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2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

8.1

Power supply

8.2

Antenna drivers

8.3

Diagnosis

8.4

Oscillator with programmable divider

8.5

Adaptive sampling time demodulator

8.6

Idle and Power-down mode

8.7

Serial interface

8.7.1

Communication protocol

8.7.2

Glitch filter

8.8

Commands

8.8.1

Command READ_TAG

8.8.2

Command WRITE_TAG_N

8.8.3

Command WRITE_TAG

8.8.4

Command READ_PHASE

8.8.5

Command SET_SAMPLING_TIME

8.8.6

Command GET_SAMPLING_TIME

8.8.7

Command SET_CONFIG_PAGE

8.8.8

Command GET_CONFIG_PAGE

LIMITING VALUES

DC CHARACTERISTICS

AC CHARACTERISTICS

APPLICATION INFORMATION

PACKAGE OUTLINE

SOLDERING

14.1

Introduction to soldering surface mount
packages

14.2

Reflow soldering

14.3

Wave soldering

14.4

Manual soldering

14.5

Suitability of surface mount IC packages for
wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

FEATURES

Combines all analog RFID reader hardware in one
single chip

Optimized for HITAG transponder family

Robust antenna coil power driver stage with modulator

High performance adaptive sampling time AM/PM
demodulator (patent pending)

Read and write function

On-chip clock oscillator

Antenna rupture and short circuit detection

Low power consumption

Very low power standby mode

Low external component count

Small package SO14.

APPLICATIONS

RFID systems.

GENERAL DESCRIPTION

HITAG

(1)

is the family name of the reader chip

HTRC11001T to use with transponders which are based
on the HITAG tag ICs (HT1ICS3002x or HT2ICS2002x).

The receiver parameters (gain factors and filter cut-off
frequencies) can be optimized to system and transponder
requirements. The HTRC11001T is designed for easy
integration into RF identification readers.

State-of-the-art technology allows almost complete
integration of the necessary building blocks. A powerful
antenna demodulator and driver, together with a low-noise
adaptive sampling time demodulator, a programmable
filter, amplifier and digitizer, build the complete transceiver
unit, required to design high-performance readers.

A three-pin microcontroller interface is employed for
programming the HTRC11001T as well as for the
bidirectional communication with the transponders. The
three-wire interface can be changed into a two-wire
interface by connecting the data input and the data output.

Tolerance dependent zero amplitude modulation will
cause severe problems in envelope detector systems,
resulting in the need of very low tolerance reader
antennas. These problems are solved by the new Adaptive
Sampling Time (AST) technique.

(1) HITAG - is a trademark of Philips Semiconductors

Gratkorn GmbH.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

4.5

5.0

5.5

clk

clock frequency

programmable

MHz

res

antenna resonant frequency

125

kHz

ant(p)

antenna driver output current (peak value) continuous

200

amb

ambient temperature

+85

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

HTRC11001T

SO14

plastic small outlet package; 14 leads; body width 3.9 mm

SOT108-1

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

PINNING

SYMBOL

PIN

DESCRIPTION

ground supply

TX2

antenna driver output 2

supply voltage (5 V stabilized)

TX1

antenna driver output 1

MODE

control input to enable filtering of serial clock and data input; for active antenna applications

XTAL1

oscillator input 1

XTAL2

oscillator input 2

SCLK

serial clock input of microcontroller interface

DIN

serial data input of microcontroller interface

DOUT

serial data output of microcontroller interface

n.c.

not connected

CEXT

high-pass filter coupling capacitor connection

QGND

internal analog virtual ground capacitor connection

demodulator input

handbook, halfpage

MGW266

HTRC11001T

VSS

TX2

VDD

TX1

MODE

XTAL1

XTAL2

SCLK

DIN

DOUT

n.c.

CEXT

QGND

Fig.2 Pin configuration.

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

FUNCTIONAL DESCRIPTION

8.1

Power supply

The HTRC11001T works with an external 5 V

10% power

supply at pin V

. The maximum DC current is

10 mA +

ant(p)

= 137 mA.

For optimum performance, the power supply connection
should be bypassed to ground with a 100 nF capacitor
close to the chip.

8.2

Antenna drivers

The drivers deliver a square shaped voltage to the series
resonant antenna circuit (see Fig.4). Due to the full bridge
configuration of the drivers the output voltage V

ant(p-p)

approximately 10 V, corresponding to V

ant(p)

= 5 V.

The current flowing through the antenna is sine shaped
and the peak and RMS values are approximately:

8.3

Diagnosis

In order to detect an antenna short-circuit or open-circuit
the antenna tap voltage is monitored.

An antenna fail condition is reported in the status
bit ANTFAIL (see Table 5) if the antenna tap voltage does
not go more negative than the diagnosis level voltage
(V

diag

1.15 V). This condition is checked for every coil

driver cycle.

8.4

Oscillator with programmable divider

The crystal oscillator at pins XTAL1 and XTAL2 works with
either crystal or ceramic resonators. It delivers the input
clock frequency of 4, 8, 12 or 16 MHz. The oscillator
frequency is divided by a programmable divider (selection
bits FSEL1 and FSEL0) to obtain the carrier frequency of
125 kHz (see Table 3).

Alternatively, an external clock signal (CMOS compatible)
may connected to pin XTAL1. For example, this clock
signal can be derived from the microcontroller clock.

8.5

Adaptive sampling time demodulator

The demodulator senses the absorption modulation
applied by a transponder when inserted into the field. The
signal is picked up at the antenna tap point between
L

and C

. It is divided by R

and the internal resistor R

int

to a level on pin RX below 8 V (peak value) with respect to
pin QGND (see Fig.4). Internally the signal is filtered with
a second-order low-pass filter.

The antenna current and therefore the tap voltage is
modulated by the transponder in amplitude and/or phase.
This signal is fed into a synchronous demodulator
recovering the baseband signal. The amplification and the
bandpass filter edge frequencies of the demodulator can
be adapted to different transponders via settings in the
configuration pages (see Table 3).

The phase between the driver excitation signal and the
antenna tap voltage depends on the antenna tuning. With
optimum tuning, the phase of the antenna tap voltage is
90

off the antenna driver signal. Detuning of the antenna

resonant circuit results in a change of this phase
relationship. The built-in phase measurement unit allows
the measurement of this phase relationship with a

resolution of

. This can be used to

compute a sampling time that compensates the detuning
of the reader antenna.

The phase measurement procedure can be carried out:

Once before the first communication starts, if the
position of the transponder does not change with
respect to the reader antenna

During the communication (after sending the write
pulses and before receiving the answer of the
transponder), if the tag is moving.

Before the system is switched into WRITE_TAG mode, the
demodulator has to be frozen. This is internally done by
clamping the input of the filter amplifier unit to the level on
pin QGND. Doing so avoids large transients in the
amplifier and digitizer, which could affect settling times.
In addition to the clamping, there exist other means in the
HTRC11001T which allow further reduction of the settling
times. All the parts of the circuitry which are associated
with these functions are controlled by the bits FREEZE0,
FREEZE1 and THRESET (see Table 2).

For more details concerning write timing, demodulator
setting, power-up sequence, etc. please refer to the
application note

"AN 98080 Read/Write devices based on

the HITAG Read/Write IC HTRC110".

---

ant(p)

---

ant(p)

ant

----------------

ant(rms)

-------

ant(p)

------

360

5.625

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

8.6

Idle and Power-down mode

The HTRC11001T can be switched into the Idle mode via
setting bit PD = 1 and resetting bit PD_MODE = 0
(see Table 3). In this Idle mode, only the oscillator and a
few other system components are active.

It is also possible to switch the HTRC11001T completely
off. This is achieved by the Power-down mode (bit PD = 1
and bit PD_MODE = 1). Within this mode also the clock
oscillator is switched off. This reduces the supply current
of the HTRC11001T to less than 20

8.7

Serial interface

The communication between the HTRC11001T and the
microcontroller is done via a 3-wire digital interface. The
interface is operated by the following signals:

Clock pulse on pin SCLK

Data input on pin DIN

Data output on pin DOUT.

Pins SCLK and DIN are realized as Schmitt-trigger inputs.
Pin DOUT is an open-drain output with an internal pull-up
resistor.

8.7.1

OMMUNICATION PROTOCOL

Every communication between the HTRC11001T and the
microcontroller begins with an initialization of the serial
interface. The interface initialization condition is a
LOW-to-HIGH transition on pin DIN while pin SCLK is at
HIGH level (see Fig.3).

All commands transmitted to the HTRC11001T serial
interface start with the Most Significant Bit (MSB).

Input DIN and output DOUT are valid when pin SCLK is at
HIGH level.

8.7.2

LITCH FILTER

Connecting pin MODE to V

enables digital filtering of the

SCLK and the DIN input signals. This mode offers
improved immunity against noise and interference
(glitches) on these interface signals. It is intended to be
used in the so called `active antenna applications' where
the microcontroller and the reader communicate via long
signal lines (e.g. 1 meter).

In other applications pin MODE has to be connected to
ground (pin V

For a detailed description of this feature, refer to the
application note

"AN 98080 Read/Write devices based on

the HITAG Read/Write IC HTRC110".

handbook, full pagewidth

MGW268

initialization

SCLK

DIN

tsu

DOUT

Fig.3 Serial interface communication protocol.

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

8.8

Commands

Table 1

Summary of the HTRC11001T command set

8.8.1

OMMAND

READ_TAG

This command is used to read the demodulated bit stream from a transponder.

After the assertion of the three command bits the HTRC11001T instantaneously switches to the READ_TAG mode and
transmits the demodulated, filtered and digitized data to the microcontroller. This data should be decoded by the
microcontroller.

The READ_TAG mode is terminated by a LOW-to-HIGH transition on pin SCLK.

8.8.2

OMMAND

WRITE_TAG_N

This command is used to write data to a transponder.

If bits N3 to N0 are set to 0000, the signal on pin DIN is transparently switched to the drivers. A HIGH level on pin DIN
corresponds to antenna drivers switched off and a LOW level corresponds to antenna drivers switched on.

For any binary number N between 0001 and 1111, the drivers are switched off at the next positive transition on pin DIN.
This state is held for a time interval t = N

(for T

= 8

s). This method relaxes the timing resolution requirements to

the microcontroller and to the software implementation while providing an exact, selectable write pulse timing.

The WRITE_TAG mode is terminated immediately by a LOW- to-HIGH transition on pin SCLK.

COMMAND NAME

BIT 7

BIT 6

BIT5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

REMARK

MSB

LSB

READ_TAG

READ_TAG mode

WRITE_TAG_N

WRITE_TAG mode with
pulse width programming

WRITE_TAG

WRITE_TAG mode

READ_PHASE

read command

response

SET_SAMPLING_TIME

GET_SAMPLING_TIME

read command

response

SET_CONFIG_PAGE

4 configuration bits

available

GET_CONFIG_PAGE

read command

response

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command bits

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command bits

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

8.8.3

OMMAND

WRITE_TAG

This is the 3-bit short form of the previously described command WRITE_TAG_N. It allows to switch into the
WRITE_TAG mode with a minimum communication time.

The behaviour of the WRITE_TAG command is identical to WRITE_TAG_N with two exceptions:

WRITE_TAG mode is entered after assertion of the third command bit

No N parameter is specified with this command; instead the N value which was programmed with the most recent
WRITE_TAG_N command is used. If no WRITE_TAG_N was issued so far, a default N = 0 (transparent mode) will be
assumed.

8.8.4

OMMAND

READ_PHASE

This command is used to read the antenna phase, which is measured at every carrier cycle.

The response bits D5 to D0 represent the phase (coded binary).

8.8.5

OMMAND

SET_SAMPLING_TIME

This command specifies the demodulator sampling time t

. The sampling time is coded binary in bits D5 to D0.

8.8.6

OMMAND

GET_SAMPLING_TIME

This command is used to read back the sampling time t

set with SET_SAMPLING_TIME.

The response bits D5 to D0 represent the sampling time (coded binary).

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command bits

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command bits

Response bits

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command bits

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command bits

Response bits

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

8.8.7

OMMAND

SET_CONFIG_PAGE

This command is used to set the filter and amplifier parameters (cut-off frequencies and gain factors) and to select the
operation mode. Bits P1 and P0 select one of four configuration pages.

Table 2

Configuration page bit names

Table 3

Description of the configuration page bits

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command

COMMAND

PAGE NUMBER

BIT

SET_CONFIG_PAGE 0

GAIN1

GAIN0

FILTERH

FILTERL

SET_CONFIG_PAGE 1

PD_MODE

HYSTERESIS

TXDIS

SET_CONFIG_PAGE 2

THRESET

ACQAMP

FREEZE1

FREEZE0

SET_CONFIG_PAGE 3

DISLP1

DISSMART-
COMP

FSEL1

FSEL0

BIT NAME

VALUE

DESCRIPTION

INITIAL

VALUE

FILTERL

main low-pass cut-off frequency

= 3 kHz

= 6 kHz

FILTERH

main high-pass cut-off frequency

= 40 kHz

= 160 kHz

GAIN0

amplifier 0 gain factor

gain = 16

gain = 32

GAIN1

amplifier 1 gain factor

gain = 6.22

gain = 31.5

TXDIS

disable coil driver

coil driver active

coil driver inactive

HYSTERESIS

data comparator hysteresis

hysteresis OFF

hysteresis ON

Power-down mode enable

device active

device power-down

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

PD_MODE

select Power-down mode

Idle mode

Power-down mode

FREEZE1,
FREEZE0

facility to achieve fast settling times (MSB and LSB)

normal operation

main low-pass is frozen; main high-pass is pre-charged to level on pin QGND

main low-pass is frozen; time constant of main high-pass is reduced by a
factor of 16 for bit FILTERH = 0 and by a factor of 8 for bit FILTERH = 1

main high-pass time constant is reduced by a factor of 16 for bit FILTERH = 0
and by a factor of 8 for bit FILTERH = 1; second high-pass is pre-charged

ACQAMP

store signal amplitude (see also bit AMPCOMP in Table 5)

set status bit AMPCOMP when the actual data signal amplitude is higher than
the stored reference

store actual amplitude of the data signal as reference for later amplitude
comparison

THRESET

reset threshold generation of digitizer

no reset

reset

FSEL1, FSEL0

clock frequency selection (MSB and LSB)

4 MHz

8 MHz

12 MHz

16 MHz

DISSMART-
COMP

disable smart comparator

smart comparator: on

smart comparator: off

DISLP1

disable low-pass 1

low-pass: on

low-pass: off

BIT NAME

VALUE

DESCRIPTION

INITIAL

VALUE

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

8.8.8

OMMAND

GET_CONFIG_PAGE

This command has three functions:

1. Reading back the configuration parameters set by command SET_CONFIG_PAGE

2. Reading back the transmit pulse width programmed with command WRITE_TAG_N

3. Reading the system status information.

Bits P1 and P0 select one of four configuration pages.

The response bits (X3 to X0 and D3 to D0) contains the contents of the selected configuration page in its lower nibble.

For page 0 and page 1 the higher nibble reflects the current setting of the transmit pulse width N.

For page 2 and page 3 the system status information is returned in the higher nibble.

Table 4

Configuration page bit names

Table 5

Description of the configuration page bits

NAME

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Command bits

Response bits

COMMAND

PAGE NUMBER

BIT

GET_CONFIG_PAGE 0

GET_CONFIG_PAGE 1

GET_CONFIG_PAGE 2

0 (RFU)

AMPCOMP

ANTFAIL

GET_CONFIG_PAGE 3

0 (RFU)

AMPCOMP

ANTFAIL

BIT NAME

VALUE

DESCRIPTION

D3 to D0

XXXX

contents of the selected configuration page

N3 to N0

XXXX

current setting of the transmit pulse width

ANTFAIL

antenna failure

no antenna failure

antenna failure

AMPCOMP

amplitude comparison result (see also bit ACQAMP in Table 3)

actual data signal amplitude is lower than the stored reference

actual data signal amplitude is higher than the stored reference

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.

Note

1. Stress above one or more of the limiting values may cause permanent damage to the device. These are stresses

ratings only and operation of the device at these or at any other conditions above those given in Chapter 10 not
implied. Exposure or limiting values for extended periods may affect device reliability.

10 DC CHARACTERISTICS
All voltages are measured with respect to ground (pin V

); T

amb

40 to +85

Note

1. Power consumption of external quartz or any other component is not included.

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

voltage at any pin (except pin RX)

0.3

6.5

n(max)

maximum voltage at any pin with respect to V

(except pin RX)

0.3

+ 0.3

voltage at pin RX

+12

j(max)

maximum junction temperature

140

stg

storage temperature

+125

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply voltage

4.5

5.0

5.5

supply current

= 5.5 V; I

TX1

= I

TX2

= 0

idle

idle current

= 5.5 V; note 1

0.2

0.4

power-down current

= 5.5 V

Driver outputs (pins TX1 and TX2)

ant(p)

antenna driver output current
(peak value)

permanent

200

pulse load; t

< 400 ms;

ratio on : off = 1 : 4

400

output resistance

both drivers together

2.5

Demodulator input (pin RX)

input voltage

with respect to pin QGND

diag

diagnosis level voltage

with respect to pin QGND;
V

= 5 V

1.5

1.15

0.8

QGND

potential on pin QGND

0.35V

0.42V

0.50V

internal demodulator
impedance

Digital inputs

HIGH-level input voltage

0.7V

+ 0.3 V V

LOW-level input voltage

0.3

0.3V

Digital outputs

LOW-level output voltage

OL(max)

= 1 mA

0.4

LOW-level output current

0.4 V

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

11 AC CHARACTERISTICS
T

amb

40 to +85

Note

1. These short times require special command sequences. Please refer to the application note

"AN 98080 Read/Write

devices based on the HITAG Read/Write IC HTRC110".

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Oscillator inputs (pins XTAL1 and XTAL2)

osc

oscillator frequency

depending on bits FSEL1
and FSEL0

MHz

start-up time

input capacitance on pin XTAL1

input resistance

between pins XTAL1
and XTAL2

0.9

1.3

3.0

External clock input (pin XTAL1)

ext

external clock frequency

depending on bits FSEL1
and FSEL0

MHz

duty cycle

Serial interface

set-up time

pin MODE at V

hold time

pin MODE at V

Receiver (pin RX)

RX(p-p)

sensitivity (peak-to-peak value)

receiver input

receiver delay

bit FILTERL = 0

290

310

340

bit FILTERL = 1

160

175

190

Demodulator valid time

rec

demodulator recovery time

after clock stable; note 1

after WRITE-pulse; note 1

500

after AST-step

0.7

1.5

phase measurement error

5.7

deg

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

12 APPLICATION INFORMATION

Figure 4 shows a minimal application circuitry for the
HTRC11001T.

The reader coil L

together with the capacitor C

forms a

series resonant LC circuit (f

= 125 kHz). The high

voltages in the LC circuit are divided to safe operating
levels by R

and the internal resistor R

behind pin RX.

The two capacitors connected to pin XTAL1 and
pin XTAL2 shall be the recommended values and types
from the data sheet of the crystal.

Alternatively to a crystal, a ceramic resonator can be used
or an external clock source can be connected to
pin XTAL1.

handbook, full pagewidth

MGW267

100 nF

HTRC11001T

VSS

TX2

VDD

TX1

MODE

XTAL1

XTAL2

SCLK

DIN

DOUT

to microcontroller

n.c.

CEXT

QGND

Fig.4 Minimum application circuitry.

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

13 PACKAGE OUTLINE

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

8.75
8.55

4.0
3.8

1.27

6.2
5.8

0.7
0.6

0.7
0.3

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0
0.4

SOT108-1

detail X

(A )

076E06

MS-012

pin 1 index

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.35
0.34

0.16
0.15

0.050

1.05

0.041

0.244
0.228

0.028
0.024

0.028
0.012

0.01

0.25

0.01

0.004

0.039
0.016

97-05-22
99-12-27

2.5

5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

14 SOLDERING

14.1

Introduction to soldering surface mount
packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

14.2

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 220

C for

thick/large packages, and below 235

C for small/thin

packages.

14.3

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.4

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

14.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, HBGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

2001 Nov 23

Philips Semiconductors

Product specification

HITAG reader chip

HTRC11001T

15 DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS

(1)

PRODUCT

STATUS

(2)

DEFINITIONS

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

16 DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

17 DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA73

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

613502/02/pp

Date of release:

2001 Nov 23

Document order number:

9397 750 08329

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: HTRC11001T

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: HTRC11001T