PDF: 1999 Apr 16
Philips Semiconductors
Package outline
UNIT
c
b
A
e
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
97-06-28
IEC
JEDEC
EIAJ
mm
4.15
3.85
0.25
2.54
2.0
0.51
0.38
6.0
5.6
36.2
35.8
18.2
17.8
25.5
24.5
3.5
3.4
34.4
34.0
22.2
21.8
6
Q
19
1.8
q
F
S
U1
v
0.25
0.3
w
0.1
y
4.1
Z
max.
DIMENSIONS (mm are the original dimensions)
SOT347
0
5
10 mm
scale
E
U
D
G
L
min.
P
Ceramic single-ended flat package; heatsink mounted; 2 mounting holes;
12 in-line tin (Sn) plated leads
SOT347
q
U
e
b
c
Z
L
G
S
D
P
A
Q
w M
1
12
F
E
U1
v A
y
A
PDF 
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