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Электронный компонент: 2PC4617M

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DATA SHEET
Product specification
2003 Jul 15
DISCRETE SEMICONDUCTORS
2PC4617M series
NPN general purpose transistors
M3D883
BOTTOM VIEW
2003 Jul 15
2
Philips Semiconductors
Product specification
NPN general purpose transistors
2PC4617M series
FEATURES
Leadless ultra small plastic package
(1 mm
0.6 mm
0.5 mm)
Board space 1.3
0.9 mm
Power dissipation comparable to SOT23.
APPLICATIONS
General purpose small signal DC applications
Low and medium frequency AC applications
Mobile communications, digital (still) cameras, PDAs,
PCMCIA cards.
DESCRIPTION
NPN general purpose transistor in a SOT883 leadless
ultra small plastic package.
PNP complement: 2PA1776M series.
MARKING
TYPE NUMBER
MARKING CODE
2PC4617QM
D7
2PC4617RM
D8
2PC4617SM
D9
PINNING
PIN
DESCRIPTION
1
base
2
emitter
3
collector
handbook, halfpage
MAM475
1
2
3
2
1
3
Bottom view
Fig.1 Simplified outline (SOT883) and symbol.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MAX.
UNIT
V
CEO
collector-emitter voltage
50
V
I
C
collector current (DC)
100
mA
I
CM
peak collector current
200
mA
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60
m copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm
2
.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CBO
collector-base voltage
open emitter
-
50
V
V
CEO
collector-emitter voltage
open base
-
50
V
V
EBO
emitter-base voltage
open collector
-
5
V
I
C
collector current (DC)
-
100
mA
I
CM
peak collector current
-
200
mA
I
BM
peak base current
-
200
mA
P
tot
total power dissipation
T
amb
25
C
note 1
-
250
mW
note 2
-
430
mW
T
stg
storage temperature
-
65
+150
C
T
j
junction temperature
-
150
C
T
amb
operating ambient temperature
-
65
+150
C
2003 Jul 15
3
Philips Semiconductors
Product specification
NPN general purpose transistors
2PC4617M series
THERMAL CHARACTERISTICS
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60
m copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm
2
.
CHARACTERISTICS
T
amb
= 25
C unless otherwise specified.
Note
1. Pulse test: t
p
300
s;
0.02.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient
in free air
note 1
500
K/W
note 2
290
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
I
CBO
collector-base cut-off current
V
CB
= 30 V; I
E
= 0
-
100
nA
V
CB
= 30 V; I
E
= 0; T
j
= 150
C
-
5
A
I
EBO
emitter-base cut-off current
V
EB
= 4 V; I
C
= 0
-
100
nA
h
FE
DC current gain
V
CE
= 6 V; I
C
= 1 mA
2PC4617QM
120
270
2PC4617RM
180
390
2PC4617SM
270
560
V
CEsat
collector-emitter saturation voltage
I
C
= 50 mA; I
B
= 5 mA; note 1
-
200
mV
C
c
collector capacitance
I
E
= i
e
= 0; V
CB
= 12 V; f = 1 MHz
-
1.5
pF
f
T
transition frequency
V
CE
= 12 V; I
C
= 2 mA;
f = 100 MHz
100
-
MHz
2003 Jul 15
4
Philips Semiconductors
Product specification
NPN general purpose transistors
2PC4617M series
PACKAGE OUTLINE
UNIT
A
1
max.
A
(1)
b
b
1
e
1
e
L
L
1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.50
0.46
0.20
0.12
0.55
0.47
0.03
0.62
0.55
0.35
0.65
DIMENSIONS (mm are the original dimensions)
Note
1. Including plating thickness
0.30
0.22
0.30
0.22
SOT883
SC-101
03-02-05
03-04-03
D
E
1.02
0.95
L
E
2
3
1
b
b1
A1
A
D
L1
0
0.5
1 mm
scale
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
SOT883
e
e1
2003 Jul 15
5
Philips Semiconductors
Product specification
NPN general purpose transistors
2PC4617M series
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.