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Электронный компонент: ON1004

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Transmissive Photosensors (Photo lnterrupters)
1
Publication date: April 2004
SHG00022BED
CNA1302K
(ON1004)
Photo lnterrupter
For contactless SW, object detection
Overview
CNA1302K is an ultraminiature, highly reliable transmissive
photosensor in which a high efficiency GaAs infrared light emitting
diode chip and a high sensitivity Si phototransistor chip are integrated
in a double molded resin package.
Features
Ultraminiature: 4.2 mm 5.0 mm (height: 5.2 mm)
Fast response: t
r
, t
f
= 35 s (typ.)
Highly precise position detection: 0.15 mm
Gap width: 2.0 mm
Absolute Maximum Ratings T
a
= 25C
Parameter
Symbol
Rating
Unit
Input (Light
Reverse voltage
V
R
6
V
emitting diode) Forward current
I
F
50
mA
Power dissipation
*1
P
D
75
mW
Output (Photo Collector-emitter voltage
V
CEO
35
V
transistor)
(Base open)
Emitter-collector voltage
V
ECO
6
V
(Base open)
Collector current
I
C
20
mA
Collector power dissipation
*2
P
C
75
mW
Temperature
Operating ambient temperature
T
opr
-25 to +85
C
Storage temperature
T
stg
-40 to +100
C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Input
Forward voltage
V
F
I
F
= 20 mA
1.2
1.4
V
characteristics Reverse current
I
R
V
R
= 3 V
10
A
Output
Collector-emitter cutoff current
I
CEO
V
CE
= 20 V
100
nA
characteristics (Base open)
Transfer
Collector current
I
C
V
CE
= 5 V, I
F
= 5 mA
100
400
A
characteristics Collector-emitter saturation voltage V
CE(sat)
I
F
= 10 mA, I
C
= 40 A
0.4
V
Rise time
*
t
r
V
CC
= 5 V, I
C
= 0.1 mA
35
s
Fall time
*
t
f
R
L
= 1 000
35
s
Electrical-Optical Characteristics T
a
= 25C 3C
Note) 1. Input and output are practiced by electricity.
2. This device is designed be disregarded radiation.
3. *: Switching time measurement circuit
50
R
L
V
CC
Sig. out
10%
90%
Sig. in
t
r
t
f
(Input pulse)
(Output pulse)
t
r
: Rise time
t
f
: Fall time
Note) *1: Input power derating ratio is 1.0 mW/
C at
T
a
25C.
*2: Output power derating ratio is 1.0 mW/
C at
T
a
25C.
Unit: mm
(Note) 1. Tolerance unless otherwise specified is
0.2
2. ( ) Dimension is reference
3. * is dimension at the root of leads
4. Burrs should be less than 0.15 mm
5.0
4.2
Slit width
(0.3)
1.5
1.5
(C0.3)
(C0.5)
2.0
A
A'
*3.8
*2.54
2-0.25
1
3
2
4
2-0.5
2.8
2.4
(1.0)
5.2
3.9
4.0 min.
Device
center
Gate the rest
0.3 max.
Not soldered
1.0 max.
(1.5)
1.5
+0.1
-0
SEC. A-A'
1: Anode
2: Cathode
3: Collector
4: Emitter
PISMR104-003 Package
Note) The part number in the parenthesis shows conventional part number.
2
CNA1302K
SHG00022BED
I
F
, I
C
T
a
I
F
V
F
V
F
T
a
I
C
I
F
I
C
V
CE
I
C
T
a
I
CEO
T
a
t
r
I
C
t
f
I
C
60
50
40
30
20
10
0
60
50
40
30
20
10
0
0
20
40
60
80
100
-25
5
4
3
2
1
0
3
2
1
0
0
1
2
3
4
5
6
0
5
20
10
15
25
T
a
= 25C
T
a
= 25C
V
CE
= 5 V
I
F
= 5 mA
V
CE
= 20 V
V
CE
= 5 V
T
a
= 25C
V
CC
= 5 V
T
a
= 25C
V
CC
= 5 V
T
a
= 25C
Ambient temperature T
a
(
C )
Forward current I
F
, collector current I
C
(mA)
Forward current I
F
(mA)
Collector current I
C
(mA)
Collector-emitter voltage V
CE
(V)
Collector current I
C
(mA)
Collector current I
C
(mA)
Fall time t
f
(
s)
0.4
1.2
1.6
2.0
2.4
0.8
0
1.6
1.2
0.8
0.4
0
Forward voltage V
F
(V)
Forward current I
F
(mA)
Ambient temperature T
a
(
C )
Forward voltage
V
F
(V)
120
100
80
60
40
20
-40
0
40
80
-40
0
40
80
0
1
10
-
1
10
-
2
10
-
3
10
-
4
10
-
5
-40
0
40
80
10
3
10
2
10
1
10
10
-
1
10
3
10
2
10
1
10
-
1
10
-
2
10
-
1
1
10
10
-
2
10
-
1
1
I
F
I
C
10 mA
1 mA
I
F
= 50 mA
I
F
= 20 mA
10 mA
15 mA
5 mA
2 mA
R
L
= 2 k
1 k
100
R
L
= 2 k
1 k
100
Ambient temperature T
a
(
C )
Relative collector current
I
C
(%)
Ambient temperature T
a
(
C )
Collector-emitter cutoff current (Base open) I
CEO
(
A)
Collector current I
C
(mA)
Rise time t
r
(
s)
CNA1302K
3
SHG00022BED
I
C
d (1)
I
C
d (2)
100
80
60
40
20
0
100
80
60
40
20
0
1
2
3
4
0
0.5
1.0
1.5
2.0
2.5
0
V
CE
= 5 V
T
a
= 25C
I
F
= 5 mA
V
CE
= 5 V
T
a
= 25C
I
F
= 5 mA
d
d
Distance d (mm)
Distance d (mm)
Relative collector current
I
C
(%)
Relative collector current
I
C
(%)
Criterion
0
Criterion
0
2003 SEP
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP
Caution for Safety
DANGER
This product contains Gallium Arsenide (GaAs).
GaAs powder and vapor are hazardous to human health if inhaled or
ingested. Do not burn, destroy, cut, cleave off, or chemically dis-
solve the product. Follow related laws and ordinances for disposal.
The product should be excluded form general industrial waste or
household garbage.