PDF: 2002 Nov 27
Philips Semiconductors
Package outline
1.27
1
A1
Eh
b
UNIT
y
e
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
5.15
4.85
Dh
3.95
3.65
y1
6.15
5.85
3.65
3.35
e1
3.81
0.5
0.3
0.05
0.00
0.05
0.1
DIMENSIONS (mm are the original dimensions)
SOT685-1
- - -
0.75
0.50
L
0.1
v
0.05
w
0
2.5
5 mm
scale
SOT685-1
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 6 x 5 x 0.85 mm
A
(1)
max.
A
A1
c
detail X
y
y1 C
e
L
Eh
eh
Dh
exposed tie bar (4
)
e1
b
1
4
8
5
X
D
E
C
B
A
terminal 1
index area
terminal 1
index area
02-08-12
02-11-27
A
C
C
B
v
M
w
M
eh
0.35
E
(1)
D
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
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