycle
19
t
REF
Refresh Period (8192 cycles)
64
--
64
--
64
--
ms
20
t
SREX
Self Refresh Exit Time
10
--
10
--
10
--
ns
Read Cycle
21
t
OH
Data Out Hold Time
3
3
3
ns
2
22
t
LZ
Data Out to Low Impedance Time
1
1
1
ns
23
t
HZ
Data Out to High Impedance Time
3
7.5
3
7.5
3
10
ns
7
24
t
DQZ
DQM Data Out Disable Latency
2
2
2
CLK
Write Cycle
25
t
WR
Write Recovery Time
2
2
2
CLK
26
t
DQW
DQM Write Mask Latency
0
0
0
CLK
AC Characteristics
T
A
= 0 to 70
C; V
SS
= 0V; V
CC
= 3.3V
0.3V, t
T
= 1 ns (Continued)
#
Symbol
Parameter
Limit Values
Unit
Note
-75PC
-75
-10PC
Min.
Max.
Min.
Max.
Min.
Max.
input signal of 1V / ns edge rate between 0.8V and 2.0V.
MOSEL VITELIC
V436616Y24V
9
V436616Y24V Rev. 1.0 January 2002
.
5.
If clock rising time is longer than 1 ns, a time (t
T
/2 -0.5) ns has to be added to this parameter.
6.
Rated at 1.5V
7.
If t
T
is longer than 1 ns, a time (t
T
-1) ns has to be added to this parameter.
8.
Any time that the refresh Period has been exceeded, a minimum of two Auto (CBR) Refresh commands must be
given to "wake-up" the device.
9.
Self Refresh Exit is a synchronous operation and begins on the 2nd positive clock edge after CKE returns high.
Self Refresh Exit is not complete until a time period equal to t
RC
is satisfied once the Self Refresh Exit command
is registered.
10.
Referenced to the time which the output achieves the open circuit condition, not to output voltage levels.
11.
t
DAL
is equivalent to t
DPL
+ t
RP
.
1.4V
1.4V
tSETUP
tHOLD
tAC
tAC
tLZ
tOH
tHZ
CLOCK
INPUT
OUTPUT
50 pF
I/O
Z=50 Ohm
+ 1.4 V
50 Ohm
2.4V
0.4V
t
T
tCL
tCH
I/O
Measurement conditions for
tac and toh
50 pF
10
V436616Y24V Rev. 1.0 January 2002
MOSEL VITELIC
V436616Y24V
Package Diagram
144 Pin SODIMM
V43644YO4V(C)TG-10PC-04
2.661
1.00
0.039
0.140
0.787
1
Pin 2 on Backside
3.3V
Pin 144 on Backside
28
29
143
NOTE:
1. All dimensions in inches.
Tolerances
0.005 unless otherwise specified.
MOSEL VITELIC
V436616Y24V
11
V436616Y24V Rev. 1.0 January 2002
Module Label Information
C
L
= 3 or 2 (CLK)
t
RCD
= 3 or 2 (CLK)
t
RP
= 3 or 2 (CLK)
-XXX
U
UNBUFFERED DIMM
PC133
54
JEDEC SPD Revision 2
2
V436616Y24XXX-XX 128MB CLX
PC133U-XXX-542-A
XXXX-XXXXXXX
Assembly in Taiwan
A
Gerber file Intel PC100 x16 Based
MOSEL VITELIC
Part Number
Module Density
DIMM manufacture date code
Criteria of PC100 or PC133
(refer to MVI datasheet)
t
AC
= 5.4 ns
CAS Latency
2=CL2
3=CL3
12
V436616Y24V Rev. 1.0 January 2002
MOSEL VITELIC
V436616Y24V
WORLDWIDE OFFICES
Copyright , MOSEL VITELIC Corp.
Printed in U.S.A.
The information in this document is subject to change without
notice.
MOSEL VITELIC makes no commitment to update or keep cur-
rent the information contained in this document. No part of this
document may be copied or reproduced in any form or by any
means without the prior written consent of MOSEL-VITELIC.
MOSEL VITELIC subjects its products to normal quality control
sampling techniques which are intended to provide an assurance
of high quality products suitable for usual commercial applica-
tions. MOSEL VITELIC does not do testing appropriate to provide
100% product quality assurance and does not assume any liabil-
ity for consequential or incidental arising from any use of its prod-
ucts. If such products are to be used in applications in which
personal injury might occur from failure, purchaser must do its
own quality assurance testing appropriate to such applications.
U.S. SALES OFFICES
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PHONE: 408-433-6000
FAX: 408-433-0952
TAIWAN
7F, NO. 102
MIN-CHUAN E. ROAD, SEC. 3
TAIPEI
PHONE: 886-2-2545-1213
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PHONE: 886-3-579-5888
FAX: 886-3-566-5888
SINGAPORE
10 ANSON ROAD #23-13
INTERNATIONAL PLAZA
SINGAPORE 079903
PHONE: 65-3231801
FAX: 65-3237013
JAPAN
ONZE 1852 BUILDING 6F
2-14-6 SHINTOMI, CHUO-KU
TOKYO 104-0041
PHONE: 03-3537-1400
FAX: 03-3537-1402
UK & IRELAND
SUITE 50, GROVEWOOD
BUSINESS CENTRE
STRATHCLYDE BUSINESS
PARK
BELLSHILL, LANARKSHIRE,
SCOTLAND, ML4 3NQ
PHONE: 44-1698-748515
FAX: 44-1698-748516
GERMANY
(CONTINENTAL
EUROPE & ISRAEL)
BENZSTRASSE 32
71083 HERRENBERG
GERMANY
PHONE: +49 7032 2796-0
FAX: +49 7032 2796 22
WEST
3910 NORTH FIRST STREET
SAN JOSE, CA 95134
PHONE: 408-433-6000
FAX: 408-433-0952
CENTRAL / EAST
604 FIELDWOOD CIRCLE
RICHARDSON, TX 75081
PHONE: 214-352-3775
FAX: 214-904-9029
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