General description

The SE98 is a JEDEC compliant local temperature sensor specifically designed for higher
performance SO-DIMM applications. The temperature sensor is mounted on the
SO-DIMM module and communicates with the processor via the I

C-bus/SMBus. Since

the DRAM refresh rate is dependent on temperature, mounting the temperature sensor on
the module allows the processor to adjust the refresh rate based on the actual
temperature instead of the calculated worst-case temperature. The end result being
longer battery life and better system performance.

The SE98 consists of a

A-D converter that continuously monitors and updates its own

temperature readings, converts the reading to digital data, and registers into the data
temperature register. The data is compared to three alarm registers which are
programmed and read via a 2-wire serial bus (SMBus, I

C-bus Standard-mode and

C-bus Fast-mode). The device also supports the SMBus time-out function that prevents

system lock-ups.

SO-DIMM applications normally use the C-grade accuracy SE98TK temperature sensor.
For applications requiring higher B-grade accuracy, the SE98TK/1 is available.

Features

Monitor local temperature

JEDEC (JC-42.4) SO-DIMM temperature sensor compliant

Local temperature sensor accuracy (V

= 3.3 V

10 %):

C to 95

C--sensor grade B =

C; sensor grade C =

2.0

C to 125

C--sensor grade B =

C; sensor grade C =

C to 125

C--sensor grade B =

C; sensor grade C =

ADC resolution: 0.125

Conversion rate: 8 Hz minimum

Programmable hysteresis threshold: 0

C, 1.5

C, 3

C, 6

Over/under/critical temperature EVENT output

Security lock bit for data protection

Operating voltage range: 3.0 V to 3.6 V

Maximum operating current: 250

Maximum standby current is 15

C-bus and SMBus compatible, supporting:

Bus speed: 0 Hz to 400 kHz

SMBus Alert and Time-out (programmable)

Operating temperature range: 20

C to +125

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

Rev. 01 -- 10 May 2006

Product data sheet

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

3 of 28

Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

Pinning information

6.1 Pinning

6.2 Pin description

Fig 2.

Pin configuration for TSSOP8

Fig 3.

Pin configuration for HVSON8

SE98PW

SE98PW/1

EVENT

SCL

GND

SDA

002aab806

Transparent top view

terminal 1
index area

002aab804

SE98TK

SE98TK/1

SDA

GND

SCL

EVENT

Table 2.

Pin description

Symbol

Pin

Type

Description

C-bus/SMBus slave address bit 0

C-bus/SMBus slave address bit 1

C-bus/SMBus slave address bit 2

GND

ground

device ground

SDA

I/O

SMBus/I

C-bus serial data input/output (open-drain).

Must have external pull-up resistor.

SCL

SMBus/I

C-bus serial clock input/output (open-drain).

Must have external pull-up resistor.

EVENT

Thermal alarm output for high/low and critical temperature
limit (open-drain). Must have external pull-up resistor.

power

device power supply (3.0 V to 3.6 V)

SE98_1

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

Functional description

7.1 Serial bus interface

The SE98 uses the 2-wire serial bus (I

C-bus/SMBus) to communicate with a host

controller. The serial bus consists of a clock (SCL) and data (SDA) signals. The device
can operate on either the I

C-bus Standard/Fast mode or SMBus. The I

C-bus Standard

mode is defined to have bus speeds from 0 Hz to 100 kHz, I

C-bus Fast mode from 0 Hz

to 400 kHz, and the SMBus is from 10 kHz to 100 kHz. The host or bus master generates
the SCL signal, and the SE98 uses the SCL signal to receive or send data on the SDA
line. Data transfer is serial, bidirectional, and is one bit at a time with the Most Significant
Bit (MSB) transferred first, and a complete I

C-bus data is 1 byte. Since SCL and SDA are

open-drain, pull-up resistors must be installed on these pins.

7.2 Slave address

The SE98 uses a 4-bit fixed and 3-bit programmable (A0, A1 and A2) 7-bit slave address
that allows a total of eight devices to co-exist on the same bus. The input of each pin is
sampled at the start of each I

C-bus/SMBus access. The temperature sensor's fixed

address is 0011.

7.3 EVENT output

The EVENT pin is an open-drain output whose function can be programmed as an
interrupt, comparator, or critical alarm mode. When the device operates in Interrupt mode,
and the temperature reaches a critical temperature, the device switches to the comparator
mode automatically and asserts the EVENT pin. When the temperature drops below
critical temperature, the device reverts back to either interrupt or comparator mode, as
programmed in the Configuration Register. The interrupt latch can be cleared by writing a
`1' to the `clear EVENT' bit in the Configuration Register or by performing the SMBus Alert
Response Address (ARA).

In comparator mode, the EVENT pin remains asserted until the temperature falls below
the value programmed in the Upper Boundary Alarm Trip Register or rises above the
value programmed in the Lower Boundary Alarm Trip register, or until the range of these
alarm registers are reprogrammed and the temperature falls inside the alarm limits.

Figure 5

depicts the EVENT output for all the three modes. All event thresholds use

hysteresis as programmed in the Configuration Register.

Fig 4.

Slave address

R/W

002aab304

fixed

hardware

selectable

slave address

MSB

LSB

SE98_1

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

7.3.1 Alarm window

The alarm window consists of two registers: an Upper Boundary Alarm Trip register (02h),
and a Lower Boundary Alarm Trip register (03h). The Upper Boundary Alarm Trip register
holds the upper temperature trip point, while the Lower Boundary Alarm Trip register holds
the lower temperature trip point. When the EVENT control is enabled, the EVENT output
will be triggered whenever entering or exiting the alarm window.

7.3.2 Critical trip

The device can be programmed in such a way that the EVENT output is triggered when
the temperature exceeds the critical trip point set by the Critical Alarm Trip register (04h).

When the temperature sensor reaches the critical temperature value, the device is
automatically placed in comparator mode; the EVENT output is only cleared when the
temperature falls below the critical temperature value and cannot be cleared through the
clear EVENT bit or SMBus Alert.

7.4 Conversion rate

The conversion time is the amount of time required for the ADC to complete a temperature
measurement for the local temperature sensor. The conversion rate is the inverse of the
conversion period which describes the number of cycles the temperature measurement
completes in one second--the faster the conversion rate, the faster the temperature
reading is updated. The SE98's conversion rate is at least 8 Hz or 125 ms.

Fig 5.

EVENT output for `Interrupt', `Comparator', and `Critical Temp only' modes

002aab233

time

temperature (

critical

EVENT in Interrupt mode

EVENT in Comparator mode

EVENT in `Critical Temp only' mode

alarm window

hysteresis affects

these trip points

software clears event

Lower Boundary Alarm

Upper Boundary Alarm

SE98_1

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

7.5 Power-up default condition

After power-on, the SE98 is initialized to the following default condition:

Starts monitoring local sensor

EVENT register is cleared--EVENT output is pulled HIGH by external pull-ups

EVENT hysteresis is defaulted to 0

Command pointer is defaulted to `00h'

Critical Temp, Alarm Temperature Upper and Lower Boundary Trip register are
defaulted to 0

Operational mode: comparator

7.6 SMBus Time-out

The SE98 supports SMBus time-out feature. If the host holds SCL LOW between 25 ms
and 35 ms, the SE98 would reset its internal state machine to the bus IDLE state to
prevent the system bus hang-up. This feature is turned on by default. The SMBus time-out
is disabled by writing a logic 1 to bit 7 of register 22h.

Remark: When SMBus time-out is enabled, the I

C-bus minimum bus speed is limited by

the SMBus time-out timer, and goes down to only 10 kHz.

7.7 SMBus Alert

The SE98 supports SMBus Alert when it is programmed for the Interrupt mode and when
the EVENT polarity bit is set to logic 0. The EVENT pin can be ANDed with other EVENT
or ALERT signals from other slave devices to signal their intention to communicate with
the host controller. When the host detects EVENT or ALERT signal LOW, it issues an
Alert Response Address (ARA) to which a slave device would respond with its address.
When there are multiple slave devices generating an Alert the SE98 performs bus
arbitration. If it wins the bus, it responds to the ARA and then clears the EVENT pin.

Remark: Either in comparator mode or when the SE98 crosses the critical temperature,
the host must also read the EVENT status bit and provide remedy to the situation by
bringing the temperature to within the alarm window or below the critical temperature if
that bit is set. Otherwise, the EVENT pin will not get de-asserted.

Fig 6.

How SE98 responds to SMBus Alert

Alert Response Address

START bit

read

acknowledge

002aab330

device address

not acknowledge

STOP bit

host NACK and

sends a STOP bit

Slave acknowledges and

sends its slave address.

The last bit of slave address

is hard coded '0'.

master sends a START bit,

ARA and a read command

host detects

SMBus ALERT

SE98_1

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

7.8 SMBus/I

C-bus interface

The data registers in this device are selected by the Pointer Register. At power-up, the
Pointer Register is set to `00', the location for the Capability Register. The Pointer Register
latches the last location is was set to. Each data register falls into one of three types of
user accessibility:

Read only

Write only

Write/Read same address.

A `write' to this device will always include the address byte and the pointer byte. A write to
any register other than the Pointer register requires two data bytes.

Reading this device can take place either of two ways:

If the location latched in the Pointer Register is correct (most of the time it is expected
that the Pointer Register will point to one of the Temperature Register (as it will be the
data most frequently read), then the read can simply consist of an address byte,
followed by retrieving the two data bytes.

If the Pointer Register needs to be set, then an address byte, pointer byte,
repeat START, and another address byte will accomplish a read.

The data byte has the most significant bit first. At the end of a read, this device can accept
either Acknowledge (ACK) or No Acknowledge (NACK) from the Master (No Acknowledge
is typically used as a signal for the slave that the Master has read its last byte). It takes this
device 125 ms to measure the temperature. Refer to the following timing diagrams on how
to program the device.

A = ACK = Acknowledge bit. W = Write bit = 0. R = Read bit = 1.

Fig 7.

SMBus/I

C-bus write to the Pointer Register

SCL

SDA

device address and write

START
by host

ACK

device

STOP

by host

ACK

device

002aab308

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

A = ACK = Acknowledge bit. W = Write bit = 0. R = Read bit = 1.

Fig 8.

SMBus/I

C-bus write to the Pointer Register followed by a write data word

SCL

SDA

device address and write

write register address

START
by host

ACK

by device

ACK

by device

(cont.)

002aab412

SCL

D15

D14

D13

D12

D11

D10

SDA

most significant byte data

least significant byte data

by host

ACK

by device

STOP

by host

ACK

by device

A = ACK = Acknowledge bit. NA = Not Acknowledge bit. W = Write bit = 0. R = Read bit = 1.

Fig 9.

SMBus/I

C-bus write to Pointer Register followed by a repeat START and an immediate data word read

SCL

SDA

device address and write

read register address

START
by host

ACK

by device

ACK

by device

(cont.)

D15

D14

D13

D12

D11

D10

returned most significant byte data

ACK

by host

SCL

SDA

SCL

SDA

device address and read

repeated

START
by host

ACK

by device

(cont.)

002aab413

returned least significant byte data

STOP

by host

NACK

by host

SE98_1

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

Register descriptions

8.1 Register overview

This section describes all the registers used in the SE98. The registers are used for
latching the temperature reading, storing the low and high temperature limits, configuring,
the hysteresis threshold and the ADC, as well as reporting status. The device uses the
pointer register to access these registers. Read registers, as the name implies, are used
for read only, and the write registers are for write only. Any attempt to read from a
write-only register will result in reading zeroes. Writing to a read-only register will have no
effect on the read even though the write command is acknowledged. The Pointer register
is an 8-bit register. All other registers are 16-bit.

A write to reserved registers my cause unexpected results which may result in requiring a
reset by removing and re-applying its power.

A = ACK = Acknowledge bit. NA = Not Acknowledge bit. W = Write bit = 0. R = Read bit = 1.

Fig 10. SMBus/I

C-bus word read from register with a pre-set pointer

D15

D14

D13

D12

D11

D10

returned most significant byte data

ACK

by host

SCL

SDA

SCL

SDA

device address and read

ACK

by device

(cont.)

002aab414

returned least significant byte data

STOP

NACK

by host

START
by host

Table 3.

Register summary

Address (hex)

POR state (hex)

Register name

n/a

Pointer Register

00h

0015h/0017h

Capability Register (B-grade = 0017h, C-grade = 0015h)

01h

0000h

Configuration Register

02h

0000h

Upper Boundary Alarm Trip Register

03h

0000h

Lower Boundary Alarm Trip Register

04h

0000h

Critical Alarm Trip Register

05h

n/a

Temperature Register

06h

1131h

Manufacturer ID Register

07h

A101h

Device ID/Revision Register

08h to 21h

0000h

reserved registers

22h

0000h

SMBus Register

23h to FFh

0000h

reserved registers

SE98_1

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

8.2 Capability Register (00h, 16-bit read-only)

[1]

See

Table 5

Table 4.

Capability Register (address 00h) bit allocation

Bit

Symbol

RFU

Reset

Access

Bit

Symbol

RFU

TRES

WRNG

HACC

BCAP

Reset

[1]

Access

Table 5.

Capability Register (address 00h) bit description

Bit

Symbol

Description

15:5

RFU

Reserved for future use. Must be zero.

4:3

TRES

Temperature resolution.

10 -- 0.125

C LSB

WRNG

Wider range.

1 -- can read temperatures below 0

C and set sign bit accordingly

HACC

Higher accuracy.

0 -- Accuracy

C over the active range and

C over the

monitor range (C-grade)

1 -- High accuracy

C over the active range and

C over the

monitor range (B-grade)

BCAP

Basic capability.

1 -- Has Alarm and Critical Trips capability.

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

8.3 Configuration Register (01h, 16-bit read/write)

Table 6.

Configuration Register (address 01h) bit allocation

Bit

Symbol

RFU

HEN

SHMD

Reset

Access

R/W

Bit

Symbol

CTLB

AWLB

CEVNT

ESTAT

EOCTL

CVO

EMD

Reset

Access

R/W

Table 7.

Configuration Register (address 01h) bit description

Bit

Symbol

Description

15:11

RFU

reserved for future use; must be `0'.

10:9

HEN

Hysteresis Enable

00 -- Disable hysteresis (default)

01 -- Enable hysteresis at 1.5

10 -- Enable hysteresis at 3

11 -- Enable hysteresis at 6

When enabled, hysteresis is applied to temperature movement around
trigger points. For example, consider the behavior of the `Above Alarm
Window' bit (bit 14 of the Temperature register) when the hysteresis is set
to 3

C. As the temperature rises, bit 14 will be set to 1 (temperature is

above the alarm window) when the Temperature register contains a value
that is greater than the value in the Alarm Temperature Upper Boundary
Register. If the temperature decreases, bit 14 will remain set until the
measured temperature is less than or equal to the value in the Alarm
Temperature Upper Boundary register minus 3

C. (Refer to

Figure 5

and

Table 8

Similarly, the `Below Alarm Window' bit (bit 13 of the Temperature register)
will be set to 0 (temperature is equal to or above the Alarm Window Lower
Boundary Trip Register) when the value in the Temperature register is
equal to or greater than the value in the Alarm Temperature Lower
Boundary Register. As the temperature decreases, bit 13 will be set to 1
when the value in the Temperature Register is equal to or less than the
value in the Alarm Temperature Lower Boundary Register minus 3

Note that hysteresis is also applied to EVENT pin functionality.

When either of the lock bits is set, these bits cannot be altered.

SHMD

Shutdown Mode.

0 -- Enabled Temperature Sensor (default)

1 -- Disabled Temperature Sensor

When shut down, the thermal sensor diode and A/D converter are
disabled to save power, no events will be generated. When either of the
lock bits is set, this bit cannot be set until unlocked. However, it can be
cleared at any time.

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

CTLB

Critical Trip Lock bit.

0 -- Critical Alarm Trip Register is not locked and can be altered
(default).

1 -- Critical Alarm Trip Register settings cannot be altered.

This bit is initially cleared. When set, this bit will return a 1, and remains
locked until cleared by internal Power-on reset. This bit can be written with
a single write and do not require double writes.

AWLB

Alarm Window Lock bit.

0 -- Upper and Lower Alarm Trip Registers are not locked and can be
altered (default).

1 -- Upper and Lower Alarm Trip Registers setting cannot be altered.

This bit is initially cleared. When set, this bit will return a 1 and remains
locked until cleared by internal power-on reset. This bit can be written with
a single write and does not require double writes.

CEVNT

Clear EVENT (write only).

0 -- No effect (default).

1 -- Clears active EVENT in Interrupt mode. Writing to this register has
no effect in Comparator mode.

When read, this register always returns zero.

ESTAT

EVENT Status (read only).

0 -- EVENT output condition is not being asserted by this device
(default).

1 -- EVENT output pin is being asserted by this device due to Alarm
Window or Critical Trip condition.

The actual event causing the event can be determined from the Read
Temperature Register. Interrupt Events can be cleared by writing to the
`clear EVENT' bit. Writing to this bit will have no effect.

EOCTL

EVENT Output Control.

0 -- EVENT output disabled (default).

1 -- EVENT output enabled.

When either of the lock bits is set, this bit cannot be altered until unlocked.

CVO

Critical Event Only.

0 -- EVENT output on Alarm or Critical temperature event (default)

1 -- EVENT only if temperature is above the value in the critical
temperature register

When the alarm window lock bit is set, this bit cannot be altered until
unlocked.

EVENT Polarity.

0 -- active LOW (default).

1 -- active HIGH. When either of the alarm or critical lock bits is set, this
bit cannot be altered until unlocked.

EMD

EVENT Mode.

0 -- comparator output mode (default)

1 -- interrupt mode

When either of the alarm or critical lock bits is set, this bit cannot be
altered until unlocked.

Table 7.

Configuration Register (address 01h) bit description

...continued

Bit

Symbol

Description

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

8.4 Temperature format

The 16-bit value used in the following Trip Point Set and Temperature Read-Back registers
is 2's complement with the Least Significant Bit (LSB) equal to 0.0625

C. For example:

A value of 019Ch will represent 25.75

A value of 07C0h will represent 124

A value of 1E64h will represent 25.75

The resolution is 0.125

C. The unused LSB (bit 0) is set to `0'. Bit 11 will have a resolution

of 128

The upper 3 bits of the temperature register indicate Trip Status based on the current
temperature, and are not affected by the status of the Event Output.

8.5 Temperature Trip Point registers

8.5.1 Upper Boundary Alarm Trip Register (16-bit read/write)

The value is the upper threshold temperature value for Alarm mode. The data format is
2's complement with bit 2 = 0.25

C. `RFU' bits will always report zero. Interrupts will

respond to the presently programmed boundary values. If boundary values are being
altered in-system, it is advised to turn off interrupts until a known state can be obtained to
avoid superfluous interrupt activity.

Table 9.

Upper Boundary Alarm Trip Register bit allocation

Bit

Symbol

RFU

SIGN

UBT

Reset

Access

R/W

Bit

Symbol

UBT

RFU

Reset

Access

R/W

Table 10.

Upper Boundary Alarm Trip Register bit description

Bit

Symbol

Description

15:13

RFU

reserved; always 0

SIGN

Sign (MSB)

11:2

UBT

Upper Boundary Alarm Trip Temperature (LSB = 0.25

1:0

RFU

reserved; always 0

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

8.5.2 Lower Boundary Alarm Trip Register (16-bit read/write)

The value is the lower threshold temperature value for Alarm mode. The data format is
2's complement with bit 2 = 0.25

C. RFU bits will always report zero. Interrupts will

8.5.3 Critical Alarm Trip Register (16-bit read/write)

The value is the critical temperature. The data format is 2's complement with
bit 2 = 0.25

C. RFU bits will always report zero.

Table 11.

Lower Boundary Alarm Trip Register bit allocation

Bit

Symbol

RFU

SIGN

LBT

Reset

Access

R/W

Bit

Symbol

LBT

RFU

Reset

Access

R/W

Table 12.

Lower Boundary Alarm Trip Register bit description

Bit

Symbol

Description

15:13

RFU

reserved; always 0

SIGN

Sign (MSB)

11:2

LBT

Lower Boundary Alarm Trip Temperature (LSB = 0.25

1:0

RFU

reserved; always 0

Table 13.

Lower Boundary Alarm Trip Register bit allocation

Bit

Symbol

RFU

SIGN

Reset

Access

R/W

Bit

Symbol

RFU

Reset

Access

R/W

Table 14.

Critical Alarm Trip Register bit description

Bit

Symbol

Description

15:13

RFU

reserved; always 0

SIGN

Sign (MSB)

11:2

Critical Alarm Trip Temperature (LSB = 0.25

1:0

RFU

reserved; always 0

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SE98

SO-DIMM SMBus/I

C-bus temperature sensor

8.6 Temperature Register (16-bit read-only)

8.7 Manufacturer's ID register (16-bit read-only)

The manufacture's ID matches that assigned to Philips' PCI SIG (1131h), and is intended
for use to identify the manufacturer of the device.

Table 15.

Temperature Register bit allocation

Bit

Symbol

ACT

AAW

BAW

SIGN

TEMP

Reset

Access

Bit

Symbol

TEMP

RFU

Reset

Access

Table 16.

Temperature Register bit description

Bit

Symbol

Description

ACT

Above Critical Trip.

0 -- temperature is below the Critical Alarm Trip Register setting

1 -- temperature is equal to or above the Critical Alarm Trip Register
setting

AAW

Above Alarm Window.

0 -- temperature is equal to or below the Upper Boundary Alarm Trip
Register

1 -- temperature is above the Alarm window

BAW

Below Alarm Window.

0 -- temperature is equal to or above the Lower Boundary Alarm Trip
Register

1 -- temperature is below the Alarm window

SIGN

Sign bit.

0 -- positive temperature value

1 -- negative temperature value

11:1

TEMP

Temperature Value (2's complement). (LSB = 0.125

RFU

reserved; always 0

Table 17.

Manufacturer's ID register bit allocation

Bit

Symbol

Manufacturer ID

Reset

Access

Bit

Symbol

(cont.)

Reset

Access

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

8.8 Device ID register

The device ID and device revision are A1h and 00h, respectively.

8.9 SMBus Register

Table 18.

Device ID register bit allocation

Bit

Symbol

Device ID

Reset

Access

Bit

Symbol

Device revision

Reset

Access

Table 19.

SMBus Time-out register bit allocation

Bit

Symbol

RFU

Reset

Access

Bit

Symbol

STMOUT

RFU

SALRT

Reset

Access

R/W

Table 20.

SMBus Time-out register bit description

Bit

Symbol

Description

15:8

RFU

reserved; always 0

STMOUT

SMBus time-out.

0 -- SMBus time-out is enabled (default)

1 -- disable SMBus time-out

When either of the lock bits is set, this bit cannot be altered until unlocked.

6:1

RFU

reserved; always 0

SALRT

SMBus Alert.

0 -- SMBus Alert is enabled (default)

1 -- disable SMBus Alert

When either of the lock bits is set, this bit cannot be altered until unlocked.

SE98_1

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SE98

SO-DIMM SMBus/I

C-bus temperature sensor

11. Characteristics

Table 22.

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

lim(acc)

temperature limit accuracy

B-grade temperature accuracy;
V

= 3.3 V

10 %

amb

= 75

C to 95

1.0

0.5

+1.0

amb

= 40

C to 125

2.0

+2.0

amb

= 20

C to 125

3.0

+3.0

C-grade temperature accuracy;
V

= 3.3 V

10 %

amb

= 75

C to 95

2.0

+2.0

amb

= 40

C to 125

3.0

+3.0

amb

= 20

C to 125

4.0

+4.0

res

temperature resolution

0.25

CC(AV)

average supply current

250

stb(VCC)

power supply standby
current

SMBus inactive

conv

conversion period

100

f(conv)

conversion rate error

percentage error in programmed
data

leakage current

on A0, A1, A2 pins

supply voltage

3.0

3.3

3.6

Table 23.

SMBus DC characteristics

= 3.0 V to 3.6 V; T

amb

= 20

C to +120

C; unless otherwise specified. These specifications are guaranteed by design.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

HIGH-level input voltage

SCL, SDA;
V

= 3.0 V to 3.6 V

2.2

LOW-level input voltage

SCL, SDA;
V

= 3.0 V to 3.6 V

0.8

OL(sink)EVENT_N

LOW-level output sink current on pin
EVENT

= 0.4 V

OL(sink)(SDA)

LOW-level output sink current on pin
SDA

= 0.6 V

LOH

HIGH-level output leakage current

= V

1.0

LIH

HIGH-level input leakage current

= V

or GND

1.0

LIL

LOW-level input leakage current

= V

or GND

1.0

input capacitance

SCL, SDA pins

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

Fig 13. Typical I

CC(AV)

Fig 14. Typical I

stb(VCC)

Fig 15. Typical I

OL(sink)EVENT_N

at 0.4 V

Fig 16. Typical I

OL(sink)(SDA)

at 0.6 V

Sample of 25 devices at V

= 3.3 V

Fig 17. Typical Temp Error

100

200

300

CC(AV)

(

amb

(

125

002aac157

100

= 3.0 V

3.3 V
3.6 V

stb(VCC)

(

amb

(

125

002aac158

100

= 3.0 V

3.3 V
3.6 V

amb

(

125

002aac159

100

= 3.0 V

3.3 V
3.6 V

5.0

10.0

15.0

OL(sink)EVENT_N

(mA)

amb

(

125

002aac160

100

= 3.0 V

3.3 V
3.6 V

15.0

10.0

5.0

20.0

OL(sink)(SDA)

(mA)

Temp

Error

(

amb

(

125

002aac161

100

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

[1]

Delay from SDA START to first SCL HIGH-to-LOW transition.

[2]

Delay from SCL HIGH-to-LOW transition to SDA edges.

[3]

Delay from SCL LOW-to-HIGH transition to restart SDA.

[4]

LOW period to reset SMBus.

Table 24.

SMBus AC characteristics

= 3.0 V to 3.6 V; T

amb

= 20

C to +120

C; unless otherwise specified. These specifications are guaranteed by design.

The AC specifications fully meet or exceed SMBus 2.0 specifications, but allow the bus to interface with the I

C-bus from DC

to 400 kHz.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

SCL

SCL clock frequency

400

kHz

LOW

LOW period of the SCL clock

10 % to 10 %

1.3

HIGH

HIGH period of the SCL clock

90 % to 90 %

0.6

BUF

bus free time between a STOP and
START condition

4.7

HD;STA

hold time (repeated) START condition

10 % of SDA to
90 % of SCL

[1]

4.7

HD;DAT

data hold time

[2]

300

SU;DAT

data set-up time

250

SU;STA

set-up time for a repeated START
condition

[3]

250

SU;STO

set-up time for STOP condition

0.6

rise time of both SDA and SCL signals

300

fall time of both SDA and SCL signals

300

f(o)

output fall time

250

to(SMBus)

SMBus time-out time

[4]

Fig 18. AC timing diagram

SCL

SDA

002aab235

LOW

SU;STO

HD;STA

HD;DAT

BUF

SU;DAT

SU;STA

HIGH

HD;STA

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

12. Package outline

Fig 19. Package outline SOT530-1 (TSSOP8)

UNIT

max.

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15
0.05

0.95
0.85

0.30
0.19

0.20
0.13

3.1
2.9

4.5
4.3

0.65

6.5
6.3

0.70
0.35

0.1

0.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7
0.5

SOT530-1

MO-153

00-02-24
03-02-18

0.25

(A3)

detail X

2.5

5 mm

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm

SOT530-1

1.1

pin 1 index

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

Fig 20. Package outline SOT908-1 (HVSON8)

0.5

0.2

0.05
0.00

UNIT

(1)

1.5

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

3.1
2.9

1.65
1.35

3.1
2.9

2.25
1.95

0.3
0.2

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT908-1

MO-229

(1)

0.5
0.3

0.1

0.05

SOT908-1

HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm

(1)

max.

05-09-26
05-10-05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

terminal 1
index area

detail X

exposed tie bar (4

)

exposed tie bar (4

)

terminal 1
index area

2 mm

scale

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

24 of 28

Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

13. Soldering

13.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

13.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215

C to 260

C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

13.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

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Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

or 265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

13.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270

C and 320

13.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217

C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

Table 25.

Suitability of surface mount IC packages for wave and reflow soldering methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, HTSSON..T

[3]

, LBGA, LFBGA, SQFP,

SSOP..T

[3]

, TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

[4]

suitable

PLCC

[5]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[5][6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

[7]

suitable

CWQCCN..L

[8]

, PMFP

[9]

, WQCCN..L

[8]

not suitable

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

26 of 28

Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

14. Abbreviations

15. Revision history

Table 26.

Abbreviations

Acronym

Description

ADC

A-to-D Converter

ARA

Alert Response Address

CDM

Charged Device Model

DIMM

Dual In-line Memory Module

HBM

Human Body Model

C-bus

Inter IC bus

LSB

Least Significant Bit

Machine Model

MSB

Most Significant Bit

SO-DIMM

Small Outline Dual In-line Memory Module

POR

Power-On Reset

SMBus

System Management Bus

Table 27.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

SE98_1
(9397 750 14649)

20060510

Product data sheet

SE98_1

Product data sheet

Rev. 01 -- 10 May 2006

27 of 28

Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

16. Legal information

16.1

Data sheet status

[1]

Please consult the most recently issued document before initiating or completing a design.

[2]

The term `short data sheet' is explained in section "Definitions".

[3]

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL

http://www.semiconductors.philips.com.

16.2

Definitions

Draft -- The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.

Short data sheet -- A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.

16.3

Disclaimers

General -- Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.

Right to make changes -- Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

Suitability for use -- Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer's own risk.

Applications -- Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values -- Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and and
operation of the device at these or any other conditions above those given in
the Characteristics sections of this document is not implied. Exposure to
limiting values for extended periods may affect device reliability.

Terms and conditions of sale -- Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at

http://www.semiconductors.philips.com/profile/terms

, including those

pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.

No offer to sell or license -- Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.

16.4

Trademarks

Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.

C-bus -- logo is a trademark of Koninklijke Philips Electronics N.V.

17. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Document status

[1][2]

Product status

[3]

Definition

Objective [short] data sheet

Development

This document contains data from the objective specification for product development.

Preliminary [short] data sheet

Qualification

This document contains data from the preliminary specification.

Product [short] data sheet

Production

This document contains the product specification.

Philips Semiconductors

SE98

SO-DIMM SMBus/I

C-bus temperature sensor

For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Date of release: 10 May 2006

Document identifier: SE98_1

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section `Legal information'.

18. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 4

7.1

Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 4

7.2

Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.3

EVENT output. . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.3.1

Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.3.2

Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.4

Conversion rate. . . . . . . . . . . . . . . . . . . . . . . . . 5

7.5

Power-up default condition . . . . . . . . . . . . . . . . 6

7.6

SMBus Time-out . . . . . . . . . . . . . . . . . . . . . . . . 6

7.7

SMBus Alert . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.8

SMBus/I

C-bus interface . . . . . . . . . . . . . . . . . 7

Register descriptions . . . . . . . . . . . . . . . . . . . . 9

8.1

8.2

Capability Register (00h, 16-bit read-only) . . . 10

8.3

Configuration Register (01h, 16-bit read/write) 11

8.4

Temperature format . . . . . . . . . . . . . . . . . . . . 14

8.5

Temperature Trip Point registers . . . . . . . . . . . 14

8.5.1

Upper Boundary Alarm Trip Register (16-bit
read/write). . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.5.2

Lower Boundary Alarm Trip Register (16-bit
read/write). . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.5.3

Critical Alarm Trip Register (16-bit read/write) 15

8.6

Temperature Register (16-bit read-only) . . . . . 16

8.7

Manufacturer's ID register (16-bit read-only) . 16

8.8

Device ID register . . . . . . . . . . . . . . . . . . . . . . 17

8.9

SMBus Register . . . . . . . . . . . . . . . . . . . . . . . 17

Application design-in information . . . . . . . . . 18

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 18

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 19

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

13.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

13.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24

13.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24

13.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 25

13.5

Package related soldering information . . . . . . 25

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 26

Revision history . . . . . . . . . . . . . . . . . . . . . . . 26

Legal information . . . . . . . . . . . . . . . . . . . . . . 27

16.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27

16.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

16.3

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 27

16.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Contact information . . . . . . . . . . . . . . . . . . . . 27

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SE98PW

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SE98PW

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SE98PW