93
LOW PROFILE HIGH
FREQUENCY RELAY
RP-RELAYS
1
Ex. RP
H
Contact arrangement
1:1 Form C
Note: Standard packing; Carton: 50 pcs. Case 1,000 pcs.
Nil: Standard PC board terminal
H: Self-clinching terminal
1.5, 3, 4.5, 5, 6, 9, 12, 24 V
Terminal shape
Coil voltage (DC)
3V
Arrangement
Contact material
Movable
Stationary
Nominal switch-
ing capacity
Isolation
Insertion loss
V.S.W.R.
Mechanical
(at 180 cpm)
Electrical
(at 20 cpm)
Initial contact resistance, max.
(By voltage drop 6 V DC 0.1 A)
Rating
High frequency
characteristics
(Impedance 50
)
Expected life
(min. opera-
tions)
Contact
Coil (at 25
C,
68
F
)
Voltage type
1.5 to 12 V DC
24 V DC
Nominal operating power
140 mW
270 mW
1 Form C
Silver alloy
Gold-clad silver
50 m
0.1 A 30 V DC
Contact switching power: 1 W
(Max. 1.8 GHz); Contact carrying
power: 3 W (Max. 1.2 GHz)
1 W (Max. 1.8 GHz)
Min. 15 dB (at 1 GHz)
Min. 10 dB (at 1.8 GHz)
Max. 0.5 dB (at 1 GHz)
Max. 1 dB (at 1.8 GHz)
Max. 1.2 (at 1 GHz)
Max. 1.3 (at 1.8 GHz)
5
10
6
10
5
(0.1 A 30 V DC)
10
5
(1 W at 1.8 GHz;
V.S.W.R.: max. 1.3)
Max. operating speed (at rated load)
Initial breakdown
voltage*
2
Initial insulation resistance*
1
Operate time*
3
(at nominal voltage)
Release time(without diode)*
3
(at nominal voltage)
Temperature rise
Shock resistance
Vibration
resistance
Unit weight
Remarks
* Specifications will vary with foreign standards certification ratings.
*
1
Measurement at same location as "Initial breakdown voltage" section
*
2
Detection current: 10mA
*
3
Excluding contact bounce time
*
4
Half-wave pulse of sine wave: 11ms, detection time: 10
s
*
5
Half-wave pulse of sine wave: 6ms
*
6
Detection time: 10
s
Approx. 1 g
.04 oz
Characteristics
20 cpm
Min. 1,000 M
at 500 V DC
750 Vrms for 1 min.
1,500 Vrms for 1 min.
Between open contacts
Between contacts and coil
Max. 3 ms
(Approx. 1.5 ms)
Max. 2 ms
(Approx. 1 ms)
Max. 50
Cwith nominal coil
voltage across coil and at
nominal switching capacity
Min. 500 m/s
2
{50 G}
Min. 1,000 m/s
2
{100 G}
Functional*
4
Destructive*
5
Functional*
6
Destructive
10 to 55 Hz
at double amplitude of 3 mm
10 to 55 Hz
at double amplitude of 5 mm
Conditions for operation,
transport and storage
(Not freezing and condensing
at low temperature)
Ambient temp.
Humidity
40
C to 70
C
40
F to 158
F
5 to 85% R.H.
9
.748
4
.157
10.6
.417
TYPICAL APPLICATIONS
Antenna switching of mobile phone
Switching signal of measuring equipment
ORDERING INFORMATION
High frequency relay with the low profile of 4 mm
.157 inch
Excellent high frequency characteristics
Isolation: Min. 10dB (at 1.8 GHz)
Insertion loss: Max. 1.0dB (at 1.8 GHz)
V.S.W.R.: Max. 1.3 (at 1.8 GHz)
High sensitivity in small size
Size: 10.6
9
4 mm
.417
.354
.157 inch
Nominal operating power: 140 mW
SPECIFICATIONS
mm
inch
94
RP
5.08
.200
7.62
.300
6-1 dia.
6-.039 dia.
2.54
.100
10.6
.417
7.62
.300
9
.354
3.75
.148
4
.157
2.54
.100
0.5
.020
0.25
.010
2.54
.100
3.5
.138
(0.25)
(.010)
10.6
.417
7.62
.300
9
.354
3.75
.148
4
.157
2.54
.100
0.5
.020
0.25
.010
2.54
.100
3.5
.138
(0.25)
(.010)
Deenergized condition
General tolerance:
0.3
.012
Self-clinching terminal
Schematic (Bottom view)
Standard PC board terminal
PC board pattern (Copper-side view)
mm
inch
Tolerance:
0.1
.004
Direction indication
1 2 3
6 5 4
+
61.60 dia
.063 dia
61.00 dia
.039 dia
62.30 dia
.090 dia
260.80 dia
.031 dia
18.92
.745
0.60
.024
1.94
.076
4.22
.166
5.08
.200
7.62
.300
18.00
.709
9.82
.387
Soldering
SMA connector
PC board
Double-sided through hole
Material: Glass-epoxy resin
t= 1.0mm
.039 inch
Copper plated thickness: 35
m
mm
inch
10
20
40
50
60
80
100
0.8
0
0.4
1.0
30
70
90
0
1.8
1.6
1.4
1.2
0.6
0.2
2.0
Frequency, GHz
Isolation, dB
1
2
3
4
5
0.8
0
0.4
1.0
0
1.8
1.6
1.4
1.2
0.6
0.2
2.0
Frequency, GHz
Insertion loss, dB
N.O. (Terminal Nos. 5-6)
N.C. (Terminal Nos. 4-5)
Frequency, GHz
Return loss, dB
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
N.C. (Terminal Nos. 4-5)
N.O. (Terminal Nos. 5-6)
0
10
20
30
40
50
60
70
80
90
100
Frequency, GHz
V.S.W.R.
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
N.C.
N.O.
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
Part No.
RP1-1.5V
RP1-H-1.5V
RP1-3V
RP1-H-3V
RP1-4.5V
RP1-H-4.5V
RP1-5V
RP1-H-5V
RP1-6V
RP1-H-6V
RP1-9V
RP1-H-9V
RP1-12V
RP1-H-12V
RP1-24V
RP1-H-24V
1.5
3
4.5
5
6
9
12
24
0.15
0.3
0.45
0.5
0.6
0.9
1.2
2.4
16
64.3
145
178
257
579
1,028
2,133
93.8
46.7
31.1
28
23.3
15.6
11.7
11.3
2.25
4.5
6.75
7.5
9
13.5
18
28.8
140
140
140
140
140
140
140
270
1.125
2.25
3.375
3.75
4.5
6.75
9
18
Nominal
voltage,
V DC
Standard PC
board terminal
Self-clinching
terminal
Pick-up
voltage, max.
V DC
Drop-out
voltage, min.
V DC
Coil
resistance,
(
10%)
Nominal
operating
current,
mA (
10%)
Nominal
operating
power,
mW
Maximum.
allowable
voltage,
V DC
TYPES ANE COIL DATA
(at 20C
68F
)
DIMENSIONS
REFERENCE DATA
Sample: RP1-6V
Measuring method: Impedance 50
Measuring tool:
1. High frequency characteristics
Isolation
Insertion loss
Return loss
V.S.W.R
95
RP
10
30
60
70
80
100
80
100
120
150
0
20
40
90
50
Coil applied voltage, %V
Temperature rise,
C
2
4
6
8
10
12
70 80
100
120
150
0
Max.
Max.
Min.
Min.
Coil applied voltage, %V
Time, ms
Operate time
Release time
2
4
6
8
10
12
70 80
100
120
150
0
Max.
Min.
Max.
Min.
Coil applied voltage, %V
Time, ms
Operate time
Release time
2
4
6
8
10
12
100
1,000
500
50
Max.
Max.
Min.
Min.
No. of operations,
10
4
Pick-up/drop-out voltage, V
Pick-up voltage
Drop-out voltage
2
4
6
8
10
12
30
20
10
0
Max.
Max.
Min.
Min.
No. of operations,
10
4
Pick-up/drop-out voltage, V
Pick-up voltage
Drop-out voltage
20
40
60
80
100
120
30
20
10
0
Max.
Min.
No. of operations,
10
4
Contact resistance, m
40
40
20
40 20
0
20 40
60
80
Rate of change, %
Drop-out
voltage
Pick-up
voltage
Ambient
temperature,
C
20
10
20
40
50
28
24
30
30
0
38
36
34
32
26
22
40
Contact resistance, m
Quantity
5
10
.394
5
.197
0
0
5
5
0
5
OFF
OFF
OFF
ON
ON
ON
Inter-relay distance, (mm,
inch
)
Rate of change, %
Rate of change, %
Pick-up voltage
Drop-out voltage
OFF
OFF
OFF
ON
ON
ON
5
10
.394
5
.197
0
0
5
5
0
5
Inter-relay distance, (mm,
inch
)
Rate of change, %
Rate of change, %
Pick-up voltage
Drop-out voltage
OFF
ON
5
10
.394
5
.197
0
0
5
5
0
5
Inter-relay distance, (mm,
inch
)
Rate of change, %
Rate of change, %
Pick-up voltage
Drop-out voltage
2. Coil temperature rise
Sample: RP1-6V; No. of samples: n = 5
Carrying current: 0.1 A
Ambient temperature: 25C
77F
3. Operate/release time
Sample: RP1-9V; No. of samples: n = 50
With diode
Without diode
4. Mechanical life
Sample: RP1-5V; No. of samples: n = 8
Change of pick-up, drop-out voltage
5. Electrical life (0.1 A 30 V DC)
Sample: RP1-6V; No. of samples: n = 6
Change of pick-up/drop-out voltage
Change of contact resistance
6. Ambient temperature characteristics
Sample: RP1-6V; No. of samples: n = 5
7. Contact resistance distribution (initial)
Sample: RP1-6V; No. of samples: n = 25
8.-(1) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
8.-(2) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
8.-(3) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
96
RP
NOTES
T1
T2
T1
T2
0.2s
0.2s
1.5s
1.5s
OFF
Trans-
mission
Dummy load (50
)
WD-2351
Transmission: RF Tranceiver
IC-1201 (ICOH)
ON
RP relay
Orientation (indicates PIN No. 1) stripe
Stopper (green)
A
C
B
Direction A Direction B Direction C
mm
inch
5 4
6
2 3
3
.118
6
.236
1
1
2
3
(4)
(5)
(6)
9. High frequency switching test (1.2 GHz, 1 W)
Sample: RP1-6V; No. of samples: n = 6
Ambient temperature: 20C
68F
Change of pick-up/drop-out voltage
Change of contact resistance
2
4
6
8
10
12
15
10
5
0
Max.
Max.
Min.
Min.
No. of operations,
10
4
Pick-up/drop-out voltage, V
Pick-up voltage
Drop-out voltage
20
40
60
80
100
120
15
10
5
0
Max.
Min.
No. of operations,
10
4
Contact resistance, m
1. Packing direction
Relays are packed in a tube with the ori-
entation stripe (PIN NO. 1) toward the
green stopper.
2. Automatic mounting
To maintain the internal function of the
relay, the chucking pressure should
not exceed the values below.
Chucking pressure* in the direction A:
4.9 N {500 gf} or less
Chucking pressure* in the direction B:
9.8 N {1 kgf} or less
Chucking pressure* in the direction C:
9.8 N {1 kgf} or less
Please chuck the
portion.
Avoid chucking the center of the relay. In
addition, excessive chucking pressure to
the pinpoint of the relay should be avoid-
ed.
3. Soldering
Preheat according to the following condi-
tions.
Soldering should be done at 250C
482F
within 5 s.
,
,
Temperature
100C
212F
or less
Time
Within 1 minute
*Value of chucking pressure is shown by the value of weight
pressed on the portion (4 mm .157
inch dia.
).
For Cautions for Use, see Relay Technical Information (Page 48 to 76).
9/1/2000
All Rights Reserved, Copyright Matsushita Electric Works, Ltd.
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