ChipFind - документация

Электронный компонент: FD64

Скачать:  PDF   ZIP
1
Seating Plane
0.50 BSC
.019
0.17
0.27
.007
.010
1.60
.063
1.35
1.45
.053
.057
0.05
0.15
.002
.006
X.XX
X.XX
DENOTES DIMENSIONS
IN MILLIMETERS
12.00 BSC
.394
Square
10.00 BSC
.472
Square
GAUGE PLANE
1.00 REF
.039
0.45
0.75
.018
.030
0.09
0.20
.004
.008
0.25
mm
Max.
0.10
.004
DESCRIPTION: 64-Pin Low Profile Quad Flat Package, LQFP
PACKAGE CODE: FC
DOCUMENT CONTROL NO.
PD - 1804
REVISION: C
DATE: 03/09/05
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 www.pericom.com
Notes:
1. All dimensions in millimeters
2. Ref.: JEDEC MS-026D/BCD
3. Package Outline Exclusive of Mold Flash and Metal Burr