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Электронный компонент: NTE937M

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NTE937M
Integrated Circuit
JFET Input Operational Amplifier
Description:
The NTE937M is a monolithic JFET input operational amplifier in an 8Lead DIP type package incor-
porating wellmatched, high voltage JFET's on the same chip with standard bipolar transistors. This
amplifier features low input bias and offset currents, low offset voltage and offset voltage drift, coupled
with offset adjust which does not degrade drift or commonmode rejection. It is also designed for high
slew rate, wide bandwidth, extremely fast settling time, low voltage and current noise and a low 1/f
noise corner.
Advantages:
D
Replaces Expensive Hybrid and Module FET OP Amps
D
Rugged JFET's Allow BlowOut Free Handling Compared with MOSFET Input Device
D
Excellent for Low Noise Applications using either High or Low Source Impedance Very Low
1/f Corner
D
Offset Adjust does not Degrade Drift or CommonMode Rejection as in Most Monolithic Amplifiers
D
New Output Stage Allows use of Large Capacitive Loads (10,000pF) without Stability Problems
D
Internal Compensation and Large Differential Input Voltage Capability
Applications:
D
Precision High Speed Integrators
D
Fast D/A and A/D Converters
D
High Impedance Buffers
D
Wideband, Low Noise, Low Drift Amplifiers
D
Logarithmic Amplifiers
D
Photocell Amplifiers
D
Sample and Hold Circuits
Absolute Maximum Ratings:
Supply Voltage
18V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Power Dissipation (at +25
C, Note 1), P
d
500mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential Input Voltage
30V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage Range (Note 2)
16V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output ShortCircuit Duration
Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Operating Junction Temperature (Note 1), T
J
max
+100
C
. . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature Range, T
stg
65
to +150
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (During Soldering, 10sec), T
L
+300
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance, JunctiontoAmbient (Note 1), R
thJC
+155
C/W
. . . . . . . . . . . . . . . . . . . . . . . . .
Note 1. The maximum power dissipation for this device must be derated at elevated temperatures
and is dictated by T
J
max, R
thJC
, and the ambient temperature, T
A
. The maximum available
power dissipation at any temperature is P
d
= (T
J
max T
A
)/R
thJC
or the +25
C P
d
max, which-
ever is less.
Note 2. Unless otherwise specified, the absolute maximum negative input voltage is equal to the
negative power supply voltage.
DC Electrical Characteristics: (T
A
= +25C, V
S
=
15V unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Supply Current
I
CC
5
10
mA
DC Electrical Characteristics: (V
S
=
15V, 0
T
A
+70
C, T
HIGH
= +70
C unles otherwise
specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Offset Voltage
V
OS
R
S
= 50
, T
A
= +25
C
3
10
mV
Over Temperature
13
mV
Average TC of Input Offset Voltage
V
OS
/
T
R
S
= 50
5
V/
C
Change in Average TC with V
OS
Adjust
TC/
V
OS
R
S
= 50
, Note 3
0.5
V/
C
Input Offset Current
I
OS
T
J
= +25
C, Note 4
3
50
pA
T
J
T
HIGH
2
nA
Input Bias Current
I
B
T
J
= +25
C, Note 4
30
200
pA
T
J
T
HIGH
8
nA
Input Resistance
R
IN
T
J
= +25
C
10
12
Large Signal Voltage Gain
A
VOL
T
A
= +25
C, V
O
=
10V,
R
L
= 2k
25
200
V/mV
Over Temperature
15
V/mV
Output Voltage Swing
V
O
R
L
= 10k
12
13
V
R
L
= 2k
10
12
V
Input CommonMode Voltage Range
V
CM
10
+15.1
12
V
CommonMode Rejection Ratio
CMRR
80
100
dB
Supply Voltage Rejection Ratio
PSRR
Note 5
80
100
dB
Note 3. The temperature coeficient of the adjust input offset voltage changes only a small amount
(0.5
V/
C typically) for each mV of adjustment from its original unadjusted value. Common
mode rejection and open loop voltage gain are also unaffected by offset adjustment.
Note 4. The input bias currents are junction leakage currents which approximately double for every
10
C increase in the junction temperature, T
J
. Due to limited production test time, the input
bias currents measured are correlated to junction temperature. In normal operation the junc-
tion temperature rises above the ambient temperature as a result of internal power dissipa-
tion, P
d
. T
J
= T
A
+ R
thJC
P
d
where R
thJC
is the thermal resistance from junction to ambient.
Use of a heat sink is recommended if input bias current is to be kept to a minimum.
Note 5. Supply Voltage Rejection is measured for both supply magnitudes increasing or decreasing
simultaneously, in accordance with common practice.
AC Electrical Characteristics: (T
A
= +25C, V
S
=
15V unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Slew Rate
SR
A
V
= 5
30
50
V/
s
Gain Bandwidth Product
GBW
20
MHz
Settling Time to 0.01%
t
s
Note 6
1.5
s
Equivalent Input Noise Voltage
e
N
R
S
= 100
f = 100Hz
15
nV/
Hz
f = 1000Hz
12
nV/
Hz
Equivalent Input Current Noise
i
N
f = 100Hz
0.01
pA/
Hz
f = 1000Hz
0.01
pA/
Hz
Input Capacitance
C
IN
3
pF
Note 6. A
V
= 5, the feedback resistor from output to input is 2k
and the output step is 10V.
Pin Connection Diagram
V
CC
N.C.
V
EE
Output
Inverting Input
1
2
3
4
Offset Null
NonInverting Input
8
7
6
5
Offset Null
1
4
.260 (6.6)
.390 (9.9)
Max
8
5
.155
(3.93)
.145 (3.68)
.300
(7.62)
.300 (7.62)
.100 (2.54)