Semiconductor Components Industries, LLC, 2005
June, 2005 - Rev. 0
1
Publication Order Number:
NUF2222FC/D
NUF2222FC
2 Line USB 1.1 Upstream
EMI Filter
This device is a 2 line EMI filter array for USB port protection in
wireless applications. Greater than -20 dB attenuation is obtained at
frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated
ESD protection. ESD protection is provided across all capacitors.
Features
EMI Filtering and ESD Protection
Integration of 10 Discretes
Provides Protection for IEC61000-4-2 (Level 4)
15 kV (Contact)
Flip-Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
Benefits
Reduces EMI/RFI Emissions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More "Ideal" Low Pass
Filter Response
Integrated Solution Improves System Reliability
This is a Pb-Free Device
Applications
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Products
Notebook Computers
MP3 Players
MAXIMUM RATINGS
(T
A
= 25
C unless otherwise noted)
Rating
Symbol
Value
Unit
ESD Discharge
IEC61000-4-2
Contact Discharge
V
PP
15
kV
Operating Temperature Range
T
OP
-40 to +85
C
Storage Temperature Range
T
STG
-55 to +150
C
Junction Temperature
T
J
+125
C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping
ORDERING INFORMATION
NUF2222FCT1G
Flip-Chip
3000 Tape & Reel
MARKING
DIAGRAM
Flip-Chip
FC SUFFIX
CASE 499AM
http://onsemi.com
PIN CONFIGURATION
A
B
C
D
E
3
2 1
1
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
B2
D2
(Gnd Pin)
A1
A3
1.3 K
C1
33 R
C3
E3
33 R
E1
2222AYWW
2222
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
NUF2222FC
http://onsemi.com
3
TYPICAL PERFORMANCE CURVES
(T
A
= 25
C unless otherwise specified)
Figure 1. Typical Insertion Loss
Characteristics
FREQUENCY (Hz)
S21 (dB)
Figure 2. Typical Crosstalk Characteristics
-10
-15
-20
-25
-30
-35
1.0E+6
10E+6
100E+6
1.0E+9
10E+9
Figure 3. Typical Resistance (R33) vs.
Temperature
85
-15
35
TEMPERATURE (
C)
32.50
RESIST
ANCE (
W
)
60
10
34.50
33.00
32.00
31.50
-40
10E+6
1.0E+9
FREQUENCY (Hz)
S41 (dB)
10E+9
100E+6
1.0E+6
0
-10
-20
-30
-40
-60
REVERSE VOLTAGE (V)
CAP
ACIT
ANCE (pF)
15
25
0
1
2
3
4
5
35
45
0
-5
-50
33.50
34.00
Figure 4. Typical Resistance (R1300) vs.
Temperature
85
-15
35
TEMPERATURE (
C)
1270
RESIST
ANCE (
W
)
60
10
1310
1280
1260
1250
-40
1290
1300
Figure 5. Typical Line Capacitance vs. Reverse
Bias Voltage
1350
1320
1330
1340
NUF2222FC
http://onsemi.com
4
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
500
m
m Pitch
300 or 350
m
m Solder Ball
PCB Pad Size
250
m
m +25
-0
Pad Shape
Round
Pad Type
NSMD
Solder Mask Opening
350
m
m
"
25
Solder Stencil Thickness
125
m
m
Stencil Aperture
250 x 250
m
m sq.
Solder Flux Ratio
50/50
Solder Paste Type
No Clean Type 3 or Finer
Trace Finish
OSP Cu
Trace Width
150
m
m Max
Figure 6. NSMD vs. SMD
NSMD
SMD
Copper
Solder mask
RAMP-UP
280
270
260
250
240
230
210
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0
15
30
45
60
75
90
105
11
9
134
149
165
180
195
209
224
239
254
269
284
299
314
329
344
359
374
389
404
419
434
449
464
479
494
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
RAMP-DOWN
PRE-HEAT
ZONE
t
L
(60-90 sec)
T
p
= 260
C - 5
C
T
p
= (15-30 sec)
T
L
= 217
TEMPERA
TURE (
C)
TIME (seconds)
Figure 7. Typical Pb-Free Solder Heating Profile
PDF 
ZIP
