Document Outline
- Mechanical Key Switch (SMD) B3S
- Ordering Information
- Specifications
- Ratings/Characteristics
- Operating Characteristics
- Engineering Data
- Nomenclature
- Dimensions
- Precautions
1
Mechanical Key Switch (SMD)
B3S
Surface-mounted Device (SMD) Design
Meets High-density Mounting
Requirements
The whole switch body can be washed after
soldering due to its sealing property.
Sealed construction provides high reliability in
dusty environments.
Available with ground terminal for protection
against static electricity.
Positive tactile feedback.
Fully sealed.
Ordering Information
6
6-mm-type B3S-1000 Series
Operating force (OF)
Without ground terminal
With ground terminal
p
g
(
)
Bags
Embossed tape
(see note)
Bags
Embossed tape
(see note)
General-purpose
1.57 N (160 gf)
B3S-1000
B3S-1000P
B3S-1100
B3S-1100P
High-force
2.25 N (230 gf)
B3S-1002
B3S-1002P
B3S-1102
B3S-1102P
Note:
Switches on embossed tape must be ordered in units of 1,000.
Specifications
Ratings/Characteristics
Switching capacity
5 to 24 VDC, 1 to 30 mA (resistive load)
Insulation voltage
30 VDC
Contact configuration
SPST-NO
Contact resistance
100 m
max. (initial value) (Rated 5 VDC, 1 mA)
Insulation resistance
100 M
min. (at 250 VDC)
Dielectric strength
500 VAC, 50/60 Hz for 1 min
Bounce time
5 ms max.
Vibration resistance
Malfunction: 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance
Destruction: 1,000 m/s
2
min. (approx. 100G min.)
Malfunction: 100 m/s
2
min. (approx. 10G min.)
Life expectancy
General-purpose models:
500,000 operations min.
High-force models:
300,000 operations min.
Ambient temperature
Operating: 25
C to 70
C (with no icing)
Ambient humidity
Operating: 35% to 85%
Weight
Approx. 0.30 g
B3S
B3S
2
Operating Characteristics
Item
B3S-1000 Series
General-purpose models
High-force models
Operating force (OF max.)
1.57 N (160 gf) max.
2.25 N (230 gf) max.
Reset force (RF min.)
0.2 N (20 gf) min.
0.49 N (50 gf) min.
Pretravel (PT)
0.25
+0.2
/
0.1
mm
B3S
B3S
3
Engineering Data
Operating Force vs. Stroke
(Typical)
Stroke S (mm)
Operating force (gf)
High-force
models
General-purpose
models
Nomenclature
Cover
Plunger
Moving contact (disk spring)
Fixed contact
Base
Spacer
Sealing rubber
B3S
B3S
4
Dimensions
Note:
All units are in millimeters unless otherwise indicated.
Without Ground Terminal
B3S-1000
B3S-1002
With Ground Terminal
B3S-1100
B3S-1102
PCB Mounting
(Top View)
Terminal Arrangement
/Internal Connections
(Top View)
PCB Mounting
(Top View)
Terminal Arrangement
/Internal Connections
(Top View)
3.3
dia.
3.3
dia.
Precautions
Reflow Soldering
Attach a thermocouple to one side of the terminal with high-temper-
ature solder and use the thermocouple to set the reflow oven to a
peak terminal temperature of 230
5
C. The optimum heating
curve is shown below.
Note:
The above heating curve applies if the
thickness of the circuit board is 1.6 mm.
30 s
max.
Time (s)
60 to 90 s
20 s
Normal
temperature
1 to 4
C/s
1 to 5
C/s
T
emperature ( C)
%
10 s max.
Do not apply additional force to the plunger once it has stopped
moving.
Do not repeatedly press the plunger off-center or from an acute
angle.
B3S Switches are designed to allow submersed washing after sol-
dering. When washing, follow the guidelines given below:
1. Clean with alcohol solvents. Do not use chlorine solvents or
water.
2. When using ultrasonic cleaning in two- or three-tank systems
and do not clean for more than one minute at a time or for
more than three minutes total.
3. Do not apply external force to the Switch while washing.
4. Do not wash immediately after soldering. If possible, allow
components to stand for at least three minutes before
washing.
5. The Switch cannot be used where subject to direct contact
with water.
B3S
B3S
5
Key Switch Packing
Key Switches are packed on tape as shown below.
Top tape
Material: PET
Carrier tape
(Material:
PS+butadiene)
Tape reel
Label
330 dia.
13 dia.
21.5
Tape drawing direction
1.5 dia.
+0.1
/
0
Pitch: 12
0.1
Pitch: 4
0.1
2
1.5
9.4
0.06
0.4
4.7
8.7
7
7.5
1.75
16
Standard
Conforms to EIAJ standards
Package
1,000 Key Switches
Heat resistance
60
C for 24 hours (without deformation)
Note:
The ground terminals of the Key Switches are on the guide-
hole side of the package.
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Cat. No. C108-E1-1
OMRON Corporation
Control Components Division H.Q.
28th Fl., Crystal Tower Bldg.
1-2-27, Shiromi, Chuo-ku,
Osaka 540 Japan
Phone: 06-949-6115 Fax: 06-949-6134
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
In the interest of product improvement, specifications are subject to change without notice.
Printed in Japan
0697-1M (0697)
a
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