Document Outline
- FEATURES
- DESCRIPTION
- QUICK REFERENCE DATA
- FUNCTION TABLE
- ORDERING INFORMATION
- PINNING
- RECOMMENDED OPERATING CONDITIONS
- LIMITING VALUES
- DC CHARACTERISTICS
- AC CHARACTERISTICS
- AC WAVEFORMS
- PACKAGE OUTLINES
- SOT163-1
- SOT360-1
- SOT764-1
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
Supersedes data of 2003 Aug 11
2003 Sep 08
INTEGRATED CIRCUITS
74ALVC244
Octal buffer/line driver; 3-state
2003 Sep 08
2
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
FEATURES
Wide supply voltage range from 1.65 to 3.6 V
3.6 V tolerant inputs/outputs
CMOS low power consumption
Direct interface with TTL levels (2.7 to 3.6 V)
Power-down mode
Latch-up performance exceeds 250 mA
Complies with JEDEC standard:
JESD8-7 (1.65 to 1.95 V)
JESD8-5 (2.3 to 2.7 V)
JESD8B/JESD36 (2.7 to 3.6 V)
ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
DESCRIPTION
The 74ALVC244 is a high-performance, low-power,
low-voltage, Si-gate CMOS device and superior to most
advanced CMOS compatible TTL families.
The 74ALVC244 is an octal non-inverting buffer/line driver
with 3-state outputs. The 3-state outputs are controlled by
the output enable inputs 1OE and 2OE. A HIGH on nOE
causes the outputs to assume a high-impedance
OFF-state. Schmitt-trigger action at all inputs makes the
circuit highly tolerant for slower input rise and fall times.
QUICK REFERENCE DATA
GND = 0 V; T
amb
= 25
C.
Notes
1. C
PD
is used to determine the dynamic power dissipation (P
D
in
W).
P
D
= C
PD
V
CC
2
f
i
N +
(C
L
V
CC
2
f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in Volts;
N = total load switching outputs;
(C
L
V
CC
2
f
o
) = sum of the outputs.
2. The condition is V
I
= GND to V
CC
.
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
t
PHL
/t
PLH
propagation delay nAn to nYn
V
CC
= 1.8 V; C
L
= 30 pF; R
L
= 1 k
2.7
ns
V
CC
= 2.5 V; C
L
= 30 pF; R
L
= 500
2.0
ns
V
CC
= 2.7 V; C
L
= 50 pF; R
L
= 500
2.3
ns
V
CC
= 3.3 V; C
L
= 50 pF; R
L
= 500
2.2
ns
C
I
input capacitance
3.5
pF
C
PD
power dissipation capacitance per buffer
V
CC
= 3.3 V; notes 1 and 2
20
pF
2003 Sep 08
3
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don't care;
Z = high-impedance OFF-state.
ORDERING INFORMATION
INPUT
OUTPUT
nOE
nAn
nYn
L
L
L
L
H
H
H
X
Z
TYPE NUMBER
PACKAGE
TEMPERATURE
RANGE
PINS
PACKAGE
MATERIAL
CODE
74ALVC244D
-
40 to +85
C
20
SO20
plastic
SOT163-1
74ALVC244PW
-
40 to +85
C
20
TSSOP20
plastic
SOT360-1
74ALVC244BQ
-
40 to +85
C
20
DHVQFN20
plastic
SOT764-1
PINNING
PIN
SYMBOL
DESCRIPTION
1
1OE
output enable input (active LOW)
2
1A0
data input
3
2Y0
bus output
4
1A1
data input
5
2Y1
bus output
6
1A2
data input
7
2Y2
bus output
8
1A3
data input
9
2Y3
bus output
10
GND
ground (0 V)
11
2A3
data input
12
1Y3
bus output
13
2A2
data input
14
1Y2
bus output
15
2A1
data input
16
1Y1
bus output
17
2A0
data input
18
1Y0
bus output
19
2OE
output enable input (active LOW)
20
V
CC
supply voltage
PIN
SYMBOL
DESCRIPTION
2003 Sep 08
4
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
handbook, halfpage
1OE
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3
GND
VCC
2OE
1Y0
2A0
2A1
1Y2
1Y1
2A2
1Y3
2A3
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
244
MNA162
Fig.1 Pin configuration.
handbook, halfpage
1
2
3
4
5
6
7
8
9
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3
19
18
17
16
15
14
13
12
2OE
1Y0
2A0
1Y1
2A1
1Y2
2A2
1Y3
20
1OE
VCC
10
11
GND
Top view
2A3
GND
(1)
MNA981
Fig.2 Logic symbol.
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
handbook, halfpage
MNA168
1A3
1A2
1A1
1A0
2
4
6
8
1
1Y0
1Y1
18
16
14
12
1Y2
1Y3
1OE
2A3
2A2
2A1
2A0
17
15
13
11
19
2Y0
2Y1
3
5
7
9
2Y2
2Y3
2OE
Fig.3 Logic symbol.
handbook, halfpage
12
14
2
4
6
8
18
16
1
EN
MNA169
3
5
11
13
15
17
9
7
19
EN
Fig.4 IEE/IEC logic symbol.
2003 Sep 08
5
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
handbook, halfpage
MNA170
1A3
1A2
1A1
1A0
2
4
6
8
1
1Y0
1Y1
18
16
14
12
1Y2
1Y3
1OE
2A3
2A2
2A1
2A0
17
15
13
11
19
2Y0
2Y1
3
5
7
9
2Y2
2Y3
2OE
Fig.5 Logic diagram.
2003 Sep 08
6
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. When V
CC
= 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation.
3. For SO20 packages: above 70
C derate linearly with 8 mW/K.
For TSSOP20 packages: above 60
C derate linearly with 5.5 mW/K.
For DHVQFN20 packages: above 60
C derate linearly with 4.5 mW/K.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
1.65
3.6
V
V
I
input voltage
0
3.6
V
V
O
output voltage
V
CC
= 1.65 to 3.6 V; enable mode 0
V
CC
V
V
CC
= 1.65 to 3.6 V; disable mode 0
3.6
V
V
CC
= 0 V; Power-down mode
0
3.6
V
T
amb
operating ambient temperature
-
40
+85
C
t
r
, t
f
input rise and fall times
V
CC
= 1.65 to 2.7 V
0
20
ns/V
V
CC
= 2.7 to 3.6 V
0
10
ns/V
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
-
0.5
+4.6
V
I
IK
input diode current
V
I
< 0
-
-
50
mA
V
I
input voltage
-
0.5
+4.6
V
I
OK
output diode current
V
O
> V
CC
or V
O
< 0
-
50
mA
V
O
output voltage
enable mode; notes 1 and 2
-
0.5
V
CC
+ 0.5
V
disable mode
-
0.5
+4.6
V
Power-down mode; note 2
-
0.5
+4.6
V
I
O
output source or sink current
V
O
= 0 to V
CC
-
50
mA
I
GND
, I
CC
V
CC
or GND current
-
100
mA
T
stg
storage temperature
-
65
+150
C
P
tot
power dissipation
T
amb
=
-
40 to +85
C; note 3
-
500
mW
2003 Sep 08
7
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
DC CHARACTERISTICS
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Notes
1. All typical values are measured at T
amb
= 25
C.
2. For transceivers, the parameters I
OZ
includes the input leakage current.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN.
TYP.
(1)
MAX.
UNIT
OTHER
V
CC
(V)
T
amb
=
-
40 to +85
C
V
IH
HIGH-level input
voltage
1.65 to 1.95
0.65
V
CC
-
-
V
2.3 to 2.7
1.7
-
-
V
2.7 to 3.6
2
-
-
V
V
IL
LOW-level input
voltage
1.65 to 1.95
-
-
0.35
V
CC
V
2.3 to 2.7
-
-
0.7
V
2.7 to 3.6
-
-
0.8
V
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
I
O
= 100
A
1.65 to 3.6
-
-
0.2
V
I
O
= 6 mA
1.65
-
-
0.3
V
I
O
= 12 mA
2.3
-
-
0.4
V
I
O
= 18 mA
2.3
-
-
0.6
V
I
O
= 12 mA
2.7
-
-
0.4
V
I
O
= 18 mA
3.0
-
-
0.4
V
I
O
= 24 mA
3.0
-
-
0.55
V
V
OH
HIGH-level output
voltage
V
I
= V
IH
or V
IL
I
O
=
-
100
A
1.65 to 3.6
V
CC
-
0.2
-
-
V
I
O
=
-
6 mA
1.65
1.25
-
-
V
I
O
=
-
12 mA
2.3
1.8
-
-
V
I
O
=
-
18 mA
2.3
1.7
-
-
V
I
O
=
-
12 mA
2.7
2.2
-
-
V
I
O
=
-
18 mA
3.0
2.4
-
-
V
I
O
=
-
24 mA
3.0
2.2
-
-
V
I
LI
input leakage
current
V
I
= 3.6 V or GND
3.6
-
0.1
5
A
I
OZ
3-state output
OFF-state current
V
I
= V
IH
or V
IL
;
V
O
= 3.6 V or GND; note 2
3.6
-
0.1
10
A
I
off
power OFF leakage
current
V
I
or V
O
= 3.6 V
0.0
-
0.1
10
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND; I
O
= 0
3.6
-
0.2
20
A
I
CC
additional
quiescent supply
current per input
pin
V
I
= V
CC
-
0.6 V; I
O
= 0
3.0 to 3.6
-
5
750
A
2003 Sep 08
8
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
AC CHARACTERISTICS
Note
1. All typical values are measured at T
amb
= 25
C.
AC WAVEFORMS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN.
TYP.
(1)
MAX.
UNIT
WAVEFORMS
V
CC
(V)
T
amb
=
-
40 to +85
C
t
PHL
/t
PLH
propagation delay nAn to nYn
see Figs 6 and 8 1.65 to 1.95
1.0
2.7
4.4
ns
2.3 to 2.7
1.0
2.0
3.1
ns
2.7
1.0
2.3
3.1
ns
3.0 to 3.6
1.0
2.2
2.8
ns
t
PZH
/t
PZL
3-state output enable time
nOE to nYn
see Figs 7 and 8 1.65 to 1.95
1.0
3.4
6.9
ns
2.3 to 2.7
1.0
2.6
5.4
ns
2.7
1.0
3.2
5.3
ns
3.0 to 3.6
1.0
2.5
4.5
ns
t
PHZ
/t
PLZ
3-state output disable time
nOE to nYn
see Figs 7 and 8 1.65 to 1.95
1.0
3.8
5.9
ns
2.3 to 2.7
1.0
2.2
4.1
ns
2.7
1.0
3.0
4.4
ns
3.0 to 3.6
1.0
2.9
4.2
ns
handbook, halfpage
MNA171
nAn input
nYn output
tPLH
tPHL
GND
VI
VM
VM
VM
VM
VOH
VOL
Fig.6 Input nAn to output nYn propagation delay times.
V
CC
V
M
INPUT
V
I
t
r
= t
f
1.65 to 1.95 V
0.5
V
CC
V
CC
2.0 ns
2.3 to 2.7 V
0.5
V
CC
V
CC
2.0 ns
2.7 V
1.5 V
2.7 V
2.5 ns
3.0 to 3.6 V
1.5 V
2.7 V
2.5 ns
2003 Sep 08
9
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
handbook, full pagewidth
MNA654
tPLZ
tPHZ
outputs
disabled
outputs
enabled
Vy
Vx
outputs
enabled
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
nOE input
VI
VCC
VM
VOL
VOH
GND
GND
tPZL
tPZH
VM
VM
Fig.7 3-state enable and disable times.
V
CC
V
M
INPUT
V
I
t
r
= t
f
1.65 to 1.95 V 0.5
V
CC
V
CC
2.0 ns
2.3 to 2.7 V
0.5
V
CC
V
CC
2.0 ns
2.7 V
1.5 V
2.7 V
2.5 ns
3.0 to 3.6 V
1.5 V
2.7 V
2.5 ns
V
OL
and V
OH
are typical output voltage drop that occur with the output load.
V
X
= V
OL
+ 0.3 V at V
CC
2.7 V;
V
X
= V
OL
+ 0.15 V at V
CC
< 2.7 V;
V
Y
= V
OH
-
0.3 V at V
CC
2.7 V;
V
Y
= V
OH
-
0.15 V at V
CC
< 2.7 V.
2003 Sep 08
10
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
handbook, full pagewidth
VEXT
VCC
VI
VO
MNA616
D.U.T.
CL
RT
RL
RL
PULSE
GENERATOR
Fig.8 Load circuitry for switching times.
Definitions for test circuit:
R
L
= Load resistor.
C
L
= Load capacitance including jig and probe capacitance.
R
T
= Termination resistance should be equal to the output impedance Z
o
of the pulse generator.
V
CC
V
I
C
L
R
L
V
EXT
t
PLH
/t
PHL
t
PZH
/t
PHZ
t
PZL
/t
PLZ
1.65 to 1.95 V
V
CC
30 pF
1 k
open
GND
2
V
CC
2.3 to 2.7 V
V
CC
30 pF
500
open
GND
2
V
CC
2.7 V
2.7 V
50 pF
500
open
GND
6 V
3.0 to 3.6 V
2.7 V
50 pF
500
open
GND
6 V
2003 Sep 08
11
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
PACKAGE OUTLINES
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
2003 Sep 08
12
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1
MO-153
99-12-27
03-02-19
w
M
b
p
D
Z
e
0.25
1
10
20
11
pin 1 index
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
2003 Sep 08
13
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
terminal 1
index area
0.5
1
A1
Eh
b
UNIT
y
e
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
4.6
4.4
Dh
3.15
2.85
y1
2.6
2.4
1.15
0.85
e1
3.5
0.30
0.18
0.05
0.00
0.05
0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1
MO-241
- - -
- - -
0.5
0.3
L
0.1
v
0.05
w
0
2.5
5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
(1)
max.
A
A1
c
detail X
y
y1 C
e
L
Eh
Dh
e
e1
b
2
9
19
12
11
10
1
20
X
D
E
C
B
A
terminal 1
index area
A
C
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
2003 Sep 08
14
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands
R20/03/pp
15
Date of release:
2003 Sep 08
Document order number:
9397 750 12018
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