TL F 9553
54F74F540
54F74F541
Octal
BufferLine
Driver
with
TRI-STATE
Outputs
May 1995
54F 74F540
54F 74F541
Octal Buffer Line Driver with TRI-STATE
Outputs
General Description
The 'F540 and 'F541 are similar in function to the 'F240 and
'F244 respectively except that the inputs and outputs are
on opposite sides of the package (see Connection Dia-
grams) This pinout arrangement makes these devices es-
pecially useful as output ports for microprocessors allowing
ease of layout and greater PC board density
Features
Y
TRI-STATE outputs drive bus lines
Y
Inputs and outputs opposite side of package allowing
easier interface to microprocessors
Commercial
Military
Package
Package Description
Number
74F540PC
N20A
20-Lead (0 300 Wide) Molded Dual-In-Line
54F540DM (Note 2)
J20A
20-Lead Ceramic Dual-In-Line
74F540SC (Note 1)
M20B
20-Lead (0 300 Wide) Molded Small Outline JEDEC
74F540SJ (Note 1)
M20D
20-Lead (0 300 Wide) Molded Small Outline EIAJ
54F540FM (Note 2)
W20A
20-Lead Cerpack
54F540LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier Type C
74F541PC
N20A
20-Lead (0 300 Wide) Molded Dual-In-Line
54F541DM (Note 2)
J20A
20-Lead Ceramic Dual-In-Line
74F541SC (Note 1)
M20B
20-Lead (0 300 Wide) Molded Small Outline JEDEC
74F541SJ (Note 1)
M20D
20-Lead (0 300 Wide) Molded Small Outline EIAJ
54F541FM (Note 2)
W20A
20-Lead Cerpack
54F541LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1
Devices also available in 13
reel Use suffix
e
SCX and SJX
Note 2
Military grade device with environmental and burn-in processing Use suffix
e
DMQB FMQB and LMQB
Connection Diagrams
Pin Assignment for
DIP SOIC and Flatpak
Pin Assignment
for LCC
'F540
TL F 9553 1
TL F 9553 2
TRI-STATE
is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation
RRD-B30M75 Printed in U S A
Connection Diagrams
(Continued)
'F541
TL F 9553 4
TL F 9553 5
Unit Loading Fan Out
54F 74F
Pin Names
Description
U L
Input I
IH
I
IL
HIGH LOW
Output I
OH
I
OL
OE
1
OE
2
TRI-STATE Output Enable Input (Active LOW)
1 0 1 0
20 mA
b
0 6 mA
I
n
Inputs
1 0 1 0
20 mA
b
0 6 mA
O
n
O
n
Outputs
600 106 6 (80)
b
12 mA 64 mA (48 mA)
Truth Table
Inputs
Outputs
OE
1
OE
2
I
'F540
'F541
L
L
H
L
H
H
X
X
Z
Z
X
H
X
Z
Z
L
L
L
H
L
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
Z
e
High Impedance
Logic Diagrams
IEEE IEC
'F540
TL F 9553 3
IEEE IEC
'F541
TL F 9553 6
2
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
b
65 C to
a
150 C
Ambient Temperature under Bias
b
55 C to
a
125 C
Junction Temperature under Bias
b
55 C to
a
175 C
Plastic
b
55 C to
a
150 C
V
CC
Pin Potential to
Ground Pin
b
0 5V to
a
7 0V
Input Voltage (Note 2)
b
0 5V to
a
7 0V
Input Current (Note 2)
b
30 mA to
a
5 0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0 5V to V
CC
TRI-STATE Output
b
0 5V to
a
5 5V
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
Note 1
Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
Note 2
Either voltage limit or current limit is sufficient to protect inputs
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
b
55 C to
a
125 C
Commercial
0 C to
a
70 C
Supply Voltage
Military
a
4 5V to
a
5 5V
Commercial
a
4 5V to
a
5 5V
DC Electrical Characteristics
Symbol
Parameter
54F 74F
Units
V
CC
Conditions
Min
Typ
Max
V
IH
Input HIGH Voltage
2 0
V
Recognized as a HIGH Signal
V
IL
Input LOW Voltage
0 8
V
Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1 2
V
Min
I
IN
e b
18 mA
V
OH
Output HIGH
54F 10% V
CC
2 4
I
OH
e b
3 mA
Voltage
54F 10% V
CC
2 0
I
OH
e b
12 mA
74F 10% V
CC
2 4
V
Min
I
OH
e b
3 mA
74F 10% V
CC
2 0
I
OH
e b
15 mA
74F 5% V
CC
2 7
I
OH
e b
3 mA
V
OL
Output LOW
54F 10% V
CC
0 55
V
Min
I
OL
e
48 mA
Voltage
74F 10% V
CC
0 55
I
OL
e
64 mA
I
IH
Input HIGH
54F
20 0
m
A
Max
V
IN
e
2 7V
Current
74F
5 0
I
BVI
Input HIGH Current
54F
100
m
A
Max
V
IN
e
7 0V
Breakdown Test
74F
7 0
I
CEX
Output HIGH
54F
250
m
A
Max
V
OUT
e
V
CC
Leakage Current
74F
50
V
ID
Input Leakage
74F
4 75
V
0 0
I
ID
e
1 9 mA
Test
All Other Pins Grounded
I
OD
Output Leakage
74F
3 75
m
A
0 0
V
IOD
e
150 mV
Circuit Current
All Other Pins Grounded
I
IL
Input LOW Current
b
0 6
mA
Max
V
IN
e
0 5V
I
OZH
Output Leakage Current
50
m
A
Max
V
OUT
e
2 7V
I
OZL
Output Leakage Current
b
50
m
A
Max
V
OUT
e
0 5V
I
OS
Output Short-Circuit Current
b
100
b
225
mA
Max
V
OUT
e
0V
I
ZZ
Bus Drainage Test
500
m
A
0 0V
V
OUT
e
5 25V
3
DC Electrical Characteristics
(Continued)
Symbol
Parameter
54F 74F
Units
V
CC
Conditions
Min
Typ
Max
I
CCH
Power Supply Current ('F540)
11
20
mA
Max
V
O
e
HIGH
I
CCL
Power Supply Current ('F540)
53
75
mA
Max
V
O
e
LOW
I
CCZ
Power Supply Current ('F540)
31
45
mA
Max
V
O
e
HIGH Z
I
CCH
Power Supply Current ('F541)
26
35
mA
Max
V
O
e
HIGH
I
CCL
Power Supply Current ('F541)
55
75
mA
Max
V
O
e
LOW
I
CCZ
Power Supply Current ('F541)
31
55
mA
Max
V
O
e
HIGH Z
AC Electrical Characteristics
74F
54F
74F
T
A
e a
25 C
T
A
V
CC
e
Mil
T
A
V
CC
e
Com
Symbol
Parameter
V
CC
e a
5 0V
C
L
e
50 pF
C
L
e
50 pF
Units
C
L
e
50 pF
Min
Typ
Max
Min
Max
Min
Max
t
PLH
Propagation Delay
1 5
3 0
5 0
1 0
6 0
1 0
5 5
ns
t
PHL
Data to Output ('F540)
1 0
2 0
4 0
1 0
4 5
1 0
4 0
t
PZH
Output Enable Time ('F540)
2 5
4 9
8 0
2 5
9 0
2 5
8 5
t
PZL
3 5
5 8
10 0
3 5
11 0
3 5
10 5
ns
t
PHZ
Output Disable Time ('F540)
1 5
3 4
6 0
1 5
7 0
1 5
6 5
t
PLZ
1 0
2 5
5 5
1 0
7 5
1 0
6 0
t
PLH
Propagation Delay
1 5
3 3
5 5
1 5
6 0
ns
t
PHL
Data to Output ('F541)
1 5
2 7
5 5
1 5
6 0
t
PZH
Output Enable Time ('F541)
3 0
5 8
8 0
2 5
9 5
t
PZL
3 5
6 1
8 5
3 0
9 5
ns
t
PHZ
Output Disable Time ('F541)
1 5
3 4
6 0
1 5
6 5
t
PLZ
1 5
2 9
5 5
1 5
6 0
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
540 541
S
C
X
Temperature Range Family
Special Variations
74F
e
Commercial
QB
e
Military grade device with
54F
e
Military
environmental and burn-in
processing
Device Type
X
e
Devices shipped in 13 reel
Package Code
Temperature Range
P
e
Plastic DIP
C
e
Commercial (0 C to
a
70 C)
D
e
Ceramic DIP
M
e
Military (
b
55 C to
a
125 C)
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC JEDEC
SJ
e
Small Outline SOIC EIAJ
4
Physical Dimensions
inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
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