ChipFind - документация

Электронный компонент: 54F676SDM

Скачать:  PDF   ZIP
TL F 9588
54F74F676
16-Bit
SerialParallel-In
Serial-Out
Shift
Register
December 1994
54F 74F676
16-Bit Serial Parallel-In Serial-Out Shift Register
General Description
The 'F676 contains 16 flip-flops with provision for synchro-
nous parallel or serial entry and serial output When the
Mode (M) input is HIGH information present on the parallel
data (P
0
P
15
) inputs is entered on the falling edge of the
Clock Pulse (CP) input signal When M is LOW data is shift-
ed out of the most significant bit position while information
present on the Serial (SI) input shifts into the least signifi-
cant bit position A HIGH signal on the Chip Select (CS)
input prevents both parallel and serial operations
Features
Y
16-bit parallel-to-serial conversion
Y
16-bit serial-in serial-out
Y
Chip select control
Y
Slim 24 lead 300 mil package
Commercial
Military
Package
Package Description
Number
74F676PC
N24A
24-Lead (0 600 Wide) Molded Dual-In-Line
74F676SPC
N24C
24-Lead (0 300 Wide) Molded Dual-In-Line
54F676DM (Note 2)
J24A
24-Lead (0 600 Wide) Ceramic Dual-In-Line
54F676SDM (Note 2)
J24F
24-Lead (0 300 Wide) Ceramic Dual-In-Line
74F676SC (Note 1)
M24B
24-Lead (0 300 Wide) Molded Small Outline JEDEC
54F676FM (Note 2)
W24C
24-Lead Cerpack
54F676LM (Note 2)
E28A
24-Lead Ceramic Leadless Chip Carrier Type C
Note 1
Devices also available in 13
reel Use suffix
e
SCX
Note 2
Military grade device with environmental and burn-in processing Use suffix
e
DMQB FMQB and LMQB
Connection Diagrams
Pin Assignment
for DIP SOIC and Flatpak
TL F 9588 2
Pin Assignment
for LCC
TL F 9588 3
TRI-STATE
is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation
RRD-B30M105 Printed in U S A
Logic Symbols
TL F 9588 1
IEEE IEC
TL F 9588 4
Unit Loading Fan Out
54F 74F
Pin Names
Description
U L
Input I
IH
I
IL
HIGH LOW
Output I
OH
I
OL
P
0
P
15
Parallel Data Inputs
1 0 1 0
20 mA
b
0 6 mA
CS
Chip Select Input (Active LOW)
1 0 1 0
20 mA
b
0 6 mA
CP
Clock Pulse Input (Active LOW)
1 0 1 0
20 mA
b
0 6 mA
M
Mode Select Input
1 0 1 0
20 mA
b
0 6 mA
SI
Serial Data Input
1 0 1 0
20 mA
b
0 6 mA
SO
Serial Output
50 33 3
b
1 mA 20 mA
Functional Description
The 16-bit shift register operates in one of three modes as
indicated in the Shift Register Operations Table
HOLD
a HIGH signal on the Chip Select (CS) input pre-
vents clocking and data is stored in the sixteen registers
Shift Serial Load
data present on the SI pin shifts into
the register on the falling edge of CP Data enters the Q
0
position and shifts toward Q
15
on successive clocks finally
appearing on the SO pin
Parallel Load
data present on P
0
P
15
are entered into
the register on the falling edge of CP The SO output repre-
sents the Q
15
register output
To prevent false clocking CP must be LOW during a LOW-
to-HIGH transition of CS
Shift Register Operations Table
Control Input
Operating Mode
CS
M
CP
H
X
X
Hold
L
L
K
Shift Serial Load
L
H
K
Parallel Load
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
K
e
HIGH-to-LOW Transition
Block Diagram
TL F 9588 5
2
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
b
65 C to
a
150 C
Ambient Temperature under Bias
b
55 C to
a
125 C
Junction Temperature under Bias
b
55 C to
a
175 C
Plastic
b
55 C to
a
150 C
V
CC
Pin Potential to
Ground Pin
b
0 5V to
a
7 0V
Input Voltage (Note 2)
b
0 5V to
a
7 0V
Input Current (Note 2)
b
30 mA to
a
5 0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0 5V to V
CC
TRI-STATE Output
b
0 5V to
a
5 5V
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
Note 1
Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
Note 2
Either voltage limit or current limit is sufficient to protect inputs
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
b
55 C to
a
125 C
Commercial
0 C to
a
70 C
Supply Voltage
Military
a
4 5V to
a
5 5V
Commercial
a
4 5V to
a
5 5V
DC Electrical Characteristics
Symbol
Parameter
54F 74F
Units
V
CC
Conditions
Min
Typ
Max
V
IH
Input HIGH Voltage
2 0
V
Recognized as a HIGH Signal
V
IL
Input LOW Voltage
0 8
V
Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1 2
V
Min
I
IN
e b
18 mA
V
OH
Output HIGH
54F 10% V
CC
2 5
I
OH
e b
1 mA
Voltage
74F 10% V
CC
2 5
V
Min
I
OH
e b
1 mA
74F 5% V
CC
2 7
I
OH
e b
1 mA
V
OL
Output LOW
54F 10% V
CC
0 5
V
Min
I
OL
e
20 mA
Voltage
74F 10% V
CC
0 5
I
OL
e
20 mA
I
IH
Input HIGH
54F
20 0
m
A
Max
V
IN
e
2 7V
Current
74F
5 0
I
BVI
Input HIGH Current
54F
100
m
A
Max
V
IN
e
7 0V
Breakdown Test
74F
7 0
I
CEX
Output HIGH
54F
250
m
A
Max
V
OUT
e
V
CC
Leakage Current
74F
50
V
ID
Input Leakage
74F
4 75
V
0 0
I
ID
e
1 9 mA
Test
All Other Pins Grounded
I
OD
Output Leakage
74F
3 75
m
A
0 0
V
IOD
e
150 mV
Circuit Current
All Other Pins Grounded
I
IL
Input LOW Current
b
0 6
mA
Max
V
IN
e
0 5V
I
OS
Output Short-Circuit Current
b
60
b
150
mA
Max
V
OUT
e
0V
I
CC
Power Supply Current
72
mA
Max
3
AC Electrical Characteristics
74F
54F
74F
T
A
e a
25 C
T
A
V
CC
e
Mil
T
A
V
CC
e
Com
Symbol
Parameter
V
CC
e a
5 0V
C
L
e
50 pF
C
L
e
50 pF
Units
C
L
e
50 pF
Min
Typ
Max
Min
Max
Min
Max
f
max
Maximum Clock Frequency
100
110
45
90
MHz
t
PLH
Propagation Delay
4 5
9 0
11 0
4 5
17 0
4 5
12 0
ns
t
PHL
CP to SO
5 0
9 0
12 5
5 0
14 5
5 0
13 5
AC Operating Requirements
74F
54F
74F
Symbol
Parameter
T
A
e a
25 C
T
A
V
CC
e
Mil
T
A
V
CC
e
Com
Units
V
CC
e a
5 0V
Min
Max
Min
Max
Min
Max
t
s
(H)
Setup Time HIGH or LOW
4 0
4 0
4 0
t
s
(L)
SI to CP
4 0
4 0
4 0
ns
t
h
(H)
Hold Time HIGH or LOW
4 0
4 0
4 0
t
h
(L)
SI to CP
4 0
4 0
4 0
t
s
(H)
Setup Time HIGH or LOW
3 0
3 0
3 0
t
s
(L)
P
n
to CP
3 0
3 0
3 0
ns
t
h
(H)
Hold Time HIGH or LOW
4 0
4 0
4 0
t
h
(L)
P
n
to CP
4 0
4 0
4 0
t
s
(H)
Setup Time HIGH or LOW
8 0
8 0
8 0
t
s
(L)
M to CP
8 0
8 0
8 0
ns
t
h
(H)
Hold Time HIGH or LOW
2 0
2 0
2 0
t
h
(L)
M to CP
2 0
2 0
2 0
t
s
(L)
Setup Time LOW
10 0
12 0
10 0
CS to CP
ns
t
h
(H)
Hold Time HIGH
10 0
10 0
10 0
CS to CP
t
w
(H)
CP Pulse Width
4 0
5 0
4 0
ns
t
w
(L)
HIGH or LOW
6 0
9 0
6 0
4
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
676
S
C
X
Temperature Range Family
Special Variations
74F
e
Commercial
QB
e
Military grade device with
54F
e
Military
environmental and burn-in
processing
Device Type
Temperature Range
Package Code
C
e
Commercial (0 C to
a
70 C)
P
e
Plastic DIP
M
e
Military (
b
55 C to
a
125 C)
SP
e
Slim Plastic DIP
D
e
Ceramic DIP
SD
e
Slim Ceramic DIP
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC JEDEC
5
6
Physical Dimensions
inches (millimeters)
28-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E28A
24-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J24A
7
Physical Dimensions
inches (millimeters) (Continued)
24-Lead (0 300 Wide) Ceramic Dual-In-Line Package (SD)
NS Package Number J24F
24-Lead (0 300 Wide) Molded Small Outline Package JEDEC
NS Package Number M24B
8
Physical Dimensions
inches (millimeters) (Continued)
24-Lead (0 600 Wide) Molded Dual-In-Line Package (P)
NS Package Number N24A
24-Lead (0 300 Wide) Molded Dual-In-Line Package (SP)
NS Package Number N24C
9
54F74F676
16-Bit
SerialParallel-In
Serial-Out
Shift
Register
Physical Dimensions
inches (millimeters) (Continued)
24 Lead Ceramic Flatpak (F)
NS Package Number W24C
LIFE SUPPORT POLICY
NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION As used herein
1 Life support devices or systems are devices or
2 A critical component is any component of a life
systems which (a) are intended for surgical implant
support device or system whose failure to perform can
into the body or (b) support or sustain life and whose
be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance
support device or system or to affect its safety or
with instructions for use provided in the labeling can
effectiveness
be reasonably expected to result in a significant injury
to the user
National Semiconductor
National Semiconductor
National Semiconductor
National Semiconductor
Corporation
Europe
Hong Kong Ltd
Japan Ltd
1111 West Bardin Road
Fax (a49) 0-180-530 85 86
13th Floor Straight Block
Tel 81-043-299-2309
Arlington TX 76017
Email cnjwge tevm2 nsc com
Ocean Centre 5 Canton Rd
Fax 81-043-299-2408
Tel 1(800) 272-9959
Deutsch Tel (a49) 0-180-530 85 85
Tsimshatsui Kowloon
Fax 1(800) 737-7018
English
Tel (a49) 0-180-532 78 32
Hong Kong
Fran ais Tel (a49) 0-180-532 93 58
Tel (852) 2737-1600
Italiano
Tel (a49) 0-180-534 16 80
Fax (852) 2736-9960
National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications