LA T68B, LY T68B
TOPLED
Enhanced optical Power LED (HOP2000)
Vorlufige Daten / Preliminary Data
2003-04-28
1
Besondere Merkmale
Gehusetyp: weies P-LCC-2 Gehuse
Besonderheit des Bauteils: Kontrasterhhung
durch schwarze Oberflche (RGB-Displays); mehr
Licht durch erhhten optischen Wirkungsgrad; ex-
trem breite Abstrahlcharakteristik
Wellenlnge: 617 nm (amber), 587 nm (yellow)
Abstrahlwinkel: Lambertscher Strahler (120)
Technologie: InGaAlP
optischer Wirkungsgrad: 24 lm/W
Gruppierungsparameter: Lichtstrke,
Wellenlnge
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten und
Wellenlten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 2000/Rolle, 180 mm
oder 8000/Rolle, 330 mm
ESD-Festigkeit: ESD-sicher bis 2 kV nach
EOS/ESD-5.1-1993
Anwendungen
Ampelanwendung
Informationsanzeigen im Innen- und
Auenbereich (z. B. Verkehrsbereich)
Innen- und Auenbeleuchtung im Auto-
mobilbereich (z.B. Instrumentenbeleuchtung und
Bremslichter)
Hinterleuchtung (LCD, Schalter, Tasten, Displays,
Werbebeleuchtung)
Ersatz von Kleinst-Glhlampen
Markierungsbeleuchtung (z.B. Stufen,
Fluchtwege, u..)
Signal- und Symbolleuchten
Vollfarbdisplay im Innen- und Auenbereich in
Kombination mit LB T68C und LT T68C
Features
package: white P-LCC-2 package
feature of the device: higher contrast by a black
suface (RGB-Displays); more light due to higher
optical efficiency; extremely wide viewing angle
wavelength: 617 nm (amber), 587 nm (yellow)
viewing angle: Lambertian Emitter (120)
technology: InGaAlP
optical efficiency: 24 lm/W
grouping parameter: luminous intensity,
wavelength
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering and TTW
soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 2000/reel, 180 mm or
8000/reel, 330 mm
ESD-withstand voltage: up to 2 kV acc. to
EOS/ESD-5.1-1993
Applications
traffic lights
indoor and outdoor information panels
(e.g. displays for traffic)
interior and exterior automotive lighting
(e.g. dashboard backlighting and brake lights)
backlighting (LCD, switches, keys, displays,
illuminated advertising)
substitution of micro incandescent lamps
marker lights (e.g. steps, exit ways, etc.)
signal and symbol luminaire
indoor and outdoor full color displays in
combination with LB T68C and LT T68C
2003-04-28
2
LA T68B, LY T68B
Anm.: -24 gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5)
-26 gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5)
Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe, die aus
nur 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Dimmverhltnis im Gleichstrom-Betrieb max. 5:1
Note: -24 Total color tolerance range, delivery in single groups (please see page 5)
-26 Total color tolerance range, delivery in single groups (please see page 5)
The standard shipping format for serial types includes a group of only 4 individual groups.
Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
Dimming range for direct current mode max. 5:1
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous
Intensity
I
F
= 30 mA
I
V
(mcd)
Lichtstrom
Luminous
Flux
I
F
= 30 mA
V
(mlm)
Bestellnummer
Ordering Code
LA T68B-T2V1-24
amber
colorless clear
355 ... 900
1900 (typ.) Q65110A0657
LY T68B-T2V1-26
yellow
colorless clear
355 ... 900
1900 (typ.) Q65110A0816
LA T68B, LY T68B
2003-04-28
3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 125
C
Durchlassstrom
Forward current
I
F
50
mA
Stostrom
Surge current
t
10
s, D = 0.1
I
FM
100
mA
Sperrspannung
1)
Reverse voltage
V
R
12
V
Leistungsaufnahme
Power consumption
T
A
25 C
P
tot
130
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/ambient
Sperrschicht/Ltpad
Junction/soldering point
Montage auf PC-Board FR 4 (Padgre
16 mm
2
)
mounted on PC board FR 4 (pad size
16 mm
2
)
R
th JA
R
th JS
400
180
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term operation
2003-04-28
4
LA T68B, LY T68B
Kennwerte (
T
A
= 25 C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LA
LY
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 30 mA
peak
624
594
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
I
F
= 30 mA
dom
617
5/+7
587
7/+8
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 30 mA
18
15
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
120
120
Grad
deg.
Durchlassspannung
2)
(min.)
Forward voltage
(typ.)
I
F
= 30 mA
(max.)
V
F
V
F
V
F
1.8
2.1
2.4
1.8
2.1
2.4
V
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 12 V
I
R
I
R
0.01
10
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 30 mA; 10C
T
100C
TC
peak
0.15
0.13
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 30 mA; 10C
T
100C
TC
dom
0.07
0.10
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 30 mA; 10C
T
100C
TC
V
3.7
3.7
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 30 mA
opt
24
24
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Durchlassspannungsgruppen werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V
ermittelt.
Forward voltage groups are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LA T68B, LY T68B
2003-04-28
5
1)
Wellenlngengruppen
Wavelength groups
Gruppe
Group
amber
yellow
Einheit
Unit
min.
max.
min.
max.
2
612
616
580
583
nm
3
616
620
583
586
nm
4
620
624
586
589
nm
5
589
592
6
592
595
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstrke
Luminous Intensity
I
V
(mcd)
Lichtstrom
Luminous Flux
V
(mlm)
T2
U1
U2
V1
355 ... 450
450 ... 560
560 ... 710
710 ... 900
1200 (typ.)
1500 (typ.)
1900 (typ.)
2400 (typ.)
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 11 % ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11 %.
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: T2-3
Example: T2-3
Lichtgruppe
Luminous Intensity Group
Halbgruppe
Half Group
Wellenlnge
Wavelength
T
2
3
2003-04-28
6
LA T68B, LY T68B
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 30 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
OHL00013
400
0
20
40
60
80
100
450
500
550
600
650
700
nm
%
I
rel
V
amber
yellow
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL01660
50
60
70
80
90
100
0
20
40
60
80
100
120
LA T68B, LY T68B
2003-04-28
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
Relative Lichtstrke
I
V
/
I
V(30 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 30 mA
OHL00590
10
-2
10
-1
10
0
10
1
F
V
10
2
F
I
mA
2.3
1.3
1.5
1.7
1.9
2.1
V 2.5
C
OHL00176
0
0
20
60
40
80
mA
I
F
100
temp. solder point
S
10
20
30
40
50
60
temp. ambient
A
S
A
OHL00988
10
-3
10
-2
10
-1
10
0
10
1
10
-1
10
5
10
0
5
1
mA
2
10
F
I
I
V (30 mA)
I
V
amber
yellow
OHL00740
0
-40
C
T
(25 C)
I
V
I
V
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2.0
-20
0
20
40
60
100
LA T68B, LY T68B
2003-04-28
8
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
OHL00193
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01633
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
LA T68B, LY T68B
2003-04-28
9
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Kathodenkennung:
abgeschrgte Ecke
Cathode mark:
bevelled edge
Gewicht / Approx. weight: 35 mg
GPLY6724
0.7 (0.028)
0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)
0.18 (0.007)
0.5 (0.020)
1.1 (0.043)
3.3 (0.130)
3.7 (0.146)
0.4 (0.016)
0.6 (0.024)
2.6 (0.102)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
Cathode marking
3.0 (0.118)
3.4 (0.134)
(2.4) (0.095)
0.1 (0.004) (typ.)
4
1
2003-04-28
10
LA T68B, LY T68B
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
LA T68B, LY T68B
2003-04-28
11
Wellenlten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskhlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
2003-04-28
12
LA T68B, LY T68B
Empfohlenes Ltpaddesign
IR-Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)
Gehuse fr Wellenlten (TTW) geeignet / Package suitable for TTW-soldering
OHLPY970
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
Paddesign
for improved
heat dissipation
Cu-area > 16 mm
Cu-Flche > 16 mm
2
fr verbesserte
Padgeometrie
Wrmeableitung
2
Solder resist
Ltstopplack
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
LA T68B, LY T68B
2003-04-28
13
Empfohlenes Ltpaddesign verwendbar fr TOPLED
und Power TOPLED
IR Reflow Lten
Recommended Solder Pad useable for TOPLED
and Power TOPLED
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHLPY440
Padgeometrie fr
verbesserte Wrmeableitung
improved heat dissipation
Paddesign for
Ltstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Flche / 16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
Kathode/
Cathode
Anode
Flche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
Flche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
2003-04-28
14
LA T68B, LY T68B
Gurtung / Polaritt und Lage
Verpackungseinheit 2000/Rolle, 180 mm
oder 8000/Rolle, 330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, 180 mm
or 8000/reel, 330 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHAY2271
C
A
3.6 (0.142)
8 (0.315)
3.5 (0.138)
1.75 (0.069)
4 (0.157)
1.5 (0.059)
2.9 (0.114)
4 (0.157)
2 (0.079)
LA T68B, LY T68B
2003-04-28
15
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2003-04-28
Date of change
Previous Version:
2003-02-17
Page
Subjects (major changes since last revision)
2
ordering code for yellow
2003-04-28
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