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Электронный компонент: 2N5064

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Philips Semiconductors
Product specification
Thyristor
2N5064
sensitive gate
GENERAL DESCRIPTION
QUICK REFERENCE DATA
Glass
passivated
sensitive
gate
SYMBOL
PARAMETER
MAX. UNIT
thyristor
in
a
plastic
envelope,
intended for use in general purpose
V
DRM
,
Repetitive peak off-state voltages
200
V
switching
and
phase
control
V
RRM
applications. This device is intended
I
T(AV)
Average on-state current
0.5
A
to
be
interfaced
directly
to
I
T(RMS)
RMS on-state current
0.8
A
microcontrollers, logic
integreated
I
TSM
Non-repetitive peak on-state current
10
A
circuits and other low power gate
trigger circuits.
PINNING - TO92 variant
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
anode
2
gate
3
cathode
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DRM
, V
RRM
Repetitive peak off-state
-
200
V
voltages
I
T(AV)
Average on-state current
half sine wave
T
c
67 C
-
0.51
A
T
c
102 C
-
0.255
A
I
T(RMS)
RMS on-state current
all conduction angles
-
0.8
A
I
TRM
Repetitive peak on-state
-
8
A
current
I
TSM
Non-repetitive peak
half sine wave; T
a
= 25 C prior to surge;
-
10
A
on-state current
t = 8.3 ms
I
2
t
I
2
t for fusing
t = 8.3 ms
-
0.4
A
2
s
I
GM
Peak gate current
T
a
= 25C, t
p
= 300
s; f = 120 Hz
-
1
A
V
GM
Peak gate voltage
-
5
V
V
RGM
Peak reverse gate voltage
-
5
V
P
GM
Peak gate power
T
a
= 25C
-
0.1
W
P
G(AV)
Average gate power
T
a
= 25C, over any 16 ms period
-
0.01
W
T
stg
Storage temperature
-65
150
C
T
j
Operating junction
-65
125
C
temperature
a
k
g
3 2 1
October 1997
1
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
2N5064
sensitive gate
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
R
th j-c
Thermal resistance
see note:
1
-
-
75
K/W
junction to case
R
th j-a
Thermal resistance
-
200
-
K/W
junction to ambient
STATIC CHARACTERISTICS
T
c
= 25 C, R
GK
= 1 k
unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I
GT
Gate trigger current
T
c
= 25 C
-
-
200
A
T
c
= -65 C
-
-
350
A
V
D
= V
DRM(max)
; R
L
= 100
; gate open
circuit
I
L
Latching current
V
D
= 12 V; R
GK
= 1 k
-
-
6
mA
I
H
Holding current
V
D
= 12 V; R
GK
= 1 k
-
-
5
mA
V
T
On-state voltage
I
T
= 1.2 A peak; t
p
= 300
s;
0.01
-
-
1.7
V
V
GT
Gate trigger voltage
T
j
= 25 C
-
-
0.8
V
T
j
= -65 C
-
-
1.2
V
T
j
= 125 C
0.1
-
-
V
V
D
= V
DRM(max)
; R
L
= 100
; gate open
circuit
I
D
, I
R
Off-state leakage current
V
D
= V
DRM(max)
; V
R
= V
RRM(max)
T
j
= 25 C
-
-
10
A
T
j
= 125 C
-
-
50
A
DYNAMIC CHARACTERISTICS
T
c
= 25 C, R
GK
= 1 k
unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dV
D
/dt
Critical rate of rise of
V
DM
= 67% V
DRM(max)
; T
j
= 125 C;
-
25
-
V/
s
off-state voltage
exponential waveform; R
GK
= 1 k
t
gt
Gate controlled turn-on
I
TM
= 2 A; V
D
= V
DRM(max)
; I
G
= 10 mA;
-
2
-
s
time
dI
G
/dt = 0.1 A/
s
t
q
Circuit commutated
V
DM
= 67% V
DRM(max)
; T
j
= 125 C;
-
100
-
s
turn-off time
I
TM
= 1.6 A; V
R
= 35 V; dI
TM
/dt = 30 A/
s;
dV
D
/dt = 2 V/
s; R
GK
= 1 k
1 This measurement is made with the case mounted "flat side down" on a heatsink and held in position by means of
a metal clamp over the curved surface.
October 1997
2
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
2N5064
sensitive gate
MECHANICAL DATA
Dimensions in mm
Net Mass: 0.2 g
Fig.1. TO92; plastic envelope.
Notes
1. Epoxy meets UL94 V0 at 1/8".
0.48
0.40
0.40
min
12.7 min
5.2 max
4.8 max
4.2 max
2.5 max
1.6
2.54
0.66
0.56
1
2
3
October 1997
3
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
2N5064
sensitive gate
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
October 1997
4
Rev 1.200