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Электронный компонент: SM5002LDS

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SM5002L series
NIPPON PRECISION CIRCUITS--1
NIPPON PRECISION CIRCUITS INC.
Crystal Oscillator Module ICs
OVERVIEW
The SM5002L series crystal oscillator module ICs fabricated in NPC's Molybdenum-gate CMOS. They
comprise low-voltage low-current consumption oscillator circuits and output buffers. They incorporate built-in
oscillation capacitance with superior frequency response to realize stable 3rd overtone oscillation without any
external components.
FEATURES
s
Oscillation frequency up to 100 MHz
s
Third harmonic
s
Capacitors C
G
and C
D
built-in
s
Standby function (oscillator stops)
s
3 A (typ) low standby current
s
Inverter amplifier feedback resistance built-in
s
INH pin pull-up resistance built-in
INH= L : 2M
typ
INH= H : 90k
typ
s
CMOS input level
s
8 mA (V
DD
= 3.0 V) output drive capability
s
CMOS output duty level
s
Output three-state function
s
2.7 to 3.6 V supply voltage
s
Oscillator frequency output
s
8-pin SOP (SM5002L
S)
s
Chip form (CF5002L
)
SERIES CONFIGURATION
ORDERING INFORMATION
Version
Recommended
operating
frequency range
(MHz)
g
m
(relative
value)
Built-in capacitance
R
f1
(k
)
C
f
(pF)
Output
duty level
Output
current
(mA)
Standby
function
C
G
(pF)
C
D
(pF)
CF5002LA
SM5002LAS
30 to 40
1.0
8
15
5.6
22
CMOS
8
Yes
CF5002LB
SM5002LBS
40 to 50
1.5
8
15
4.7
22
CMOS
8
Yes
CF5002LC
SM5002LCS
50 to 70
1.5
8
10
3.9
22
CMOS
8
Yes
CF5002LD
SM5002LDS
70 to 90
2.0
8
10
3.9
22
CMOS
8
Yes
CF5002LE
SM5002LES
85 to 100
2.0
8
10
2.7
22
CMOS
8
Yes
CF5002LF
SM5002LFS
25 to 30
1.0
10
15
8.5
22
CMOS
8
Yes
Device
Package
SM5002L
S
8-pin SOP
CF5002L
Chip form
SM5002L series
NIPPON PRECISION CIRCUITS--2
PACKAGE DIMENSIONS
(UNIT : mm)
8-pin SOP
4.4 0.2
6.2 0.3
5.2 0.3
0.695TYP
1.27
1.5 0.1
0.05 0.05
0.12
M
0.10
0.15
+
0.1
-
0.05
0.4 0.2
0 to 10
0.4 0.1
SM5002L series
NIPPON PRECISION CIRCUITS--3
PAD LAYOUT
(Unit :
m)
PINOUT
(Top View)
PIN DESCRIPTION and PAD DIMENSIONS
BLOCK DIAGRAM
Chip size: 0.92
1.31 mm
Chip thickness: 400 30 m
Chip base: V
DD
level
Q
VDD
XT
VSS
(0,0)
(920,1310)
X
Y
INH
XT
HA5002L
1
XT
VSS
Q
VDD
4
2
3
NC
NC
8
7
6
5
5002L
XT
INH
Number
Name
I/O
Description
Pad dimensions [m]
X
Y
1
INH
I
Output state control input. Oscillator stopped when LOW. Power-saving pull-up
resistor built in
195
188
2
XT
I
Amplifier input.
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XT
385
188
3
XT
O
Amplifier output.
575
188
4
VSS
Ground
766
188
5
Q
O
Output. Output frequency. High impedance at standby operation
765
1159
6
NC
No connection
7
NC
No connection
8
VDD
Supply voltage
162
1159
XT
VSS
VDD
Q
C
G
C
D
R
f 1
XT
INH
R
f 2
C
f
R
UP1
/R
UP2
SM5002L series
NIPPON PRECISION CIRCUITS--4
SPECIFICATIONS
Absolute Maximum Ratings
V
SS
= 0 V unless otherwise noted.
Recommended Operating Conditions
CF5002L
series (Chip form)
V
SS
= 0 V unless otherwise noted.
SM5002L
S series (8-pin SOP)
V
SS
= 0 V unless otherwise noted.
Parameter
Symbol
Condition
Rating
Unit
Supply voltage range
V
DD
-
0.5 to 7.0
V
Input voltage range
V
IN
-
0.5 to V
DD
+ 0.5
V
Output voltage range
V
OUT
-
0.5 to V
DD
+ 0.5
V
Operating temperature range
T
opr
-
40 to 85
C
Storage temperature range
T
stg1
Chip form
-
65 to 150
C
T
stg2
8-pin SOP
-
40 to 125
Output current
I
OUT
25
mA
Power dissipation
P
D
Ta
85
C, 8-pin SOP
200
mW
Soldering temperature
T
sld
8-pin SOP
255
C
Soldering time
t
sld
8-pin SOP
10
s
Parameter
Symbol
Conditions
Limits
Units
min
typ
max
Supply voltage
V
DD
C
L
15pF, f
70 MHz
2.7
3.6
V
C
L
15pF, 70 < f
100 MHz
3.0
3.6
V
C
L
30pF, f
70 MHz
3.0
3.6
V
Input voltage
V
IN
V
SS
V
DD
V
Operating temperature
T
OPR
-
20
80
C
Parameter
Symbol
Conditions
Limits
Units
min
typ
max
Supply voltage
V
DD
C
L
15pF, f
50 MHz
2.7
3.6
V
C
L
15pF, 50 < f
70 MHz
3.0
3.6
V
C
L
30pF, f
50 MHz
3.0
3.6
V
Input voltage
V
IN
V
SS
V
DD
V
Operating temperature
T
OPR
-
20
80
C
SM5002L series
NIPPON PRECISION CIRCUITS--5
Electrical Characteristics
V
DD
= 2.7 to 3.6 V, V
SS
= 0 V, T
a
=
-
20 to 80
C, unless otherwise noted.
Parameter
Symbol
Conditions
Limits
Units
min
typ
max
HIGH-level output voltage
V
OH
Q: Measurement cct 1, V
DD
= 2.7 V, I
OH
= 8 mA
2.2
2.4
V
LOW-level output voltage
V
OL
Q: Measurement cct 2, V
DD
= 2.7 V, I
OL
= 8 mA
0.3
0.4
V
Output leakage current
I
Z
Q: Measurement cct 2,
INH = LOW, V
DD
= 3.6V
V
OH
= V
DD
10
A
V
OL
= V
SS
10
A
HIGH-level input voltage
V
IH
INH pin
0.7V
DD
V
LOW-level input voltage
V
IL
INH pin
0.3V
DD
V
Current consumption
I
DD
INH = open,
Measurement cct 3,
load cct 1,
V
DD
= 3.0 to 3.6 V
SM5002LAS, SM5002LFS
CF5002LA, CF5002LF
C
L
= 30 pF, f = 30 MHz
10
18
mA
SM5002LBS, CF5002LB
C
L
= 30 pF, f = 50 MHz
15
25
mA
SM5002LCS, CF5002LC
C
L
= 30 pF, f = 70 MHz
20
35
mA
SM5002LDS, SM5002LES
CF5002LD, CF5002LE
C
L
= 15 pF, f = 100 MHz
25
45
mA
Standby current
I
ST
INH = LOW, Measurement cct 3
3
10
A
INH pull-up resistance
R
UP1
Measurement cct 4, INH = LOW
0.4
4
M
R
UP2
Measurement cct 4, INH = 0.7V
DD
50
150
k
AC feedback resistance
R
f1
Design value,
determined by the
internal wafer pattern
SM5002LAS, CF5002LA
4.7
5.6
6.5
k
SM5002LBS, CF5002LB
4.0
4.7
5.4
k
SM5002LCS, SM5002LDS
CF5002LC, CF5002LD
3.3
3.9
4.5
k
SM5002LES, CF5002LE
2.2
2.7
3.2
k
SM5002LFS, CF5002LF
7.2
8.5
9.8
k
DC feedback resistance
R
f2
Measurement cct 5
50
150
k
AC feedback capacitance
C
f
Design value, determined by the internal wafer pattern
19.8
22
24.2
pF
Built-in capacitance
C
G
Design value,
determined by the
internal wafer pattern
SM5002LAS, CF5002LA
SM5002LBS, CF5002LB
SM5002LCS, CF5002LC
SM5002LDS, CF5002LD
SM5002LES, CF5002LE
7.2
8
8.8
pF
SM5002LFS, CF5002LF
9
10
11
pF
C
D
SM5002LAS, CF5002LA
SM5002LBS, CF5002LB
SM5002LFS, CF5002LF
13.5
15
16.5
pF
SM5002LCS, CF5002LC
SM5002LDS, CF5002LD
SM5002LES, CF5002LE
9
10
11
pF