Document Outline
- FEATURES
- DESCRIPTION
- QUICK REFERENCE DATA
- ORDERING INFORMATION
- PIN CONFIGURATION
- PIN DESCRIPTION
- FUNCTION TABLE
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- DC CHARACTERISTICS
- AC CHARACTERISTICS
- AC WAVEFORMS
- TEST CIRCUIT
- PACKAGE
- Data sheet status
- Definitions
- Disclaimers
Philips
Semiconductors
PCK2002P
140 MHz PCI-X clock buffer
Product data
File under Integrated Circuits ICL03
2001 May 09
INTEGRATED CIRCUITS
Philips Semiconductors
Product data
PCK2002P
140 MHz PCI-X clock buffer
2
2001 May 09
853-2254 26252
FEATURES
General purpose and PCI-X 1:4 clock buffer
8-pin TSSOP package
See PCK2001 for 48-pin 1:18 buffer part
See PCK2001M for 28-pin 1:10 buffer part
See PCK2001R for 16-pin 1:6 buffer part
Operating frequency: 0 140 MHz
Part-to-part skew < 500 ps
Low output skew: <200 ps
3.3 V operation
ESD classification testing is done to JEDEC Standard JESD22.
Protection exceeds 2000 V to HBM per method A114.
DESCRIPTION
The PCK2002PL is a 14 fanout buffer used as a high-performance,
low skew, general purpose and PCI-X clock buffer. It distributes one
input clock (BUF_IN) signal to four output clocks (BUF_OUT
n
).
PIN CONFIGURATION
3
4
5
6
OE
BUF_OUT0
V
SS
BUF_OUT1
V
DD
TOP VIEW
1
2
7
8
BUF_IN
BUF_OUT2
BUF_OUT3
SA00552
PCK2002P
PIN DESCRIPTION
PIN
NUMBER
I/O
TYPE
SYMBOL
FUNCTION
1
Input
BUF_IN
Buffered clock input
3, 5, 7, 8
Output
BUF_OUT
(03)
Buffered clock outputs
6
Input
V
DD
3.3 V supply
2
Input
OE
Output Enable
4
Input
V
SS
Ground
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
t
PLH
t
PHL
Propagation delay
BUF_IN to BUF_OUT
n
V
CC
= 3.3 V, C
L
= 25 pF
2.9
2.8
ns
t
r
Rise time
V
CC
= 3.3 V, C
L
= 25 pF, 0.2V
DD
to 0.6V
DD
800
ps
t
f
Fall time
V
CC
= 3.3 V, C
L
= 25 pF, 0.6V
DD
to 0.2V
DD
600
ps
I
CC
Total supply current
V
CC
= 3.6 V
50
A
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
DRAWING NUMBER
8-Pin Plastic TSSOP
40 to +85
C
PCK2002PDP
SOT505-1
8-Pin Plastic SO
40 to +85
C
PCK2002PD
SOT96-1
Philips Semiconductors
Product data
PCK2002P
140 MHz PCI-X clock buffer
2001 May 09
3
FUNCTION TABLE
OE
BUF_IN
BUF_OUTn
L
X
L
H
L
L
H
H
H
ABSOLUTE MAXIMUM RATINGS
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to V
SS
(V
SS
= 0 V).
SYMBOL
PARAMETER
CONDITION
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITION
MIN
MAX
UNIT
V
DD
DC 3.3 V supply voltage
0.5
+4.3
V
I
IK
DC input diode current
V
I
< 0
--
50
mA
V
I
DC input voltage
Note 2
0.5
V
DD
+ 0.5
V
I
OK
DC output diode current
V
O
> V
DD
or V
O
< 0
--
50
mA
V
O
DC output voltage
Note 2
0.5
V
DD
+ 0.5
V
I
O
DC output source or sink current
V
O
0 to V
DD
--
50
mA
T
stg
Storage temperature range
65
+150
C
P
tot
Power dissipation per package
plastic medium-shrink SO (SSOP)
For temperature range: 0 to +70
C
above +55
C derate linearly with 11.3 mW/K
--
850
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITIONS
MIN
MAX
UNIT
V
DD
DC 3.3V supply voltage
3.0
3.6
V
C
L
Capacitive load
20
30
pF
V
I
DC input voltage range
0
V
DD
V
V
O
DC output voltage range
0
V
DD
V
T
amb
Operating ambient temperature range in free air
40
+85
C
Philips Semiconductors
Product data
PCK2002P
140 MHz PCI-X clock buffer
2001 May 09
4
DC CHARACTERISTICS
TEST CONDITIONS
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
= 40 to +85
C
UNIT
V
DD
(V)
OTHER
MIN
MAX
V
IH
HIGH level input voltage
3.0 to 3.6
--
--
2.0
V
DD
+ 0.3
V
V
IL
LOW level input voltage
3.0 to 3.6
--
--
V
SS
0.3
0.8
V
3.0 to 3.6
I
OH
= 1 mA
--
V
DD
0.2
--
V
V
OH
Output HIGH voltage
3.0
I
OH
= 24 mA
--
2.0
--
V
3.0
I
OH
= 12 mA
--
2.4
--
V
3.0 to 3.6
I
OL
= 1 mA
--
--
0.2
V
V
OL
Output LOW voltage
3.0
I
OL
= 24 mA
--
--
0.8
V
3.0
I
OL
= 12 mA
--
--
0.55
V
I
O
Output HIGH current
3.0
V
OUT
= 1 V
--
50
--
mA
I
OH
Output HIGH current
3.3
V
OUT
= 1.65 V
--
--
150
mA
I
O
Output LOW current
3.0
V
OUT
= 2.0 V
--
60
--
mA
I
OL
Output LOW current
3.3
V
OUT
= 1.65 V
--
--
150
mA
I
I
Input leakage current
3.6
V
I
= V
DD
or GND
--
--
5
A
I
CC
Quiescent supply current
3.6
V
I
= V
DD
or GND
I
O
= 0
--
100
A
Philips Semiconductors
Product data
PCK2002P
140 MHz PCI-X clock buffer
2001 May 09
5
AC CHARACTERISTICS
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
T
amb
= 40 to +85
C
UNIT
NOTES
MIN
TYP
6
MAX
T
H
CLK HIGH time
66 MHz
2
6.0
--
--
ns
T
L
CLK LOW time
66 MHz
3
6.0
--
--
ns
T
H
CLK HIGH time
140 MHz
2
2.9
--
--
ns
T
L
CLK LOW time
140 MHz
3
3.0
--
--
ns
T
R
Output rise slew rate
4
1.4
1.7
4.0
V/ns
T
F
Output fall slew rate
4
1.5
2.2
4.0
V/ns
T
PLH
Buffer LH propagation delay
5
1.8
2.9
3.4
ns
T
PHL
Buffer HL propagation delay
5
1.8
2.8
3.4
ns
T
SKW
Bus CLK skew
1
--
--
200
ps
T
DDSKW
Device to device skew
1
--
--
500
ps
NOTES:
1. CLK skew is only valid for equal loading of all outputs.
2. T
H
is measured at 0.5 V
DD
as shown in Figure 2.
3. T
L
is measured at 0.35 V
DD
as shown in Figure 2.
4. T
R
and T
F
are measured as a transition through the threshold region 0.2 V
DD
to 0.6 V
DD
and 0.6 V
DD
to 0.2 V
DD
.
5. Input edge rate for these tests must be faster than 1 V/ns.
6. All typical values are at V
CC
= 3.3 V and T
amb
= 25
C.
AC WAVEFORMS
V
M
= 50% V
DD
C
L
= 25 pF
V
OL
and V
OH
are the typical output voltage drop that occur with the
output load.
BUF_IN
INPUT
V
M
t
PLH
t
PHL
BUF_OUT
V
M
V
M
V
M
SW00811
V
DD
0.6 V
DD
0.2 V
DD
T
R
0.6 V
DD
0.2 V
DD
T
F
Figure 1. Load circuitry for switching times.
t
p
t
h
t
l
0.5 V
DD
0.4 V
DD
0.35 V
DD
SW00812
Figure 2. Buffer Output clock
TEST CIRCUIT
PULSE
GENERATOR
R
T
V
I
D.U.T.
V
O
C
L
V
DD
140
140
SW00813
V
DD
Figure 3. Load circuitry for switching times
Philips Semiconductors
Product data
PCK2002P
140 MHz PCI-X clock buffer
2001 May 09
6
TSSOP8:
plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
Philips Semiconductors
Product data
PCK2002P
140 MHz PCI-X clock buffer
2001 May 09
7
SO8:
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
Philips Semiconductors
Product data
PCK2002P
140 MHz PCI-X clock buffer
2001 May 09
8
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 940883409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 2001
All rights reserved. Printed in U.S.A.
Date of release: 05-01
Document order number:
9397 750 08348
Philips
Semiconductors
Data sheet status
[1]
Objective data
Preliminary data
Product data
Product
status
[2]
Development
Qualification
Production
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be
published at a later date. Philips Semiconductors reserves the right to change the specification
without notice, in order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply.
Changes will be communicated according to the Customer Product/Process Change Notification
(CPCN) procedure SNW-SQ-650A.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on
the Internet at URL http://www.semiconductors.philips.com.
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