TL H 12321
LMC6008
8
Channel
Buffer
April 1996
LMC6008
8 Channel Buffer
General Description
The LMC6008 octal buffer is designed specifically to buffer
the multi-level voltages going to the inputs of the integrated
circuits The LMC6008 AC characteristics including settling
time are specified for a capacitive load of 0 1 mF for this
reason
The LMC6008 contains 4 high-speed buffers and 4 low-
power buffers The high-speed buffers can provide an out-
put current of at least 250 mA (minimum) and the low-pow-
er buffers can provide at least 150 mA (minimum) By includ-
ing the 2 types of buffers the LMC6008 is able to provide
this function while consuming a supply current of only 6 5
mA (maximum) The buffers are a rail-to-rail design which
typically swing to within 30 mV of either supply
The LMC6008 also contains a standby function which puts
the buffer into a high-impedance mode The supply current
in the standby mode is a low 500 mA max Also a thermal
limit circuit is included to protect the device from overload
conditions
Features
Y
High Output Current
High Speed Buffers
250 mA min
Low Power Buffers
150 mA min
Y
Slew Rate
High Speed Buffers
1 7 V ms
Low Power Buffers
0 85V ms
Y
Settling Time C
L
e
0 1 mF
16 ms max
Y
Wide Input Output Range
0 1V to V
CC
b
0 1V min
Y
Supply Voltage Range
5V to 16V
Y
Supply Current
6 5 mA max
Y
Standby Mode Current
500 mA
Applications
Y
AMLCD voltage buffering
Y
Multi-voltage buffering
Connection Diagram
24-Pin SO
TL H 12321 1
Top View
Note
Buffers 1 3 5 and 7 are High Speed and
Buffers 2 4 6 and 8 are Low Speed
Ordering Information
Package
Temperature Range
NSC
Transport
b
40 C to
a
85 C
Drawing
Media
24-Pin
LMC6008IM
M24B
Rail
Surface Mount
LMC6008IMX
M24B
Tape
Reel
C1996 National Semiconductor Corporation
RRD-B30M56 Printed in U S A
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
ESD Tolerance (Note 2)
2000V
Voltage at Input Pin
V
a
a
0 4V V
b
b
0 4V
Voltage at Output Pin
V
a
a
0 4V V
b
b
0 4V
Supply Voltage (V
a
b
V
b
)
16V
Lead Temperature
(soldering 10 sec )
260 C
Storage Temperature Range
b
55 C to
a
150 C
Junction Temperature (Note 4)
150 C
Power Dissipation (Note 4)
Internally Limited
Operating Ratings
(Note 1)
Supply Voltage
4 5V
s
V
a s
16V
Temperature Range
b
20 C to
a
100 C
Thermal Resistance (i
JA
)
M Package 24-Pin Surface Mount
50 C W
DC Electrical Characteristics
Unless otherwise specified all limits guaranteed for T
J
e
25 C V
CC
e
14 5V and R
L
e
0
Symbol
Parameter
Conditions
(Note 5)
Typ
LMC6008
Units
Limit
(Note 6)
V
OS
Input Offset Voltage
R
S
e
10 kX
25
mV max
A
V
V
O
e
10 V
PP
0 985
V V
I
B
Input Bias Current
300
nA max
I
LP
Peak Load Current
Hi Speed Buffers
b
250
mA max
V
O
e
13 V
PP
a
250
mA min
I
LP
Peak Load Current
Lo Speed Buffers
b
150
mA max
V
O
e
13 V
PP
a
150
mA min
V
ERR
Output Voltage Difference
35
mV max
(Note 9)
V
IH
Standby Logic
3 30
V min
HIgh Voltage
V
IL
I
STANDBY
Logic
1 80
V max
Low Voltage
I
IH
Standby High Input Current
1 0
m
A max
I
IL
Standby Low Input Current
1 0
m
A max
I
O (STD-BY)
Output Leakage Current
V
STD-BY
e
High
5
m
A max
I
CC
Supply Current
V
IL
e
Low V
IN
e
7 25V
6 5
mA max
I
STD-BY
Standby Current
V
STD-BY
e
High
500
m
A max
PSRR
Power Supply Rejection Ratio
5V
k
V
CC
k
14 5V
55
dB min
V
O
Voltage Output Swing
0 1
V min
V
CC
b
0 1
V max
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2
AC Electrical Characteristics
Unless otherwise specified all limits guaranteed for T
J
e
25 C V
CC
e
14 5V and R
L
e
0X
Symbol
Parameter
Conditions
(Note 5)
Typ
LMC6008
Units
Limit
(Note 6)
SR
Slew Rate
Buffers 1 3 5 7 (Note 3)
1 70
V ms min
Buffers 2 4 6 8 (Note 3)
0 85
V ms min
t
S
Settling Time
(Notes 3 7)
16
m
s max
t
ON
Standby Response Time ON
10
m
s max
t
OFF
Standby Response Time OFF
10
m
s max
PBW
Power Bandwidth
V
O
e
10 V
PP
for Hi-Speed
45
V
O
e
5 V
PP
for Lo-Speed
KHz min
(Note 3)
C
L
Load Capacitance
0 1
m
F max
Note 1
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur Operating ratings indicate conditions for which the device is
intended to be functional but specific performance is not guaranteed For guaranteed specifications and the test conditions see the Electrical Characteristics
Note 2
Human body model 1 5 kX in series with 100 pF
Note 3
The Load is a series connection of a 0 1 mF capacitor and a 1X resistor
Note 4
The maximum power dissipation is a function of T
J(max)
i
JA
and T
A
The maximum allowable power dissipation at any ambient temperature is
P
D
e
(T
J(max)
b
T
A
) i
JA
where the junction-to-ambient thermal resistance i
JA
e
50 C W If the maximum allowable power dissipation is exceeded the thermal
limit circuit will limit the die temperature to approximately 160 C All numbers apply for packages soldered directly into a PC board
Note 5
Typical Values represent the most likely parametric norm
Note 6
All limits are guaranteed by testing or statistical analysis
Note 7
The settling time is measured from the input transition to a point 50 mV of the final value for both rising and falling transitions The input swing is 0 5V to
13 5V for buffers 1 3 5 7 and 3 75V to 10 25V for buffers 2 4 6 8 Input rise time should be less than 1 ms
Note 8
High-Speed Buffers are 1 3 5 7 and Low-Speed Buffers are 2 4 6 8
Note 9
Output Voltage Difference is the difference between the highest and lowest buffer output voltage when all buffer inputs are at identical voltages
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LMC6008
8
Channel
Buffer
Physical Dimensions
inches (millimeters) unless otherwise noted
24-Lead (3 00 Wide) Small Outline Molded Package (M)
Order Number LMC6008IM or LMC6008IMX
NS Package Number M24B
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SEMICONDUCTOR CORPORATION As used herein
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failure to perform when properly used in accordance
support device or system or to affect its safety or
with instructions for use provided in the labeling can
effectiveness
be reasonably expected to result in a significant injury
to the user
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