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Электронный компонент: TP3057WM

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TL H 5510
TP3054
TP3057
``Enhanced''
Serial
Interface
CODECFilter
COMBO
Family
August 1994
TP3054 TP3057
``Enhanced'' Serial Interface
CODEC Filter COMBO
Family
General Description
The TP3054 TP3057 family consists of m-law and A-law
monolithic PCM CODEC filters utilizing the A D and D A
conversion architecture shown in
Figure 1 and a serial PCM
interface The devices are fabricated using National's ad-
vanced double-poly CMOS process (microCMOS)
The encode portion of each device consists of an input gain
adjust amplifier an active RC pre-filter which eliminates very
high frequency noise prior to entering a switched-capacitor
band-pass filter that rejects signals below 200 Hz and above
3400 Hz Also included are auto-zero circuitry and a com-
panding coder which samples the filtered signal and en-
codes it in the companded m-law or A-law PCM format The
decode portion of each device consists of an expanding
decoder which reconstructs the analog signal from the
companded m-law or A-law code a low-pass filter which
corrects for the sin x x response of the decoder output and
rejects signals above 3400 Hz followed by a single-ended
power amplifier capable of driving low impedance loads
The devices require two 1 536 MHz 1 544 MHz or 2 048
MHz transmit and receive master clocks which may be
asynchronous transmit and receive bit clocks which may
vary from 64 kHz to 2 048 MHz and transmit and receive
frame sync pulses The timing of the frame sync pulses and
PCM data is compatible with both industry standard formats
Features
Y
Complete CODEC and filtering system (COMBO)
including
Transmit high-pass and low-pass filtering
Receive low-pass filter with sin x x correction
Active RC noise filters
m
-law or A-law compatible COder and DECoder
Internal precision voltage reference
Serial I O interface
Internal auto-zero circuitry
Y
m
-law 16-pin
TP3054
Y
A-law 16-pin
TP3057
Y
Designed for D3 D4 and CCITT applications
Y
g
5V operation
Y
Low operating power
typically 50 mW
Y
Power-down standby mode
typically 3 mW
Y
Automatic power-down
Y
TTL or CMOS compatible digital interfaces
Y
Maximizes line interface card circuit density
Y
Dual-In-Line or surface mount packages
Y
See also AN-370 ``Techniques for Designing with
CODEC Filter COMBO Circuits''
Connection Diagrams
Dual-In-Line Package
TL H 5510 1
Top View
Order Number TP3054J or TP3057J
See NS Package Number J16A
Order Number TP3054N or TP3057N
See NS Package Number N16A
Order Number TP3054WM or TP3057WM
See NS Package Number M16B
Plastic Chip Carriers
TL H 5510 10
Top View
Order Number TP3057V
See NS Package Number V20A
COMBO
and TRI-STATE
are registered trademarks of National Semiconductor Corporation
C1995 National Semiconductor Corporation
RRD-B30M125 Printed in U S A
Block Diagram
FIGURE 1
TL H 5510 2
Pin Description
Symbol
Function
V
BB
Negative power supply pin
V
BB
e b
5V
g
5%
GNDA
Analog ground All signals are referenced
to this pin
VF
R
O
Analog output of the receive power ampli-
fier
V
CC
Positive power supply pin
V
CC
e a
5V
g
5%
FS
R
Receive frame sync pulse which enables
BCLK
R
to shift PCM data into D
R
FS
R
is
an 8 kHz pulse train See
Figures 2 and 3
for timing details
D
R
Receive data input PCM data is shifted
into D
R
following the FS
R
leading edge
BCLK
R
CLKSEL The bit clock which shifts data into D
R
af-
ter the FS
R
leading edge May vary from
64 kHz to 2 048 MHz Alternatively may
be a logic input which selects either
1 536 MHz 1 544 MHz or 2 048 MHz for
master clock in synchronous mode and
BCLK
X
is used for both transmit and re-
ceive directions (see Table I)
MCLK
R
PDN
Receive
master
clock
Must
be
1 536 MHz 1 544 MHz or 2 048 MHz
May be asynchronous with MCLK
X
but
Symbol
Function
should be synchronous with MCLK
X
for best per-
formance When MCLK
R
is connected continu-
ously low MCLK
X
is selected for all internal tim-
ing When MCLK
R
is connected continuously
high the device is powered down
MCLK
X
Transmit master clock Must be 1 536 MHz
1 544 MHz or 2 048 MHz May be asynchronous
with MCLK
R
Best performance is realized from
synchronous operation
FS
X
Transmit frame sync pulse input which enables
BCLK
X
to shift out the PCM data on D
X
FS
X
is
an 8 kHz pulse train see
Figures 2 and 3 for
timing details
BCLK
X
The bit clock which shifts out the PCM data on
D
X
May vary from 64 kHz to 2 048 MHz but
must be synchronous with MCLK
X
D
X
The TRI-STATE
PCM data output which is en-
abled by FS
X
TS
X
Open drain output which pulses low during the
encoder time slot
GS
X
Analog output of the transmit input amplifier
Used to externally set gain
VF
X
I
b
Inverting input of the transmit input amplifier
VF
X
I
a
Non-inverting input of the transmit input amplifi-
er
2
Functional Description
POWER-UP
When power is first applied power-on reset circuitry initializ-
es the COMBO and places it into a power-down state All
non-essential circuits are deactivated and the D
X
and VF
R
O
outputs are put in high impedance states To power-up the
device a logical low level or clock must be applied to the
MCLK
R
PDN pin
and FS
X
and or FS
R
pulses must be pres-
ent Thus 2 power-down control modes are available The
first is to pull the MCLK
R
PDN pin high the alternative is to
hold both FS
X
and FS
R
inputs continuously low
the device
will power-down approximately 1 ms after the last FS
X
or
FS
R
pulse Power-up will occur on the first FS
X
or FS
R
pulse The TRI-STATE PCM data output D
X
will remain in
the high impedance state until the second FS
X
pulse
SYNCHRONOUS OPERATION
For synchronous operation the same master clock and bit
clock should be used for both the transmit and receive di-
rections In this mode a clock must be applied to MCLK
X
and the MCLK
R
PDN pin can be used as a power-down
control A low level on MCLK
R
PDN powers up the device
and a high level powers down the device In either case
MCLK
X
will be selected as the master clock for both the
transmit and receive circuits A bit clock must also be ap-
plied to BCLK
X
and the BCLK
R
CLKSEL can be used to
select the proper internal divider for a master clock of 1 536
MHz 1 544 MHz or 2 048 MHz For 1 544 MHz operation
the device automatically compensates for the 193rd clock
pulse each frame
With a fixed level on the BCLK
R
CLKSEL pin BCLK
X
will be
selected as the bit clock for both the transmit and receive
directions Table 1 indicates the frequencies of operation
which can be selected depending on the state of BCLK
R
CLKSEL In this synchronous mode the bit clock BCLK
X
may be from 64 kHz to 2 048 MHz but must be synchro-
nous with MCLK
X
Each FS
X
pulse begins the encoding cycle and the PCM
data from the previous encode cycle is shifted out of the
enabled D
X
output on the positive edge of BCLK
X
After 8
bit clock periods the TRI-STATE D
X
output is returned to a
high impedance state With an FS
R
pulse PCM data is
latched via the D
R
input on the negative edge of BCLK
X
(or
BCLK
R
if running) FS
X
and FS
R
must be synchronous with
MCLK
X R
TABLE I Selection of Master Clock Frequencies
BCLK
R
CLKSEL
Master Clock
Frequency Selected
TP3057
TP3054
Clocked
2 048 MHz
1 536 MHz or
1 544 MHz
0
1 536 MHz or
2 048 MHz
1 544 MHz
1
2 048 MHz
1 536 MHz or
1 544 MHz
ASYNCHRONOUS OPERATION
For asynchronous operation separate transmit and receive
clocks may be applied
MCLK
X
and MCLK
R
must be
2 048 MHz for the TP3057 or 1 536 MHz 1 544 MHz for the
TP3054 and need not be synchronous For best transmis-
sion performance however MCLK
R
should be synchronous
with MCLK
X
which is easily achieved by applying only static
logic levels to the MCLK
R
PDN pin This will automatically
connect MCLK
X
to all internal MCLK
R
functions (see Pin
Description) For 1 544 MHz operation the device automati-
cally compensates for the 193rd clock pulse each frame
FS
X
starts each encoding cycle and must be synchronous
with MCLK
X
and BCLK
X
FS
R
starts each decoding cycle
and must be synchronous with BCLK
R
BCLK
R
must be a
clock the logic levels shown in Table 1 are not valid in
asynchronous mode BCLK
X
and BCLK
R
may operate from
64 kHz to 2 048 MHz
SHORT FRAME SYNC OPERATION
The COMBO can utilize either a short frame sync pulse or a
long frame sync pulse Upon power initialization the device
assumes a short frame mode In this mode both frame sync
pulses FS
X
and FS
R
must be one bit clock period long
with timing relationships specified in
Figure 2 With FS
X
high
during a falling edge of BCLK
X
the next rising edge of
BCLK
X
enables the D
X
TRI-STATE output buffer which will
output the sign bit The following seven rising edges clock
out the remaining seven bits and the next falling edge dis-
ables the D
X
output With FS
R
high during a falling edge of
BCLK
R
(BCLK
X
in synchronous mode) the next falling edge
of BCLK
R
latches in the sign bit The following seven falling
edges latch in the seven remaining bits All four devices
may utilize the short frame sync pulse in synchronous or
asynchronous operating mode
LONG FRAME SYNC OPERATION
To use the long frame mode both the frame sync pulses
FS
X
and FS
R
must be three or more bit clock periods long
with timing relationships specified in
Figure 3 Based on the
transmit frame sync FS
X
the COMBO will sense whether
short or long frame sync pulses are being used For 64 kHz
operation the frame sync pulse must be kept low for a mini-
mum of 160 ns The D
X
TRI-STATE output buffer is enabled
with the rising edge of FS
X
or the rising edge of BCLK
X
whichever comes later and the first bit clocked out is the
sign bit The following seven BCLK
X
rising edges clock out
the remaining seven bits The D
X
output is disabled by the
falling BCLK
X
edge following the eighth rising edge or by
FS
X
going low whichever comes later A rising edge on the
receive frame sync pulse FS
R
will cause the PCM data at
D
R
to be latched in on the next eight falling edges of BCLK
R
(BCLK
X
in synchronous mode) All four devices may utilize
the long frame sync pulse in synchronous or asynchronous
mode
In applications where the LSB bit is used for signalling with
FS
R
two bit clock periods long the decoder will interpret the
lost LSB as ``
'' to minimize noise and distortion
3
Functional Description
(Continued)
TRANSMIT SECTION
The transmit section input is an operational amplifier with
provision for gain adjustment using two external resistors
see
Figure 4 The low noise and wide bandwidth allow gains
in excess of 20 dB across the audio passband to be real-
ized The op amp drives a unity-gain filter consisting of RC
active pre-filter followed by an eighth order switched-ca-
pacitor bandpass filter clocked at 256 kHz The output of
this filter directly drives the encoder sample-and-hold circuit
The A D is of companding type according to m-law
(TP3054) or A-law (TP3057) coding conventions A preci-
sion voltage reference is trimmed in manufacturing to pro-
vide an input overload (t
MAX
) of nominally 2 5V peak (see
table of Transmission Characteristics) The FS
X
frame sync
pulse controls the sampling of the filter output and then the
successive-approximation encoding cycle begins The 8-bit
code is then loaded into a buffer and shifted out through D
X
at the next FS
X
pulse The total encoding delay will be ap-
proximately 165 ms (due to the transmit filter) plus 125 ms
(due to encoding delay) which totals 290 ms Any offset
voltage due to the filters or comparator is cancelled by sign
bit integration
RECEIVE SECTION
The receive section consists of an expanding DAC which
drives a fifth order switched-capacitor low pass filter
clocked at 256 kHz The decoder is A-law (TP3057) or
m
-law (TP3054) and the 5th order low pass filter corrects for
the sin x x attenuation due to the 8 kHz sample hold The
filter is then followed by a 2nd order RC active post-filter
power amplifer capable of driving a 600X load to a level of
7 2 dBm The receive section is unity-gain Upon the occur-
rence of FS
R
the data at the D
R
input is clocked in on the
falling edge of the next eight BCLK
R
(BCLK
X
) periods At
the end of the decoder time slot the decoding cycle begins
and 10 ms later the decoder DAC output is updated The
total decoder delay is E 10 ms (decoder update) plus
110 ms (filter delay) plus 62 5 ms (
frame) which gives
approximately 180 ms
4
Absolute Maximum Ratings
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
V
CC
to GNDA
7V
V
BB
to GNDA
b
7V
Voltage at any Analog Input
or Output
V
CC
a
0 3V to V
BB
b
0 3V
Voltage at any Digital Input or
Output
V
CC
a
0 3V to GNDA
b
0 3V
Operating Temperature Range
b
25 C to
a
125 C
Storage Temperature Range
b
65 C to
a
150 C
Lead Temperature (Soldering 10 seconds)
300 C
ESD (Human Body Model)
2000V
Latch-Up Immunity
e
100 mA on any Pin
Electrical Characteristics
Unless otherwise noted limits printed in BOLD characters are guaranteed for V
CC
e
5 0V
g
5% V
BB
e b
5 0V
g
5% T
A
e
0 C to 70 C by correlation with 100% electrical testing at T
A
e
25 C All other limits
are assured by correlation with other production tests and or product design and characterization All signals referenced to
GNDA Typicals specified at V
CC
e
5 0V V
BB
e b
5 0V T
A
e
25 C
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DIGITAL INTERFACE
V
IL
Input Low Voltage
0 6
V
V
IH
Input High Voltage
2 2
V
V
OL
Output Low Voltage
D
X
I
L
e
3 2 mA
0 4
V
SIG
R
I
L
e
1 0 mA
0 4
V
TS
X
I
L
e
3 2 mA Open Drain
0 4
V
V
OH
Output High Voltage
D
X
I
H
e b
3 2 mA
2 4
V
SIG
R
I
H
e b
1 0 mA
2 4
V
I
IL
Input Low Current
GNDA
s
V
IN
s
V
IL
All Digital Inputs
b
10
10
m
A
I
IH
Input High Current
V
IH
s
V
IN
s
V
CC
b
10
10
m
A
I
OZ
Output Current in High Impedance
D
X
GNDA
s
V
O
s
V
CC
b
10
10
m
A
State (TRI-STATE)
ANALOG INTERFACE WITH TRANSMIT INPUT AMPLIFIER (ALL DEVICES)
I
I
XA
Input Leakage Current
b
2 5V
s
V
s
a
2 5V VF
X
I
a
or VF
X
I
b
b
200
200
nA
R
I
XA
Input Resistance
b
2 5V
s
V
s
a
2 5V VF
X
I
a
or VF
X
I
b
10
MX
R
O
XA
Output Resistance
Closed Loop Unity Gain
1
3
X
R
L
XA
Load Resistance
GS
X
10
kX
C
L
XA
Load Capacitance
GS
X
50
pF
V
O
XA
Output Dynamic Range
GS
X
R
L
t
10 kX
b
2 8
2 8
V
A
V
XA
Voltage Gain
VF
X
I
a
to GS
X
5000
V V
F
U
XA
Unity Gain Bandwidth
1
2
MHz
V
OS
XA
Offset Voltage
b
20
20
mV
V
CM
XA
Common-Mode Voltage
CMRRXA
l
60 dB
b
2 5
2 5
V
CMRRXA
Common-Mode Rejection Ratio
DC Test
60
dB
PSRRXA
Power Supply Rejection Ratio
DC Test
60
dB
ANALOG INTERFACE WITH RECEIVE FILTER (ALL DEVICES)
R
O
RF
Output Resistance
Pin VF
R
O
1
3
X
R
L
RF
Load Resistance
VF
R
O
e
g
2 5V
600
X
C
L
RF
Load Capacitance
500
pF
VOS
R
O
Output DC Offset Voltage
b
200
200
mV
POWER DISSIPATION (ALL DEVICES)
I
CC
0
Power-Down Current
No Load (Note)
0 5
1 5
mA
I
BB
0
Power-Down Current
No Load (Note)
0 05
0 3
mA
I
CC
1
Power-Up Active Current
No Load
5 0
9 0
mA
I
BB
1
Power-Up Active Current
No Load
5 0
9 0
mA
Note
I
CC0
and I
BB0
are measured after first achieving a power-up state
5
Timing Specifications
Unless otherwise noted limits printed in BOLD characters are guaranteed for V
CC
e
5 0V
g
5% V
BB
e b
5 0V
g
5% T
A
e
0 C to 70 C by correlation with 100% electrical testing at T
A
e
25 C All other limits are
assured by correlation with other production tests and or product design and characterization All signals referenced to GNDA
Typicals specified at V
CC
e
5 0V V
BB
e b
5 0V T
A
e
25 C All timing parameters are measured at V
OH
e
2 0V and V
OL
e
0 7V See Definitions and Timing Conventions section for test methods information
Symbol
Parameter
Conditions
Min
Typ
Max
Units
1 t
PM
Frequency of Master Clocks
Depends on the Device Used and the
1 536
MHz
BCLK
R
CLKSEL Pin
1 544
MHz
MCLK
X
and MCLK
R
2 048
MHz
t
RM
Rise Time of Master Clock
MCLK
X
and MCLK
R
50
ns
t
FM
Fall Time of Master Clock
MCLK
X
and MCLK
R
50
ns
t
PB
Period of Bit Clock
485
488
15725
ns
t
RB
Rise Time of Bit Clock
BCLK
X
and BCLK
R
50
ns
t
FB
Fall Time of Bit Clock
BCLK
X
and BCLK
R
50
ns
t
WMH
Width of Master Clock High
MCLK
X
and MCLK
R
160
ns
t
WML
Width of Master Clock Low
MCLK
X
and MCLK
R
160
ns
t
SBFM
Set-Up Time from BCLK
X
High
First Bit Clock after the Leading
100
ns
to MCLK
X
Falling Edge
Edge of FS
X
t
SFFM
Set-Up Time from FS
X
High
Long Frame Only
100
ns
to MCLK
X
Falling Edge
t
WBH
Width of Bit Clock High
V
IH
e
2 2V
160
ns
t
WBL
Width of Bit Clock Low
V
IL
e
0 6V
160
ns
t
HBFL
Holding Time from Bit Clock
Long Frame Only
0
ns
Low to Frame Sync
t
HBFS
Holding Time from Bit Clock
Short Frame Only
0
ns
High to Frame Sync
t
SFB
Set-Up Time from Frame Sync
Long Frame Only
80
ns
to Bit Clock Low
t
DBD
Delay Time from BCLK
X
High
Load
e
150 pF plus 2 LSTTL Loads
0
140
ns
to Data Valid
t
DBTS
Delay Time to TS
X
Low
Load
e
150 pF plus 2 LSTTL Loads
140
ns
t
DZC
Delay Time from BCLK
X
Low to
C
L
e
0 pF to 150 pF
50
165
ns
Data Output Disabled
t
DZF
Delay Time to Valid Data from
C
L
e
0 pF to 150 pF
20
165
ns
FS
X
or BCLK
X
Whichever
Comes Later
t
SDB
Set-Up Time from D
R
Valid to
50
ns
BCLK
R X
Low
t
HBD
Hold Time from BCLK
R X
Low to
50
ns
D
R
Invalid
t
SF
Set-Up Time from FS
X R
to
Short Frame Sync Pulse (1 Bit Clock
50
ns
BCLK
X R
Low
Period Long)
t
HF
Hold Time from BCLK
X R
Low
Short Frame Sync Pulse (1 Bit Clock
100
ns
to FS
X R
Low
Period Long)
t
HBFl
Hold Time from 3rd Period of
Long Frame Sync Pulse (from 3 to 8 Bit
100
ns
Bit Clock Low to Frame Sync
Clock Periods Long)
(FS
X
or FS
R
)
t
WFL
Minimum Width of the Frame
64k Bit s Operating Mode
160
ns
Sync Pulse (Low Level)
6
Timing Diagrams
TLH5510
3
FIGURE
2
Short
Frame
Sync
Timing
7
Timing Diagrams
(Continued)
TLH5510
4
FIGURE
3
Long
Frame
Sync
Timing
8
Transmission Characteristics
Unless otherwise noted limits printed in BOLD characters are guaranteed for
V
CC
e
5 0V
g
5% V
BB
e b
5 0V
g
5% T
A
e
0 C to 70 C by correlation with 100% electrical testing at T
A
e
25 C All other
limits are assured by correlation with other production tests and or product design and characterization GNDA
e
0V f
e
1 02 kHz V
IN
e
0 dBm0 transmit input amplifier connected for unity gain non-inverting Typicals specified at V
CC
e
5 0V V
BB
e b
5 0V T
A
e
25 C
Symbol
Parameter
Conditions
Min
Typ
Max
Units
AMPLITUDE RESPONSE
Absolute Levels
Nominal 0 dBm0 Level is 4 dBm
(Definition of Nominal Gain)
(600X)
0 dBm0
1 2276
Vrms
t
MAX
Virtual Decision Valve Defined
Max Overload Level
Per CCITT Rec G711
TP3054 (3 17 dBm0)
2 501
V
PK
TP3057 (3 14 dBm0)
2 492
V
PK
G
XA
Transmit Gain Absolute
T
A
e
25 C V
CC
e
5V V
BB
e b
5V
Input at GS
X
e
0 dBm0 at 1020 Hz
TP3054 57
b
0 15
0 15
dB
G
XR
Transmit Gain Relative to G
XA
f
e
16 Hz
b
40
dB
f
e
50 Hz
b
30
dB
f
e
60 Hz
b
26
dB
f
e
200 Hz
b
1 8
b
0 1
dB
f
e
300 Hz
b
3000 Hz
b
0 15
0 15
dB
f
e
3300 Hz
b
0 35
0 05
dB
f
e
3400 Hz
b
0 7
0
dB
f
e
4000 Hz
b
14
dB
f
e
4600 Hz and Up Measure
b
32
dB
Response from 0 Hz to 4000 Hz
G
XAT
Absolute Transmit Gain Variation
Relative to G
XA
b
0 1
0 1
dB
with Temperature
G
XAV
Absolute Transmit Gain Variation
Relative to G
XA
b
0 05
0 05
dB
with Supply Voltage
G
XRL
Transmit Gain Variations with
Sinusoidal Test Method
Level
Reference Level
e b
10 dBm0
VF
X
I
a
e b
40 dBm0 to
a
3 dBm0
b
0 2
0 2
dB
VF
X
I
a
e b
50 dBm0 to
b
40 dBm0
b
0 4
0 4
dB
VF
X
I
a
e b
55 dBm0 to
b
50 dBm0
b
1 2
1 2
dB
G
RA
Receive Gain Absolute
T
A
e
25 C V
CC
e
5V V
BB
e b
5V
Input
e
Digital Code Sequence for
0 dBm0 Signal at 1020 Hz
TP3054 57
b
0 15
0 15
dB
G
RR
Receive Gain Relative to G
RA
f
e
0 Hz to 3000 Hz
b
0 15
0 15
dB
f
e
3300 Hz
b
0 35
0 05
dB
f
e
3400 Hz
b
0 7
0
dB
f
e
4000 Hz
b
14
dB
G
RAT
Absolute Receive Gain Variation
Relative to G
RA
b
0 1
0 1
dB
with Temperature
G
RAV
Absolute Receive Gain Variation
Relative to G
RA
b
0 05
0 05
dB
with Supply Voltage
G
RRL
Receive Gain Variations with
Sinusoidal Test Method Reference
Level
Input PCM Code Corresponds to an
Ideally Encoded PCM Level
e b
40 dBm0 to
a
3 dBm0
b
0 2
0 2
dB
e b
50 dBm0 to
b
40 dBm0
b
0 4
0 4
dB
e b
55 dBm0 to
b
50 dBm0
b
1 2
1 2
dB
V
RO
Receive Output Drive Level
R
L
e
600X
b
2 5
2 5
V
9
Transmission Characteristics
(Continued) Unless otherwise noted limits printed in BOLD characters are
guaranteed for V
CC
e
5 0V
g
5% V
BB
e b
5 0V
g
5% T
A
e
0 C to 70 C by correlation with 100% electrical testing at T
A
e
25 C All other limits are assured by correlation with other production tests and or product design and characterization GNDA
e
0V f
e
1 02 kHz V
IN
e
0 dBm0 transmit input amplifier connected for unity gain non-inverting Typicals specified at V
CC
e
5 0V V
BB
e b
5 0V T
A
e
25 C
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ENVELOPE DELAY DISTORTION WITH FREQUENCY
D
XA
Transmit Delay Absolute
f
e
1600 Hz
290
315
m
s
D
XR
Transmit Delay Relative to D
XA
f
e
500 Hz 600 Hz
195
220
m
s
f
e
600 Hz 800 Hz
120
145
m
s
f
e
800 Hz 1000 Hz
50
75
m
s
f
e
1000 Hz 1600 Hz
20
40
m
s
f
e
1600 Hz 2600 Hz
55
75
m
s
f
e
2600 Hz 2800 Hz
80
105
m
s
f
e
2800 Hz 3000 Hz
130
155
m
s
D
RA
Receive Delay Absolute
f
e
1600 Hz
180
200
m
s
D
RR
Receive Delay Relative to D
RA
f
e
500 Hz 1000 Hz
b
40
b
25
m
s
f
e
1000 Hz 1600 Hz
b
30
b
20
m
s
f
e
1600 Hz 2600 Hz
70
90
m
s
f
e
2600 Hz 2800 Hz
100
125
m
s
f
e
2800 Hz 3000 Hz
145
175
m
s
NOISE
N
XC
Transmit Noise C Message
TP3054
12
15
dBrnC0
Weighted
N
XP
Transmit Noise P Message
TP3057
b
74
b
67
dBm0p
Weighted
N
RC
Receive Noise C Message
PCM Code is Alternating Positive
Weighted
and Negative Zero
TP3054
8
11
dBrnC0
N
RP
Receive Noise P Message
PCM Code Equals Positive
Weighted
Zero
TP3057
b
82
b
79
dBm0p
N
RS
Noise Single Frequency
f
e
0 kHz to 100 kHz Loop Around
b
53
dBm0
Measurement VF
X
I
a
e
0 Vrms
PPSR
X
Positive Power Supply Rejection
VF
X
I
a
e b
50 dBm0
Transmit
V
CC
e
5 0 V
DC
a
100 mVrms
f
e
0 kHz 50 kHz (Note 2)
40
dBC
NPSR
X
Negative Power Supply Rejection
VF
X
I
a
e b
50 dBm0
Transmit
V
BB
e b
5 0 V
DC
a
100 mVrms
f
e
0 kHz 50 kHz (Note 2)
40
dBC
PPSR
R
Positive Power Supply Rejection
PCM Code Equals Positive Zero
Receive
V
CC
e
5 0 V
DC
a
100 mVrms
Measure VF
R
0
f
e
0 Hz 4000 Hz
40
dBC
f
e
4 kHz 25 kHz
40
dB
f
e
25 kHz 50 kHz
36
dB
NPSR
R
Negative Power Supply Rejection
PCM Code Equals Positive Zero
Receive
V
BB
e b
5 0 V
DC
a
100 mVrms
Measure VF
R
0
f
e
0 Hz 4000 Hz
40
dBC
f
e
4 kHz 25 kHz
40
dB
f
e
25 kHz 50 kHz
36
dB
10
Transmission Characteristics
(Continued) Unless otherwise noted limits printed in BOLD characters are
guaranteed for V
CC
e
5 0V
g
5% V
BB
e b
5 0V
g
5% T
A
e
0 C to 70 C by correlation with 100% electrical testing at T
A
e
25 C All other limits are assured by correlation with other production tests and or product design and characterization GNDA
e
0V f
e
1 02 kHz V
IN
e
0 dBm0 transmit input amplifier connected for unity gain non-inverting Typicals specified at V
CC
e
5 0V V
BB
e b
5 0V T
A
e
25 C
Symbol
Parameter
Conditions
Min
Typ
Max
Units
SOS
Spurious Out-of-Band Signals
Loop Around Measurement 0 dBm0
b
30
dB
at the Channel Output
300 Hz to 3400 Hz Input PCM Code Applied
at D
R
4600 Hz 7600 Hz
b
30
dB
7600 Hz 8400 Hz
b
40
dB
8400 Hz 100 000 Hz
b
30
dB
DISTORTION
STD
X
Signal to Total Distortion
Sinusoidal Test Method (Note 3)
STD
R
Transmit or Receive
e
3 0 dBm0
Level
33
dBC
Half-Channel
e
0 dBm0 to
b
30 dBm0
36
dBC
XMT
e b
40 dBm0
29
dBC
RCV
30
dBC
XMT
e b
55 dBm0
14
dBC
RCV
15
dBC
SFD
X
Single Frequency Distortion
b
46
dB
Transmit
SFD
R
Single Frequency Distortion
b
46
dB
Receive
IMD
Intermodulation Distortion
Loop Around Measurement
b
41
dB
VF
X
a
e b
4 dBm0 to
b
21 dBm0 Two
Frequencies in the Range
300 Hz 3400 Hz
CROSSTALK
CT
X-R
Transmit to Receive Crosstalk
f
e
300 Hz 3400 Hz
0 dBm0 Transmit Level
D
R
e
Quiet PCM Code
b
90
b
75
dB
CT
R-X
Receive to Transmit Crosstalk
f
e
300 Hz 3400 Hz VF
X
I
e
Multitone
b
90
b
70
dB
0 dBm0 Receive Level
(Note 2)
ENCODING FORMAT AT D
X
OUTPUT
TP3054
TP3057
m-Law
A-Law
(Includes Even Bit Inversion)
V
IN
(at GS
X
)
e a
Full-Scale
1
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
V
IN
(at GS
X
)
e
0V
1
1
1
1
1
1
1
1
1
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
0
1
0
1
0
1
0
1
V
IN
(at GS
X
)
e b
Full-Scale
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
Note 1
Measured by extrapolation from the distortion test result at
b
50 dBm0
Note 2
PPSR
X
NPSR
X
and CT
R-X
are measured with a
b
50 dBm0 activation signal applied to VF
X
I
a
Note 3
Devices are measured using C message weighted filter for m-Law and psophometric weighted filter for A-Law
11
Applications Information
POWER SUPPLIES
While the pins of the TP305X family are well protected
against electrical misuse it is recommended that the stan-
dard CMOS practice be followed ensuring that ground is
connected to the device before any other connections are
made In applications where the printed circuit board may be
plugged into a ``hot'' socket with power and clocks already
present an extra long ground pin in the connector should
be used
All ground connections to each device should meet at a
common point as close as possible to the GNDA pin This
minimizes the interaction of ground return currents flowing
through a common bus impedance 0 1 mF supply decou-
pling capacitors should be connected from this common
ground point to V
CC
and V
BB
as close to the device as
possible
For best performance the ground point of each CODEC
FILTER on a card should be connected to a common card
ground in star formation rather than via a ground bus
This common ground point should be decoupled to V
CC
and
V
BB
with 10 mF capacitors
RECEIVE GAIN ADJUSTMENT
For applications where a TP305X family CODEC filter re-
ceive output must drive a 600X load but a peak swing lower
than
g
2 5V is required the receive gain can be easily ad-
justed by inserting a matched T-pad or
q
-pad at the output
Table II lists the required resistor values for 600X termina-
tions As these are generally non-standard values the equa-
tions can be used to compute the attenuation of the closest
practical set of resistors It may be necessary to use un-
equal values for the R1 or R4 arms of the attenuators to
achieve a precise attenuation Generally it is tolerable to
allow a small deviation of the input impedance from nominal
while still maintaining a good return loss For example a 30
dB return loss against 600X is obtained if the output imped-
ance of the attenuator is in the range 282X to 319X (as-
suming a perfect transformer)
T-Pad Attenuator
R1
e
Z1
N
2 a
1
N
2 b
1
J
b
2
0
Z1 Z2
N
N
2 b
1
J
R2
e
2
0
Z1 Z2
N
N
2 b
1
J
Where N
e
0
POWER IN
POWER OUT
and
S
e
0
Z1
Z2
Also Z
e
0
Z
SC
Z
OC
Where Z
SC
e
impedance with short circuit termination
and Z
OC
e
impedance with open circuit termination
q
-Pad Attenuator
TL H 5510 5
R3
e
0
Z1 Z2
2
N
2 b
1
N
J
R3
e
Z1
N
2 b
1
N
2 b
2NS
a
1
J
Note
See Application Note 370 for further details
12
Applications Information
(Continued)
TABLE II Attentuator Tables for Z1
e
Z2
e
300X
(All Values in X)
dB
R1
R2
R3
R4
0 1
1 7
26k
3 5
52k
0 2
3 5
13k
6 9
26k
0 3
5 2
8 7k
10 4
17 4k
0 4
6 9
6 5k
13 8
13k
0 5
8 5
5 2k
17 3
10 5k
0 6
10 4
4 4k
21 3
8 7k
0 7
12 1
3 7k
24 2
7 5k
0 8
13 8
3 3k
27 7
6 5k
0 9
15 5
2 9k
31 1
5 8k
1 0
17 3
2 6l
34 6
5 2k
2
34 4
1 3k
70
2 6k
3
51 3
850
107
1 8k
4
68
650
144
1 3k
5
84
494
183
1 1k
6
100
402
224
900
7
115
380
269
785
8
379
284
317
698
9
143
244
370
630
10
156
211
427
527
11
168
184
490
535
12
180
161
550
500
13
190
142
635
473
14
200
125
720
450
15
210
110
816
430
16
218
98
924
413
18
233
77
1 17k
386
20
246
61
1 5k
366
Typical Synchronous Application
TL H 5510 6
Note 1
XMIT gain
e
20
c
log
R1
a
R2
R2
J
where (R1
a
R2)
l
10 KX
FIGURE 4
13
Connection Diagrams
(Continued)
Plastic Chip Carrier
TL H 5510 7
Top View
Order Number TP3057V
See NS Package Number V20A
14
Physical Dimensions
inches (millimeters)
Cavity Dual-In-Line Package (J)
Order Number TP3054J or TP3057J
NS Package Number J16A
Molded Small Outline Package (WM)
Order Number TP3054WM or TP3057WM
NS Package Number M16B
15
TP3054
TP3057
``Enhanced''
Serial
Interface
CODECFilter
COMBO
Family
Physical Dimensions
inches (millimeters) (Continued)
Molded Dual-In-Line Package (N)
Order Number TP3054N or TP3057N
NS Package Number N16A
LIFE SUPPORT POLICY
NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION As used herein
1 Life support devices or systems are devices or
2 A critical component is any component of a life
systems which (a) are intended for surgical implant
support device or system whose failure to perform can
into the body or (b) support or sustain life and whose
be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance
support device or system or to affect its safety or
with instructions for use provided in the labeling can
effectiveness
be reasonably expected to result in a significant injury
to the user
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Corporation
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