LS M779, LY M779, LG M779
LC Mini TOPLED
RG
Low Current LED
Abgekndigt nach PD_078_02 - werden durch Mini
TOPLED Santana
ersetzt werden
Obsolete acc. to PD_078_02 - will be replaced by Mini
TOPLED Santana
2003-08-04
1
Besondere Merkmale
Gehusetyp: weies SMT Gehuse
Besonderheit des Bauteils: kleine Bauform
fr Anwendungen mit wenig Platzbedarf;
Bauteil wird top-down montiert und strahlt
durch das PCB
Wellenlnge: 628 nm (super-rot),
587 nm (gelb), 570 m (grn)
Abstrahlwinkel: Lambertscher Strahler (120)
Technologie: GaAsP
optischer Wirkungsgrad: 2 lm/W
Gruppierungsparameter: Lichtstrke
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten
Vorbehandlung: nach JEDEC Level 2
Gurtung: 12 mm Gurt mit 3000/Rolle,
180 mm oder 11800/Rolle, 330 mm
Anwendungen
optischer Indikator
Einkopplung in Lichtleiter
Hinterleuchtung (LCD, Handy, Schalter,
Tasten, Displays, Werbebeleuchtung,
Allgemeinbeleuchtung)
Innenbeleuchtung im Automobilbereich
(z.B. Instrumentenbeleuchtung, u..)
Features
package: white SMT package
feature of the device: small package for
applications where small space is required;
LED is mounted top down and emits through
the PCB
wavelength: 628 nm (super-red),
587 nm (yellow), 570 nm (green)
viewing angle: Lambertian Emitter (120)
technology: GaAsP
optical efficiency: 2 lm/W
grouping parameter: luminous intensity
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering
preconditioning: acc. to JEDEC Level 2
taping: 12 mm tape with 3000/reel, 180 mm
or 11800/reel, 330 mm
Applications
optical indicators
coupling into light guides
backlighting (LCD, cellular phones, switches,
keys, displays, illuminated advertising, general
lighting)
interior automotive lighting. (e.g. dashboard
backlighting, etc.)
2003-08-04
2
LS M779, LY M779, LG M779
s
Abgekndigt nach PD_078_02 - werden durch Mini TOPLED Santana
ersetzt werden
Obsolete acc. to PD_078_02 - will be replaced by Mini TOPLED Santana
Letzte Bestellung / Last Order: 30.09.2003
Letzte Lieferung / Last Delivery: 31.03.2004
Anm.: -1 gesamter Farbbereich
Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe,
die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Note: -1 Total color tolerance range
The standard shipping format for serial types includes a lower or upper family group of 3 or 4
individual groups. Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous
Intensity
I
F
= 2 mA
I
V
(mcd)
Lichtstrom
Luminous
Flux
I
F
= 2 mA
V
(mlm)
Bestellnumm
er
Ordering
Code
s
LS M779-D1E1-1
s
LS M779-E1F1-1
s
LS M779-F1G2-1
super-red
colorless clear
0.45 ... 0.90
0.71 ... 1.40
1.12 ... 2.80
2.0 (typ.)
3.1 (typ.)
5.5 (typ.)
Q62703Q5091
Q62703Q5092
Q62703Q5093
s
LY M779-D1E1-1
s
LY M779-E1F1-1
s
LY M779-F1G1-1
yellow
colorless clear
0.45 ... 0.90
0.71 ... 1.40
1.12 ... 2.24
2.0 (typ.)
3.1 (typ.)
4.9 (typ.)
Q62703Q5129
Q62703Q5130
Q62703Q5131
s
LG M779-C1F2-1
green
colorless clear
0.28 (1.0 typ.)
1.0 (typ.)
Q62703Q3049
LS M779, LY M779, LG M779
2003-08-04
3
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 100
C
Durchlassstrom
Forward current
I
F
7.5
mA
Stostrom
Surge current
t
10
s,
D
= 0.005
I
FM
0.15
A
Sperrspannung
1)
Reverse voltage
V
R
12
V
Leistungsaufnahme
Power consumption
P
tot
20
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/ambient
Sperrschicht/Ltpad
Junction/solder point
Montage auf PC-Board FR 4 (Padgre
5 mm
2
)
mounted on PC board FR 4 (pad size
5 mm
2
)
R
th JA
R
th JS
480
230
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term application
2003-08-04
4
LS M779, LY M779, LG M779
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LS
LY
LG
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 2 mA
peak
635
586
572
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
I
F
= 2 mA
dom
628
6
587
7/+8
570
6
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 2 mA
45
45
25
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
120
120
120
Grad
deg.
Durchlassspannung
2)
(typ.)
Forward voltage
(max.)
I
F
= 2 mA
V
F
V
F
1.8
2.5
2.0
2.6
1.9
2.5
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 12 V
I
R
I
R
0.01
10
0.01
10
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 2 mA; 10C
T
100C
TC
peak
0.11
0.10
0.11
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 2 mA; 10C
T
100C
TC
dom
0.07
0.07
0.07
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 2 mA; 10C
T
100C
TC
V
2.0
1.6
1.9
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 2 mA
opt
2
2
2
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LS M779, LY M779, LG M779
2003-08-04
5
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von
11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of
11%.
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstrke
Luminous Intensity
I
V
(mcd)
Lichtstrom
Luminous Flux
V
(mlm)
D1
D2
E1
E2
F1
F2
G1
G2
0.45 ... 0.56
0.56 ... 0.71
0.71 ... 0.90
0.90 ... 1.12
1.12 ... 1.40
1.40 ... 1.80
1.80 ... 2.24
2.24 ... 2.80
1.5 (typ.)
2.0 (typ.)
2.5 (typ.)
3.0 (typ.)
3.8 (typ.)
4.8 (typ.)
6.0 (typ.)
7.6 (typ.)
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: F2
Example: F2
Lichtgruppe
Luminous Intensity Group
Halbgruppe
Half Group
F
2
2003-08-04
6
LS M779, LY M779, LG M779
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 2 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
%
rel
OHL01210
100
80
60
40
20
0
400
450
500
550
600
650
700
nm
I
green
yellow
super-red
V
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL01660
50
60
70
80
90
100
0
20
40
60
80
100
120
LS M779, LY M779, LG M779
2003-08-04
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
Relative Lichtstrke
I
V
/
I
V(2 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 2 mA
10
-1
V
5
OHL01208
I
F
F
V
0
10
1
10
2
10
5
mA
1
1.4
1.8
2.2
2.6
3
3.4
yellow
green
super-red
0
OHL01082
C
0
20
40
60
80
100
1
2
3
4
5
6
mA
8
T
F
I
A
T
S
T
temp. solder point
temp. ambient
T
S
A
T
7
V
V(2 mA)
10
-1
0
10
10
1
2
10
mA
10
-3
5
OHL01207
F
I
5
-2
10
5
-1
10
0
10
1
10
I
I
5
5
green
super-red
yellow
yellow
green
super-red
0
OHL01675
C
A
T
0
20
40
60
80
100
V
V (25 C)
I
I
0.4
0.8
1.2
1.6
2
2003-08-04
8
LS M779, LY M779, LG M779
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
OHL01278
s
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t
D
I
T
T
P
F
t
P
=
D
= 0.005
0.01
0.02
0.05
0.2
0.5
DC
10
0
5
I
F
t
1
10
2
10
3
10
5
mA
0.1
p
LS M779, LY M779, LG M779
2003-08-04
9
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Kathodenkennung:
abgeschrgte Ecke
Cathode mark:
bevelled edge
Gewicht / Approx. weight: 10 mg
1.4 (0.055)
Cathode marking
Cathode marking
+0.05 (0.002)
1.0 (0.039)
0.8 (0.031)
0...0.1 (0.004)
Cathode
GPLY6926
5.0 (0.197)
5.4 (0.213)
1.2 (0.047)
1.5 (0.059)
2.0 (0.079)
1.1 (0.043)
1.3 (0.051)
1.0 (0.039)
0.8 (0.031)
1.25 (0.049)
1.35 (0.053)
0.5 (0.020)
0.6 (0.024)
0.18 (0.007)
0.12 (0.005)
0.7 (0.028) min.
Light emitting window
typ. 1.5 (0.059) x 1.0 (0.039)
2003-08-04
10
LS M779, LY M779, LG M779
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
LS M779, LY M779, LG M779
2003-08-04
11
Wellenlten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskhlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
2003-08-04
12
LS M779, LY M779, LG M779
Empfohlenes Ltpaddesign
IR Reflow Lten
Recommended Solder Pad
IR reflow soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gehuse fr Wellenlten (TTW) geeignet / Package suitable for TTW-soldering
OHLPY963
6 (0.236)
2.6 (0.102)
1.5 (0.059)
1.2 (0.047)
Ltstopplack
Solder resist
Hole on the PCB,
dimension: 2.5 (0.098) +0.3 (0.012)
6 (0.236)
2.6 (0.102)
1.5 (0.059)
LS M779, LY M779, LG M779
2003-08-04
13
Gurtung / Polaritt und Lage
Verpackungseinheit 3000/Rolle, 180 mm
oder 11800/Rolle, 330 mm
Method of Taping / Polarity and Orientation Packing unit 3000/reel, 180 mm
or 11800/reel, 330 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHAY0224
A
C
1.5 (0.059)
2 (0.079)
4 (0.157)
4 (0.157)
1.55 (0.061)
5.5 (0.217)
12 (0.472)
1.75 (0.069)
5.4 (0.213)
2003-08-04
14
LS M779, LY M779, LG M779
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don't represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2003-08-04
Date of change
Previous Version:
2002-09-30
Page
Subjects (major changes since last revision)
3
pad size from 16 mm
2
to 5 mm
2
1
insertion of "Not for new designs..."
2002-06-14
13
annotations
2002-07-23
3, 4
value (reverse voltage from 5 V to 12 V)
2002-09-18
2
Not for new design
2002-09-16
2
Ordering Code
2002-09-16
1,12
removal: pad for TTW soldering
2002-09-30
1, 2
Obsolete
2003-08-04
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