PAGE . 1
DATE : OCT.11.2002
DATA SHEET
3EZ11~3EZ200
FEATURES
Low profile package
Built-in strain relief
Glass passivated iunction
Low inductance
Typical I
D
less than 1.0A above 11V
Plastic package has Underwriters Laboratory Flammability
Classification 94V-O
High temperature soldering : 260C /10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-15, Molded plastic over passivated junction
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes positive end (cathode)
Standard packing: 52mm tape
Weight: 0.015 ounce, 0.04 gram
GLASS PASSIVATED JUNCTION SILICON ZENER DIODES
VOLTAGE- 11 to 200 Volts Power - 3.0 Watts
MAXIMUM5RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
Pwak Pulse Power Dissipation on TA=50C (Notes A)
Derate above 70C
Peak Forward Surge Current 8.3ms single half sine-wave
superimposed on rated load (JEDEC method)
Operating and Storage Temperature Range
UNITS
NOTES:
A.Mounted on 5.0mm2 (.013mm thick) land areas.
B.Measured on8.3ms, and single half sine-wave or equivalent square wave ,duty cycle=4 pulses per minute maximum
DO-15
Unit: inch ( mm )
.140(3.6)
.104(2.6)
.034(.86)
.028(.71)
1.
0(
25.
4)
M
I
N
.
.3
0
0
(
7
.
6
)
.
2
30(
5.
8)
1.
0(
25.
4)
M
I
N
.
VALUE
SYMBOLS
Watts
mW / C
3.0
24.0
P
D
Amps
15
I
FSM
C
-55 to +150
T
J,
T
STG