Philips
Semiconductors
74F378
Hex D flip-flop with enable
Product specification
IC15 Data Handbook
1989 Oct 05
INTEGRATED CIRCUITS
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
2
1989 Oct 05
8530067 97804
FEATURES
6-bit high-speed parallel register
Positive edge-triggered D-type inputs
Fully buffered common Clock and Enable inputs
Input clamp diodes limit high speed termination effects
Fully TTL and CMOS compatible
DESCRIPTION
The 74F378 has six edge-triggered D-type flip-flops with individual
D inputs and Q outputs. The common buffered Clock (CP) input
loads all flip-flops simultaneously when the Enable (E) input is Low.
The register is fully edge-triggered. The state of each D input, one
setup time before the Low-to-High clock transition is transformed to
the corresponding flop-flop's Q output. The E input must be stable
one setup time prior to the Low-to-High clock transition for
predictable operation.
PIN CONFIGURATION
16
15
14
13
12
11
10
7
6
5
4
3
2
1
9
8
VCC
E
Q0
D0
D1
Q1
D2
Q2
GND
Q5
D5
D4
Q4
D3
Q3
CP
SF00927
TYPE
TYPICAL f
max
TYPICAL SUPPLY
CURRENT (TOTAL)
74F378
100MHz
35mA
ORDERING INFORMATION
DESCRIPTION
COMMERCIAL
RANGE
V
CC
= 5V
10%,
T
amb
= 0
C to +70
C
PKG DWG #
16pin plastic DIP
N74F378N
SOT38-4
16pin plastic SO
N74F378D
SOT109-1
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINS
DESCRIPTION
74F (U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
D0 D5
Data inputs
1.0/1.0
20
A/0.6mA
CP
Clock pulse input (active rising edge)
1.0/1.0
20
A/0.6mA
E
Enable input (active low)
1.0/1.0
20
A/0.6mA
Q0 Q5
Data outputs
50/33
1.0mA/20mA
NOTE:
One (1.0) FAST unit load is defined as: 20
A in the High state and 0.6mA in the Low state.
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
1989 Oct 05
3
LOGIC SYMBOL
Q0 Q1 Q2 Q3 Q4 Q5
VCC = Pin 16
GND = Pin 8
D0 D1 D2 D3 D4 D5
3
4
6
11 13 14
CP
E
9
1
2
5
7
10 12 15
SF00916
IEC/IEEE SYMBOL
G1
1C2
2D
SF00917
3
4
6
11
13
14
1
9
2
5
7
10
12
15
LOGIC DIAGRAM
D
Q
Q0
VCC = Pin 16
GND = Pin 8
CP
D0
3
SF00918
2
D
Q
Q1
CP
D1
4
5
D
Q
Q2
CP
D2
6
7
D
Q
Q3
CP
D3
11
10
D
Q
Q4
CP
D4
13
12
D
Q
Q5
CP
D5
14
15
E
CP
9
1
FUNCTION TABLE
INPUTS
OUTPUTS
OPERATING
E
CP
Dn
Qn
MODE
l
h
H
Load "1"
l
l
L
Load "0"
h
H
X
X
X
no change
no change
Hold (do nothing)
H = High-voltage level
h
= High-voltage level one setup time
prior to the Low-to-High clock transition
L
= Low-voltage level
l
= Low-voltage level one setup time
prior to the Low-to-High clock transition
X = Don't care
= Low-to-High clock transition
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
1989 Oct 05
4
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
V
CC
Supply voltage
0.5 to +7.0
V
V
IN
Input voltage
0.5 to +7.0
V
I
IN
Input current
30 to +5
mA
V
OUT
Voltage applied to output in High output state
0.5 to V
CC
V
I
OUT
Current applied to output in Low output state
40
mA
T
amb
Operating free-air temperature range
0 to +70
C
T
stg
Storage temperature range
65 to +150
C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARMETER
LIMITS
UNIT
SYMBOL
SYMBOL
PARMETER
MIN
NOM
MAX
UNIT
V
CC
Supply voltage
4.5
5.0
5.5
V
V
IH
High-level input voltage
2.0
V
V
IL
Low-level input voltage
0.8
V
I
IK
Input clamp current
18
mA
I
OH
High-level output current
1
mA
I
OL
Low-level output current
20
mA
T
amb
Operating free-air temperature range
0
70
C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITIONS
1
MIN
TYP
2
MAX
V
High level output voltage
V
CC
= MIN, V
IL
= MAX,
10%V
CC
2.5
V
V
OH
High-level output voltage
V
IH
= MIN, I
OH
= MAX
5%V
CC
2.7
3.4
V
V
O
Low level output voltage
V
CC
= MIN, V
IL
= MAX,
10%V
CC
0.30
0.50
V
V
OL
Low-level output voltage
V
IH
= MIN, I
OL
= MAX
5%V
CC
0.30
0.50
V
V
IK
Input clamp voltage
V
CC
= MIN, I
I
= I
IK
0.73
1.2
V
I
I
Input current at maximum input voltage
V
CC
= MAX, V
I
= 7.0V
100
A
I
IH
High-level input current
V
CC
= MAX, V
I
= 2.7V
20
A
I
IL
Low-level input current
V
CC
= MAX, V
I
= 0.5V
0.6
mA
I
OS
Short-circuit output current
3
V
CC
= MAX
60
150
mA
I
CC
Supply current (total)
I
CCH
V
CC
= MAX
32
45
mA
I
CC
Supply current (total)
I
CCL
V
CC
= MAX
35
45
mA
Notes:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25
C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
1989 Oct 05
5
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
amb
= +25
C
T
amb
= 0
C to +70
C
SYMBOL
PARAMETER
TEST
V
CC
= +5.0V
V
CC
= +5.0V
10%
UNIT
CONDITION
C
L
= 50pF, R
L
= 500
C
L
= 50pF, R
L
= 500
MIN
TYP
MAX
MIN
MAX
f
MAX
Maximum clock frequency
Waveform 1
80
100
80
MHz
t
PLH
t
PHL
Propagation delay
CP to Qn
Waveform 1
3.0
3.5
5.5
6.0
7.5
8.5
3.0
3.5
8.5
9.5
ns
AC SETUP REQUIREMENTS
LIMITS
T
amb
= +25
C
T
amb
= 0
C to +70
C
SYMBOL
PARAMETER
TEST
V
CC
= +5.0V
V
CC
= +5.0V
10%
UNIT
CONDITION
C
L
= 50pF, R
L
= 500
C
L
= 50pF, R
L
= 500
MIN
TYP
MAX
MIN
MAX
t
s
(H)
t
s
(L)
Setup time, High or Low
Dn to CP
Waveform 2
4.0
4.0
4.0
4.0
ns
t
h
(H
)
t
h
(L)
Hold time, High or Low
Dn to CP
Waveform 2
0
0
0
0
ns
t
s
(H)
t
s
(L)
Setup time, High or Low
E to CP
Waveform 2
4.0
10.0
4.0
10.0
ns
t
h
(H
)
t
h
(L)
Hold time, High or Low
E to CP
Waveform 2
0
0
0
0
ns
t
w
(H)
t
w
(L)
CP Pulse width,
High or Low
Waveform 1
4.0
6.0
4.0
6.0
ns
AC WAVEFORMS
For all waveforms, V
M
= 1.5V.
The shaded areas indicate when the input is permitted to change for predictable output performance.
tPLH
CP
VM
VM
VM
tw(H)
1/fMAX
VM
VM
tw(L)
tPHL
Qn
SF00919
Waveform 1. Propagation Delay, Clock Input to Output,
Clock Pulse Width, and Maximum Clock Frequency
VM
VM
VM
VM
VM
VM
ts(H)
ts(L)
En
CP
SF00920
t
h
=0
t
h
=0
VM
VM
t
s
t
h
Dn
Waveform 2. Data and Enable Setup Time and Hold Times
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
1989 Oct 05
6
TEST CIRCUIT AND WAVEFORM
tw
90%
VM
10%
90%
VM
10%
90%
VM
10%
90%
VM
10%
NEGATIVE
PULSE
POSITIVE
PULSE
tw
AMP (V)
0V
0V
tTHL (tf
)
INPUT PULSE REQUIREMENTS
rep. rate
t
w
t
TLH
t
THL
1MHz
500ns
2.5ns
2.5ns
Input Pulse Definition
VCC
family
74F
D.U.T.
PULSE
GENERATOR
RL
CL
RT
VIN
VOUT
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
R
L
= Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
C
L
= Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
R
T
= Termination resistance should be equal to Z
OUT
of
pulse generators.
tTHL (tf
)
tTLH (tr
)
tTLH (tr
)
AMP (V)
amplitude
3.0V
1.5V
V
M
SF00006
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
1989 Oct 05
7
DIP16:
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
1989 Oct 05
8
SO16:
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
1989 Oct 05
9
NOTES
Philips Semiconductors
Product specification
74F378
Hex D flip-flop with enable
yyyy mmm dd
10
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 940883409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code
Date of release: 10-98
Document order number:
9397-750-05122
Philips
Semiconductors
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
[1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1]
Please consult the most recently issued datasheet before initiating or completing a design.
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