LG L890
SmartLED
TM
2002-12-10
1
Besondere Merkmale
Gehusetyp: SMT Gehuse SCD 80
Besonderheit des Bauteils: kleinste Bauform
1,7 mm x 0,8 mm x 0,65 mm (LxBxH)
Wellenlnge: 570 nm
Abstrahlwinkel: extrem breite
Abstrahlcharakteristik (160)
Technologie: GaP
optischer Wirkungsgrad: 2,5 lm/W
Gruppierungsparameter: Lichtstrke
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten und
Wellenlten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 5000/Rolle bzw.
10000/Rolle, 180 mm
Anwendungen
Informationsanzeigen im Innenbereich
optischer Indikator
Flache Hinterleuchtung (LCD, Mobile Phone,
Schalter, Display)
Spielsachen
Features
package: SMT package SCD 80
feature of the device: smallest package
1.7 mm x 0.8 mm x 0.65 mm (LxWxH)
wavelength: 570 nm
viewing angle: extremely wide (160)
technology: GaP
optical efficiency: 2.5 lm/W
grouping parameter: luminous intensity
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering and
TTW soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 5000/reel resp.
10000/reel, 180 mm
Applications
indoor displays
optical indicators
flat backlighting (LCD, cellular phones,
switches, displays)
toys
2002-12-10
2
LG L890
Anm.: -1 gesamter Farbbereich (siehe Seite 4)
Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe,
die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Note: -1 Total color tolerance range (see page 4)
The standard shipping format for serial types includes a lower or upper family group of 3 or 4
individual groups. Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
Typ
Type
Emissions-
farbe
Color of
Emission
Gehusefarbe
Color of
Package
Lichtstrke
Luminous
Intensity
I
F
= 20 mA
I
V
(mcd)
Lichtstrom
Luminous
Flux
I
F
= 20 mA
V
(mlm)
Bestellnummer
Ordering Code
LG L890-K1L1-1
LG L890-L1M2-1
green
colorless
diffused
7.1 ... 14.0
11.2 ... 28.0
40 (typ.)
80 (typ.)
Q62703Q6022
Q62703Q6156
LG L890
2002-12-10
3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 110
C
Durchlassstrom
Forward current
I
F
20
mA
Stostrom
Surge current
t
p
=
10
s,
D
= 0.1
I
FM
100
mA
Sperrspannung
1)
Reverse voltage
V
R
12
V
Leistungsaufnahme
Power consumption
P
tot
95
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/ambient
Sperrschicht/Ltpad
Junction/solder point
Montage auf PC-Board FR 4 (Padgre
5 mm
2
)
mounted on PC board FR 4 (pad size
5 mm
2
)
R
th JA
R
th JS
500
290
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term application
2002-12-10
4
LG L890
Kennwerte (
T
A
= 25 C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 20 mA
peak
572
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
1)
I
F
= 20 mA
dom
570
6
nm
Spektrale Bandbreite
(typ.)
Spectral bandwidth
I
F
= 20 mA
25
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
160
Grad
deg.
Durchlassspannung
2)
(typ.)
Forward voltage
2)
(max.)
I
F
= 20 mA
V
F
V
F
2.2
2.5
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 12 V
I
R
I
R
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 20 mA; 10C
T
100C
TC
peak
0.11
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 20 mA; 10C
T
100C
TC
dom
0.07
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 20 mA; 10C
T
100C
TC
V
1.4
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 20 mA
opt
2.5
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LG L890
2002-12-10
5
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von
11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of
11%.
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstrke
Luminous Intensity
I
V
(mcd)
Lichtstrom
Luminous Flux
V
(mlm)
K1
K2
L1
L2
M1
M2
7.1 ...
9.0
9.0 ... 11.2
11.2 ... 14.0
14.0 ... 18.0
18.0 ... 22.4
22.4 ... 28.0
30 (typ.)
40 (typ.)
50 (typ.)
65 (typ.)
80 (typ.)
100(typ.)
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: K1
Example: K1
Lichtgruppe
Luminous Intensity Group
Halbgruppe
Half Group
K
1
2002-12-10
6
LG L890
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 20 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
%
rel
OHL01098
100
80
60
40
20
0
400
450
500
550
600
650
700
nm
I
green
V
OHL01441
0
20
40
60
80
100
120
0.4
0.6
0.8
1.0
100
90
80
70
60
50
0
10
20
30
40
0
0.2
0.4
0.6
0.8
1.0
LG L890
2002-12-10
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
A
)
Max. Permissible Forward Current
T
S
: temp. solder point
Relative Lichtstrke
I
V
/
I
V(20 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
A
)
Max. Permissible Forward Current
T
A
: temp. ambient
10
-1
V
5
OHL01263
I
F
F
V
0
10
1
10
2
10
5
mA
1
1.4
1.8
2.2
2.6
3
3.4
OHL00045
0
I
F
T
0
10 20 30 40 50 60 70 80 C 100
thja
R
= 500 K/W
5
10
15
20
25
30
35
40
mA
temp. ambient
A
T
OHL00046
0
I
F
T
0
10 20 30 40 50 60 70 80 C 100
thjs
R
= 290 K/W
5
10
15
20
25
30
35
40
mA
temp. solder point
S
T
OHL01449
10
-3
10
-2
10
-1
10
0
10
1
10
-1
10
5
10
0
5
1
mA
2
10
I
(20 mA)
I
V
I
V
OHL01456
0
I
F
T
0
A
10 20 30 40 50 60 70 80 C 100
thja
R
= 500 K/W
5
10
15
20
25
30
35
40
mA
OHL00045
0
I
F
T
0
10 20 30 40 50 60 70 80 C 100
thja
R
= 500 K/W
5
10
15
20
25
30
35
40
mA
temp. ambient
A
T
LG L890
2002-12-10
8
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 20 mA
green
0
OHL01101
C
A
T
0
20
40
60
80
100
V
V (25 C)
I
I
0.4
0.8
1.2
1.6
2
LG L890
2002-12-10
9
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
LG
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
LG
OHL00759
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.12
1
OHL00760
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.12
1
2002-12-10
10
LG L890
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 1.4 mg
GPLY6057
0.8 (0.031)
0.1 (0.004)
Cathode
0.3 (0.012)
+0.05 (0.002)
-0.03 (0.001)
0.125 (0.005)
1.7 (0.067)
0.1 (0.004)
7
max
+0.02 (0.001)
-0.05 (0.002)
0.65 (0.026)
5
1.3 (0.051)
0.1 (0.004)
marking
marking
Cathode
LG L890
2002-12-10
11
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
2002-12-10
12
LG L890
Wellenlten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskhlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
LG L890
2002-12-10
13
Empfohlenes Ltpaddesign
IR Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gehuse hlt TTW-Lthitze aus / Package able to withstand TTW-soldering heat
Empfohlenes Ltpaddesign verwendbar fr SmartLED
TM
und Chipled - Bauform 0603
IR Reflow Lten
Recommended Solder Pad useable for SmartLED
TM
and Chipled - Package 0603
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Empfohlene Ltpastendicke: 120 m/ recommended thickness of solder paste: 120 m
Gehuse fr Wellenlten (TTW) geeignet / Package suitable for TTW-soldering
OHPY1301
1.45 (0.057)
0.35 (0.014)
0.35 (0.014)
OHPY0203
2.25 (0.089)
0.65 (0.026)
0.3 (0.012)
0.5 (0.020)
0.8 (0.031)
0.35 (0.014)
0.225 (0.009)
2002-12-10
14
LG L890
Gurtung / Polaritt und Lage
Method of Taping / Polarity and Orientation
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Verpackungseinheit:
8 mm Gurt mit 5000/Rolle, 180 mm
8 mm Gurt mit 10000/Rolle, 180 mm (auf Anfrage)
Packing unit:
8 mm tape with 5000/reel, 180 mm
8 mm tape with 10000/reel, 180 mm (on request)
OHAY1350
1.5 (0.059)
4 (0.157)
2 (0.079)
0.4 (0.016)
0.93 (0.037)
3.5 (0.138)
1.75 (0.069)
8 (0.315)
1.4 (0.055)
2.04 (0.080)
A
C
LG L890
2002-12-10
15
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don't represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2002-12-10
Date of change
Previous Version:
2002-11-18
Page
Subjects (major changes since last revision)
2
changed resin from colorless clear to colorless diffused
12
recommended solder pad
9
Package Outlines
3
pad size from 16 mm
2
to 5 mm
2
3
Surge current
9
Permissible Pulse Handling Capability
15
annotations
2002-07-23
3, 4
value (reverse voltage from 5 V to 12 V)
2002-09-18
1, 14
tape with 5000/reel and 10000/reel instead of 10000
2002-12-10
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