Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
E
1
R
2
J
3
3
4
G
5
E
6
Y
7
J
8
1
9
0
10
2
11
V
12
Thick Film
Chip Resistors
Product Code
Size, Power Rating
1GE : 0201
2GE : 0402
3GE : 0603
6GE : 0805
8GE : 1206
14 : 1210
12 : 1812
12Z : 2010
1T : 2512
0.05 W
0.063 W
0.1 W
0.125 W
0.25 W
0.25 W
0.5 W
0.5 W
1 W
Power R.
Marking
Code
Y
]Nil
Marking
Value Marking on
black side
No marking
Resistance Tolerance
Code
J
0
Tolerance
5 %
Jumper
The first two digits are significant figures of resistance and
the third one denotes number of zeros following. Decimal
Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
Resistance Value
Type : inches
Thick Film Chip Resistors
Thick Film Chip Resistors
0201, 0402, 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type:
ERJ 1G, 2G, 3G, 6G, 8G, 14,
12, 12Z, 1T
n
Features
l Small size and lightweight
l High reliability
Approved under the QS-9000 system
l Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A
n
Explanation of Part Numbers
Metal glaze thick film resistive element and three layers of electrodes
(Only 14, 12, 12Z, 1T type)
Punched (Paper) Taping
Embossed Taping
Packaging
(Only 3G, 6G, 8G type)
Code
V
U
(Only 2G, 3G, 6G type)
X
B
Bulk case
Punched (Paper) Taping
2 mm pitch, 10000 pcs.
Punched (Paper) Taping
2 mm pitch, 20000 pcs.
(Only 2G, 3G type)
2 mm pitch, 15000 pcs.
Y
(Only 1G type)
(Only 2G type)
C
Punched (Paper) Taping
Packaging Specifications
]
When partly omitted, all the rest P/N factors should be moved up respectively.
l Compatible with placement machines
Taping and bulk case packaging available
l Approved under the ISO 9001 system
l Suitable for both reflow and flow soldering
Rev.02/04
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
ERJ1G
0.60
0.03
0.30
0.03
0.12
0.05
0.15
0.05
0.25
0.05
0.15 g
(0201)
ERJ2G
1.00
0.05
0.50
0.05
0.20
0.10
0.25
0.05
0.35
0.05
0.8 g
(0402)
ERJ3G
1.60
0.15
0.80
+0.15
0.30
0.20
0.30
0.15
0.45
0.10
2 g
(0603)
0.05
ERJ6G
2.00
0.20
1.25
0.10
0.40
0.20
0.40
0.20
0.60
0.10
4 g
(0805)
ERJ8G
3.20
+0.05
1.60
+0.05
0.50
0.20
0.50
0.20
0.60
0.10
10 g
(1206)
ERJ14
3.20
0.20
2.50
0.20
0.50
0.20
0.50
0.20
0.60
0.10
16 g
(1210)
ERJ12
4.50
0.20
3.20
0.20
0.50
0.20
0.50
0.20
0.60
0.10
27 g
(1812)
ERJ12Z
5.00
0.20
2.50
0.20
0.60
0.20
0.60
0.20
0.60
0.10
27 g
(2010)
ERJ1T
6.40
0.20
3.20
0.20
0.65
0.20
0.60
0.20
0.60
0.10
45 g
(2512)
n
Construction
n
Dimensions in mm (not to scale)
Thick Film Chip Resistors
n
Ratings
a
b
t
W
L
Type
(inches)
Power Rating
at 70 C
(W)
Limiting Element
Voltage (Maximum
RCWV)
(1)
(V)
Maximum Overload
Voltage
(2)
(V)
Resistance
Tolerance(%)
Standard
Resistance Values
min.
max.
Resistance Range (W)
T.C.R.
10
-6
/C
(ppm/C)
Jumper
1G
2G 3G
6G8G141212Z1T
Maximum Overload Current
1 A
2 A
4 A
Rated Current
0.5 A
1 A
2 A
Dimensions (mm)
L
W
a
b
t
Weight
(1000 pcs.)
Type
(inches)
0.20
0.15
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12, 12Z
(1812, 2010)
ERJ1T
(2512)
<10 W:
100 to
+600
0.05
0.063
0.1
0.125
0.25
0.25
0.5
1
15
50
50
150
200
200
200
200
30
100
100
200
400
400
400
400
5
5
5
5
5
5
5
5
10
1
1
1
1
1
1
1
1 M
2.2 M
10 M
10 M
10 M
10 M
10 M
1 M
E24
E24
E24
E24
E24
E24
E24
E24
10 W to
1 MW:
200
1 MW<:
400 to
+150
Protective coating
High purity alumina
substrate
Termination (Inner)
Termination
(Between)
Resistive element
Termination (Outer)
Power Derating Curve
with the right figure.
40 20 0 20 40 60 80 100 120 140 160
0
180
60
155 C
70 C
Ambient Temperature (C)
20
40
60
80
100
Rated
Load
(%)
55 C
3G, 6G, 8G
1G,2G,14,12,12Z,1T
125 C
(1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV= Power Rating
Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever is less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined from SOTV=2.5
Power Rating or max. Overload Voltage listed above
whichever is less.
For resistors operating in ambient temperature above
70 C, power rating should be derated in accordance
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
ERJ1G
0.25
15000 pcs./reel (2 mm pitch)
(0201)
ERJ2G
0.35
10000 pcs./reel (2 mm pitch)
50000 pcs./case
(0402)
20000 pcs./reel (2 mm pitch)
ERJ3G
0.45
10000 pcs./reel (2 mm pitch)
25000 pcs./case
(0603)
5000 pcs./reel (4 mm pitch)
]
ERJ6G
0.6
5000 pcs./reel (4 mm pitch)
]
10000 pcs./case
(0805)
ERJ8G
0.6
5000 pcs./reel (4 mm pitch)
]
(1206)
ERJ14
0.6
5000 pcs./reel
(1210)
ERJ12,12Z
0.6
5000 pcs./reel
(1812, 2010)
ERJ1T
0.6
4000 pcs./reel
(2512)
180.0
3.0
60 min. 13.0
1.0
1G,2G,3G
6G,8G,14
12,12Z,1T
13.0
1.0
15.4
2.0
Thick Film Chip Resistors
l Standard Quantity
l Taping Reel
Type
fA
fB
fC
W
T
9.0
1.0
11.4
2.0
0
l Bulk Case
B
*
9
6
B)
B+
Slider
Shutter
110
38
12
Dimensions
(mm)
(mm)
Punched (Paper) Taping
Embossed Taping
(4 mm pitch)
Bulk Case
Type
(inches)
Thickness
(mm)
1G
0.47
0.05
2G
2.00
0.10
0.52
0.05
3G
0.70
0.05
6G
4.00
0.10
8G
14
2.80
0.20
3.50
0.20
8.00
0.30
3.50
0.05
12
3.50
0.20
4.80
0.20
12Z
2.80
0.20
5.30
0.20
12.00
0.30
5.50
0.05
1.75
0.10
4.00
0.10
1T
3.60
0.20
6.90
0.20
l Punched (Paper) Taping
F
E
W
P
1
P
2
P
0
T
A
B
Tape running direction
Chip component
Sprocket hole
Compartment
BD
0
14
1 min.
12
12Z
2.00
0.05
4.00
0.10
1.50
+0.10
1.00
0.10
1.5 min.
1T
l Embossed Taping
Type
A
B
W
F
E
P
1
Dimensions
(mm)
Type
P
2
P
0
fD
0
t
fD
1
Dimensions
(mm)
0
FE
W
BD
1
P
1
P
2
P
0
t
A
B
Tape running direction
Chip component
Sprocket hole
Compartment
BD
0
Type
A
B
W
F
E
1G
0.38
0.05
0.68
0.05
2G
0.70
0.05
1.20
0.05
3G
1.10
0.10
1.90
0.10
6G
1.65
0.15
2.50
0.20
8G
2.00
0.15
3.60
0.20
8.00
0.20
3.50
0.05
1.75
0.10
Dimensions
(mm)
Type
P
1
P
2
P
0
fD
0
T
2.00
0.05
4.00
0.10
1.50
+0.10
0.84
0.05
Dimensions
(mm)
0
n
Packaging Specifications
] Please consult us if resistors other than shown above are needed.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
ERJ1G(0201)
0.3 to 0.4
0.8 to 0.9 0.25 to 0.35
ERJ2G(0402)
0.5 to 0.6
1.4 to 1.6
0.4 to 0.6
ERJ3G(0603)
0.7 to 0.9
2 to 2.2
0.8 to 1
ERJ6G(0805)
1 to 1.4
3.2 to 3.8
0.9 to 1.4
2 to 2.4
4.4 to 5
1.2 to 1.8
ERJ14(1210)
2 to 2.4
4.4 to 5
1.8 to 2.8
ERJ12(1812)
3.3 to 3.7
5.7 to 6.5
2.3 to 3.5
ERJ12Z(2010)
3.6 to 4
6.2 to 7
1.8 to 2.8
ERJ1T(2512)
5 to 5.4
7.6 to 8.6
2.3 to 3.5
Thick Film Chip Resistors
n
Recommended Land Pattern
Chip Resistor
c
a
b
Type
(inches)
Dimensions (mm)
a
b
c
n
Recommended Soldering Conditions
Recommendations and precautions are described below.
Preheating
Peak
Heating
Temperature
Time
l Recommended soldering conditions for reflow
Temperature
Time
Preheating
140 C to 160 C
60 s to 120 s
Main heating
Above 200 C
30 s to 40 s
Peak
235 5 C
max. 10 s
Temperature
Time
Preheating
150 C to 180 C
60 s to 120 s
Main heating
Above 230 C
30 s to 40 s
Peak
max. 260 C
max. 10 s
l Recommended soldering conditions for flow
Temperature
Time
Temperature
Time
Preheating
140 C to 160 C
60 s to 120 s
150 C to 180 C
60 s to 120 s
Soldering
2455 C
20 s to 30 s
max. 260 C
max. 10 s
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,
ERJ8G(1206)
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Reflow soldering should be a maximum of two times
Please contact us for additional information when
used in conditions other than those specified.
every type of printed circuit board for solderability, before
actual use.
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
For soldering
For lead-free soldering
Safety Precautions
confirmation test with the resistors actually mounted on the board.
When a load of more than the rated power is applied under load condition at steady state, it may
Never exceed the specified rated power.
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of
the resistors.
impair performance and/or reliability of the resistor.
3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a
soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds
and up to 350 C).
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may
damage the protective coating of the resistor and may affect its performance.
1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and
Please measure the temperature of terminations and study
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