ChipFind - документация

Электронный компонент: 83C528

Скачать:  PDF   ZIP
Philips
Semiconductors
80C528/83C528
CMOS single-chip 8-bit microcontroller
Product specification
1995 Feb 02
INTEGRATED CIRCUITS
IC20 Data Handbook
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
2
1995 Feb 02
DESCRIPTION
The 8XC528 single-chip 8-bit microcontroller
is manufactured in an advanced CMOS
process and is a derivative of the 80C51
microcontroller family. The 8XC528 has the
same instruction set as the 80C51. Three
versions of the derivative exist:
83C528 -- 32k bytes mask programmable
ROM
80C528 -- ROMless version of the
83C528
87C528 -- 32k bytes EPROM (described
in a separate data sheet)
This device provides architectural
enhancements that make it applicable in a
variety of applications in consumer, telecom
and general control systems, especially in
those systems which need large ROM and
RAM capacity on-chip.
The 8XC528 contains a 32k
8 ROM
(83C528), a 512
8 RAM, four 8-bit I/O
ports, two 16-bit timer/event counters
(identical to the timers of the 80C51), a 16-bit
timer (identical to the timer 2 of the 80C52), a
watchdog timer with a separate oscillator, a
multi-source, two-priority-level, nested
interrupt structure, two serial interfaces
(UART and I
2
C-bus), and on-chip oscillator
and timing circuits.
In addition, the 8XC528 has two software
selectable modes of power reduction -- idle
mode and power-down mode. The idle mode
freezes the CPU while allowing the RAM,
timers, serial port, and interrupt system to
continue functioning. The power-down mode
saves the RAM contents but freezes the
oscillator, causing all other chip functions to
be inoperative.
FEATURES
80C51 instruction set
32k
8 ROM (83C528)
ROMless (80C528)
512
8 RAM
Memory addressing capability
64k ROM and 64k RAM
Three 16-bit counter/timers
On-chip watchdog timer with oscillator
Full duplex UART
I
2
C serial interface
Four 8-bit I/O ports
Power control modes:
Idle mode
Power-down mode
Warm start from power-down
CMOS and TTL compatible
Extended temperature ranges
ROM code protection
7-source and 7-vector interrupt structure
with 2 priority levels
Up to 3 external interrupt request inputs
Two programmable power reduction modes
(Idle and Power-down)
Termination of Idle mode by any interrupt,
external or WDT (watchdog) reset
XTAL frequency range: 1.2 MHz to 16 MHz
PIN CONFIGURATIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
T2/P1.0
T2EX/P1.1
P1.2
P1.3
P1.4
P1.5
SCL/P1.6
RST
RxD/P3.0
TxD/P3.1
INT0/P3.2
INT1/P3.3
T0/P3.4
T1/P3.5
SDA/P1.7
WR/P3.6
RD/P3.7
XTAL2
XTAL1
V
SS
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
P2.6/A14
P2.7/A15
PSEN
ALE
EA
P0.7/AD7
P0.6/AD6
P0.5/AD5
P0.4/AD4
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
V
DD
DUAL
IN-LINE
PACKAGE
QUAD
FLAT
PACK
44
34
1
11
33
23
12
22
LEADED
CHIP
CARRIER
6
1
40
7
17
39
29
18
28
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
T2/P1.0
T2EX/P1.1
P1.2
P1.3
P1.4
P1.5
SCL/P1.6
RST
RxD/P3.0
TxD/P3.1
INT0/P3.2
INT1/P3.3
T0/P3.4
T1/P3.5
SDA/P1.7
WR/P3.6
RD/P3.7
XTAL2
XTAL1
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
P2.6/A14
P2.7/A15
PSEN
ALE
EA
P0.7/AD7
P0.6/AD6
P0.5/AD5
P0.4/AD4
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
V
DD
SHRINK
DUAL
IN-LINE
PACKAGE
21
22
V
SS
P2.0/A8
NC*
NC*
* DO NOT CONNECT
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
3
CERAMIC AND PLASTIC LEADED
CHIP CARRIER PIN FUNCTIONS
6
1
40
7
17
39
29
18
28
PLCC
Pin
Function
Pin
Function
1
NC*
23
NC*
2
P1.0/T2
24
P2.0/A8
3
P1.1/T2EX
25
P2.1/A9
4
P1.2
26
P2.2/A10
5
P1.3
27
P2.3/A11
6
P1.4
28
P2.4/A12
7
P1.5
29
P2.5/A13
8
P1.6/SCL
30
P2.6/A14
9
P1.7/SDA
31
P2.7/A15
10
RST
32
PSEN
11
P3.0/RxD
33
ALE
12
NC*
34
NC*
13
P3.1/TxD
35
EA
14
P3.2/INT0
36
P0.7/AD7
15
P3.3/INT1
37
P0.6/AD6
16
P3.4/T0
38
P0.5/AD5
17
P3.5/T1
39
P0.4/AD4
18
P3.6/WR
40
P0.3/AD3
19
P3.7/RD
41
P0.2/AD2
20
XTAL2
42
P0.1/AD1
21
XTAL1
43
P0.0/AD0
22
V
SS
44
V
DD
* DO NOT CONNECT
PLASTIC QUAD FLAT PACK
PIN FUNCTIONS
44
34
1
11
33
23
12
22
PQFP
Pin
Function
Pin
Function
1
P1.5
23
P2.5/A13
2
P1.6/SCL
24
P2.6/A14
3
P1.7/SDA
25
P2.7/A15
4
RST
26
PSEN
5
P3.0/RxD
27
ALE
6
NC*
28
NC*
7
P3.1/TxD
29
EA
8
P3.2/INT0
30
P0.7/AD7
9
P3.3/INT1
31
P0.6/AD6
10
P3.4/T0
32
P0.5/AD5
11
P3.5/T1
33
P0.4/AD4
12
P3.6/WR
34
P0.3/AD3
13
P3.7RD
35
P0.2/AD2
14
XTAL2
36
P0.1/AD1
15
XTAL1
37
P0.0/AD0
16
V
SS
38
V
DD
17
NC*
39
NC*
18
P2.0/A8
40
P1.0/T2
19
P2.1/A9
41
P1.1/T2EX
20
P2.2/A10
42
P1.2
21
P2.3/A11
43
P1.3
22
P2.4/A12
44
P1.4
* DO NOT CONNECT
LOGIC SYMBOL
POR
T
0
POR
T
1
POR
T
2
POR
T
3
ADDRESS AND
DATA BUS
ADDRESS BUS
T2
T2EX
RxD
TxD
INT0
INT1
T0
T1
WR
RD
SECONDAR
Y
FUNCTIONS
RST
EA
PSEN
ALE
V
SS
V
DD
XTAL1
XTAL2
SCL
SDA
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
4
ORDERING INFORMATION
PHILIPS
PART ORDER NUMBER
PART MARKING
PHILIPS NORTH AMERICA
PART ORDER
NUMBER
ROMless
ROM
ROMless
ROM
Drawing
Number
TEMPERATURE
o
C RANGE
AND PACKAGE
FREQ
MHz
P80C528FBP
P83C528FBP/xxx
P80C528FBP N
P83C528FBP N
SOT129-1
0 to +70, Plastic Dual In-line Package
16
P80C528FBA
P83C528FBA/xxx
P80C528FBA A
P83C528FBA A
SOT187-2
0 to +70, Plastic Leaded Chip Carrier
16
P80C528FBB
P83C528FBB/xxx
P80C528FBB B
P83C528FBB B
SOT307-2
0 to +70, Plastic Quad Flat Pack
16
P80C528FFP
P83C528FFP/xxx
P80C528FFP N
P83C528FFP N
SOT129-1
40 to +85, Plastic Dual In-line Package
16
P80C528FFA
P83C528FFA/xxx
P80C528FFA A
P83C528FFA A
SOT187-2
40 to +85, Plastic Leaded Chip Carrier
16
P80C528FFB
P83C528FFB/xxx
P80C528FFB B
P83C528FFB B
SOT307-2
40 to +85, Plastic Quad Flat Pack
16
P80C528FHP
P83C528FHP/xxx
P80C528FHP N
P83C528FHP N
SOT129-1
40 to +125, Plastic Dual In-line Package
16
P80C528FHA
P83C528FHA/xxx
P80C528FHA A
P83C528FHA A
SOT187-2
40 to +125, Plastic Leaded Chip Carrier
16
P80C528FHB
P83C528FHB/xxx
P80C528FHB B
P83C528FHB B
SOT307-2
40 to +125, Plastic Quad Flat Pack
16
P83C528FBR/xxx
SOT270-1
0 to +70, Plastic Shrink Dual In-Linr Package
16
NOTE:
1. xxx denotes the ROM code number.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
5
EPROM
Drawing
Number
TEMPERATURE
o
C RANGE
AND PACKAGE
FREQ
MHz
P87C528EBP N
SOT129-1
0 to +70, Plastic Dual In-line Package
16
P87C528EBF FA
0590B
0 to +70, Ceramic Dual In-line Package
w/Window
16
P87C528EBA AA
SOT187-2
0 to +70, Plastic Leaded Chip Carrier
16
P87C528EBL KA
1472A
0 to +70, Ceramic Leaded Chip Carrier
w/Window
16
P87C528EBB B
SOT307-2
0 to +70, Plastic Quad Flat Pack
16
P87C528EFP N
SOT129-1
40 to +85, Plastic Dual In-line Package
16
P87C528EFF FA
0590B
40 to +85, Ceramic Dual In-line Package
w/Window
16
P87C528EFF FA
SOT187-2
40 to +85, Plastic Leaded Chip Carrier
16
P87C528EFL KA
1472A
40 to +85, Ceramic Leaded Chip Carrier
w/Window
16
P87C528EFB B
SOT307-2
40 to +85, Plastic Quad Flat Pack
16
P87C528GBP N
SOT129-1
0 to +70, Plastic Dual In-line Package
20
P87C528GBF FA
0590B
0 to +70, Ceramic Dual In-line Package
w/Window
20
P87C528GBA A
SOT187-2
0 to +70, Plastic Leaded Chip Carrier
20
P87C528GBL KA
1472A
0 to +70, Ceramic Leaded Chip Carrier
w/Window
20
P87C528GFP N
SOT129-1
40 to +85, Plastic Dual In-line Package
20
P87C528GFF FA
0590B
40 to +85, Ceramic Dual In-line Package
w/Window
20
P87C528GFA A
SOT187-2
40 to +85, Plastic Leaded Chip Carrier
20
P87C528GFL KA
1472A
40 to +85, Ceramic Leaded Chip Carrier
w/Window
20
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
6
BLOCK DIAGRAM
PROGRAMMABLE I/O
CPU
T0
T1
COUNTERS
XTAL2 XTAL1
INT0 INT1
CONTROL
SERIAL IN
SERIAL OUT
OSCILLATOR
AND
TIMING
PROGRAM
MEMORY
(32K x 8 ROM)
RAM
AUXRAM
DATA
MEMORY
(256 x 8)
TWO 16-BIT
TIMER/EVENT
COUNTERS
DATA
MEMORY
(256 x 8)
16-BIT TIMER /
EVENT COUNTER
WATCHDOG
TIMER
64K-BYTE BUS
EXPANSION
CONTROL
PROGRAMMABLE
SERIAL PORT
FULL DUPLEX UART
SYNCHRONOUS SHIFT
BIT-LEVEL
I
2
C
INTERFACE
FREQUENCY
REFERENCE
T2
T2EX
RST
EXTERNAL
INTERRUPTS
PARALLEL PORTS,
ADDRESS/DATA BUS
AND I/O PINS
SHARED WITH
PORT 3
INTERNAL
INTERRUPTS
SDA
SCL
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
7
PIN DESCRIPTION
PIN NO.
MNEMONIC
DIP
SDIL
LCC
QFP
TYPE
NAME AND FUNCTION
V
SS
20
21
22
16
I
Ground: circuit ground potential.
V
DD
40
42
44
38
I
Power Supply: +5V power supply pin during normal operation, Idle mode and
Power-down mode.
P0.00.7
3932
4134
4336
3730
I/O
Port 0: Port 0 is an open-drain, bidirectional I/O port. Port 0 pins that have 1s
written to them float and can be used as high-impedance inputs. Port 0 is also the
multiplexed low-order address and data bus during accesses to external program
and data memory. In this application, it uses strong internal pull-ups when emitting
1s.
P1.0P1.7
18
18
29
4044
13
I/O
Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pull-ups, except P1.6 and
P1.7 which have open drain. Port 1 pins that have 1s written to them are pulled high
by the internal pull-ups and can be used as inputs. As inputs, port 1 pins that are
externally pulled low will source current because of the internal pull-ups. (See DC
Electrical Characteristics: I
IL
). Port 1 can sink/source one TTL (4 LSTTL) inputs.
1
1
2
40
I
T2 (P1.0): Timer/counter 2 external count input (following edge triggered).
2
2
3
41
I
T2EX (P1.1): Timer/counter 2 trigger input.
7
7
8
2
I/O
SCL (P1.6): I
2
C serial port clock line.
8
8
9
3
I/O
SDA (P1.7): I
2
C serial port data line.
P2.0P2.7
2128
2229
2431
1825
I/O
Port 2: Port 2 is an 8-bit bidirectional I/O port with internal pull-ups. Port 2 pins that
have 1s written to them are pulled high by the internal pull-ups and can be used as
inputs. As inputs, port 2 pins that are externally being pulled low will source current
because of the internal pull-ups. (See DC Electrical Characteristics: I
IL
). Port 2
emits the high-order address byte during fetches from external program memory
and during accesses to external data memory that use 16-bit addresses (MOVX
@DPTR). In this application, it uses strong internal pull-ups when emitting 1s.
During accesses to external data memory that use 8-bit addresses (MOV @Ri), port
2 emits the contents of the P2 special function register.
P3.0P3.7
1017
1018
(11=NC)
11,
1319
5,
713
I/O
Port 3: Port 3 is an 8-bit bidirectional I/O port with internal pull-ups. Port 3 pins that
have 1s written to them are pulled high by the internal pull-ups and can be used as
inputs. As inputs, port 3 pins that are externally being pulled low will source current
because of the pull-ups. (See DC Electrical Characteristics: I
IL
). Port 3 also serves
the special features of the SC80C51 family, as listed below:
10
10
11
5
I
RxD (P3.0): Serial input port
11
12
13
7
O
TxD (P3.1): Serial output port
12
13
14
8
I
INT0 (P3.2): External interrupt
13
14
15
9
I
INT1 (P3.3): External interrupt
14
15
16
10
I
T0 (P3.4): Timer 0 external input
15
16
17
11
I
T1 (P3.5): Timer 1 external input
16
17
18
12
O
WR (P3.6): External data memory write strobe
17
18
19
13
O
RD (P3.7): External data memory read strobe
RST
9
9
10
4
I/O
Reset: A high on this pin for two machine cycles while the oscillator is running,
resets the device. An internal diffused resistor to V
SS
permits a power-on reset
using only an external capacitor to V
DD
. After a watchdog timer overflow, this pin is
pulled high while the internal reset signal is active.
ALE
30
31
33
27
I/O
Address Latch Enable: Output pulse for latching the low byte of the address
during an access to external memory. In normal operation, ALE is emitted at a
constant rate of 1/6 the oscillator frequency, and can be used for external timing or
clocking. Note that one ALE pulse is skipped during each access to external data
memory.
PSEN
29
30
32
26
O
Program Store Enable: The read strobe to external program memory. When the
device is executing code from the external program memory, PSEN is activated
twice each machine cycle, except that two PSEN activations are skipped during
each access to external data memory. PSEN is not activated during fetches from
internal program memory.
EA
31
33
35
29
I
External Access Enable: EA must be externally held low during RESET to enable
the device to fetch code from external program memory locations 0000H to 7FFFH.
If EA is held high during RESET, the device executes from internal program memory
unless the program counter contains an address greater than 7FFFH. EA is don't
care after RESET.
XTAL1
19
20
21
15
I
Crystal 1: Input to the inverting oscillator amplifier and input to the internal clock
generator circuits.
XTAL2
18
19
20
14
O
Crystal 2: Output from the inverting oscillator amplifier.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
8
Table 1.
8XC524/8XC528 Special Function Registers
SYMBOL
DESCRIPTION
DIRECT
ADDRESS
BIT ADDRESS, SYMBOL, OR ALTERNATIVE PORT FUNCTION
MSB
LSB
RESET
VALUE
ACC*
Accumulator
E0H
E7
E6
E5
E4
E3
E2
E1
E0
00H
B*
B register
F0H
F7
F6
F5
F4
F3
F2
F1
F0
00H
DPTR:
DPH
DPL
Data pointer
(2 bytes)
:
Data pointer high
Data pointer low
83H
82H
00H
00H
AF
AE
AD
AC
AB
AA
A9
A8
IE*#
Interrupt enable
A8H
EA
ES1
ET2
ES0
ET1
EX1
ET0
EX0
00H
BF
BE
BD
BC
BB
BA
B9
B8
IP*#
Interrupt priority
B8H
PS1
PT2
PS0
PT1
PX1
PT0
PX0
x0000000B
87
86
85
84
83
82
81
80
P0*
Port 0
80H
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
FFH
97
96
95
94
93
92
91
90
P1*
Port 1
90H
SDA
SEL
T2EX
T2
FFH
A7
A6
A5
A4
A3
A2
A1
A0
P2*
Port 2
A0H
A15
A14
A13
A12
A11
A10
A9
A8
FFH
B7
B6
B5
B4
B3
B2
B1
B0
P3*
Port 3
B0H
RD
WR
T1
T0
INT1
INT0
TxD
RxD
FFH
PCON
Power control
87H
SMOD
GF1
GF0
PD
IDL
0xxx0000B
D7
D6
D5
D4
D3
D2
D1
D0
PSW*
Program status word
D0H
CY
AC
F0
RS1
RS0
OV
F1
P
00H
RCAP2H#
RCAP2L#
SBUF
Capture high
Capture low
Serial data buffer
CBH
CAH
99H
00H
00H
xxxxxxxxB
9F
9E
9D
9C
9B
9A
99
98
SCON*
Serial controller
98H
SM0
SM1
SM2
REN
TB8
RB8
TI
RI
00H
S1BIT#
Serial I
2
C data
D9H/RD
SDI
0
0
0
0
0
0
0
x0000000B
WR
SD0
X
X
X
X
X
X
X
0xxxxxxxB
S1INT#
Serial I
2
C interrupt
DAH
INT
X
X
X
X
X
X
X
0xxxxxxxB
DF
DE
DD
DC
DB
DA
D9
D8
S1SCS*#
Serial I
2
C control
D8H/RD
SDI
SCI
CLH
BB
RBF
WBF
STR
ENS
xxxx0000B
WR
SD0
SC0
CLH
X
X
X
STR
ENS
00xxxx00B
SP
Stack pointer
81H
07H
8F
8E
8D
8C
8B
8A
89
88
TCON*
Timer control
88H
TF1
TR1
TF0
TR0
IE1
IT1
IE0
IT0
00H
CF
CE
CD
CC
CB
CA
C9
C8
T2CON*#
Timer 2 control
C8H
TF2
EXF2
RCLK
TCLK
EXEN2
TR2
C/T2
CP/RL2
00H
TH0
TH1
TH2#
TL0
TL1
TL2#
T3#
Timer high 0
Timer high 1
Timer high 2
Timer low 0
Timer low 1
Timer low 2
Watchdog timer
8CH
8DH
CDH
8AH
8BH
CCH
FFH
00H
00H
00H
00H
00H
00H
00H
TMOD
Timer mode
89H
GATE
C/T
M1
M0
GATE
C/T
M1
M0
00H
WDCON#
Watchdog control
A5H
A5H
*
SFRs are bit addressable.
#
SFRs are modified from or added to the 80C51 SFRs.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
9
Table 2.
Internal and External Program Memory Access with Security Bit Set
INSTRUCTION
ACCESS TO INTERNAL
PROGRAM MEMORY
ACCESS TO EXTERNAL
PROGRAM MEMORY
MOVC in internal program memory
YES
YES
MOVC in external program memory
NO
YES
ROM CODE PROTECTION
By setting a mask programmable security bit,
the ROM content in the 83C528 is protected,
i.e., it cannot be read out by any test mode or
by any instruction in the external program
memory space. The MOVC instructions are
the only ones which have access to program
code in the internal or external program
memory. The EA input is latched during
RESET and is `don't care' after RESET (also
if security bit is not set). This implementation
prevents reading from internal program code
by switching from external program memory
to internal program memory during MOVC
instruction or an instruction that handles
immediate data. Table 2 lists the access to
the internal and external program memory by
the MOVC instructions when the security bit
has been set to logical one. If the security bit
has been set to a logical 0 there are no
restrictions for the MOVC instructions.
INTERNAL DATA MEMORY
The internal data memory is divided into
three physically separated segments: 256
bytes of RAM, 256 bytes of AUX-RAM, and a
128 bytes special function area. These can
be addressed each in a different way.
RAM 0 to 127 can be addressed directly
and indirectly as in the 80C51. Address
pointers are R0 and R1 of the selected
register bank.
RAM 128 to 255 can only be addressed
indirectly as in the 80C51. Address
pointers are R0 and R1 of the selected
register bank.
AUX-RAM 0 to 255 is indirectly addressed
in the same way as external data memory
with the MOVX instructions. Address
pointers are R0, R1 of the selected register
bank and DPTR. An access to AUX-RAM 0
to 255 will not affect ports P0, P2, P3.6 and
P3.7.
An access to external data memory locations
higher than 255 will be performed with the
MOVX DPTR instructions in the same way as
in the 8051 structure, so with P0 and P2 as
data/address bus and P3.6 and P3.7 as write
and read timing signals. Note that these
external data memory cannot be accessed
with R0 and R1 as address pointer.
TIMER 2
Timer 2 is functionally equal to the Timer 2 of
the 8052AH. Timer 2 is a 16-bit timer/counter.
These 16 bits are formed by two special
function registers TL2 and TH2. Another pair
of special function register RCAP2L and
RCAP2H form a 16-bit capture register or a
16-bit reload register. Like Timer 0 and 1, it
can operate either as a timer or as an event
counter. This is selected by bit C/T2N in the
special function register T2CON. It has three
operating modes: capture, autoload, and
baud rate generator mode which are selected
by bits in T2CON.
WATCHDOG TIMER T3
The watchdog timer consists of an 11-bit
prescaler and an 8-bit timer formed by
special function register T3. The prescaler is
incremented by an on-chip oscillator with a
fixed frequency of 1MHz. The maximum
tolerance on this frequency is 50% and
+100%. The 8-bit timer increments every
2048 cycles of the on-chip oscillator. When a
timer overflow occurs, the microcontroller is
reset and a reset output pulse of 16
2048
cycles of the on-chip oscillator is generated
at pin RST. The internal RESET signal is not
inhibited when the external RST pin is kept
low by, for example, an external reset circuit.
The RESET signal drives port 1, 2, 3 into the
high state and port 0 into the high impedance
state.
The watchdog timer is controlled by one
special function register WDCON with the
direct address location A5H. WDCON can be
read and written by software. A value of A5H
in WDCON halts the on-chip oscillator and
clears both the prescaler and timer T3. After
the RESET signal, WDCON contains A5H.
Every value other than A5H in WDCON
enables the watchdog timer. When the
watchdog timer is enabled, it runs
independently of the XTAL-clock.
Timer T3 can be read on the fly. Timer T3
can only be written if WDCON contains the
value 5AH. A successful write operation to
T3 will clear the prescaler and WDCON,
leaving the watchdog enabled and preventing
inadvertent changes of T3. To prevent an
overflow of the watchdog timer, the user
program has to reload the watchdog timer
within periods that are shorter than the
programmed watchdog timer internal. This
time interval is determined by an 8-bit value
that has to be loaded in register T3 while at
the same time the prescaler is cleared by
hardware.
Watchdog timer interval =
[256
*
(T3)]
2048
on
*
chip oscillator frequency
BIT-LEVEL I
2
C INTERFACE
This bit-level serial I/O interface supports the
I
2
C-bus. P1.6/SCL and P1.7/SDA are the
serial I/O pins. These two pins meet the I
2
C
specification concerning the input levels and
output drive capability. Consequently, these
pins have an open drain output configuration.
All the four modes of the I
2
C-bus are
supported:
master transmitter
master receiver
slave transmitter
slave receiver
The advantages of the bit-level I
2
C hardware
compared with a full software I
2
C
implementation are:
the hardware can generate the SCL pulse
Testing a single bit (RBF respectively,
WBF) is sufficient as a check for error free
transmission.
The bit-level I
2
C hardware operates on serial
bit level and performs the following functions:
filtering the incoming serial data and clock
signals
recognizing the START condition
generating a serial interrupt request SI
after reception of a START condition and
the first falling edge of the serial clock
recognizing the STOP condition
recognizing a serial clock pulse on the SCL
line
latching a serial bit on the SDA line (SDI)
stretching the SCL LOW period of the
serial clock to suspend the transfer of the
next serial data bit
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
10
setting Read Bit Finished (RBF) when the
SCL clock pulse has finished and Write Bit
Finished (WBF) if there is no arbitration
loss detected (i.e., SDA = 0 while SDO = 1)
setting a serial clock Low-to-High detected
(CLH) flag
setting a Bus Busy (BB) flag on a START
condition and clearing this flag on a STOP
condition
releasing the SCL line and clearing the
CLH, RBF and WBF flags to resume
transfer of the next serial data bit
generating an automatic clock if the single
bit data register S1BIT is used in master
mode.
The following functions must be done in
software:
handling the I
2
C START interrupts
converting serial to parallel data when
receiving
converting parallel to serial data when
transmitting
comparing the received slave address with
its own
interpreting the acknowledge information
guarding the I
2
C status if RBF or WBF = 0.
Additionally, if acting as master:
generating START and STOP conditions
handling bus arbitration
generating serial clock pulses if S1BIT is
not used.
Three SFRs control the bit-level I
2
C interface:
S1INT, S1BIT and S1SCS.
INTERRUPT SYSTEM
The interrupt structure of the 8XC528 is the
same as that used in the 80C51, but includes
two additional interrupt sources: one for the
third timer/counter, T2, and one for the I
2
C
interface. The interrupt enable and interrupt
priority registers are IE and IP.
IE: Interrupt Enable Register
This register is located at address A8H. Refer
to Table 3.
IE SFR (A8H)
ET1
ES
ES1
ET2
EA
EX1
ET0
EX0
7
6
5
4
3
2
1
0
IP: Interrupt Priority Register
This register is located at address B8H. Refer
to Table 4.
IP SFR (B8H)
PT1
PS
PS1
PT2
PX1
PT0
PX0
7
6
5
4
3
2
1
0
The interrupt vector locations and the
interrupt priorities are:
Source
Priority within Level
Vector
Address
0003H
IE0
Highest
002BH
TF2+EXF2
0053H
SI (I
2
C)
000BH
TF0
0013H
IE1
001BH
TF1
0023H
R1+T1
Lowest
Table 3.
Description of IE Bits
MNEMONIC
BIT
FUNCTION
EA
IE.7
General enable/disable control:
0 = NO interrupt is enabled.
1 = ANY individually enabled interrupt will be accepted.
ES1
IE.6
Enable bit-level I
2
C I/O interrupt
ET2
IE.5
Enable Timer 2 interrupt
ES
IE.4
Enable Serial Port interrupt
ET1
IE.3
Enable Timer 1 interrupt
EX1
IE.2
Enable External interrupt 1
ET0
IE.1
Enable Timer 0 interrupt
EX0
IE.0
Enable External interrupt 0
Table 4.
Description of IP Bits
MNEMONIC
BIT
FUNCTION
IP.7
Reserved.
PS1
IP.6
Bit-level I
2
C interrupt priority level
PT2
IP.5
Timer 2 interrupt priority level
PS
IP.4
Serial Port interrupt priority level
PT1
IP.3
Timer 1 interrupt priority level
PX1
IP.2
External Interrupt 1 priority level
PT0
IP.1
Timer 0 interrupt priority level
PX0
IP.0
External Interrupt 0 priority level
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
11
OSCILLATOR
CHARACTERISTICS
XTAL1 and XTAL2 are the input and output,
respectively, of an inverting amplifier. The
pins can be configured for use as an on-chip
oscillator, as shown in the Logic Symbol.
To drive the device from an external clock
source, XTAL1 should be driven while XTAL2
is left unconnected. There are no
requirements on the duty cycle of the
external clock signal, because the input to
the internal clock circuitry is through a
divide-by-two flip-flop. However, minimum
and maximum high and low times specified in
the data sheet must be observed.
RESET
A reset is accomplished by holding the RST
pin high for at least two machine cycles (24
oscillator periods), while the oscillator is
running. To insure a good power-up reset, the
RST pin must be high long enough to allow
the oscillator time to start up (normally a few
milliseconds) plus two machine cycles. At
power-up, the voltage on V
DD
and RST must
come up at the same time for a proper
start-up.
IDLE MODE
In idle mode, the CPU puts itself to sleep
while all of the on-chip peripherals stay
active. The instruction to invoke the idle
mode is the last instruction executed in the
normal operating mode before the idle mode
is activated. The CPU contents, the on-chip
RAM, and all of the special function registers
remain intact during this mode. The idle
mode can be terminated either by any
enabled interrupt (at which time the process
is picked up at the interrupt service routine
and continued), or by a hardware reset which
starts the processor in the same manner as a
power-on reset.
POWER-DOWN MODE
In the power-down mode, the oscillator is
stopped and the instruction to invoke
power-down is the last instruction executed.
The power-down mode can be terminated by
a RESET in the same way as in the 80C51 or
in addition by one of two external interrupts,
INT0 or INT1. A termination with an external
interrupt does not affect the internal data
memory and does not affect the special
function registers. This makes it possible to
exit power-down without changing the port
output levels. To terminate the power-down
mode with an external interrupt INT0 or INT1
must be switched to level-sensitive and must
be enabled. The external interrupt input
signal INT0 and INT1 must be kept low until
the oscillator has restarted and stabilized. An
instruction following the instruction that puts
the device in the power-down mode will be
executed. A reset generated by the watchdog
timer terminates the power-down mode in the
same way as an external RESET, and only
the contents of the on-chip RAM are
preserved. The control bits for the reduced
power modes are in the special function
register PCON.
DESIGN CONSIDERATIONS
At power-on, the voltage on V
DD
and RST
must come up at the same time for a proper
start-up.
When the idle mode is terminated by a
hardware reset, the device normally resumes
program execution, from where it left off, up
to two machine cycles before the internal
reset algorithm takes control. On-chip
hardware inhibits access to internal RAM in
this event, but access to the port pins is not
inhibited. To eliminate the possibility of an
unexpected write when idle is terminated by
reset, the instruction following the one that
invokes idle should not be one that writes to a
port pin or to external memory.
Table 5 shows the state of I/O ports during
low current operating modes.
Table 5.
External Pin Status During Idle and Power-Down Modes
MODE
PROGRAM MEMORY
ALE
PSEN
PORT 0
PORT 1
PORT 2
PORT 3
Idle
Internal
1
1
Data
Data
Data
Data
Idle
External
1
1
Float
Data
Address
Data
Power-down
Internal
0
0
Data
Data
Data
Data
Power-down
External
0
0
Float
Data
Data
Data
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
12
ABSOLUTE MAXIMUM RATINGS
1, 2, 3
PARAMETER
RATING
UNIT
Operating temperature under bias
0 to +70, or 40 to +85, or 40 to +125
C
Storage temperature range
65 to +150
C
Voltage on any other pin to V
SS
0.5 to V
DD
+0.5
V
Input, output current on any two pins
10
mA
Power dissipation
(based on package heat transfer limitations, not device power consumption)
1.0
W
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section
of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
3. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless otherwise
noted.
DC ELECTRICAL CHARACTERISTICS
T
amb
= 0
C to +70
C (V
DD
= 5V
20%), 40
C to +85
C (V
DD
= 5V
20%), or 40
C to +125
C (V
DD
= 5V
10%), V
SS
=0V
TEST
LIMITS
SYMBOL
PARAMETER
PART TYPE
CONDITIONS
MIN
MAX
UNIT
V
IL
Input low voltage,
except EA, P1.6/SCL, P1.7/SDA
0
C to 70
C
40
C to +85
C
40
C to +125
C
0.5
0.5
0.5
0.2V
DD
0.1
0.2V
DD
0.15
0.2V
DD
0.25
V
V
V
V
IL1
Input low voltage to EA
0
C to 70
C
40
C to +85
C
40
C to +125
C
0.5
0.5
0.5
0.2V
DD
0.3
0.2V
DD
0.35
0.2V
DD
0.45
V
V
V
V
IL2
Input low voltage to P1.6/SCL, P1.7/SDA
3
0.5
0.3V
DD
V
V
IH
Input high voltage,
except XTAL1, RST, P1.6/SCL, P1.7/SDA
0
C to 70
C
40
C to +85
C
40
C to +125
C
0.2V
DD
+0.9
0.2V
DD
+1.0
0.2V
DD
+1.0
V
DD
+0.5
V
DD
+0.5
V
DD
+0.5
V
V
V
V
IH1
Input high voltage, XTAL1, RST
0
C to 70
C
40
C to +85
C
40
C to +125
C
0.7V
DD
0.7V
DD
+0.1
0.7V
DD
+0.1
V
DD
+0.5
V
DD
+0.5
V
DD
+0.5
V
V
V
V
IH2
Input high voltage, P1.6/SCL, P1.7/SDA
3
0.7V
DD
6.0
V
V
OL
Output low voltage, ports 1, 2, 3, except
P1.6/SCL, P1.7/SDA
1
I
OL
= 1.6mA
4
0.45
V
V
OL1
Output low voltage, port 0, ALE, PSEN
1
I
OL
= 3.2mA
4
0.45
V
V
OL2
Output low voltage, P1.6/SCL, P1.7/SDA
I
OL
= 3.0mA
4
0.4
V
V
OH
Output high voltage, ports 1, 2, 3
V
DD
= 5V
10%,
I
OH
= 60
A
2.4
V
I
OH
= 25
A
0.75V
DD
V
I
OH
= 10
A
0.9V
DD
V
V
OH1
Output high voltage, Port 0 in external bus mode,
ALE, PSEN, RST
2
V
DD
= 5V
10%,
I
OH
= 800
A
I
OH
= 300
A
2.4
0.75V
DD
V
V
I
OH
= 80
A
0.9V
DD
V
I
IL
Logical 0 input current, ports 1, 2, 3,
except P1.6/SCL, P1.7/SDA
0
C to 70
C
40
C to +85
C
40
C to +125
C
V
IN
= 0.45V
50
75
75
A
A
A
I
TL
Logical 1-to-0 transition current, ports 1, 2, 3,
except P1.6/SCL, P1.7/SDA
0
C to 70
C
40
C to +85
C
40
C to +125
C
See note 5
650
750
750
A
A
A
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
13
DC ELECTRICAL CHARACTERISTICS (Continued)
T
amb
= 0
C to +70
C (V
DD
= 5V
20%), 40
C to +85
C (V
DD
= 5V
20%), or 40
C to +125
C (V
DD
= 5V
10%), V
SS
=0V
TEST
LIMITS
SYMBOL
PARAMETER
PART TYPE
CONDITIONS
MIN
MAX
UNIT
I
IL1
Input leakage current, port 0, EA
0.45<Vi<V
DD
10
A
I
IL2
Input leakage current, P1.6/SCL, P1.7/SDA
0V<Vi<6.0V
0V<V
DD
<6.0V
10
A
A
I
DD
Power supply current:
See notes 6, 7
Active mode
35
mA
Idle mode
6
mA
Power down mode
Power down mode
40
C to +125
C
100
150
A
A
R
RST
Internal reset pull-down resistor
50
150
k
C
IO
Capacitance of I/O buffer
Freq.=1MHz
T
amb
= 25
C
10
pF
NOTES:
1. Capacitive loading on Port 0 and Port 2 may cause spurious noise pulses to be superimposed on the LOW level ouput voltage of ALE, Port
1 and Port 3. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins make a 1-to-0
transition during bus operations. In the worst cases (capacitive loading > 100pF), the noise pulse on the ALE line may exceed 0.8V. In such
cases it may be desirable to qualify ALE with a Schmitt Trigger, or use an address latch with a Schmitt Trigger STROBE input.
2. Capacitive loading on Port 0 and Port 2 may cause the HIGH level output voltage on ALE and PSEN to momentarily fall below the 0.9V
DD
specification when the address bits are stabilizing.
3. The input threshold voltage of P1.6 and P1.7 (SIO1) meets the I
2
C specification, so a voltage below 0.3V
DD
will be recognized as a logic 0
while an input above 0.7V
DD
will be recognized as a logic 1.
4. Under steady state (non-transient) conditions, I
OL
must be externally limited as follows:
Maximum I
OL
per port pin:
10mA
Maximum I
OL
per 8bit port:
Port 0:
26mA
Ports 1, 2, & 3:
15mA
Maximum total I
OL
for all output pins:
71mA
If I
OL
exceeds the test condition, V
OL
may exceed the related specification. Pins are not guaranteed to sink current greater than the listed
test conditions.
5. Pins of ports 1, 2, and 3 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its
maximum value when V
IN
is approximately 2V.
6. See Figures 9 through 12 for I
DD
test conditions.
7. I
DDMAX
at other frequencies can be derived from the figure below, where FREQ is the external oscillator frequency in MHz.
I
DDMAX
is given in mA.
35
30
25
20
15
10
5
0
MAX ACTIVE MODE
TYP ACTIVE MODE
MAX IDLE MODE
TYP IDLE MODE
I
I
DD
vs. FREQUENCY
DD
(mA)
FREQ. AT XTAL1 (MHz)
4
8
12
16
VALID ONLY WITHIN FREQUENCY SPECIFICATIONS OF DEVICE UNDER TEST.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
14
AC ELECTRICAL CHARACTERISTICS
1, 2
16MHz CLOCK
VARIABLE CLOCK
SYMBOL
FIGURE
PARAMETER
MIN
MAX
MIN
MAX
UNIT
1/t
CLCL
1
Oscillator frequency
1.2
16
MHz
t
LHLL
1
ALE pulse width
85
2t
CLCL
40
ns
t
AVLL
1
Address valid to ALE low
8
t
CLCL
55
ns
t
LLAX
1
Address hold after ALE low
28
t
CLCL
35
ns
t
LLIV
1
ALE low to valid instruction in
150
4t
CLCL
100
ns
t
LLPL
1
ALE low to PSEN low
23
t
CLCL
40
ns
t
PLPH
1
PSEN pulse width
143
3t
CLCL
45
ns
t
PLIV
1
PSEN low to valid instruction in
83
3t
CLCL
105
ns
t
PXIX
1
Input instruction hold after PSEN
0
0
ns
t
PXIZ
1
Input instruction float after PSEN
38
t
CLCL
25
ns
t
AVIV
1
Address to valid instruction in
208
5t
CLCL
105
ns
t
PLAZ
1
PSEN low to address float
10
10
ns
Data Memory
t
RLRH
2, 3
RD pulse width
275
6t
CLCL
100
ns
t
WLWH
2, 3
WR pulse width
275
6t
CLCL
100
ns
t
RLDV
2, 3
RD low to valid data in
148
5t
CLCL
165
ns
t
RHDX
2, 3
Data hold after RD
0
0
ns
t
RHDZ
2, 3
Data float after RD
55
2t
CLCL
70
ns
t
LLDV
2, 3
ALE low to valid data in
350
8t
CLCL
150
ns
t
AVDV
2, 3
Address to valid data in
398
9t
CLCL
165
ns
t
LLWL
2, 3
ALE low to RD or WR low
138
238
3t
CLCL
50
3t
CLCL
+50
ns
t
AVWL
2, 3
Address valid to WR low or RD low
120
4t
CLCL
130
ns
t
QVWX
2, 3
Data valid to WR transition
3
t
CLCL
60
ns
t
WHQX
2, 3
Data hold after WR
13
t
CLCL
50
ns
t
RLAZ
2, 3
RD low to address float
0
0
ns
t
WHLH
2, 3
RD or WR high to ALE high
23
103
t
CLCL
40
t
CLCL
+40
ns
External Clock
t
CHCX
6
High time
20
20
ns
t
CLCX
6
Low time
20
20
ns
t
CLCH
6
Rise time
20
20
ns
t
CHCL
6
Fall time
20
20
ns
Shift Register
t
XLXL
4
Serial port clock cycle time
750
12t
CLCL
ns
t
QVXH
4
Output data setup to clock rising edge
492
10t
CLCL
133
ns
t
XHQX
4
Output data hold after clock rising edge
8
2t
CLCL
117
ns
t
XHDX
4
Input data hold after clock rising edge
0
0
ns
t
XHDV
4
Clock rising edge to input data valid
492
10t
CLCL
133
ns
NOTES:
1. Parameters are valid over operating temperature range unless otherwise specified.
2. Load capacitance for port 0, ALE, and PSEN = 100pF, load capacitance for all other outputs = 80pF.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
15
AC ELECTRICAL CHARACTERISTICS I
2
C INTERFACE
SYMBOL
PARAMETER
INPUT
OUTPUT
I
2
C SPECIFICATION
SCL TIMING CHARACTERISTICS
t
HD;STA
START condition hold time
14 t
CLCL
1
Note 2
4.0
s
t
LOW
SCL LOW time
16 t
CLCL
Note 2
4.7
s
t
HIGH
SCL HIGH time
14 t
CLCL
1
80 t
CLCL
3
4.0
s
t
RC
SCL rise time
1
s
4
Note 5
1.0
s
t
FC
SCL fall time
0.3
s
4
0.3
s
6
0.3
s
SDA TIMING CHARACTERISTICS
t
SU;DAT1
Data set-up time
250ns
Note 2
250ns
t
HD;DAT
Data hold time
0ns
Note 2
0ns
t
SU;STA
Repeated START set-up time
14 t
CLCL
1
Note 2
4.7
s
t
SU;STO
STOP condition set-up time
14 t
CLCL
1
Note 2
4.0
s
t
BUF
Bus free time
14 t
CLCL
1
Note 2
4.7
s
t
RD
SDA rise time
1
s
4
Note 5
1.0
s
t
FD
SDA fall time
0.3
s
4
0.3
s
6
0.3
s
NOTES:
1. At f
CLK
= 3.5MHz, this evaluates to 14
286ns = 4
s, i.e., the bit-level I
2
C interface can respond to the I
2
C protocol for f
CLK
3.5MHz.
2. This parameter is determined by the user software, it has to comply with the I
2
C.
3. This value gives the autoclock pulse length which meets the I
2
C specification for the specified XTAL clock frequency range. Alternatively, the
SCL pulse may be timed by software.
4. Spikes on SDA and SCL lines with a duration of less than 4
f
CLK
will be filtered out.
5. The rise time is determined by the external bus line capacitance and pull-up resistor, it must be
1
s.
6. The maximum capacitance on bus lines SDA and SCL is 400pF.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
16
EXPLANATION OF THE AC SYMBOLS
Each timing symbol has five characters. The
first character is always `t' (= time). The other
characters, depending on their positions,
indicate the name of a signal or the logical
status of that signal. The designations are:
A Address
C Clock
D Input data
H Logic level high
I Instruction (program memory contents)
L Logic level low, or ALE
P PSEN
Q Output data
R RD signal
t Time
V Valid
W WR signal
X No longer a valid logic level
Z Float
Examples: t
AVLL
= Time for address valid
to ALE low.
t
LLPL
= Time for ALE low to
PSEN low.
t
PXIZ
Figure 1. External Program Memory Read Cycle
ALE
PSEN
PORT 0
PORT 2
A8A15
A8A15
A0A7
A0A7
t
AVLL
t
PXIX
t
LLAX
INSTR IN
t
PLIV
t
LHLL
t
PLPH
t
LLIV
t
PLAZ
t
LLPL
t
AVIV
ALE
PSEN
PORT 0
PORT 2
Figure 2. External Data Memory Read Cycle
RD
A0A7
FROM RI OR DPL
DATA IN
A0A7 FROM PCL
INSTR IN
P2.0P2.7 OR A8A15 FROM DPH
A8A15 FROM PCH
t
WHLH
t
LLDV
t
LLWL
t
RLRH
t
LLAX
t
RLAZ
t
AVLL
t
RHDX
t
RHDZ
t
AVWL
t
AVDV
t
RLDV
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
17
t
LLAX
ALE
PSEN
PORT 0
PORT 2
Figure 3. External Data Memory Write Cycle
WR
A0A7
FROM RI OR DPL
DATA OUT
A0A7 FROM PCL
INSTR IN
P2.0P2.7 OR A8A15 FROM DPF
A8A15 FROM PCH
t
WHLH
t
LLWL
t
WLWH
t
AVLL
t
AVWL
t
QVWX
t
WHQX
Figure 4. Shift Register Mode Timing
0
1
2
3
4
5
6
7
8
INSTRUCTION
ALE
CLOCK
OUTPUT DATA
WRITE TO SBUF
INPUT DATA
CLEAR RI
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
SET TI
SET RI
t
XLXL
t
QVXH
t
XHQX
t
XHDX
t
XHDV
0
1
2
3
4
5
6
7
Figure 5. Timing SIO1 (I
2
C) Interface
tRD
tSU;STA
tBUF
tSU; STO
0.7 VDD
0.3 VDD
0.7 VDD
0.3 VDD
tFD
tRC
tFC
tHIGH
tLOW
tHD;STA
tSU;DAT1
tHD;DAT
tSU;DAT2
tSU;DAT3
START condition
repeated START condition
SDA
(INPUT/OUTPUT)
SCL
(INPUT/OUTPUT)
STOP condition
START or repeated START condition
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
18
VDD0.5
0.45V
0.7VDD
0.2VDD0.1
t
CHCL
t
CLCL
t
CLCH
t
CLCX
t
CHCX
Figure 6. External Clock Drive
VDD0.5
0.45V
0.2VDD+0.9
0.2VDD0.1
NOTE:
Figure 7. AC Testing Input/Output
VLOAD
VLOAD+0.1V
VLOAD0.1V
VOH0.1V
VOL+0.1V
NOTE:
Figure 8. Float Waveform
TIMING
REFERENCE
POINTS
AC inputs during testing are driven at VDD 0.5 for a logic `1' and 0.45V for a logic `0'.
Timing measurements are made at VIH min for a logic '1' and VIL for a logic '0'.
For timing purposes, a port is no longer floating when a 100mV change from load
voltage occurs, and begins to float when a 100mV change from the loaded VOH/
VOL level occurs. IOH/IOL
20mA.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
19
VDD
P0
EA
RST
XTAL1
XTAL2
VSS
VDD
VDD
VDD
IDD
(NC)
CLOCK SIGNAL
Figure 9. I
DD
Test Condition, Active Mode
All other pins are disconnected
VDD
P0
RST
XTAL1
XTAL2
VSS
VDD
VDD
IDD
(NC)
CLOCK SIGNAL
Figure 10. I
DD
Test Condition, Idle Mode
All other pins are disconnected
P1.6
P1.7
*
*
P1.6
P1.7
*
*
EA
VDD0.5
0.45V
0.7VDD
0.2VDD0.1
t
CHCL
t
CLCL
t
CLCH
t
CLCX
t
CHCX
Figure 11. Clock Signal Waveform for
I
DD
Tests in Active and Idle Modes
t
CLCH
= t
CHCL
= 5ns
VDD
P0
RST
XTAL1
XTAL2
VSS
VDD
VDD
IDD
(NC)
Figure 12. I
DD
Test Condition, Power Down Mode
All other pins are disconnected. V
DD
= 2V to 5.5V
P1.6
P1.7
*
*
EA
NOTE:
*
Ports 1.6 and 1.6 should be connected to V
DD
through resistors of sufficiently high value such that the sink current into these pins does not
exceed the I
OL1
specifications.
Purchase of Philips I
2
C components conveys a license under the Philips' I
2
C patent
to use the components in the I
2
C system provided the system conforms to the
I
2
C specifications defined by Philips. This specification can be ordered using the
code 9398 393 40011.
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
20
DIP40:
plastic dual in-line package; 40 leads (600 mil)
SOT129-1
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
21
PLCC44:
plastic leaded chip carrier; 44 leads
SOT187-2
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
22
QFP44:
plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
23
SDIP42:
plastic shrink dual in-line package; 42 leads (600 mil)
SOT270-1
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
24
0590B
40-PIN (600 mils wide) CERAMIC DUAL IN-LINE (F) PACKAGE (WITH WINDOW (FA) PACKAGE)
NOTES:
1.
Controlling dimension: Inches. Millimeters are
2.
Dimension and tolerancing per
ANSI
Y14. 5M-1982.
3.
"T", "D", and "E" are reference datums on the body
4.
These dimensions measured with the leads
5.
Pin numbers start with Pin #1 and continue
6.
Denotes window location for EPROM products.
and include allowance for glass overrun and meniscus
on the seal line, and lid to base mismatch.
constrained to be perpendicular to plane
T
.
counterclockwise to Pin #40 when viewed
shown in parentheses.
from the top.
D
PIN # 1
E
0.225 (5.72) MAX.
0.010 (0.254)
T
E
D
0.023 (0.58)
0.015 (0.38)
0.165 (4.19)
0.125 (3.18)
0.070 (1.78)
0.050 (1.27)
T
SEA
TING
PLANE
0.620 (15.75)
0.590 (14.99)
(NOTE 4)
0.598 (15.19)
0.571 (14.50)
BSC
0.600 (15.24)
0.695 (17.65)
0.600 (15.24)
(NOTE 4)
0.015 (0.38)
0.010 (0.25)
0.175 (4.45)
0.145 (3.68)
0.055 (1.40)
0.020 (0.51)
0.100 (2.54) BSC
2.087 (53.01)
2.038 (51.77)
0.098 (2.49)
0.040 (1.02)
0.098 (2.49)
0.040 (1.02)
SEE NOTE 6
8530590B 06688
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
25
1472A
44-PIN CERQUAD J-BEND (K) PACKAGE
NOTES:
1.
All dimensions and tolerances to conform
2.
UV window is optional.
3.
Dimensions do not include glass protrusion.
Glass protrusion to be 0.005 inches maximum
4.
Controlling dimension millimeters.
5.
All dimensions and tolerances include
lead trim of
fset and lead plating finish.
6.
Backside solder relief is optional and
dimensions are for reference only
.
1.02 (0.040) X 45
16.89 (0.665)
16.00 (0.630)
17.65 (0.695)
17.40 (0.685)
CHAMFER
45
16.89 (0.665)
16.00 (0.630)
17.65 (0.695)
17.40 (0.685)
on each side.
to
ANSI
Y14.51982.
2
3
3 X 0.63 (0.025) R MIN.
3.05 (0.120)
2.29 (0.090)
4.83 (0.190)
3.94 (0.155)
SEA
TING
PLANE
0.38 (0.015)
0.51 (0.02) X 45
6
6
17.65 (0.656)
17.40 (0.685)
1.27 (0.050)
12.7 (0.500)
8.13 (0.320)
7.37 (0.290)
40X
4.83 (0.190)
3.94 (0.155)
SEA
TING
PLANE
0.15 (0.006) MIN.
0.25 (0.010) R MIN.
0.508 (0.020) R MIN.
0.25 (0.010)
0.15 (0.006)
90
+ 5
10
0.076 (0.003) MIN.
DET
AIL
B
mm/(inch)
SEE DET
AIL
B
SEE DET
AIL

A
DET
AIL

A
TYP
.
ALL
SIDES
mm/(inch)
1.52 (0.060) REF
.
0.482 (0.019 + 0.002)
SEA
TING
PLANE
1.02 + 0.25 (0.040 + 0.010)
BASE PLANE
45
TYP
.
4 PLACES
0.73 + 0.08 (0.029 + 0.003)
1.27 (0.050)
TYP
.
NOMINAL
8.13 (0.320)
7.37 (0.290)
3
853-1472A 05854
Philips Semiconductors
Product specification
80C528/83C528
CMOS single-chip 8-bit microcontrollers
1995 Feb 02
26
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 940883409
Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification
Product Status
Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1996
All rights reserved. Printed in U.S.A.
Philips
Semiconductors