Document Outline
- FEATURES
- GENERAL DESCRIPTION
- ORDERING INFORMATION
- BLOCK DIAGRAM
- PINNING
- FUNCTIONAL DESCRIPTION
- Supply
- Power-on reset (SELECT = LOW)
- Power failure
- Voltage trip-point
- COMIN
- LIMITING VALUES
- HANDLING
- CHARACTERISTICS
- Typical performance characteristics
- APPLICATION INFORMATION
- PACKAGE OUTLINES
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Product specification
Supersedes data of 1996 Jan 23
File under Integrated Circuits, IC11
1998 Apr 16
INTEGRATED CIRCUITS
PCF1252-X family
Threshold detector and reset
generator
1998 Apr 16
2
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
FEATURES
Very low current consumption, typically 10
A
10 factory programmed threshold voltages available
covering trip voltages from 4.75 to 2.55 V
50 mV trip point accuracy over full temperature range
Variable RESET delay
RESET pulse polarity selection
Defined outputs at 0.6 V (typ.)
Comparator for second level detection
(e.g. overvoltage detection)
Advance warning of power fail
Operating temperature range
-
40 to +85
C.
GENERAL DESCRIPTION
The PCF1252-Xs are low-power CMOS voltage threshold
detectors designed especially for supervision of
microcontroller/microprocessor systems for detection of
power-on/off conditions and generation of a system reset
pulse. The PCF1252-X also provides a POWF (power fail)
output which is activated at a precise factory-programmed
trip point. A system RESET output has a built-in delay with
duration determined by an external capacitor (C
CT
).
A second comparator (comparator 2) has been included to
enable the possibility of a second monitoring point in the
system.
ORDERING INFORMATION
Note
1. X = 0 to 9; depending on threshold voltage.
BLOCK DIAGRAM
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
PCF1252-XP
(1)
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
PCF1252-XT
(1)
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
Fig.1 Block diagram.
handbook, full pagewidth
+
-
+
-
COMIN
comparator 2
8
3
5
PCF1252-X
7
6
1
CT
SELECT
RESET
POWF
COMOUT
MGC915
1.30 V
4
2
comparator 1
DELAY
VDD
VSS
1998 Apr 16
3
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
PINNING
SYMBOL
PIN
DESCRIPTION
CT
1
connection for the external capacitor
SELECT
2
select polarity or external reset input
COMIN
3
comparator input
V
SS
4
ground (0 V)
COMOUT
5
comparator output
RESET
6
reset output
POWF
7
power failure signal output
V
DD
8
supply voltage
Fig.2 Pinning diagram.
handbook, halfpage
1
2
3
4
CT
SELECT
COMIN
VSS
VDD
POWF
RESET
COMOUT
8
7
6
5
MGC916
PCF1252-X
FUNCTIONAL DESCRIPTION (see Fig.1)
The PCF1252-X contains:
A precise factory-programmed voltage reference
Two comparators
A delay circuit.
The PCF1252-X family is comprised of 10 versions with
different factory-programmed voltage trip-points (V
TRIP
),
see Chapter "Characteristics".
Supply
The supply voltage (V
DD
) is internally divided before being
compared, via comparator 1, with the internal reference
voltage.
POWF (see Fig.3)
The POWF output is:
LOW, if V
DD
is below V
TRIP
HIGH, if V
DD
is above V
TRIP
.
Power-on reset (SELECT = LOW)
As V
DD
rises past V
TRIP
, a positive reset pulse is generated
at RESET. The duration of the reset pulse (t
R
) is
determined by the value of the external capacitor (C
CT
;
maximum 1
F, see Fig.8) connected to CT. With no
external capacitor connected, C
CT
assumes a minimum
value of 100 pF. If SELECT is HIGH, the reset pulse is
inverted.
Power failure
During a power-off condition (V
DD
< V
TRIP
), POWF goes
LOW. After a time delay (t
S
), also determined by C
CT
,
RESET goes HIGH. Any POWF assertion (V
DD
< V
TRIP
)
will result in a subsequent RESET pulse.
Voltage trip-point
By selecting the voltage trip-point slightly higher than the
minimum operating voltage of the
microcontroller/microprocessor, there is sufficient time for
data storage before the power actually fails.
In order to prevent oscillations around the voltage
trip-point, a small hysteresis has been included, resulting
in a power-on switching point that is higher than the
voltage trip-point (minimum of 15 mV). The voltage
trip-point refers to the value at which power-off is signalled.
COMIN
Input to the second comparator (comparator 2).
When used in conjunction with an external voltage divider,
this allows a second point in the system to be monitored.
This input has no built-in hysteresis. When not in use
connect to V
DD
. COMOUT will be LOW or HIGH
depending on the voltage at COMIN:
COMOUT = HIGH, if voltage at COMIN is above the
switch point V
SP
(typically 1.30 V).
COMOUT = LOW, if voltage at COMIN is below the
switch point V
SP
(typically 1.30 V).
1998 Apr 16
4
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal handling precautions appropriate to handling MOS devices (see
"Handling MOS Devices").
CHARACTERISTICS
V
DD
= 2.4 to 6.0 V; V
SS
= 0 V; T
amb
=
-
40 to +85
C; (see Fig.3); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DD
supply voltage
-
0.5
+7.0
V
V
I
input voltage
-
0.5
V
DD
+ 0.5
V
I
I
DC clamp-diode current
all pins: V
I
<
-
0.5 V
or V
I
> V
DD
+ 0.5 V
-
20
mA
I
O
output current
-
20
mA
P
tot
total power dissipation
-
150
mW
T
stg
storage temperature
-
65
+100
C
T
amb
operating ambient temperature
-
40
+85
C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DD
supply voltage
2.4
-
6.0
V
V
TRIP
Voltage trip-point:
T
amb
= 25
C; note 1
PCF1252-0
4.70
4.75
4.80
V
PCF1252-1
4.50
4.55
4.60
V
PCF1252-2
4.20
4.25
4.30
V
PCF1252-3
4.00
4.05
4.10
V
PCF1252-4
3.70
3.75
3.80
V
PCF1252-5
3.50
3.55
3.60
V
PCF1252-6
3.20
3.25
3.30
V
PCF1252-7
3.00
3.05
3.10
V
PCF1252-8
2.70
2.75
2.80
V
PCF1252-9
2.50
2.55
2.60
V
I
DD
supply current
T
amb
= 25
C;
V
DD
= V
TRIP
+ 0.5 V;
COMIN = V
DD
;
see Figs. 4 and 5
-
10
15
A
V
TRIP
voltage trip-point temperature
coefficient
note 2
-
100
10
-
6
400
10
-
6
mV/K
V
hys
voltage trip-point hysteresis
15
30
50
mV
1998 Apr 16
5
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
Notes
1. Long time stability of COMIN switch point V
SP
and voltage trip point V
TRIP
: within 10 years of continuous operation
at V
DD(max)
and an average operating temperature of 55
C the drift of V
SP
will not exceed
10 mV. The maximum
drift for V
TRIP
will not exceed (
V
TRIP(typ)
/V
SP(typ)
) 10 mV.
2. Values given per degree Kelvin; tested on a sample basis.
3. Conformance to these specifications is only guaranteed if the slew rate of V
DD
is less than 25 V/ms.
COMIN
V
SP
COMIN switch point
T
amb
= 25
C; note 1
1.28
1.30
1.32
V
V
SP
COMIN switch point temperature
coefficient
note 2
-
0.1
0.5
mV/K
SELECT
V
IL
LOW level input voltage
-
-
0.3V
DD
V
V
IH
HIGH level input voltage
0.7V
DD
-
-
V
SELECT and COMIN
I
LI
LOW level leakage input current
-
-
-
1.0
A
I
LI
HIGH level leakage input current
-
-
1.0
A
POWF, RESET and COMOUT
I
O
output sink current
V
O
= 0.4 V;
V
DD
= 2.4 V;
see Fig.6
1
3
-
mA
I
O
output source current
V
O
= 2.0 V;
V
DD
= 2.4 V;
see Fig.7
-
0.75
-
2
-
mA
t
R
reset time
C
CT
= 1 nF; note 3
400
1000
2000
s
t
S
save time
C
CT
= 1 nF; note 3
40
100
200
s
t
R
/t
S
reset to save time ratio
-
10
-
C
int
CT internal capacitance
-
100
-
pF
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1998 Apr 16
6
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
Fig.3 Timing diagram.
handbook, full pagewidth
supply voltage
typ. = 0.6 V
undefined
output
undefined
output
POWF
reset
tR
tS
tR
reset
0 V
MGC917
0 V
0 V
VDD
Vhys
VTRIP
RESET
(SELECT = VSS)
t
R
= reset time (duration of reset pulse).
t
S
= save time (time between assertion of POWF and assertion of the reset output). This time can be used for storing of critical data and orderly system
shut-down.
V
hys
= hysteresis voltage (prevents oscillation around V
TRIP
).
1998 Apr 16
7
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
Typical performance characteristics
Fig.4
Supply current as a function of temperature;
V
DD
= 5 V; COMIN = V
DD
.
handbook, halfpage
-
40
0
40
120
14
12
(
A)
8
6
10
IDD
MGC918
80
Tamb (
o
C)
4.75 V
VTRIP =
2.55 V
Fig.5
Supply current as a function of the supply
voltage; T
amb
= +25
C.
handbook, halfpage
0
12
8
4
0
2
4
8
MGC919
6
VDD (V)
(
A)
IDD
4.75 V
VTRIP =
2.55 V
Fig.6
Output sink current as a function of the
output voltage.
handbook, halfpage
0
2
4
8
40
IO
30
(mA)
10
0
20
MGC920
6
VO (V)
6 V
2.5 V
VDD =
4.0 V
Fig.7
Output source current as a function of the
output voltage.
handbook, halfpage
0
2
4
6
40
30
10
0
20
MGC921
IO
(mA)
VO (V)
2.5 V
VDD = 6 V
4.0 V
1998 Apr 16
8
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
Fig.8 Reset and save times as a function of the external capacitor (C
CT
).
(1) t
R
(typ.) = (0.1 + C
CT
) ms.
(2) t
S
(typ.) = (0.01 + 0.1 C
CT
) ms.
handbook, full pagewidth
10
-
1
10
-
1
10
10
2
10
3
10
-
1
10
2
10
2
10
3
10
1
10
-
2
10
-
2
10
-
3
1
external capacitor (nF)
MGC922
1
10
(ms)
tR(1)
(ms)
tS(2)
APPLICATION INFORMATION
Fig.9
Typical power-on reset circuit for a microcontroller/microprocessor system; (when not used, COMIN must
be connected to V
DD
).
handbook, full pagewidth
MICROCONTROLLER/
MICROPROCESSOR
VDD
VDD
VDD
RESET
MGC923
RESET
COMIN
PCF1252-X
SELECT
VSS
VSS
VSS
CT
(0 V)
(
+
5 V)
1 nF
1998 Apr 16
9
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
Fig.10 Data retention circuit for memory back-up systems.
handbook, full pagewidth
MICROCONTROLLER/
MICROPROCESSOR
VDD
VDD
RESET
INT
MGC924
RESET
COMIN
VOLTAGE
REGULATOR
COMOUT
PCF1252-X
SELECT
VSS
VDD
VSS
VSS
CT
RAM
VRAM
addres/data bus
12 V
5 V
1 M
6 M
1 nF
10
F
CHIP-
DECODING
LOGIC
R/W
CS
Fig.11 Data retention circuit with external switchable reset for systems with a single voltage supply.
(1) For external reset application, the SELECT input must be debounced.
handbook, full pagewidth
MICROCONTROLLER/
MICROPROCESSOR
VDD
VDD
VDD
RESET
RAM
INT
MGC925
RESET
COMIN
PCF1252-X
SELECT
external reset
input signal (1)
VSS
VDD
VSS
VSS
VSS
CT
10
F
POWF
1998 Apr 16
10
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT97-1
92-11-17
95-02-04
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
1.15
4.2
0.51
3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.01
0.10
0.30
0.32
0.31
0.39
0.33
0.045
0.17
0.020
0.13
b
2
050G01
MO-001AN
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
1998 Apr 16
11
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S
MS-012AA
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
95-02-04
97-05-22
1998 Apr 16
12
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1998 Apr 16
13
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1998 Apr 16
14
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
NOTES
1998 Apr 16
15
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1998
SCA59
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Printed in The Netherlands
295102/1200/03/pp16
Date of release: 1998 Apr 16
Document order number:
9397 750 03645
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