¡ Semiconductor

ML63512A/63514A

1/29

GENERAL DESCRIPTION

The ML63512A/63514A is a CMOS 4-bit microcontroller with built-in level detector and
operates at 0.9 V (min.).
The ML63512A/63514A is an M6351x series mask ROM-version product of OLMS-63K family,
which employs Oki's original CPU core nX-4/250.
The program memory capacity and data memory capacity of the ML63512A differ from those of
the ML63514A.
48-pin TQFP and 64-pin TQFP packages are available for the ML63512A and ML63514A.

FEATURES

· Extensive instruction set

407 instructions

Transfer, rotate, increment/decrement, arithmetic operations, comparison, logic operations,
mask operations, bit operations, ROM table reference, stack operations, flag operations,
jump, conditional branch, call/return, control.

· Wide variety selection of addressing modes

Indirect addressing of four data memory types, with current bank register, extra bank
register, HL register and XY register.
Data memory bank internal direct addressing mode.

· Processing speed

Two clocks per machine cycle, with most instructions executed in one machine cycle.
Minimum instruction execution time

: 61 ms (@ 32.768 kHz system clock)

1 ms (@ 2 MHz system clock)

· Clock generation circuit

Low-speed clock

: Crystal oscillation or RC oscillation selectable by

mask option (30 to 80 kHz)

High-speed clock

: Ceramic oscillation or RC oscillation selectable by

mask option (2 MHz max.)

· Program memory space

ML63512A: 4K words
ML63514A: 8K words
Basic instruction length is 16 bits/1 word

· Data memory space

ML63512A: 128 nibbles
ML63514A: 256 nibbles

¡ Semiconductor

ML63512A/63514A

4-Bit Microcontroller with Built-in Level Detector, Melody Circuit, and Comparator,
Operating at 0.9 V (Min.)

E2E0057-29-71

This version: Jul. 1999

Previous version: Jun. 1999

¡ Semiconductor

ML63512A/63514A

2/29

· Stack level

Call stack level

: 16 levels

· I/O ports

Input ports: Selectable as input with pull-up resistor/high-impedance input
Output ports: N-channel open drain output (can directly drive LEDs)
Input-output ports: Selectable as input with pull-up resistor/high-impedance input

Selectable as N-channel open drain output/CMOS output

Can be interfaced with external peripherals that use a different power supply than this device
uses. (Power to the output port is supplied from V

DDI

(separate power suply))

Number of ports:

(For 48-pin packages)

Input port

: 1 port ¥ 4 bits

Output port

: 1 port ¥ 4 bits

Input-output port

: 6 ports ¥ 4 bits

(For 64-pin packages)

Input port

: 1 port ¥ 4 bits

Output port

: 1 port ¥ 4 bits

Input-output port

: 9 ports ¥ 4 bits

· Melody output function

Melody sound frequency

: 529 to 2979 Hz (@ 32.768 kHz)

Tone length

: 63 varieties

Tempo

: 15 varieties

Melody data

: Stored in the program memory

Number of ports

: 1 (dedicated pin)

Buzzer driver signal output

: 4 kHz (@ 32.768 kHz)

· Level detector

Conversion time

: Approx. 183 ms (@ 32.768 kHz)

Dedicated input pins

: 2 pins (switched by software; for the secondary

functions of the input ports)

Detection level

: 12 levels

· Comparator

Offset voltage

: 50 mV max. (V

= 1.5 V)

Comparison time

: Approx. 183 ms (@ 32.768 kHz)

Number of channels

: 1 (for the secondary functions of the input ports)

· Reset function

Reset through RESETB pin (RESETB pin can be pulled up by mask option)

· Power supply backup

Backup circuit (voltage multiplier) enables operation at 0.9 V minimum

¡ Semiconductor

ML63512A/63514A

3/29

· Timers and counter

8-bit timer ¥ 2

Selectable as auto-reload mode/capture mode/clock frequency measurement mode

15-bit time base counter ¥ 1

1 Hz, 2 Hz, 4 Hz, 8 Hz, 16 Hz, 32 Hz, 64 Hz, 128 Hz, 256 Hz, 512 Hz, 1 kHz, and 2 kHz signals
can be read (@ 32.768 kHz)

· Serial port

Mode

: Selectable as UART mode/synchronous

mode

UART communication speed

: 2TBCCLK, TBCCLK, 1/2TBCCLK, Timers 0

& 1 overflow
24 kbps Max. (when 2TBCCLK @ 80 kHz
selected)

Clock frequency in synchronous mode

: 30 to 80 kHz (internal clock mode), external

clock frequency

Data length

: 5 to 8 bits

· Interrupt sources

External interrupt (4 sources)

: Selectable as rising edge/falling edge/both

rising and falling edges

Internal interrupt (10 sources)

: Time base interrupt ¥ 4 (2, 4, 16, and 32 Hz

@ 32.768 kHz)
Timer interrupt ¥ 2
Level detector interrupt ¥ 1
Serial port reception interrupt ¥ 1
Serial port transmission interrupt ¥ 1
Melody end interrupt ¥ 1

· Operating Temperature

20 to +70

· Supply voltage

When backup used

: 0.9 to 1.8 V

(Maximum operating frequency 1 MHz)

When backup not used

: 1.8 to 3.5 V

(When Level detector or Comparator is

used, maximum operating frequency
2 MHz)

1.8 to 5.5 V

(When Level detector and Comparator are

not used, maximum operating frequency
2 MHz)

· Package options:

48-pin plastic TQFP (TQFP48-P-0707-0.50-K) : (Product name: ML63512A-xxxTB,

ML63514A-xxxTB)

64-pin plastic TQFP (TQFP64-P-1010-0.50-K) : (Product name: ML63512A-xxxTP,

ML63514A-xxxTP)

xxx indicates a code number.

¡ Semiconductor

ML63512A/63514A

4/29

BLOCK DIAGRAM

An asterisk (*) indicates the port secondary function. The power to the circuits corresponding
to the signal names inside is supplied from V

DDI

(power supply for interface).

ROM
ML63512A: 4KW
ML63514A: 8KW

BUS

CON-

TROL

MIE

XT0
XT1

OSC0
OSC1

TBCCLK*

HSCLK*

OSC

CBR

EBR

C G

ALU

INSTRUCTION

DECODER

RAM

ML63512A: 128N
ML63514A: 256N

nX-4/250

RESETB

RST

DDI

TIMING
CON-
TROL

RSP

STACK

CAL: 16-level

REG: 16-level

TIMER

8bit ¥ 2

RXC*
TXC*
RXD*
TXD*

INT

SIO

TM0CAP/TM1CAP*
TM0OVF/TM1OVF*
T0CK*
T1CK*

INT

I/O
PORT

P0.0-P0.3

P1.0-P1.3

P2.0-P2.3

P3.0-P3.3

P4.0-P4.3

P5.0-P5.3

P6.0-P6.3

P9.0-P9.3

PA.0-PA.3

INT

DATA BUS

TBC

INT

MELODY

INT

TST1B

TST

TST2B

P7.0-P7.3

INT

INPUT

PORT

P8.0-P8.3

OUTPUT

PORT

LDIN0*

Level

Detector

LDIN1*

CMPIN*

CMP

CMPREF*

DDH

CB1
CB2

BACK-

DDL

Port 6 (P6.0 to P6.3), Port 9 (P9.0 to P9.3) and Port A (PA.0 to PA.3) are only provided for the 64-

pin packages.

¡ Semiconductor

ML63512A/63514A

5/29

PIN CONFIGURATION (TOP VIEW)

48-Pin Plastic TQFP

P3.0/RXD

P3.1/TXC

P3.2/RXC

P3.3/TXD

P4.0

P4.1

P4.2

P4.3

P5.0

P5.1

P5.2

P5.3

RESETB

OSC1

OSC0

TST2B

TST1B

XT1

XT0

DDL

CB2

CB1

P0.0/INT0

P0.1/INT1

P0.2/INT2

P0.3/INT3

P1.0/TM0CAP/TM0OVF

P1.1/TM1CAP/TM1OVF

P1.2/T0CK

P1.3/T1CK

P2.0/TBCCLK

P2.1/HSCLK

P2.2

P2.3

DDH

DDI

P8.3

P8.2

P8.1

P8.0

P7.3/LDIN1

P7.2/LDIN0

P7.1/CMPREF

P7.0/CMPIN

¡ Semiconductor

ML63512A/63514A

6/29

PIN CONFIGURATION (TOP VIEW) (continued)

64-Pin Plastic TQFP

Note: Pins marked as (NC) are no-connection pins which are left open.

PA.2

PA.3

P3.0/RXD

P3.1/TXC

P3.2/RXC

P3.3/TXD

P4.0

P4.1

P4.2

P4.3

P5.0

P5.1

P5.2

P5.3

P9.1

P9.0

RESETB

OSC1

OSC0

TST2B

TST1B

XT1

XT0

DDL

CB2

CB1

P0.0/INT0

P0.1/INT1

P0.2/INT2

P0.3/INT3

P1.0/TM0CAP/TM0OVF

P1.1/TM1CAP/TM1OVF

P1.2/T0CK

P1.3/T1CK

P2.0/TBCCLK

P2.1/HSCLK

P2.2

P2.3

PA.0

PA.1

DDH

DDI

P8.3

P8.2

P8.1

P8.0

P7.3/LDIN1

P7.2/LDIN0

P7.1/CMPREF

P7.0/CMPIN

P6.3

P6.2

P6.0

P6.1

(NC)

P9.2

P9.3

(NC)

¡ Semiconductor

ML63512A/63514A

7/29

PIN DESCRIPTIONS

The basic functions of each pin of the ML63512A/63514A are described in Table 1.
A symbol with a slash (/) denotes a pin that has a secondary function.
Refer to Table 2 for secondary functions.
For type, "--" denotes a power supply pin, "I" an input pin, "O" an output pin, and "I/O" an input-
output pin.
For pin, "TB" denotes a 48-pin flat package (48TQFP), and "TP" a 64-pin flat package (64TQFP).

Table 1 Pin Descriptions (Basic Functions)

Function Symbol

Type

22, 32

Power

Supply

DDI

DDL

DDH

CB1

CB2

XT0

Oscillation

XT1

OSC0

OSC1

Test

TST1B

TST2B

Reset

RESETB

Melody

Description

Positive power supply

Negative power supply

Positive power supply pin for external interface (PORT8 supply)

Positive power supply pin for internal logic (internally generated).

A capacitor C

(0.1 mF) should be connected between this pin and V

Voltage multiplier pin for power supply backup (internally generated).

A capacitor C

(1.0 mF) should be connected between this pin and V

Pins to connect a capacitor for voltage multiplier.

A capacitor (1.0 mF) should be connected between CB1 and CB2.

Low-speed clock oscillation pins.

Crystal oscillation or RC oscillation is selected by the mask option.

If crystal oscillation is selected, connect a crystal between XT0 and

XT1, and connect capacitor (C

) between XT0 and V

If RC oscillation is selected, connect external oscillation resistor

CRL

) between XT0 and XT1.

High-speed clock oscillation pins.

Ceramic oscillation or RC oscillation is selected by the mask option.

If ceramic oscillation is selected, connect a ceramic resonator

between OSC0 and OSC1, and connect capacitor (C

, C

) between

OSC0 and V

, OSC1 and V

If RC oscillation is selected, connect external oscillation resistor

CRH

) between OSC0 and OSC1.

Input pins for testing.

A pull-up resistor is internally connected to these pins.

Reset input pin.

Setting this pin to "L" level puts this device into a reset state.

Then, setting this pin to "H" level starts executing an instruction

from address 0000H.

An internal or external pull-up resistor is selected by mask option.

Melody output pin (non-inverted output)

28, 42

Pin

¡ Semiconductor

ML63512A/63514A

8/29

Table 1 Pin Descriptions (Basic Functions) (continued)

Function

Symbol

Type

P0.0/INT0

I/O

Port

Description

4-bit input-output ports.

In input mode, pull-up resistor input or high-impedance

input is selectable for each bit.

In output mode, N-channel open drain output or CMOS

output is selectable for each bit.

Pin

P0.1/INT1

P0.2/INT2

P0.3/INT3

P1.0/

TM0CAP/

TM0OVF

P1.1/

TM1CAP/

TM1OVF

P1.2/T0CK

P1.3/T1CK

P2.0/TBCCLK

P2.1/HSCLK

P2.2

P2.3

P3.0/RXD

P3.1/TXC

P3.2/RXC

P3.3/TXD

P4.0

P4.1

P4.2

P4.3

P5.0

P5.1

P5.2

P5.3

I/O

¡ Semiconductor

ML63512A/63514A

9/29

Table 1 Pin Descriptions (Basic Functions) (continued)

4-bit output port.

N-channel open drain output.

Function

Symbol

Type

P6.0

Port

Description

4-bit input-output port.

In input mode, pull-up resistor input or high-impedance

input is selectable for each bit.

In output mode, N-channel open drain output or CMOS

output is selectable for each bit.

Note that these pins are available for only a 64-pin package.

Pin

P7.0/CMPIN

P7.1/CMPREF

P7.2/LDIN0

P7.3/LDIN1

P8.0

P8.1

P8.2

P8.3

4-bit input port.

Pull-up resistor input or high-impedance input is selectable

for each bit.

I/O

P6.1

P6.2

P6.3

P9.0

P9.1

P9.2

P9.3

PA.0

PA.1

PA.2

PA.3

4-bit input-output ports.

In input mode, pull-up resistor input or high-impedance

input is selectable for each bit.

In output mode, N-channel open drain output or CMOS

output is selectable for each bit.

Note that these pins are available for only a 64-pin package.

I/O

¡ Semiconductor

ML63512A/63514A

10/29

Table 2 shows the secondary functions of each pin of the ML63512A/63514A.

Table 2 Pin Descriptions (Secondary Functions)

Function

Symbol

Type

Description

Pin

P0.0/INT0

Capture

External 0 interrupt input pin.

Edge detection can be selected from one of a rising edge,

a falling edge, or both rising and falling edges.

P0.1/INT1

External 1 interrupt input pin.

Edge detection can be selected from one of a rising edge,

a falling edge, or both rising and falling edges.

P0.2/INT2

External 2 interrupt input pin.

Edge detection can be selected from one of a rising edge,

a falling edge, or both rising and falling edges.

P0.3/INT3

P1.0/TM0CAP

Timer 0 (TM0) capture trigger input pin.

P1.1/TM1CAP

Timer 1 (TM1) capture trigger input pin.

External

Interrupt

External 3 interrupt input pin.

Edge detection can be selected from one of a rising edge,

a falling edge, or both rising and falling edges.

P1.0/TM0OVF

Timer 0 (TM0) overflow flag output pin.

P1.1/TM1OVF

Timer 1 (TM1) overflow flag output pin.

P1.2/T0CK

Timer 0 (TM0) external clock input pin.

P1.3/T1CK

Timer 1 (TM1) external clock input pin.

Timer

P2.0/TBCCLK

Low-speed oscillation clock output pin.

P2.1/HSCLK

High-speed oscillation clock output pin.

Oscillation

Output

P3.0/RXD

Serial port receive data input pin.

Sync serial port clock input-output pin.

Transmit sync clock input-output pin when a serial port is used

synchronously.

Transmit clock output when this device is used as a master processor.

Transmit clock input when this device is used as a slave processor.

P3.1/TXC

I/O

Sync serial port clock input-output pin.

Receive sync clock input-output pin when a serial port is used

synchronously.

Receive clock output when this device is used as a master processor.

Receive clock input when this device is used as a slave processor.

P3.2/RXC

I/O

P3.3/TXD

Serial port transmit data output pin.

Serial

Port

P7.0/CMPIN

Comparator analog input pin.

P7.1/CMPREF

Comparator reference voltage input pin.

Comparator

P7.2/LDIN0

Level detector analog input pin.

P7.3/LDIN1

Level detector analog input pin.

Level

Detector

¡ Semiconductor

ML63512A/63514A

11/29

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Condition

Rating

Unit

Power Supply Voltage 1

0.3 to +5.8

Power Supply Voltage 2

Ta = 25°C

DDI

0.3 to +5.8

Power Supply Voltage 3

Ta = 25°C

DDH

0.3 to V

+ 0.3

Input Voltage 1

Input, Ta = 25°C

IN1

0.3 to V

DDI

+ 0.3

Input Voltage 2

DDI

Input, Ta = 25°C

IN2

0.3 to V

+ 0.3

Output Voltage 1

Output, Ta = 25°C

OUT1

0.3 to V

DDI

+ 0.3

Output Voltage 2

DDI

Output, Ta = 25°C

OUT2

0.3 to V

DDH

+ 0.3

Output Voltage 3

DDH

Output, Ta = 25°C

OUT3

55 to +150

Storage Temperature

STG

°C

= 0 V)

0.3 to +5.8

Power Supply Voltage 4

Ta = 25°C

DDL

0.3 to +5.8

Ta = 25°C

Power Dissipation

Ta = 25°C

¡ Semiconductor

ML63512A/63514A

12/29

RECOMMENDED OPERATING CONDITIONS

· When backup is used

DDI

0.9 to 3.5

Crystal Oscillation Frequency

30 to 80

kHz

Low-Speed RC Oscillator

Frequency

CRL

Parameter

Symbol

Condition

Range

Unit

Operating Temperature

20 to +70

°C

0.9 to 1.8

Operating Voltage

= 0 V)

External High-Speed RC

Oscillator Resistance

CRH

kHz

CRL

= 1 MW ±10%

100 to 300

= 0.9 to 1.8 V

DDI

1.8 to 5.5

Crystal Oscillation Frequency

30 to 80

kHz

Low-Speed RC Oscillator

Frequency

CRL

kHz

Parameter

Symbol

Condition

Range

Unit

Operating Temperature

20 to +70

°C

1.8 to 3.5

Operating Voltage

= 0 V)

External High-Speed RC

Oscillator Resistance

CRH

CRL

= 1 MW ±10%

15 to 300

= 1.8 to 5.5 V

300k to 1M

= 2.2 to 5.5 V

200k to 2M

= 2.7 to 5.5 V

Ceramic Oscillation Frequency

When Level detector and

Comparator are not used

1.8 to 5.5

· When backup is not used

¡ Semiconductor

ML63512A/63514A

13/29

Parameter

Symbol

Condition

Mea-

suring

Circuit

= V

DDI

= 1.5 V, V

= 0 V, Ta = 20 to +70°C unless otherwise specified)

Unit

Max.

Typ.

Min.

5.8
9.0

15.0

5.3
5.3
5.3

4.8

--
--

Supply Current 1

DD1

CPU is in HALT state

High-speed oscillation stop

Level detector stop

Supply Current 2

DD2

CPU operating

High-speed oscillation stop

Level detector stop

35.0

10.0

Supply Current 3

DD3

CPU operating at low speed

High-speed oscillation stop

Level detector active

(for a soft duty of about 3%)

750.0

550.0

Supply Current 4

DD4

CPU operating at high speed

High-speed RC oscillation

CRH

= 100 kW

Ta = 25°C
Ta = 20 to +50°C
Ta = 20 to +70°C

14.0
16.0
24.0

13.0
13.0
13.0

12.0

--
--

Ta = 25°C
Ta = 20 to +50°C
Ta = 20 to +70°C

ELECTRICAL CHARACTERISTICS

DC Characteristics

· When backup is used

· When backup is not used

Parameter

Symbol

Condition

Mea-

suring

Circuit

= V

DDI

= 3.0 V, V

= 0 V, Ta = 20 to +70°C unless otherwise specified)

Unit

Max.

Typ.

Min.

2.7
7.0

10.0

2.4
2.4
2.4

2.1

--
--

Supply Current 1

DD1

CPU is in HALT state

High-speed oscillation stop

Level detector stop

Supply Current 2

DD2

CPU operating

High-speed oscillation stop

Level detector stop

25.0

6.0

Supply Current 3

DD3

CPU operating at low speed

High-speed oscillation stop

Level detector active

(for a soft duty of about 3%)

550.0

410.0

Supply Current 4

DD4

CPU operating at high speed

High-speed RC oscillation

CRH

= 100 kW

Ta = 25°C
Ta = 20 to +50°C
Ta = 20 to +70°C

7.0
9.0

15.0

6.0
6.0
6.0

5.0

--
--

Ta = 25°C
Ta = 20 to +50°C
Ta = 20 to +70°C

1000.0

850.0

Supply Current 5

DD5

CPU operating at high speed

High-speed ceramic oscillation

(ceramic oscillation, 2 MHz)

¡ Semiconductor

ML63512A/63514A

14/29

DC Characteristics (continued)

Parameter

(Pin Name)

DDH

Voltage

DDL

Voltage

Crystal Oscillation Start

Voltage

Crystal Oscillation Hold

Voltage

External Crystal Oscillator

Capacitance

Internal Crystal Oscillator

Capacitance

Internal High-Speed RC

Oscillator Capacitance

Input Pin Capacitance

(P0.0 to P0.3)

(P1.0 to P1.3)

(P7.0 to P7.3)

(P9.0 to P9.3)

(PA.0 to PA.3)

High-speed clock stop

= 1.5 V

2.8

3.0

DDH

High-speed clock oscillation

(RC oscillation, R

CRH

= 100 kW)

2.0

DDL

High-speed clock stop

1.0

1.5

2.0

High-speed clock oscillation

2.0

2.7

STA

Oscillation start time: within 5 seconds

1.2

HOLD

0.9

5.0

25.0

20.0

25.0

30.0

8.0

12.0

16.0

5.0

Symbol

Condition

Typ.

Min.

Max.

Mea-

suring

Circuit

Internal Low-Speed RC

Oscillator Capacitance

10.0

15.0

20.0

Unit

···

= V

DDI

= 1.5 V, V

= 0 V, Ta = 20 to +70°C unless otherwise specified)

¡ Semiconductor

ML63512A/63514A

15/29

DC Characteristics (continued)

0.2

1.3

2.5

Output Current 1
(P0.0 to P0.3)
(P1.0 to P1.3)

(P6.0 to P6.3)
(P9.0 to P9.3)
(PA.0 to PA.3)
(MD)

OH1

= 1.5 V

1.0

3.5

6.0

OL1

1.0

OH2Z

Output Current 2

(P8.0 to P8.3)

Output Current 3

(OSC1)

14.0

7.5

3.0

OL2

20.0

12.0

6.0

= 3.0 V

DDI

= 1.5 V

DDI

= 3.0 V

OH1

= V

0.5 V

OL1

= 0.5 V

OH2

= V

OL2

= 0.5 V

OH3R

= V

DDH

= 3.0 V

OH3R

= V

DDH

0.5 V

= V

DDH

= 5.0 V

0.2

1.5

2.5

0.5

1.8

3.5

Parameter

(Pin Name)

Symbol

Condition

Typ.

Min.

Max.

Mea-

suring

Circuit

Unit

···

= V

DDI

= 1.5 V, V

= 0 V, Ta = 20 to +70°C unless otherwise specified)

1.5

5.0

8.5

= 5.0 V

2.5

1.3

0.2

= 1.5 V

6.0

3.0

1.0

= 3.0 V

8.5

3.7

1.5

= 5.0 V

28.0

15.0

8.0

DDI

= 5.0 V

OL3R

= V

DDH

= 3.0 V

OL3R

= 0.5 V

= V

DDH

= 5.0 V

2.5

1.5

0.2

3.5

1.8

0.5

OH3C

= V

DDH

= 3.0 V

OH3C

= V

DDH

0.5 V

= V

DDH

= 5.0 V

160

300

100

240

400

OL3C

= V

DDH

= 3.0 V

OL3C

= 0.5 V

= V

DDH

= 5.0 V

300

170

400

210

100

Output Leakage
(P0.0 to P0.3)
(P1.0 to P1.3)

(P6.0 to P6.3)
(P8.0 to P8.3)
(P9.0 to P9.3)
(PA.0 to PA.3)

1.0

OOH

= V

1.0

OOL

= V

···

¡ Semiconductor

ML63512A/63514A

16/29

DC Characteristics (continued)

IH4

= V

= 1.5 V

10.0

60.0

120.0

100.0

350.0

600.0

IL4

= V

(when pulled up)

Parameter

(Pin Name)

Symbol

Condition

Mea-

suring

Circuit

Unit

1.0

Input Current 1
(P0.0 to P0.3)
(P1.0 to P1.3)

(P7.0 to P7.3)
(P9.0 to P9.3)
(PA.0 to PA.3)

IH1U

1.0

4.0

8.0

IL1U

10.0

30.0

60.0

1.0

IH1Z

IH1

= V

(in a high-impedance state)

1.0

IL1Z

IL1

= V

(in a high-impedance state)

30.0

170.0

350.0

IL3

= V

(when pulled up)

1.0

IH3R

IH3

= V

DDH

1.0

IL3R

IL3

= V

= 1.5 V

= 3.0 V

IH1

= V

(when pulled up)

IL1

= V

(when pulled up)

IH2

= V

= 1.5 V

1.0

2.0

20.0

45.0

= V

DDH

= 3.0 V

70.0

300.0

870.0

IL2

= V

(when pulled up)

Input Current 3

(OSC0)

Input Current 2

(RESETB)

Input Current 4

(TST1B, TST2B)

Max.

Typ.

Min.

= 5.0 V

0.1

= 3.0 V

···

= V

DDI

= 1.5 V, V

= 0 V, Ta = 20 to +70°C unless otherwise specified)

23.0

90.0

150.0

= 5.0 V

30.0

120.0

260.0

= 3.0 V

200.0

450.0

750.0

= V

DDH

= 5.0 V

220.0

770.0

1320.0

= 5.0 V

¡ Semiconductor

ML63512A/63514A

17/29

DC Characteristics (continued)

Parameter

(Pin Name)

Symbol

Condition

Mea-

suring

Circuit

Unit

Max.

Typ.

Min.

0.30

0.10

0.05

1.0

0.5

0.2

= 3.0 V

= 1.5 V

Hysteresis Width
(P0.0 to P0.3)
(P1.0 to P1.3)

(P7.0 to P7.3)
(P9.0 to P9.3)
(PA.0 to PA.3)
(RESETB)

(TST1B, TST2B)

1.5

1.2

IH1

3.0

2.4

= 3.0 V

= 1.5 V

0.3

0.0

IL1

0.6

0.0

= 3.0 V

= 1.5 V

Input Voltage 1
(P0.0 to P0.3)
(P1.0 to P1.3)

(P7.0 to P7.3)
(P9.0 to P9.3)
(PA.0 to PA.3)

···

= V

DDI

= 1.5 V, V

= 0 V, Ta = 20 to +70°C unless otherwise specified)

Input Voltage 2

(OSC0)

3.0

2.4

IH2

5.0

4.0

= V

DDH

= 5.0 V

= V

DDH

= 3.0 V

0.6

0.0

1.0

0.0

= V

DDH

= 5.0 V

= V

DDH

= 3.0 V

5.0

4.0

= 5.0 V

1.0

0.0

= 5.0 V

IL2

0.15

0.00

IL3

0.6

0.0

= 3.0 V

= 1.5 V

1.50

1.35

IH3

3.0

2.4

= 3.0 V

= 1.5 V

Input Voltage 3

(RESETB)

(TST1B, TST2B)

5.0

4.0

= 5.0 V

1.0

0.0

= 5.0 V

1.50

1.00

0.25

= 5.0 V

¡ Semiconductor

ML63512A/63514A

22/29

TXD (P3.3)

RXD (P3.0)

CYC

DDR

CWH

CWL

DDR

(5.0 V)

TXC (P3.1)/
RXC (P3.2)

AC Characteristics (Serial Interface, Serial Port)

= 0.9 to 5.5 V, V

DDH

= 1.8 to 5.5 V, V

= 0 V, V

DDI

= 0.9 to 5.5 V, Ta = 20 to +70

C unless

otherwise specified)

(1) Synchronous Communication

Parameter

Symbol

Condition

Unit

TXC/RXC Input Fall Time

Max.

Typ.

Min.

1.0

TXC/RXC Input Rise Time

1.0

0.8

TXC/RXC Input "L" Level
Pulse Width

CWL

0.8

TXC/RXC Input "H" Level
Pulse Width

CWH

2.0

TXC/RXC Input Cycle Time

CYC

TXC/RXC Output Cycle Time

CYC1(O)

CPU operating at 32.768 kHz

30.5

CYC2(O)

CPU operating at 2 MHz

= V

DDH

= 2.7 to 5.5 V

0.5

TXD Output Delay Time

DDR

Output load capacitance 10 pF

0.4

0.5

RXD Input Setup Time

0.8

RXD Input Hold Time

Synchronous communication timing
("H" level = 4.0 V, "L" level = 1.0 V)

¡ Semiconductor

ML63512A/63514A

23/29

TXD (P3.3)

BRT

(5.0 V)

RXD (P3.0)

BRT

(5.0 V)

(2) UART Communication

Parameter

Symbol

Condition

Unit

BRT

Transmit Baud Rate

Max.

Typ.

Min.

BRT

= 1/f

BRT

= 1/f

OSC

BRT

¥0.97

Receive Baud Rate

BRT

¥1.03

BRT

= 1/f

BRT

: Baud rates (2TBCCLK, TBCCLK, 1/2TBCCLK, Timer 0/1 overflow)

UART communication timing
("H" level = 4.0 V, "L" level = 1.0 V)

¡ Semiconductor

ML63512A/63514A

24/29

AC Characteristics

Parameter

Symbol

Condition

Unit

External Interrupt Enable
Pulse Width (Rising Edge)

Max.

Typ.

Min.

= V

DDI

= 0.9 to 5.5 V, V

= 0 V, Ta = 20 to + 70°C unless otherwise specified)

External Interrupt Enable
Pulse Width (Falling Edge)

13.0

External Interrupt Disable
Time

NUL

Interrupt enable, MIE = 1

CPU operating under

the NOP instruction

System clock: 32.768 kHz

65.1

AC characteristics timing

NUL

P0.0 to P0.3

(Interrupt on the rising edge)

P0.0 to P0.3

(Interrupt on the falling edge)

P0.0 to P0.3

(Interrupt on both rising and falling edges)

NUL

¡ Semiconductor

ML63512A/63514A

25/29

Comparator Electrical Characteristics

Conceptual diagram of comparator supply current

The conceptual diagram of the comparator supply current I

DDCMP

and I

DSCMP

is shown below.

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Comparator Offset

Voltage

Vcoff

Comparator Conversion

Time

System clock: 32.768 kHz

183

Comparator Supply

Current

DDCMP

Comparator operating

= 0.9 V, V

= 0 V, Ta = 20 to +70°C)

Comparator Input

Voltage

Vcin

DSCMP

Comparator stopped

0.1

Remarks

CMPIN

CMPREF

Sampling reference voltage

Comparing

reference

voltage with

input voltage

t [ms]

DDCMP

DSCMP

)

[mA]

Level detector operating

Level detector stopped

¡ Semiconductor

ML63512A/63514A

26/29

Level Detector Electrical Characteristics

Conceptual diagram of level detector supply current

The conceptual diagram of the level detector supply current I

DDLD

and I

DSLD

is shown below.

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Level Detector Input

Voltage

Level Dtector Supply

Current

System clock: 32.768 kHz

183

DDLD

Level detector operating

130

= 0.9 V, V

= 0 V, Ta = 20 to +70°C)

Level Detector Conversion

Time

DSLD

Level detector stopped

0.1

Remarks

LDIN0, 1

Sampling reference voltage

Comparing

reference

voltage with

input voltage

t [ms]

DDLD

DSLD

)

[mA]

Level detector operating

Level detector stopped

¡ Semiconductor

ML63512A/63514A

27/29

Level Detector Input Levels and Output Codes

= 0.9 to 1.8 V: when backup is used, V

= 1.8 to 3.5 V: when backup is not used;

= 0 V, Ta = 20 to +70

Input Level [V]

Min.

Max.

1440/1500 ¥ V

1306/1500 ¥ V

1366/1500 ¥ V

1190/1500 ¥ V

1250/1500 ¥ V

1074/1500 ¥ V

1134/1500 ¥ V

958/1500 ¥ V

1018/1500 ¥ V

842/1500 ¥ V

902/1500 ¥ V

726/1500 ¥ V

786/1500 ¥ V

610/1500 ¥ V

670/1500 ¥ V

494/1500 ¥ V

554/1500 ¥ V

378/1500 ¥ V

438/1500 ¥ V

262/1500 ¥ V

322/1500 ¥ V

146/1500 ¥ V

206/1500 ¥ V

88/1500 ¥ V

LDOUT

bit 0

bit 1

bit 2

bit 3

Level Detector

Operation State

OFF state

ON state

¡ Semiconductor

ML63512A/63514A

28/29

(Unit : mm)

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

TQFP48-P-0707-0.50-K

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more
0.13 TYP.

Mirror finish

¡ Semiconductor

ML63512A/63514A

29/29

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

TQFP64-P-1010-0.50-K

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more
0.26 TYP.

Mirror finish

NOTICE

The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

Neither indemnity against nor license of a third party's industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party's right which may result from the use thereof.

The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.

No part of the contents contained herein may be reprinted or reproduced without our prior
permission.

MS-DOS is a registered trademark of Microsoft Corporation.

Printed in Japan

E2Y0002-29-62

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