LATB T66B
Hyper Multi TOPLED
Enhanced optical Power LED (HOP2000 / ATON
)
Vorlufige Daten / Preliminary Data
2003-07-18
1
Besondere Merkmale
Gehusetyp: weies P-LCC-4 Gehuse;
Kontrasterhhung durch schwarze Oberflche
(RGB-Displays) und diffuses Harz
Besonderheit des Bauteils: additive
Farbmischung durch unabhngige Ansteuerung
aller Chips
Wellenlnge: 617 nm (amber),
528 nm (true green), 470 nm (blau)
Abstrahlwinkel: Lambertscher Strahler (120)
Technologie: InGaAlP (amber),
InGaN (true green, blau)
optischer Wirkungsgrad: 24 lm/W (amber),
13 lm/W (true green), 3 lm/W (blau)
Gruppierungsparameter: Lichtstrke,
Wellenlnge
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten und
Wellenlten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 2000/Rolle, 180 mm
oder 8000/Rolle, 330 mm
ESD-Festigkeit: ESD-sicher bis 2 kV nach
EOS/ESD-5.1-1993
Anwendungen
Anzeigen im Innen- und Auenbereich
(z.B. im Verkehrsbereich; Laufschriftanzeigen)
Leuchtdiodenchips getrennt ansteuerbar
Vollfarbdisplays bzw. RGB-Displays
Hinterleuchtung (LCD, Displays,
Werbebeleuchtung, Allgemeinbeleuchtung)
Einkopplung in Lichtleiter
Features
package: white P-LCC-4 package;
higher contrast by a black surface
(RGB-Displays) and diffused resin
feature of the device: additive mixture of color
stimuli by independent driving of each chip
wavelength: 617 nm (amber),
528 nm (true green), 470 nm (blue)
viewing angle: Lambertian Emitter (120)
technology: InGaAlP (amber),
InGaN (true green, blue)
optical efficiency: 24 lm/W (amber),
13 lm/W (true green), 3 lm/W (blue)
grouping parameter: luminous intensity,
wavelength
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering and
TTW soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 2000/reel, 180 mm
or 8000/reel, 330 mm
ESD-withstand voltage: up to 2 kV acc. to
EOS/ESD-5.1-1993
Applications
indoor and outdoor displays (e.g. displays for
traffic; light writing displays)
LED chips can be controlled separately
full color displays, RGB-Displays
backlighting (LCD, displays, illuminated
advertising, general lighting)
coupling into light guides
2003-07-18
2
LATB T66B
Anm.: -78 gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5)
Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Gruppen sind
nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe pro Farbe enthalten.
Dimmverhltnis im Gleichstrom-Betrieb max. 5:1 fr amber
Note: -78 Total color tolerance range, delivery in single groups (please see page 5)
The standard shipping format for serial types includes a family group. Individual groups are not
available.
No packing unit / tape ever contains more than one luminous intensity group per color.
Dimming range for direct current mode max. 5:1 for amber
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous Intensity
I
F
= 20 mA
I
V
(mcd)
amber
true green
blue
LATB T66B
amber
true green
blue
colorless diffused
and
black painted
package surface
180 ... 450
180 ... 450
45 ... 112
Bestell - Information
Ordering Information
Typ
Type
Bestellnummer
Ordering Code
LATB T66B-ST-1+ST-78+PQ-1
LATB T66B-ST-1+ST-7+PQ-1
LATB T66B-ST-1+ST-8+PQ-1
LATB T66B-ST-1+TU-78+QR-1
Q65110A0152
Q65110A0181
Q65110A0182
Q65110A0697
LATB T66B
2003-07-18
3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LA
LT
LB
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 125
+ 125
+ 110
C
Durchlassstrom
Forward current
I
F
50
20
20
mA
Stostrom
Surge current
t
p
= 10
s,
D
= 0.005
I
FM
100
400
300
mA
Sperrspannung
1)
Reverse voltage
V
R
12
5
5
V
Leistungsaufnahme
Power consumption
P
tot
130
85
85
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
1 chip on
Junction/ambient
3 chips on
Sperrschicht/Ltpad
1 chip on
Junction/solder point
3 chips on
Montage auf PC-Board FR 4 (Padgre
16 mm
2
)
mounted on PC board FR 4 (pad size
16 mm
2
)
R
th JA
R
th JA
R
th JS
R
th JS
480
770
260
420
530
820
290
470
530
820
290
470
K/W
K/W
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term application
2003-07-18
4
LATB T66B
Kennwerte (
T
A
= 25 C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LA
LT
LB
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 20 mA
peak
628
523
465
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
I
F
= 20 mA
dom
617
2/+7
528
9
470
6
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 20 mA
16
33
25
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
120
120
120
Grad
deg.
Durchlassspannung
2)
(min.)
Forward voltage
(typ.)
I
F
= 20 mA
(max.)
V
F
V
F
V
F
2.0
2.4
3.5
4.1
3.6
4.1
V
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 12 V (amber);
V
R
= 5 V (true green / blue)
I
R
I
R
0.01
10
0.01
10
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
=20 mA; 10C
T
100C
TC
peak
0.13
0.04
0.05
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 20 mA; 10C
T
100C
TC
dom
0.06
0.03
0.04
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 20 mA; 10C
T
100C
TC
V
1.8
3.6
3.1
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 20 mA
opt
24
13
3
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LATB T66B
2003-07-18
5
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 11 % ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11 %.
1)
Wellenlngengruppen / Wavelength groups
Gruppe
Group
true green
Einheit
Unit
min.
max.
7
519
528
nm
8
528
537
nm
Lichtgruppe
Luminous
Intensity
Group
Lichtstrke
Luminous
Intensity
I
V
(mcd)
Lichtstrom
Luminous
Flux
V
(mlm)
Lichtstrke
Luminous
Intensity
I
V
(mcd)
Lichtstrom
Luminous
Flux
V
(mlm)
Lichtstrke
Luminous
Intensity
I
V
(mcd)
Lichtstrom
Luminous
Flux
V
(mlm)
amber
true green
blue
S+S+P
S+S+Q
S+T+P
S+T+Q
S+T+R
S+U+P
S+U+Q
S+U+R
T+S+P
T+S+Q
T+T+P
T+T+Q
T+T+R
T+U+P
T+U+Q
T+U+R
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
180 ... 280
180 ... 280
280 ... 450
280 ... 450
280 ... 450
450 ... 710
450 ... 710
450 ... 710
180 ... 280
180 ... 280
280 ... 450
280 ... 450
280 ... 450
450 ... 710
450 ... 710
450 ... 710
680 (typ.)
680 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1700 (typ.)
1700 (typ.)
1700 (typ.)
680 (typ.)
680 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1700 (typ.)
1700 (typ.)
1700 (typ.)
45 ...
71
71 ...
112
45 ...
71
71 ...
112
112 ... 180
45 ...
71
71 ...
112
112 ... 180
45 ...
71
71 ...
112
45 ...
71
71 ...
112
112 ... 180
45 ...
71
71 ...
112
112 ... 180
95 (typ.)
270 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
95 (typ.)
270 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: T-1+S-7+P-1
Example: T-1+S-7+P-1
Lichtgruppe
Luminous
Intensity
Group
(amber)
Wellenlnge
(keine
Gruppierung)
Wavelength
(no grouping)
(amber)
Lichtgruppe
Luminous
Intensity
Group
(true green)
Wellenlnge
Wavelength
(true green)
Lichtgruppe
Luminous
Intensity
Group
(blue)
Wellenlnge
(keine
Gruppierung)
Wavelength
(no grouping)
(blue)
T
1
S
7
P
1
2003-07-18
6
LATB T66B
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 20 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
0
350
nm
OHL01452
I
20
40
60
80
%
100
rel
blue
400
450
500
550
600
650
700
true green
V
amber
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL01660
50
60
70
80
90
100
0
20
40
60
80
100
120
LATB T66B
2003-07-18
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(20 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 20 mA
OHL00590
10
-2
10
-1
10
0
10
1
F
V
10
2
F
I
mA
2.3
1.3
1.5
1.7
1.9
2.1
V 2.5
OHL01481
I
F
3.5
2
3
2.5
5
V
4.5
4
V
F
5
mA
10
2
10
-1
5
10
0
5
10
1
true green
blue
V
V (20 mA)
10
-1
0
10
10
1
2
10
mA
OHL01473
F
I
I
I
5
5
true green
blue
1
10
-2
-3
10
10
5
-1
0
5
10
5
10
amber
OHL01477
0
-40
C
T
(25 C)
I
V
I
V
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2.0
-20
0
20
40
60
100
amber
true green,
blue
LATB T66B
2003-07-18
8
Dominante Wellenlnge
dom
=
f
(
I
F
)
Dominant Wavelength
LB
, T
A
= 25 C
Dominante Wellenlnge
dom
=
f
(
I
F
)
Dominant Wavelength
LT
, T
A
= 25 C
I
OHL105
467
dom
0
mA
nm
20
40
60
80
468
469
470
471
472
473
474
blue
f
I
510
dom
0
mA
nm
20
40
60
80
515
520
525
530
535
540
550
f
true green
LATB T66B
2003-07-18
9
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
1 chip on
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
1 chip on
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
3 chips on
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
3 chips on
OHL00926
0
0
20
40
60
80 C 100
mA
F
I
T
temp. ambient
T
A
A
amber
blue
10
20
30
40
50
60
true green
OHL00927
0
0
20
40
60
80 C 100
mA
F
I
T
temp. solder point
T
S
S
amber
blue
10
20
30
40
50
60
true green
OHL00928
0
0
20
40
60
80 C 100
mA
F
I
T
temp. ambient
T
A
A
amber
blue
10
20
30
40
50
60
true green
OHL00929
0
0
20
40
60
80 C 100
mA
F
I
T
temp. solder point
T
S
S
amber
blue
10
20
30
40
50
60
true green
LATB T66B
2003-07-18
10
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
amber (1 Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
amber (3 Chips on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
amber (1 Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
amber (3 Chips on)
OHL00193
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01605
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01604
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01606
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
LATB T66B
2003-07-18
11
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
true green (1 Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
true green (3 Chips on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
true green (1Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
true green (3 Chips on)
OHL11400
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.45
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
OHL00930
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.20
OHL11401
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.05
0.10
0.15
0.20
OHL00931
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.045
LATB T66B
2003-07-18
12
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
blue (1 Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
blue (3 Chips on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
blue (1 Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
blue (3 Chips on)
OHL11405
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.05
0.10
0.15
0.20
0.25
0.35
OHL00932
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.050
0.100
0.150
0.200
0.250
0.300
0.350
0.450
OHL11406
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.14
OHL00934
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.050
0.100
LATB T66B
2003-07-18
13
Die Farbkoordinaten des Mischlichtes knnen innerhalb des mit a) gekennzeichneten Bereichs des Farbdreiecks
erwartet werden.Der Unbuntpunkt (x = 0,33, y = 0,33) ist mit ,,+" gekennzeichnet.
The color coordinates of the mixed light can be expected within the area of the color triangle marked a).
The achromatic point (x = 0.33, y = 0.33) is marked ,,+".
OHA02290
+
520
530
540
550
560
570
580
590
600
610
620
630
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
a)
amber
blue
true green
2003-07-18
14
LATB T66B
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 35 mg
1
4
2
3
Package marking
GPLY6900
2.6 (0.102)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
0.8 (0.031)
0.6 (0.024)
3.0 (0.118)
3.4 (0.134)
(2.4 (0.094))
3.3 (0.130)
3.7 (0.146)
0.5 (0.020)
1.1 (0.043)
0.1 (0.004) typ
4
1
0.18 (0.007)
0.4 (0.016)
0.6 (0.024)
1.7 (0.067)
2.1 (0.083)
0.9 (0.035)
0.7 (0.028)
C
A
C
C
Circuit Diagram
1
Cathode
Amber (A)
2
Anode
A, T, B
3
Cathode
Blue (B)
4
Cathode
True Green (T)
LATB T66B
2003-07-18
15
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
2003-07-18
16
LATB T66B
Wellenlten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskhlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
LATB T66B
2003-07-18
17
Empfohlenes Ltpaddesign
IR Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHLPY439
Padgeometrie fr
verbesserte Wrmeableitung
improved heat dissipation
Paddesign for
Ltstoplack
Solder resist
1.1 (0.043)
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
3.3 (0.130)
0.5 (0.020)
7.5 (0.295)
0.4 (0.016)
Cathode marking
Kathoden Markierung /
Cu Flche / 12 mm per pad
2
Cu-area
_
<
3.3 (0.130)
2003-07-18
18
LATB T66B
Empfohlenes Ltpaddesign
Wellenlten (TTW)
Recommended Solder Pad
TTW Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gurtung / Polaritt und Lage
Verpackungseinheit 2000/Rolle, 180 mm
oder 8000/Rolle, 330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, 180 mm
or 8000/reel, 330 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHAY0583
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
3.5 (0.138)
1.5 (0.059)
2 (0.079)
3.5 (0.138)
1 (0.039)
8 (0.315)
2.8 (0.110)
0.5 (0.020)
7.5 (0.295)
Solder resist
Ltstoplack
PCB-direction
Bewegungsrichtung
der Platine
2 (0.079)
Padgeometrie fr
improved heat dissipation
verbesserte Wrmeableitung
Paddesign for
2
Cu Flche / > 12 mm per pad
Cu-area
OHAY0095
4 (0.157)
2.9 (0.114)
1.5 (0.059)
4 (0.157)
3.6 (0.142)
3.5 (0.138)
2 (0.079)
1.75 (0.069)
8 (0.315)
C
A
C
C
LATB T66B
2003-07-18
19
Revision History: 2003-07-18
Date of change
Previous Version:
2003-02-12
Page
Subjects (major changes since last revision)
1
ESD-withstand voltage
2
ordering informaion
5
grouping information
18
annotations
2002-07-23
3, 4
value (reverse voltage from 5 V to 12 V)
2002-09-18
3, 4
values: forward current, surge current, reverse voltage, power
consumption, thermal resistance, forward voltage
2002-12-17
7
new permissible forward current diagrams, T
S
(OHL01610 to OHL00927
and OHL01607 to OHL00929)
2002-12-17
11
amber: new pulse handling diagram, 25C, 1 chip on (OHL01505 to
OHL00193)
2002-12-17
9
true green: new pulse handling diagrams, 25C (OHL01583 to
OHL11400 and OHL01584 to OHL11401)
2002-12-17
9
true green: new pulse handling diagrams, 85C (OHL01586 to
OHL00930 and OHL01575 to OHL00931)
2002-12-17
10
blue: new pulse handling diagrams, 25C (OHL01578 to OHL11405 and
OHL01579 to OHL11406)
2002-12-17
10
blue: new pulse handling diagrams, 85C (OHL01576 to OHL00932 and
OHL01577 to OHL00934)
2002-12-17
8
true green and blue: new dominant wavelength diagrams
2002-12-17
5
new luminous intensity groups
2003-02-11
2
new ordering code
2003-02-11
7
diagram forward current OHL00737 replaced by OHL00590
2003-02-12
2003-07-18
20
LATB T66B
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don't represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
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