DS90CR213/DS90CR214
21-Bit Channel Link--66 MHz
General Description
The DS90CR213 transmitter converts 21 bits of CMOS/TTL
data into three LVDS (Low Voltage Differential Signaling)
data streams. A phase-locked transmit clock is transmitted in
parallel with the data streams over a fourth LVDS link. Every
cycle of the transmit clock 21 bits of input data are sampled
and transmitted. The DS90CR214 receiver converts the
LVDS data streams back into 21 bits of CMOS/TTL data. At
a transmit clock frequency of 66 MHz, 21 bits of TTL data are
transmitted at a rate of 462 Mbps per LVDS data channel.
Using a 66 MHz clock, the data throughput is 1.386 Gbit/s
(173 Mbytes/s).
The multiplexing of the data lines provides a substantial
cable reduction. Long distance parallel single-ended buses
typically require a ground wire per active signal (and have
very limited noise rejection capability). Thus, for a 21-bit wide
data and one clock, up to 44 conductors are required. With
the Channel Link chipset as few as 9 conductors (3 data
pairs, 1 clock pair and a minimum of one ground) are
needed. This provides an 80% reduction in required cable
width, which provides a system cost savings, reduces con-
nector physical size and cost, and reduces shielding require-
ments due to the cable's smaller form factor.
The 21 CMOS/TTL inputs can support a variety of signal
combinations. For example, 5 4-bit nibbles (byte + parity) or
2 9-bit (byte + 3 parity) and 1 control.
Features
n
66 MHz Clock Support
n
Up to 173 Mbytes/s bandwidth
n
Low power CMOS design (
<
610 mW)
n
Power-down mode (
<
0.5 mW total)
n
Up to 1.386 Gbit/s data throughput
n
Narrow bus reduces cable size and cost
n
290 mV swing LVDS devices for low EMI
n
PLL requires no external components
n
Low profile 48-lead TSSOP package
n
Rising edge data strobe
n
Compatible with TIA/EIA-644 LVDS Standard
Block Diagrams
TRI-STATE
is a registered trademark of National Semiconductor Corporation.
DS90CR213
DS012888-27
Order Number DS90CR213MTD
See NS Package Number MTD48
DS90CR214
DS012888-1
Order Number DS90CR214MTD
See NS Package Number MTD48
July 1997
DS90CR213/DS90CR214
21-Bit
Channel
Link
--
6
6
MHz
2000 National Semiconductor Corporation
DS012888
www.national.com
Pin Diagrams
Typical Application
DS90CR213
DS012888-21
DS90CR214
DS012888-22
DS012888-23
DS90CR213/DS90CR214
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2
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
)
-0.3V to +6V
CMOS/TTL Input Voltage
-0.3V to (V
CC
+ 0.3V)
CMOS/TTL Output Voltage
-0.3V to (V
CC
+ 0.3V)
LVDS Receiver Input Voltage
-0.3V to (V
CC
+ 0.3V)
LVDS Driver Output Voltage
-0.3V to (V
CC
+ 0.3V)
LVDS Output Short Circuit
Duration
Continuous
Junction Temperature
+150C
Storage Temperature
-65C to +150C
Lead Temperature
(Soldering, 4 sec)
+260C
Maximum Package Power
Dissipation Capacity
@
25C
MTD48 (TSSOP) Package:
DS90CR213
DS90CR214
1.98W
1.89W
Package Derating:
DS90CR213
16 mW/C above +25C
DS90CR214
15 mW/C above +25C
ESD Rating (Note 4)
This device does not meet 2000V
Recommended Operating
Conditions
Min
Nom
Max
Units
Supply Voltage (V
CC
)
4.75
5.0
5.25
V
Operating Free Air
Temperature (T
A
)
-10
+25
+70
C
Receiver Input Range
0
2.4
V
Supply Noise Voltage (V
CC
)
100
mV
P-P
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CMOS/TTL DC SPECIFICATIONS
V
IH
High Level Input Voltage
2.0
V
CC
V
V
IL
Low Level Input Voltage
GND
0.8
V
V
OH
High Level Output Voltage
I
OH
= -0.4 mA
3.8
4.9
V
V
OL
Low Level Output Voltage
I
OL
= 2 mA
0.1
0.3
V
V
CL
Input Clamp Voltage
I
CL
= -18 mA
-0.79
-1.5
V
I
IN
Input Current
V
IN
= V
CC
, GND, 2.5V or 0.4V
5.1
10
A
I
OS
Output Short Circuit Current
V
OUT
= 0V
-120
mA
LVDS DRIVER DC SPECIFICATIONS
V
OD
Differential Output Voltage
R
L
= 100
250
290
450
mV
V
OD
Change in V
OD
between
Complimentary Output States
35
mV
V
OS
Offset Voltage
1.1
1.25
1.375
V
V
OS
Change in Magnitude of V
OS
between Complimentary Output
States
35
mV
I
OS
Output Short Circuit Current
V
OUT
= 0V, R
L
= 100
-2.9
-5
mA
I
OZ
Output TRI-STATE
Current
Powerdown = 0V, V
OUT
= 0V or V
CC
1
10
A
LVDS RECEIVER DC SPECIFICATIONS
V
TH
Differential Input High Threshold
V
CM
= +1.2V
+100
mV
V
TL
Differential Input Low Threshold
-100
mV
I
IN
Input Current
V
IN
= +2.4V, V
CC
= 5.0V
10
A
V
IN
= 0V, V
CC
= 5.0V
10
A
TRANSMITTER SUPPLY CURRENT
I
CCTW
Transmitter Supply Current
R
L
= 100
, C
L
= 5 pF,
f = 32.5 MHz
49
63
mA
Worst Case
Worst Case Pattern
f = 37.5 MHz
51
64
mA
(
Figure 1 and Figure 2 )
f = 66 MHz
70
84
mA
I
CCTZ
Transmitter Supply Current
Powerdown = Low
Power Down
Driver Outputs in TRI-STATE under
Powerdown Mode
1
25
A
DS90CR213/DS90CR214
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3
Electrical Characteristics
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
RECEIVER SUPPLY CURRENT
I
CCRW
Receiver Supply Current
C
L
= 8 pF,
f = 32.5 MHz
64
77
mA
Worst Case
Worst Case Pattern
f = 37.5 MHz
70
85
mA
(
Figure 1 and Figure 3 )
f = 66 MHz
110
140
mA
I
CCRZ
Receiver Supply Current
Powerdown = Low
Power Down
Receiver Outputs in Previous State during
Power Down Mode.
1
10
A
Note 1: "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of "Electrical Characteristics" specify conditions for device operation.
Note 2: Typical values are given for V
CC
= 5.0V and T
A
= +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise speci-
fied (except V
OD
and
V
OD
).
Note 4: ESD Rating: HBM (1.5 k
, 100 pF)
PLL V
CC
1000V
All Other Pins
2000V
EIAJ (0
, 200 pF)
150V
Note 5: V
OS
previously referred as V
CM
.
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
LLHT
LVDS Low-to-High Transition Time (
Figure 2 )
0.75
1.5
ns
LHLT
LVDS High-to-Low Transition Time (
Figure 2 )
0.75
1.5
ns
TCIT
TxCLK IN Transition Time (
Figure 4 )
8
ns
TCCS
TxOUT Channel-to-Channel Skew (Note 6) (
Figure 5)
350
ps
TPPos0
Transmitter Output Pulse Position for Bit 0 (
Figure 16 )
f = 66 MHz
-0.30
0
0.30
ns
TPPos1
Transmitter Output Pulse Position for Bit 1
1.70
(1/7)Tclk
2.50
ns
TPPos2
Transmitter Output Pulse Position for Bit 2
3.60
(2/7)Tclk
4.50
ns
TPPos3
Transmitter Output Pulse Position for Bit 3
5.90
(3/7)Tclk
6.75
ns
TPPos4
Transmitter Output Pulse Position for Bit 4
8.30
(4/7)Tclk
9.00
ns
TPPos5
Transmitter Output Pulse Position for Bit 5
10.40
(5/7)Tclk
11.10
ns
TPPos6
Transmitter Output Pulse Position for Bit 6
12.70
(6/7)Tclk
13.40
ns
TCIP
TxCLK IN Period (
Figure 6 )
15
T
50
ns
TCIH
TxCLK IN High Time (
Figure 6 )
0.35T
0.5T
0.65T
ns
TCIL
TxCLK IN Low Time (
Figure 6 )
0.35T
0.5T
0.65T
ns
TSTC
TxIN Setup to TxCLK IN (
Figure 6 )
5
3.5
ns
THTC
TxIN Hold to TxCLK IN (
Figure 6 )
2.5
1.5
ns
TCCD
TxCLK IN to TxCLK OUT Delay
@
25C, V
CC
= 5.0V (
Figure 8 )
3.5
8.5
ns
TPLLS
Transmitter Phase Lock Loop Set (
Figure 10 )
10
ms
TPDD
Transmitter Powerdown Delay (
Figure 14 )
100
ns
Note 6: This limit based on bench characterization.
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
CLHT
CMOS/TTL Low-to-High Transition Time (
Figure 3 )
2.5
4.0
ns
CHLT
CMOS/TTL High-to-Low Transition Time (
Figure 3 )
2.0
4.0
ns
RSKM
RxIN Skew Margin (Note 7) V
CC
= 5V,T
A
= 25C(
Figure 17)
f = 40 MHz
700
ps
f = 66 MHz
600
ps
DS90CR213/DS90CR214
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4
Receiver Switching Characteristics
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
RCOP
RxCLK OUT Period (
Figure 7 )
15
T
50
ns
RCOH
RxCLK OUT High Time (
Figure 7 )
f = 40 MHz
6
ns
f = 66 MHz
4.3
5
ns
RCOL
RxCLK OUT Low Time (
Figure 7 )
f = 40 MHz
10.5
ns
f = 66 MHz
7.0
9
ns
RSRC
RxOUT Setup to RxCLK OUT (
Figure 7 )
f = 40 MHz
4.5
ns
f = 66 MHz
2.5
4.2
ns
RHRC
RxOUT Hold to RxCLK OUT (
Figure 7 )
f = 40 MHz
6.5
ns
f = 66 MHz
4
5.2
ns
RCCD
RxCLK IN to RxCLK OUT Delay
@
25C, V
CC
= 5.0V (
Figure 9 )
6.4
10.7
ns
RPLLS
Receiver Phase Lock Loop Set (
Figure 11 )
10
ms
RPDD
Receiver Powerdown Delay (
Figure 15 )
1
s
Note 7: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account for transmitter output skew (TCCS)
and the setup and hold time (internal data sampling window), allowing LVDS cable skew dependent on type/length and source clock (TxCLK IN) jitter.
RSKM
cable skew (type, length) + source clock jitter (cycle to cycle)
AC Timing Diagrams
DS012888-2
FIGURE 1. "Worst Case" Test Pattern
DS012888-3
DS012888-4
FIGURE 2. DS90CR213 (Transmitter) LVDS Output Load and Transition Times
DS012888-5
DS012888-6
FIGURE 3. DS90CR214 (Receiver) CMOS/TTL Output Load and Transition Times
DS90CR213/DS90CR214
www.national.com
5
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